CN1630977A - Piezoelectric oscillator, manufacturing method thereof, and electronic equipment - Google Patents
Piezoelectric oscillator, manufacturing method thereof, and electronic equipment Download PDFInfo
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- CN1630977A CN1630977A CNA038035960A CN03803596A CN1630977A CN 1630977 A CN1630977 A CN 1630977A CN A038035960 A CNA038035960 A CN A038035960A CN 03803596 A CN03803596 A CN 03803596A CN 1630977 A CN1630977 A CN 1630977A
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Abstract
A piezoelectric oscillator capable of being downsized by reducing a plane size, production method thereof, portable phone device, and electronic apparatus. In a laminate lead frame (50) comprising two lead frames (30, 40), a lead (32) for connection with a piezoelectric oscillation element (10) is formed on an upside lead frame (30), the lead (32) is raised upward to form a connection terminal (36), a lead (42) for mounting to a mounting substrate is formed on a downside lead frame (40), the lead (42) is raised downward to form a mounting terminal (46), and an IC (60) formed with an oscillation circuit is mounted on the laminate lead frame (50). The piezoelectric oscillation element (10) having a piezoelectric oscillation piece (12) enclosed within a package (20) is mounted on the laminate lead frame (50), and the laminate lead frame (50) and the piezoelectric oscillation element (10) are enclosed within a resin package with the main surface of the mounting terminal (46) exposed to form a piezoelectric oscillator.
Description
Technical field
The portable phone unit and the electronic equipment that the present invention relates to the manufacture method of a kind of piezoelectric oscillator, piezoelectric oscillator and adopt this piezoelectric oscillator.
Background technology
In circuit, be extensive use of the frequency signal that piezoelectric oscillator obtains to fix.Real fair 5-16724 communique has been put down in writing piezoelectric oscillator in the past 501 shown in Figure 9.
And Fig. 9 (1) is the plane graph in the manufacture process.Fig. 9 (2) is the side cut away view corresponding to the part of the H-H line among Fig. 9 (1).In the piezoelectric oscillator 501 shown in Fig. 9 (2), piezoelectric vibrator 510 is installed on the lower surface of lead frame 530, integrated circuit component (IC) 560 is installed on the upper surface of lead frame 530, and forms resin-encapsulated 570, to utilize resin-sealed total.In addition, in column type piezoelectric vibrator 510 shown in Figure 9, the piezoelectric vibration piece that will form exciting electrode on piezoelectric board is sealed in the metal cartridge, will be drawn out to the outside of this cylinder with the outside lead 524 of this exciting electrode conducting.On the other hand, IC 560 has formed oscillating circuit.
Fig. 9 (1) shows the state before forming resin-encapsulated 570 just.The central configuration of lead frame 530 has chip carrier (die pad) 552, and IC 560 is installed on it.In addition, four limits of chip carrier 552 dispose the installation of piezoelectric oscillator 501 with going between 542, and these lead-in wires are electrically connected with IC 560 by wire-bonded respectively.In addition, installation uses the exterior section of lead-in wire 542 after forming resin-encapsulated 570, and bending downwards forms mounting terminal.In addition, the installation on the above-below direction of Fig. 9 (1) is formed for connecting being connected with lead-in wire 532 of piezoelectric vibrator 510 and IC 560 with lead-in wire 542 mid portion.And the lower surface that connects with lead-in wire 532 is connected with the outside lead 524 of piezoelectric vibrator 510, and the upper surface that connects with lead-in wire 532 is connected with IC 560 by wire-bonded.Thus, piezoelectric vibrator 510 and IC 560 are electrically connected mutually.
In addition, specially permit No. 2621828 communique and also show same structure.
Though piezoelectric oscillator has been used for communicators such as portable phone, is accompanied by the strong request to the miniaturization of portable phone, has also produced the miniaturization to piezoelectric oscillator, the tight demand of slimming.In addition, developed encapsulation type (Plane Installation type) piezoelectric vibrator recently, in this piezoelectric vibrator, piezoelectric vibration piece is sealed in the encapsulation, simultaneously, and at the outer electrode of the back side of encapsulation formation with the exciting electrode conducting of piezoelectric vibration piece.Replacing column type piezoelectric vibrator 510 shown in Figure 9, and developed the encapsulation type piezoelectric vibrator, is because it can satisfy the demand to piezoelectric oscillator miniaturization, slimming.
Yet along with the miniaturization of piezoelectric oscillator, the mounting terminal that engages with installation base plate is also wanted miniaturization.Therefore, piezoelectric oscillator is more little, and it is also more little to be used for bonding area that mounting terminal is connected on the installation base plate, thereby bond strength reduces.Therefore, when being loaded in the portable electric appts such as portable phone at piezoelectric oscillator,, then can act on very big impulsive force, increase the possibility that comes off from the junction surface of installation base plate if this equipment is dropped.The junction surface of the resin of formation resin-encapsulated and the terminal of lead frame is like this too.Therefore, along with the miniaturization of piezoelectric oscillator, the bond strength of the resin of raising and installation base plate or formation resin-encapsulated becomes major issue.
Yet, in above-mentioned piezoelectric oscillator, exist following problem: owing to must will connect with lead-line configuration at the pars intermedia of installing with lead-in wire, so increased planar dimension.Therefore, limited the miniaturization of piezoelectric oscillator.
Summary of the invention
Therefore, an object of the present invention is to provide and a kind ofly realize the piezoelectric oscillator and the manufacture method thereof of miniaturization by reducing planar dimension.
In addition, another object of the present invention is to improve bond strength.
To achieve these goals, the invention provides a kind of piezoelectric oscillator, in this piezoelectric oscillator, in the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the above-mentioned lead frame of a side is with going between, above-mentioned connection is formed splicing ear with lead-in wire to above-mentioned one edge-on, simultaneously, on the above-mentioned lead frame of opposite side, be formed for being installed to the installation lead-in wire on the installation base plate, above-mentioned installation is erected and forms mounting terminal to above-mentioned opposite side with lead-in wire, the IC that will be formed with oscillating circuit is installed on the above-mentioned laminated type lead frame, there is the above-mentioned piezoelectric vibrator of piezoelectric vibration piece to be installed on the above-mentioned laminated type lead frame inner sealing of encapsulation, and above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator are sealed in the resin-encapsulated, and the interarea of mounting terminal is exposed to the outside.
In this case, can dispose splicing ear and mounting terminal stackedly, and needn't dispose them abreast.Therefore, can reduce the planar dimension of piezoelectric oscillator.In addition,, carry out the action check of the frequency adjustment of piezoelectric vibrator and IC, the piezoelectric vibrator with good quality can be combined with the IC with good quality and formed piezoelectric oscillator by before piezoelectric vibrator being installed on the laminated type lead frame.Therefore, needn't abandon the IC of good quality, can improve the rate of finished products of IC, and can reduce manufacturing cost.
In addition, because adopted the structure of utilizing resin-sealed whole laminated type lead frame and piezoelectric vibrator, so, still can use same resin forming mould even the combination of piezoelectric vibrator and IC changes.Therefore, this structure is suitable for the small lot batch manufacture of various products.In addition, can insulate, and can prevent that dust or moisture from entering whole laminated type lead frame and piezoelectric vibrator.Therefore, can prevent electric fault or chemical failure.
In addition, the present invention also provides a kind of piezoelectric oscillator, in this piezoelectric oscillator, in the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the above-mentioned lead frame of a side is with going between, above-mentioned connection is formed splicing ear with lead-in wire to above-mentioned one edge-on, simultaneously, on the above-mentioned lead frame of opposite side, form and have the installation lead-in wire that is used to be installed to the mounting terminal on the installation base plate, the IC that will be formed with oscillating circuit is installed on the above-mentioned laminated type lead frame, the piezoelectric vibrator that is sealed with piezoelectric vibration piece in the encapsulation is installed on the above-mentioned laminated type lead frame, and above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator be sealed in the resin-encapsulated, and the interarea of mounting terminal is exposed to the outside, simultaneously, form above-mentioned installation with the thickness of the above-mentioned lead frame of the opposite side of lead-in wire thickness less than the above-mentioned mounting terminal that forms on lead-in wire in above-mentioned installation.
Such the present invention can obtain and above-mentioned same action effect, simultaneously, forms to such an extent that upward formed mounting terminal is thin with lead-in wire than installing by the lead frame that makes opposite side, can realize the miniaturization of resin-encapsulated.
Install with lead-in wire and can form: the thickness of base end side is less than the thickness of the mounting terminal of end side.Thus, need not to erect (bending) and install, just can form mounting terminal with lead-in wire.Therefore, the area of mounting terminal can be increased, and the installation strength (bond strength) that is installed on the installation base plate can be improved.In addition, above-mentioned mounting terminal can be arranged at the position higher than the lower surface of above-mentioned resin-encapsulated.Thus, when being installed in piezoelectric oscillator on the installation base plate, the gap that forms between mounting terminal and the installation base plate is filled by scolder, thereby by observing the engagement state that can easily confirm mounting terminal.
In addition, the present invention further provides a kind of piezoelectric oscillator, in this piezoelectric oscillator, in the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the above-mentioned lead frame of a side is with going between, on the above-mentioned lead frame of opposite side, be formed for being installed to the installation lead-in wire on the installation base plate, above-mentioned installation is erected and forms mounting terminal to above-mentioned opposite side with lead-in wire, the IC that will be formed with oscillating circuit is installed on the above-mentioned laminated type lead frame, the piezoelectric vibrator that is sealed with piezoelectric vibration piece in the encapsulation is installed on the above-mentioned laminated type lead frame, and above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator be sealed in the resin-encapsulated, and the interarea of mounting terminal is exposed to the outside, simultaneously, above-mentioned being formed with connects with the thickness of the lead frame on the side of the lead-in wire thickness less than the splicing ear that forms on connecting with lead-in wire.Thus, can realize the slimming of resin-encapsulated.
In addition, connect with lead-in wire and can form: the thickness of base end side is less than the thickness of the described splicing ear of end side.Therefore, need not to erect connection and can form splicing ear, can increase area, and can improve bond strength with lead-in wire.In addition, also can be at the adjusting terminal of the affirmation of the conducting between the attribute inspection, characteristic adjusting and/or piezoelectric vibrator and the splicing ear that are formed for carrying out IC on the above-mentioned laminated type lead frame, above-mentioned laminated type lead frame and piezoelectric vibrator are sealed in the resin-encapsulated, are exposed to the outside and these are regulated terminal.Therefore, can be under the Product Status after resin-sealed, the conducting of carrying out between attribute inspection, characteristic adjusting and/or piezoelectric vibrator and the splicing ear of IC is confirmed.
Mounting terminal can be positioned at than the high or low position of above-mentioned adjusting terminal, but also it can be formed and regulate terminal and have identical height.Therefore, when the lead frame of processing opposite side,, install with lead-in wire, can realize the simplification of operation so needn't erect to opposite side because mounting terminal is different with the height of regulating terminal.
Install with lead-in wire and can form: the thickness of base end side is less than the thickness of the mounting terminal of end side.Thus, when forming mounting terminal, need not to erect and install, and need not to form sloping portion installing on going between, therefore, can increase effective bonding area of mounting terminal, and can improve the bond strength with installation base plate with lead-in wire to opposite side.In addition, above-mentioned connection can form with lead-in wire: the thickness of base end side is less than the thickness of the splicing ear of end side.Thus, when forming splicing ear, need not to above-mentioned one edge-on connection with lead-in wire, and need not to form rake connecting on going between, therefore, can increase effective bonding area of splicing ear, and can improve the bond strength with piezoelectric vibrator.
In addition, also can IC be installed in an above-mentioned side of above-mentioned laminated type lead frame.Therefore,, also be difficult to arrive IC, therefore can prevent that IC from breaking down even moisture is invaded from the below of piezoelectric oscillator.In addition, when having added temperature-compensation circuit among the IC,, therefore, can reduce the temperature difference between temperature sensor and the piezoelectric vibration piece because its temperature sensor is arranged near on the position of piezoelectric vibrator.Therefore, can accurately proofread and correct the temperature characterisitic of piezoelectric vibration piece.
In addition, also this laminated type lead frame and piezoelectric vibrator can be sealed in the resin-encapsulated, and the upper surface of the lid of above-mentioned piezoelectric vibrator is exposed to the outside.Owing on the upper surface of lid, put down in writing the product specification of piezoelectric vibrator,, just need on the surface of resin-encapsulated, not put down in writing product specification by exposing lid.In addition, because the position of lid is fixed on the inside of resin forming mould, so can stablize the attitude of piezoelectric vibrator.
In addition, also the lid of piezoelectric vibrator can be sealed in the resin-encapsulated.Thus, in operation, can prevent that the scolder that applies from covering the lid that exposes to the surface applied scolder of mounting terminal.Therefore, need not to cover upper surface.
In addition, also above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator can be sealed in the resin-encapsulated, and the interarea of above-mentioned mounting terminal and the side of above-mentioned mounting terminal are exposed to the outside.In this case, the scolder that overflows from the interarea of mounting terminal rises gradually along the side of mounting terminal.As a result, the side from the electrode of installation base plate to mounting terminal forms leg (fillet).Thus, the electrode of can be easily confirming installation base plate from outward appearance is connected with the mounting terminal of piezoelectric oscillator.
In addition, can on the interarea of mounting terminal, form more than one at least recess or protuberance.By on interarea, forming recess or protuberance, can increase the effective bonding area with installation base plate, simultaneously, protuberance or scolder performance fixing (anchor) effect that enters recess.Therefore, can improve the bond strength of mounting terminal and installation base plate, and piezoelectric oscillator can be installed on the installation base plate securely.In addition, mounting terminal can form more than one recess or protuberance at least on the composition surface of the resin of a side opposite with interarea.Thus, can increase effective bonding area of mounting terminal and the resin that constitutes resin-encapsulated, and, can prevent to come off from resin because protuberance or the fixation that enters the resin of recess can improve the bond strength with resin.
In addition, also can be formed on the fastener that works on the short transverse of above-mentioned piezoelectric vibrator in the side of above-mentioned encapsulation after, above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator are sealed in the resin-encapsulated.Thus, owing to can prevent that piezoelectric vibrator breaks away from from piezoelectric oscillator, so firmly fixed.
In addition, also can on the lead frame of an above-mentioned side, form a pair of wiring with going between, so that each terminal of IC and above-mentioned mounting terminal are coupled together, can be with above-mentioned each wiring with going between to above-mentioned one edge-on, to form a pair of cloth line terminals, above-mentioned a pair of wiring with the lead-in wire in one with above-mentioned IC terminal or above-mentioned mounting terminal in one be connected, simultaneously, above-mentioned a pair of wiring is connected with in above-mentioned IC terminal or the above-mentioned mounting terminal another with in the lead-in wire another, and the pair of electrodes pad that formation is connected with above-mentioned a pair of cloth line terminals respectively on above-mentioned piezoelectric vibrator and being used for the interconnective wiring pattern of above-mentioned pair of electrodes pad.Thus, even the function allocation order of IC terminal is different with the function allocation order of mounting terminal, still can between respective terminal, realize being electrically connected.Its result even between the piezoelectric oscillator of different mounting terminal function allocation order, still can adopt the IC of same type.Therefore, the IC kind can be reduced, and manufacturing cost and product cost can be reduced.
The end of mounting terminal can be stretched out from the side of above-mentioned resin-encapsulated.Thus, when joining to mounting terminal on the installation base plate, scolder rises to the part that mounting terminal stretches out from resin-encapsulated gradually and forms leg, therefore, can easily judge installation (joint) quality by observing.In addition, because scolder covers the mounting terminal of stretching out from resin-encapsulated, so can improve installation strength.
In addition, on above-mentioned splicing ear, can form more than one at least recess or protuberance in one or two of the face of the interarea that is used for engaging above-mentioned piezoelectric vibrator or its opposition side.Thus, can increase the bonding area of the resin of the bonding area of splicing ear and piezoelectric vibrator or itself and resin-encapsulated, simultaneously, owing to be arranged on the fixation that recess or protuberance produced on the splicing ear, can raising and the bond strength of the resin of piezoelectric vibrator or resin-encapsulated.
In addition, can connect with lead-in wire or install with the otch that is formed for holding resin on going between one or both of.Thus, the resin that constitutes resin-encapsulated enters this otch, brings into play fixed effect, therefore, can improve resin and be connected with lead-in wire or install with the bond strength that goes between, and can improve impact resistance.
The above-mentioned mounting terminal of the lead frame of opposite side can form thicklyer than other parts.Thus, when mounting terminal when resin-encapsulated is exposed because the thickness of other redundances beyond the mounting terminal is thinner than mounting terminal,, just can be sealed in the resin-encapsulated so need not the lead frame of bending opposite side.Therefore, when joining to mounting terminal on the installation base plate, the part beyond the mounting terminal is not exposed from resin-encapsulated.Therefore, not can be arranged on pattern on the installation base plate etc. and be short-circuited.
On the other hand, the invention provides a kind of method that is used to make piezoelectric oscillator, this method comprises following operation: in the laminated type lead frame that is made of two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the above-mentioned lead frame of a side is with going between, above-mentioned connection is formed splicing ear with lead-in wire to above-mentioned one edge-on, simultaneously, on the above-mentioned lead frame of opposite side, be formed for being installed in the installation lead-in wire on the installation base plate, above-mentioned installation is erected and forms mounting terminal and the operation that forms above-mentioned laminated type lead frame by stacked each lead frame to described opposite side with lead-in wire; The IC that will be formed with oscillating circuit is installed in the operation on the above-mentioned laminated type lead frame; There is the piezoelectric vibrator of piezoelectric vibration piece to be installed in operation on the above-mentioned laminated type lead frame encapsulation inner sealing; This laminated type lead frame and piezoelectric vibrator are sealed in the resin-encapsulated, and the interarea of above-mentioned mounting terminal is exposed to outside operation.Thus, can reduce the planar dimension of piezoelectric oscillator.
In addition, the invention provides a kind of method that is used to make piezoelectric oscillator, this method comprises following operation: in the laminated type lead frame that is made of two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the above-mentioned lead frame of a side is with going between, above-mentioned connection is formed splicing ear with lead-in wire to above-mentioned one edge-on, simultaneously, on the above-mentioned lead frame of opposite side, be formed for being installed in the installation lead-in wire on the installation base plate, side forms mounting terminal endways by the base end side of the above-mentioned installation usefulness of attenuate lead-in wire, forms the operation of above-mentioned laminated type lead frame by stacked each lead frame; The IC that will be formed with oscillating circuit is installed in the operation on the above-mentioned laminated type lead frame; There is the piezoelectric vibrator of piezoelectric vibration piece to be installed in operation on the above-mentioned laminated type lead frame inner sealing of encapsulation; And above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator be sealed in the resin-encapsulated, and the interarea of above-mentioned mounting terminal is exposed to outside operation.Thus, because do not form rake installing on going between, thus can increase effective bonding area of mounting terminal, and can improve the bond strength with installation base plate.Can be by compression moulding processing or etching and easily attenuate cardinal extremity part with lead-in wire is installed.
In addition, this method can also comprise the operation of removal attached to the resin on the interarea of above-mentioned mounting terminal.Thus, can be on the interarea of mounting terminal solder-coating.In addition, being sealed to operation in the resin-encapsulated can be pressed on the die surface by the interarea with mounting terminal and carry out, and, thereafter with above-mentioned resin-encapsulated from the operation that the framework of above-mentioned lead frame cuts off, the redundance that can cut off above-mentioned mounting terminal.Thus, can prevent owing to the interarea of mounting terminal contacts on the interarea that causes resin to be attached to mounting terminal with the tight of die surface when resin-sealed carrying out, and can omit and remove the operation that is attached to the resin on the interarea.In addition, when the framework from lead frame cuts off resin-encapsulated,, can prevent that then erection space from increasing if cut off and remove the redundance of mounting terminal.
On the other hand, portable phone unit according to the present invention is that a kind of piezoelectric oscillator that utilizes obtains the device of control with clock signal, in this piezoelectric oscillator, in the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the above-mentioned lead frame of a side is with going between, above-mentioned connection is formed splicing ear with lead-in wire to above-mentioned one edge-on, simultaneously, on the lead frame of opposite side, be formed for being installed in the installation lead-in wire on the installation base plate, above-mentioned installation is erected and forms mounting terminal to above-mentioned opposite side with lead-in wire, the IC that is formed with oscillating circuit is installed on the above-mentioned laminated type lead frame, there is the inner sealing of encapsulation the piezoelectric vibrator of piezoelectric vibration piece to be installed on the above-mentioned laminated type lead frame, and above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator are sealed in the resin-encapsulated, and the interarea of mounting terminal is exposed to the outside.
Thus, can dispose splicing ear and mounting terminal stackedly, and need not, and can reduce the planar dimension of piezoelectric oscillator, therefore, can provide more small-sized portable phone unit them and row arrangement.
In addition, portable phone unit according to the present invention is that a kind of piezoelectric oscillator that utilizes obtains the device of control with clock signal, in this piezoelectric oscillator, in the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the lead frame of a side is with going between, above-mentioned connection is formed splicing ear with lead-in wire to above-mentioned one edge-on, simultaneously, on the lead frame of opposite side, form and have the installation lead-in wire that is used to be installed to the mounting terminal on the installation base plate, the IC that will be formed with oscillating circuit is installed on the above-mentioned laminated type lead frame, there is the piezoelectric vibrator of piezoelectric vibration piece to be installed on the above-mentioned laminated type lead frame inner sealing of encapsulation, and above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator are sealed in the resin-encapsulated, and the interarea of mounting terminal is exposed to the outside, simultaneously, form the thickness of the thickness of the above-mentioned lead frame that the opposite side of using lead-in wire is installed less than the mounting terminal of formation on installing with lead-in wire.
Thus, can obtain and above-mentioned same action effect, simultaneously, form thinlyyer by the lead frame that makes opposite side than the mounting terminal that on installing, forms with lead-in wire, the slimming of the resin-encapsulated of piezoelectric oscillator can be realized, therefore, more small-sized portable phone unit can be provided.In addition, install with lead-in wire and can form: the thickness of base end side is than the thin thickness of the mounting terminal of end side.Thus, need not to erect (bending) installation and just can form mounting terminal with lead-in wire.Therefore, can increase the area of mounting terminal, can improve the installation strength (bond strength) with installation base plate, in the portable phone unit that impacts such as may being subjected to for example falling, can improve its reliability further.
In addition, portable phone unit according to the present invention is that a kind of piezoelectric oscillator that utilizes obtains the device of control with clock signal, in this piezoelectric oscillator, in the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the lead frame of a side is with going between, simultaneously, on the lead frame of opposite side, be formed for being installed to the installation lead-in wire on the installation base plate, should install with lead-in wire and erect and form mounting terminal to described opposite side, the IC that will be formed with oscillating circuit is installed on the above-mentioned laminated type lead frame, the piezoelectric vibrator that is sealed with piezoelectric vibration piece in the encapsulation is installed on the above-mentioned laminated type lead frame, above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator are sealed in the resin-encapsulated, and the interarea of mounting terminal is exposed to the outside, simultaneously, make and be formed with above-mentioned connection with the thickness of the above-mentioned lead frame of a side of lead-in wire thickness less than the splicing ear that forms on lead-in wire in above-mentioned connection.
Thus, owing to can realize the slimming of the resin-encapsulated of piezoelectric oscillator, therefore, can provide more small-sized portable phone unit.In addition, connect with lead-in wire and can form: the thickness of base end side is than the thin thickness of the described splicing ear of end side.Thus, need not to erect connection and just can form splicing ear, can increase area, can improve bond strength, and in the portable phone unit that might be subjected to impacts such as for example falling, can further improve its reliability with lead-in wire.
On the other hand, electronic equipment according to the present invention is that a kind of piezoelectric oscillator that utilizes obtains the equipment of control with clock signal, in this piezoelectric oscillator, in the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the above-mentioned lead frame of a side is with going between, above-mentioned connection is formed splicing ear with lead-in wire to above-mentioned one edge-on, simultaneously, on the above-mentioned lead frame of opposite side, be formed for being installed to the installation lead-in wire on the installation base plate, above-mentioned installation is erected and forms mounting terminal to above-mentioned opposite side with lead-in wire, the IC that will be formed with oscillating circuit is installed on the above-mentioned laminated type lead frame, there is the piezoelectric vibrator of piezoelectric vibration piece to be installed on the above-mentioned laminated type lead frame inner sealing of encapsulation, and above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator are sealed in the resin-encapsulated, and the interarea of above-mentioned mounting terminal is exposed to the outside.
Thus, can dispose splicing ear and mounting terminal stackedly, and need not, can reduce the planar dimension of piezoelectric oscillator, therefore, can provide more small-sized electronic equipment them and row arrangement.
In addition, electronic equipment according to the present invention is that a kind of piezoelectric oscillator that utilizes obtains the equipment of control with clock signal, in this piezoelectric oscillator, in the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the above-mentioned lead frame of a side is with going between, above-mentioned connection is formed splicing ear with lead-in wire to above-mentioned one edge-on, simultaneously, on the above-mentioned lead frame of opposite side, form and have the installation lead-in wire that is used to be installed to the mounting terminal on the installation base plate, the IC that will be formed with oscillating circuit is installed on the above-mentioned laminated type lead frame, there is the piezoelectric vibrator of piezoelectric vibration piece to be installed on the above-mentioned laminated type lead frame inner sealing of encapsulation, above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator are sealed in the resin-encapsulated, and the interarea of above-mentioned mounting terminal is exposed to the outside, simultaneously, make and be formed with above-mentioned installation with the thickness of the above-mentioned lead frame of the opposite side of lead-in wire thickness less than the above-mentioned mounting terminal that forms on lead-in wire in above-mentioned installation.
Thus, can obtain and above-mentioned same action effect, simultaneously, form thinlyyer by the lead frame that makes opposite side than the mounting terminal that on installing, forms with lead-in wire, the slimming of the resin-encapsulated of piezoelectric oscillator can be realized, therefore, more small-sized electronic equipment can be provided.In addition, install with lead-in wire and can form: the thickness of base end side is than the thin thickness of the mounting terminal of end side.Thus, need not to erect (bending) installation and just can form mounting terminal with lead-in wire.Therefore, can increase the area of mounting terminal, can improve the installation strength (bond strength) with installation base plate, and in the electronic equipment that impacts such as may being subjected to for example falling, can further improve its reliability.
In addition, electronic equipment according to the present invention is that a kind of piezoelectric oscillator that utilizes obtains the equipment of control with clock signal, in this piezoelectric oscillator, in the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the above-mentioned lead frame of a side is with going between, simultaneously, on the lead frame of opposite side, be formed for being installed to the installation lead-in wire on the installation base plate, should install with lead-in wire and erect and form mounting terminal to above-mentioned opposite side, the IC that will be formed with oscillating circuit is installed on the above-mentioned laminated type lead frame, there is the piezoelectric vibrator of piezoelectric vibration piece to be installed on the above-mentioned laminated type lead frame inner sealing of encapsulation, above-mentioned laminated type lead frame and above-mentioned piezoelectric vibrator are sealed in the resin-encapsulated, and the interarea of above-mentioned mounting terminal is exposed to the outside, simultaneously, be formed with above-mentioned connection with the thickness of the above-mentioned lead frame of a side of lead-in wire thickness less than the splicing ear that forms on lead-in wire in above-mentioned connection.
Thus, the slimming of the resin-encapsulated of piezoelectric oscillator can be realized, therefore, more small-sized electronic equipment can be provided.In addition, can form connecting with lead-in wire: the thickness of base end side is than the thin thickness of the splicing ear of end side.Thus, need not to erect installation and just can form splicing ear, can increase area, and can improve bond strength, and in the electronic equipment that may be subjected to impacts such as for example falling, can further improve its reliability with lead-in wire.
Description of drawings
Fig. 1 is the perspective view of decomposing state of the piezoelectric oscillator of first execution mode;
Fig. 2 is the side cut away view of the piezoelectric oscillator of first execution mode;
Fig. 3 is the plane graph of lead frame;
Fig. 4 is the perspective view of the recess of encapsulation;
Fig. 5 is the key diagram of mounting terminal;
Fig. 6 is the key diagram of frequency adjustment operation;
Fig. 7 is the perspective view of decomposing state of the piezoelectric oscillator of first execution mode;
Fig. 8 is the key diagram of cloth line states;
Fig. 9 is the key diagram of the piezoelectric oscillator of conventional art;
Figure 10 is the key diagram of the lead frame of the 3rd execution mode;
Figure 11 is the resin-sealed key diagram in the lead frame of the 3rd execution mode;
Figure 12 is the key diagram of method that cuts off the mold pressing surplus of execution mode;
Figure 13 is the key diagram of the piezoelectric oscillator of the 3rd execution mode;
Figure 14 is the figure of installment state of the piezoelectric oscillator of expression the 3rd execution mode;
Figure 15 is the key diagram of the lead frame of the 4th execution mode;
Figure 16 is the resin-sealed key diagram in the lead frame of the 4th execution mode;
Figure 17 is the key diagram of the piezoelectric oscillator of the 4th execution mode;
Figure 18 is the key diagram of installation method of the piezoelectric oscillator of the 4th execution mode;
Figure 19 is the decomposition diagram of the piezoelectric oscillator of the 5th execution mode;
Figure 20 is the decomposition diagram of the piezoelectric oscillator of the 6th execution mode;
Figure 21 is the decomposition diagram of the piezoelectric oscillator of the 7th execution mode;
Figure 22 is the key diagram of the installation of another embodiment with lead-in wire;
Figure 23 is the key diagram of the connection of another embodiment with lead-in wire;
Figure 24 is the summary construction diagram of expression as the digital mobile phone of an example of the electronic equipment of the piezoelectric oscillator that utilizes embodiments of the present invention.
Embodiment
With reference to accompanying drawing, the preferred implementation of piezoelectric oscillator of the present invention and manufacture method thereof is described in detail.And following description has only illustrated some embodiments of the present invention, and the present invention is not limited thereto.
At first, first execution mode is described.
Fig. 1 is the decomposition diagram of the piezoelectric oscillator of expression first execution mode.Fig. 2 is the side cut away view that is intercepted along the line A-A among Fig. 1.In addition, Fig. 2 shows the state of having removed resin-encapsulated 70.Promptly, in the section of laminated type lead frame 50 parts shown in Figure 2, added in fact the not terminal part of cut position, be to understand but do like this in order to help, do not represent section, but represent grade position on above-below direction (vertical direction) of each portion of terminal.By by two lead frames 30, the connection that is formed on the upside lead frame of the 40 laminated type lead frames 50 that constitute being connected with piezoelectric vibrator 10 is with going between 32, should connect with lead-in wire 32 and upwards erect and form splicing ear 36, simultaneously, on downside lead frame 40, be formed for being installed to the installation lead-in wire 42 on the installation base plate, should install with lead-in wire 42 and erect downwards and form mounting terminal 46, the IC 60 that will be formed with oscillating circuit is installed on the laminated type lead frame 50, there is the piezoelectric vibrator 10 of piezoelectric vibration piece 12 to be installed on the laminated type lead frame 50 inner sealing of encapsulation 20, and laminated type lead frame 50 and piezoelectric vibrator 10 be sealed in the resin-encapsulated 70 (with reference to figure 2), expose the interarea of above-mentioned mounting terminal 46 simultaneously, thereby form the piezoelectric oscillator 1 of first execution mode.In addition, IC also can be electronic components such as resistance or capacitor.
Fig. 3 is the plane graph of lead frame.Fig. 3 (1) is the plane graph of upside lead frame, and Fig. 3 (2) is the plane graph of downside lead frame.In this first execution mode, form laminated type lead frame 50 by stacked two lead frames 30,40.Each lead frame the 30, the 40th forms having the framework 31,41 that the curb shape is set on the sheet metal of conductivity and repeat identical pattern in the inboard of each framework 31,41.
In the upside lead frame 30 shown in Fig. 3 (1), on four jiaos in the inboard of framework 31, be formed for the connection that is connected with piezoelectric vibrator with lead-in wire 32.In addition, in this piezoelectric vibrator, form 3 outer electrodes at least, these electrodes comprise the outer electrode of a pair of and exciting electrode conducting and the outer electrode that is used for ground connection (GND).Therefore, on upside lead frame 30, form 3 connections at least with going between 32.In addition, each on the long side direction of framework 31 connects the medial end with lead-in wire 32, is formed for carrying out the pad 34 of wire-bonded.Pad 34 is connected to the long limit of framework 31, pad 34 is supported on the plane identical with framework 31.Thus, will connect with lead-in wire and 32 be fixed on the framework 31.On the other hand, form rake 35, and then form splicing ear 36 in the outside of rake 35 in the outside of pad 34.In addition, as shown in Figure 1, by rake 35 upwards being erected, splicing ear 36 is configured in abreast leaves upside lead frame 30 on the position of predetermined distance from pad 34.In addition, so-called predetermined distance is meant the distance longer than the maximum height that joins the lead 62 on the IC 60 to.
In the downside lead frame 40 shown in Fig. 3 (2), four jiaos in the inboard of framework 41, be formed for being installed to installation on the installation base plate with lead-in wire 42.In addition, medial end with lead-in wire 42 is installed, is formed for carrying out the pad 44 of wire-bonded in each of the short side direction of framework 41.Pad 44 is connected to the minor face of framework 41, pad 44 is supported on the plane identical with framework 41.Thus, will install with lead-in wire and 42 be fixed on the framework 41.On the other hand, form rake 45, and then form mounting terminal 46 in the outside of rake 45 in the outside of pad 44.In addition, as shown in Figure 1, by rake 45 being erected downwards, mounting terminal 46 is configured in abreast leaves downside lead frame 40 on the position of predetermined distance from pad 44.
In addition, mid portion with lead-in wire 42 is installed, is formed for carrying out the characteristic check of IC, the adjusting terminal 54 that the conducting between piezoelectric vibrator and the splicing ear was regulated and/or confirmed to characteristic at each of the short side direction of framework 41.In addition, so-called inspection characteristic is meant the action checking that carries out IC after resin forming, perhaps carries out characteristic check as piezoelectric oscillator etc.And, so-called characteristic is regulated and is meant, when having added temperature-compensation circuit on IC, the frequency change that the temperature because of piezoelectric oscillator causes is proofreaied and correct, perhaps added when changing the function of frequency as IC, regulated its changing sensitivity etc. by input voltage.Regulate the minor face that terminal 54 is connected to framework 41, and be supported on the same plane with downside lead frame 40.In addition, mounting terminal 46 is configured in leaves downside lead frame 40 and be the downside of predetermined distance, be short-circuited with electrode on the installation base plate so can prevent to regulate terminal 54.On the other hand, the central part in the framework 41 of downside lead frame 40 forms chip carrier 52.Chip carrier 52 is connected to the long limit of framework 41, and is supported on the same plane with downside lead frame 40.In addition, regulating terminal 54 and chip carrier 52 also can be formed on the upside lead frame.In addition, splicing ear, mounting terminal, adjusting terminal and the chip carrier position that is connected to each framework is not limited to long limit or minor face.For example, when the quantity of regulating terminal is big, will regulates terminal and be connected to long limit, and chip carrier will be connected to minor face.
Then, form the laminated type lead frame by stacked upside lead frame 30 and downside lead frame 40.By carrying out spot welding etc., upside lead frame 30 and downside lead frame 40 are fixedly attached on separately the framework 31,41.In addition,, form each bar lead-in wire of each lead frame, contact with downside lead frame 40 to prevent upside lead frame 30 in the inboard of framework 31,41.
On the other hand, as shown in Figure 1, integrated circuit component (IC) 60 is installed on the upper surface of chip carrier 52.In IC 60, be formed with oscillating circuit, temperature-compensated as required circuit or voltage-controlled circuit.Then, utilize adhesive that IC 60 is connected on the upper surface of chip carrier 52.In addition, IC 60 can also be installed on the lower surface of chip carrier 52.If originally just IC 60 is installed on the upper surface of chip carrier 52, even then water infiltrates from the below of piezoelectric oscillator, also be difficult to arrive IC 60, therefore, can prevent that IC 60 from damaging.In addition, when IC 60 has added temperature-compensation circuit because its temperature sensor be configured in piezoelectric vibrator 10 near, so can reduce the temperature difference between temperature sensor and the piezoelectric vibration piece 12.Therefore, can accurately proofread and correct the temperature characterisitic of piezoelectric vibration piece 12.
And then, each terminal of laminated type lead frame 50 and each terminal on IC 60 upper surfaces are electrically connected.More particularly, by wire-bonded, the pad 44 of the pad 34 of terminal 36, mounting terminal 46 and each terminal of regulating on the upper surface of terminal 54, IC 60 are connected.In addition, owing on connecting, be formed with otch 38 with lead-in wire 32, so expose the pad 44 of mounting terminal 46 upward.Thus, can carry out wire-bonded to the pad 44 of mounting terminal 46.
On the other hand, form piezoelectric vibrator 10, this piezoelectric vibrator is sealed in piezoelectric vibration piece 12 in the encapsulation 20.As shown in Figure 2, by a plurality of sheets that constitute by ceramic material etc. of stacked and roasting, form encapsulation 20.Specifically, become base to become the shape of regulation each sheet, and on the surface of each sheet, form the wiring pattern of regulation.Then, each sheet is stacked together and carry out roasting.In this encapsulation 20, form cavity 21, and on the bottom surface of cavity 21, form installing electrodes 22.In addition, form outer electrode 24, guarantee conducting with installing electrodes 22 by wiring pattern 23 and 24a at encapsulation 20 the back side.In addition, also can realize connecting up and down by through hole rather than side electrode 24a.
As shown in Figure 1, piezoelectric vibration piece 12 forms exciting electrode 14 on two surfaces of the flat board that is made of piezoelectrics such as quartz.In the end of this piezoelectricity flat board, form connection electrode 15 with each exciting electrode 14 conducting.In addition, as shown in Figure 2, with the single-cantilever state piezoelectric vibration piece 12 is installed in the inside of encapsulation 20 cavity 21.More particularly, electroconductive binder 13 is coated on the installing electrodes 22 of encapsulation 20, and the connection electrode 15 of bonding piezoelectric vibration piece 12 (with reference to figure 1).Thus, can be from encapsulating exciting electrode 14 (with reference to the figure 1) energising of 20 outer electrode 24 to piezoelectric vibration piece 12.In addition, can also cross-over connection be installed by piezoelectric vibration piece 12.
In addition, mounting cover 28 on the peristome of the cavity 21 in encapsulation 20, and gas-tight seal is carried out in the inside to cavity 21 under nitrogen atmosphere or under the vacuum.In addition, when using crown cap, be installed in the encapsulation 20, when using glass cover, utilize low-melting glass to attach it in the encapsulation 20 by the seam weldering.Finished piezoelectric vibrator 10 by aforesaid operations.In addition, the AT that is not limited to that is installed in encapsulation 20 inside cuts piezoelectric vibration piece, can also be tuning-fork type piezoelectric vibration piece or SAW chip.
In addition, before being installed to piezoelectric vibrator 10 on the laminated type lead frame 50, carry out the frequency adjustment of piezoelectric vibrator 10 and the action check of IC 60.Thus, can form piezoelectric oscillator by the piezoelectric vibrator 10 of combination good quality and the IC 60 of good quality.In addition, in the inside that at first IC is installed to encapsulation, then piezoelectric vibration piece is installed in such piezoelectric oscillator of its top, the frequency adjustment stage after piezoelectric vibration piece has been installed finds that there is defective in piezoelectric vibration piece sometimes.In this case, can abandon good IC and defective piezoelectric vibration piece together.In this, in the first embodiment,, therefore, the rate of finished products of IC can be improved, manufacturing cost can be reduced owing to needn't abandon good IC.
Then, piezoelectric vibrator 10 is installed on the laminated type lead frame 50.More particularly, utilize scolder 25 or electroconductive binder etc., the outer electrode 24 of piezoelectric vibrator 10 is connected to the splicing ear of laminated type lead frame.In addition, though also can only form the outer electrode 24 of piezoelectric vibrator 10, preferably outer electrode 24a is extended to form the side from the back side at the back side of encapsulation 20.In this case, will rise gradually along the outer electrode 24a of side from encapsulating the scolder that 20 the back side overflows.As a result, the splicing ear 36 from laminated type lead frame 50 forms leg 25a to the outer electrode 24a on the package side surface.Therefore, being connected between the outer electrode 24 of the connection electrode 36 that can easily confirm laminated type lead frame 50 from outward appearance and piezoelectric vibrator 10.In addition, also can only form the outer electrode 24 of piezoelectric vibrator 10 in the side of encapsulation 20.In addition, in the present embodiment, only support piezoelectric vibrator, support piezoelectric vibrator, then can increase support force, and can prevent the lead frame distortion if still additional electric independently false (dummy) splicing ear waits by splicing ear.
Then, laminated type lead frame 50 and piezoelectric vibrator 10 are sealed in the resin-encapsulated 70.More particularly, the laminated type lead frame 50 that piezoelectric vibrator 10 is installed is configured in the resin forming mould, the injection mo(u)lding by thermosetting resin forms resin-encapsulated 70.As shown in Figure 3, form resin-encapsulated 70 in the inboard of the framework 31,41 of each lead frame 30,40.After resin-encapsulated 70 moulding, cut off the framework 31,41 of each lead frame 30,40 and the connecting portion between each lead-in wire.These off- position 39,49 preferred surfaces near resin-encapsulated 70.In addition, it is outstanding and with its cut-out from resin-encapsulated 70 to make IC regulate terminal 54.
As shown in Figure 2, by laminated type lead frame 50 and piezoelectric vibrator 10 are sealed in the resin-encapsulated 70, can fix both relative positions.In addition, carry out after concavo-convex resin-sealedly if form in the side of the encapsulation 20 of piezoelectric vibrator 10, these concavo-convex fasteners that become then because piezoelectric vibrator is difficult for deviating from from piezoelectric oscillator, thereby help to fixedly secure.Fig. 4 is illustrated in the recess that the bight of the side of piezoelectric vibrator encapsulation forms.Usually form recess 18 in the side of encapsulation 20.At this, in recess 18, form fastener 19.In order to form fastener 19, need only a part of 20b to the potsherd that constitutes encapsulation 20, to shown in 4 (8), change diameter as Fig. 4 (1) as the through hole of recess, the position that wears that perhaps changes through hole gets final product.In addition, Fig. 4 (1) is illustrated in the example that forms fastener in the recess in bight of encapsulation to 4 (3), and Fig. 4 (4) is illustrated in the example that forms fastener in the recess of side of encapsulation to 4 (8).
On the other hand, on the upper surface of resin-encapsulated 70, expose the upper surface of the lid 28 of piezoelectric vibrator 10.Because on lid 28 upper surface, put down in writing the product specification of piezoelectric vibrator 10, cover 28 and just need on the surface of resin-encapsulated 70, not put down in writing product specification so expose.In addition, can stablize the attitude of the piezoelectric vibrator 10 that is positioned at the resin forming mould.On the other hand, as described below, in operation,, must cover and cover 28 upper surface for the lid 28 coated solder layers that prevent to expose cover to the surface applied scolder of mounting terminal 46.Under will covering 28 situations about being sealed in the resin-encapsulated 70, this point just there is no need.
In addition, the interarea of mounting terminal 46 is exposed on the lower surface of resin-encapsulated 70.Fig. 5 (1) expression is along the view of the D direction of Fig. 2, and Fig. 5 (2) is the profile along the bottom surface that the F-F line among Fig. 5 (1) is intercepted.Shown in Fig. 5 (1), the piezoelectric oscillator 1 of present embodiment is installed on the electrode 8 of installation base plate by scolder 9.At this, preferably, mounting terminal 46 is also exposed side 46a except interarea.In this case, the scolder 9 that overflows from the interarea of mounting terminal 46 rises gradually along side 46a.As a result, the side 46a from the electrode 8 of installation base plate to mounting terminal forms leg 9a.Being connected between the electrode 8 of thus, can be easily confirming installation base plate from the outside and the mounting terminal 46 of piezoelectric oscillator 1.
In addition, shown in Fig. 5 (2), also can on the interarea of mounting terminal 46, form depression (recess) 47 in advance.By the part beyond the formation part of the depression 47 on the interarea of covering mounting terminal 46, and etch partially the interarea of mounting terminal 46, form depression 47.If the piezoelectric oscillator 1 with this mounting terminal 46 is installed, then scolder enters depression 47 and plays fixation.Therefore, the mounting terminal 46 of piezoelectric oscillator 1 can be connected on the electrode 8 of installation base plate securely, can improve the installation strength of piezoelectric oscillator 1.
In addition, shown in Fig. 5 (1),, be under the face state of contact, carry out resin injection molding at the interarea of mounting terminal 46 and the bottom surface of resin forming mould in order on the lower surface of resin-encapsulated 70, to expose the interarea of mounting terminal 46.Yet because the injection pressure of resin, resin enters between the interarea and resin forming mould of mounting terminal 46, and on the interarea attached to mounting terminal 46.As described below, to the interarea solder-coating of mounting terminal 46, if but on the interarea of resin attached to mounting terminal 46, then coated scolder no longer can adhere to.Therefore, remove operation attached to the resin on the interarea of mounting terminal 46.Removing resin and be the method that liquid by will adding grinding agent or water etc. spray to mounting terminal 46 carries out.In addition, can also be by method to mounting terminal 46 irradiating lasers, perhaps the method by the coating medicament removes resin.
Then, to the lower surface solder-coating of mounting terminal 46.At this moment, cover and cover 28 upper surface, the not coated scolder of the upper surface of the feasible lid 28 (with reference to figure 2) that exposes covers.
Then, piezoelectric oscillator is carried out frequency adjustment.Fig. 6 is the key diagram that the frequency adjustment operation is shown.And Fig. 6 is the side cut away view corresponding to the part of the line A-A among Fig. 1.Shown in Fig. 6 (1), be exposed at the adjusting terminal 54 of resin-encapsulated 70 outsides by making probe 80 from descending side contacts, IC 60 is write, piezoelectric oscillator 1 is carried out frequency adjustment.In addition, probe 80 also can contact from upside.In addition, at the near surface of resin-encapsulated 70, cut away the adjusting terminal of finishing after the frequency adjustment 54.In addition, also can utilize probe 80 when terminal 54 is regulated in bending, piezoelectric oscillator 1 to be carried out frequency adjustment, thereby finish production, and need not after frequency adjustment, to cut away adjusting terminal 54.Fig. 6 (2) is a variation of resin-encapsulated.In this variation, above adjusting terminal 55, resin-encapsulated 72 is expanded moulding.The frequency adjustment of this piezoelectric oscillator 1 is also similarly carried out with above-mentioned, promptly finishes production process but need not to cut away adjusting terminal 55 after frequency adjustment.
By the way, finish the piezoelectric oscillator of first execution mode.
According to the piezoelectric oscillator of above-mentioned first execution mode, can reduce planar dimension.
Promptly, in the first embodiment, in the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the upside lead frame is with going between, and form splicing ear by edge-on this connection lead-in wire that makes progress, simultaneously, on the downside lead frame, be formed for being installed to installation on the installation base plate with lead-in wire, and by downwards edge-on this lead-in wire be installed formed mounting terminal.In this case, can dispose splicing ear and mounting terminal up and down overlappingly, and need not them and row arrangement.Therefore, can reduce the planar dimension of piezoelectric oscillator.In addition, can also guarantee that mounting terminal has wide area.
In addition, in the first embodiment, adopted whole piezoelectric vibrator and laminated type lead frame are sealed in structure in the resin-encapsulated.In this case,, still can use same resin forming mould, can be suitable for the various product of small lot batch manufacture even change the compound mode of piezoelectric vibrator and IC kind.In addition, because can accurately determine the position of splicing ear with respect to the external shape of resin-encapsulated, thus can be according to profile benchmark positioning and voltage oscillator, thus accurately be installed on the installation base plate.In addition, by resin-sealed, can insulate, and can prevent that dust or moisture from entering whole piezoelectric vibrator and laminated type lead frame.Therefore, can prevent electric fault or chemical failure.
Below second execution mode is described.
Fig. 8 shows the key diagram of cloth line states.In the piezoelectric oscillator of second execution mode, for the terminal b with IC 160 is connected with mounting terminal B, on upside lead frame 130, form a pair of wiring lead-in wire 132r, 132u, edge-on each wiring lead-in wire 132r makes progress, 132u, to form a pair of cloth line terminals 156r, 156u, to connect up and be connected on the IC terminal b with lead-in wire 132r, simultaneously, to connect up is connected on the mounting terminal B with lead-in wire 132u, forms a pair of a pair of cloth line terminals 156r that is connected respectively on piezoelectric vibrator, the electrode pad 127r of 156u, 127u and being used for pair of electrodes pad 127r, the interconnected wiring pattern 126x of 127u.In addition, for the parts of the first execution mode same structure, omit its explanation.
In second execution mode, consider that each terminal on the upper surface of IC 160 has the function of a, b, c, d successively and each mounting terminal distributed successively the situation of the function of A, D, C, B.In addition,, distribute each function of mounting terminal simultaneously according to each electrode on the installation base plate, then may run into this situation if adopt general purpose I C.At this, if connect between the b-B and between the d-D, then lead might intersect and be short-circuited by wire-bonded.Therefore, can not carry out wiring between these terminals by wire-bonded.Therefore, in second execution mode, in the encapsulation of piezoelectric vibrator, form wiring pattern 126 from the IC terminal to mounting terminal.
Fig. 7 is the perspective view that illustrates according to the decomposing state of the piezoelectric oscillator of second execution mode.In second execution mode, form laminated type lead frame 150 by overlapping two lead frames 130,140.Become to connect with lead-in wire 132 at the quadrangle of upside lead frame 130, and its Outboard Sections is made progress edge-on and form splicing ear 136.And, use the mid portion formation wiring of lead-in wire 132 to use in each connection of fore-and-aft direction shown in Figure 7 and go between 152.In addition, the Outboard Sections that connects up with lead-in wire 152 is made progress edge-on, form cloth line terminals 156.In addition, in second execution mode, form two cloth line terminals 156 side by side at the mid portion of each splicing ear 136.On the other hand, become to install with lead-in wire 142 at the quadrangle of downside lead frame 140, then, with edge-on and form mounting terminal 146 downwards of its Outboard Sections.
On the other hand, four jiaos of the back side of the encapsulation 120 in piezoelectric vibrator 110 form outer electrode 124.Then, the mid portion at each outer electrode 124 of fore-and-aft direction shown in Figure 7 forms electrode pad 127.In addition, in second execution mode, form two electrode pads 127 side by side at the mid portion of each outer electrode 124.In addition, form the wiring pattern 126 of electrode pad 127 interconnection that are provided with on the left and right directions shown in Figure 7.In addition, in second execution mode, form two wiring patterns 126 side by side.In addition, not necessarily on the back side of encapsulation, form wiring pattern, also can be or the inner wiring pattern that forms in its side.
Then, as shown in Figure 8, as follows IC 160 is linked together with each lead-in wire.In addition, in Fig. 8, the splicing ear of laminated type lead frame and the outer electrode of piezoelectric vibrator have been omitted.At first, by wire-bonded, with IC terminal a and mounting terminal A, and IC terminal c and mounting terminal C electrical connection.In addition, IC terminal b is connected to wiring with on the lead-in wire 132r, mounting terminal B is connected to wiring with on the lead-in wire 132u by wire-bonded.Herein, if piezoelectric vibrator is installed on the laminated type lead frame, electrode pad 127r is connected on the cloth line terminals 156r, electrode pad 127u is connected on the cloth line terminals 156u, then, can be electrically connected IC terminal b and mounting terminal B by the wiring pattern 126x on the back side that is formed on encapsulation.Equally, respectively IC terminal d is connected on the cloth line terminals 156t, 156s is connected on the mounting terminal D with the cloth line terminals.Herein, if piezoelectric vibrator is installed on the laminated type lead frame, electrode pad 127t is connected on the cloth line terminals 156t, electrode pad 127s is connected on the cloth line terminals 156s, then, can be electrically connected IC terminal d and mounting terminal D by being formed on the wiring pattern 126y on the encapsulation back side.
In the piezoelectric oscillator of aforesaid second execution mode,, still can between respective terminal, realize being electrically connected even the function allocation order of IC terminal is different with the function allocation order of mounting terminal.Its result even between the different piezoelectric oscillator of the function allocation order of mounting terminal, still can adopt the IC of same kind.Therefore, the IC kind can be reduced, manufacturing cost and product cost can be reduced.
Figure 10 is the plane graph of the downside lead frame of the 3rd execution mode.Upside lead frame 30 shown in this downside lead frame 40A and Fig. 3 (1) has constituted the laminated type lead frame together.In the downside lead frame 40A of the 3rd execution mode, the installation lead-in wire 42 that is different from the downside lead frame 40 of first execution mode shown in Fig. 3 (2) with lead-in wire 42A is installed, but in other respects, identical with downside lead frame 40.That is, in downside lead frame 40A, each installs the length on the left and right directions of Figure 10 that mounting terminal 46A with the 42A that goes between is greater than rake 45, and it has the mold pressing surplus 170 of stretching out to the short brink of framework 41 from rake 45.In that downside lead frame 40A and upside lead frame 30 is stacked together and form the lamination framework, and mounted piezoelectric vibrator 10 and IC 60 carried out utilizing the patrix of mould to push this mold pressing surplus 170 downwards when resin-sealed.Figure 11 schematically shows the mould that is used to form resin-encapsulated 70.
Shown in Figure 11 (1), 4 mold pressing surpluses 170 corresponding to being arranged on the downside lead frame 40A are provided with 4 and push protuberance 174 on patrix 172.When forming resin-encapsulated 70, these are pushed protuberance 174 and push from the top to installing with the mold pressing surplus 170 of the 42A that goes between, make the interarea (lower surface) of mounting terminal 46A closely contact the upper surface 178 of counterdie 176.Therefore, when forming resin-encapsulated 70, can prevent that resin is attached on the interarea of mounting terminal 46A, therefore can omit and remove the operation that is attached to the resin on the interarea.In addition, shown in Figure 11 (2), push in the part of protuberance 174 not forming, patrix 172 and counterdie 176 be amalgamation mutually on the height and position of regulating terminal 54.
After having formed resin-encapsulated 70 in the above described manner, with resin-encapsulated 70 from the cut-out operation that laminated type lead frame (framework 41 of downside lead frame 40A) cuts off, along the line of cut 49A shown in the double dot dash line among Figure 10, cut off the installation lead-in wire 42A of downside lead frame 40A, and cut away mold pressing surplus 170.Yet, carry out the cutting of mold pressing surplus 170 as shown in figure 10, make the end portion of mounting terminal 46A give prominence to (for example about 0.1～0.2mm) slightly from the side of resin-encapsulated 70.
Figure 12 schematically shows when the laminated type lead frame cuts off piezoelectric oscillator (resin-encapsulated 70), the dissengaged positions of mold pressing surplus 170.The laminated type lead frame that will be formed with resin-encapsulated 70 for example is configured on the lower tool 190 of cutting machine, cuts off mold pressing surplus 170 by fall upper knife 192 shown in arrow 194.At this moment, the laminated type lead frame is positioned, make and to cut off mold pressing surplus 170, make mounting terminal 46A stretch out specific length d from resin-encapsulated 70.Cut off mold pressing surplus 170 by such mode, when cutting off in the position of the line of the single-point shown in this figure 196 even make the position of laminated type lead frame that skew take place, because expose from resin-encapsulated 70 side (end face) of mounting terminal 46A, so still can observe leg, can easily confirm engagement state.
Figure 13 shows the piezoelectric oscillator 180 that comprises the mounting terminal 46A that cuts off from the laminated type lead frame, and wherein (1) schematically shows the installment state of piezoelectric vibrator 10 and IC 60, and (2) are vertical views, and (3) are upward views.But, respectively be provided with 4 situations of regulating terminal 54 about having illustrated among Figure 13.The end portion of the mounting terminal 46A that is coated with scolder of this piezoelectric oscillator 180 is stretched out from the side of resin-encapsulated 70.Therefore, in piezoelectric oscillator 180, as shown in figure 14, when utilizing scolder 186 mounting terminal 46A to be joined on the electrode 184 of installation base plate 182, because applied scolder on the mounting terminal 46A, so scolder 186 rises gradually, cover the extension of mounting terminal 46A, and form leg.Therefore, can be easily by observing (installation) state that engages of confirming piezoelectric oscillator 180 and installation base plate 182.In addition, because scolder 186 covers the extension of mounting terminal 46A, so can improve installation strength.In addition, when cutting off adjusting terminal 54, also can cut off mold pressing surplus 170.In addition, mounting terminal 46A can make along the part on the long limit of resin-encapsulated 70 and stretch out, and also can adopt L shaped extension.
Figure 15 shows the downside lead frame of the 4th execution mode, and wherein (1) is plane graph, and (2) are the profiles along the C-C line in (1).This downside lead frame 40B constitutes the laminated type lead frame with the upside lead frame 30 shown in Fig. 3 (1).Shown in Figure 15 (2), in the downside lead frame 40B of the 4th execution mode, installing with lead-in wire 42B does not have sloping portion, and mounting terminal 46B and pad 44 are formed in the same plane, and have identical height with adjusting terminal 54.Therefore, need not carry out bending machining, can simplify the operation that forms downside lead frame 40B for mounting terminal 46B being arranged on the downside of regulating terminal 54 to downside lead frame 40B.
As shown in figure 16, in the laminated type lead frame of the downside lead frame 40B that uses the 4th execution mode, carry out resin-sealed.That is amalgamation mutually on the height and position of mounting terminal 46B, patrix 200 that is used to form resin-encapsulated 70B and counterdie 202.In addition, in counterdie 202, the surface that forms cavity is provided with recess 204, and the lower surface 206 of resin-encapsulated 70B is arranged on the below of regulating terminal 54, the i.e. below of the interarea of mounting terminal 46B.That is to say that resin-encapsulated 70B forms following shape: form recess 208 on corresponding to the position of mounting terminal 46B, mounting terminal 46B is set at the end face of this recess 208.Do like this is to come in contact with installation base plate after cutting off and be short-circuited with the wiring pattern or the miscellaneous part that are arranged on the installation base plate in order to prevent to regulate terminal 54.In addition, the height of recess 208 for example, can be about 0.1mm so long as the surface that makes adjusting terminal 54 not contact installation base plate gets final product.
Figure 17 shows the piezoelectric oscillator 210 with mounting terminal 46B, and wherein (1) is the schematic diagram that the installment state of piezoelectric vibrator 10 and IC 60 is shown, and (2) are vertical views, and (3) are upward views.For example, as shown in figure 18, this piezoelectric oscillator 210 can be installed on the installation base plate 182.This installation method at first, shown in Figure 18 (1), is provided with soldered ball 212 on each installation base plate 46B of piezoelectric oscillator 210.Then, this soldered ball 212 is configured on the electrode 184 of installation base plate 182.Then, shown in Figure 18 (2),, piezoelectric oscillator 210 can be installed on the installation base plate 182 by fusing soldered ball 212.
Be installed in the piezoelectric oscillator 210 on the installation base plate 182 like this, because the end face of recess 208 is provided with mounting terminal 46B, so between mounting terminal 46B and installation base plate 182, form gap g.Then, utilize the scolder 220 that constitutes soldered ball 212 to fill this gap g.Therefore, whether filled up, can judge easily whether installation (joint) state is good by scolder 220 by visualization gap g.
Figure 19 is the decomposition diagram of explanation the 5th execution mode, and this figure is corresponding with Fig. 1.Yet, laminated type lead frame 50E has been shown among Figure 19 has rotated 90 ° state with respect to position shown in Figure 1 in the plane.In Figure 19 (1), by utilizing laminated type lead frame 50E to make encapsulation take in the piezoelectric vibrator 10 of piezoelectric vibration piece 12 in 20 and to be used to form the IC60 of oscillating circuit etc. integrated, thereby formed piezoelectric oscillator 1E.Laminated type lead frame 50E is made of upside lead frame 30E that is positioned at a side and the downside lead frame 40E that is positioned at opposite side.
4 connections that formed by upside lead frame 30E have welding disk 34E, rake 35E and splicing ear 36E respectively with lead-in wire 32E.In addition, by the outer electrode (this is not shown) on the bottom surface that is arranged on encapsulation 20 piezoelectric vibrator 10 is installed (joint) to splicing ear 36E.In addition, the rake 35E that connects with lead-in wire 32E has otch (recess) 37E.When forming resin-encapsulated 70, this otch 37E is used to make resin to enter, and under the fixation of the resin that enters otch 37E, can prevent to connect with the 32E that goes between and deviate from and come off from resin-encapsulated.
As shown in Figure 19 (2) of the profile that is intercepted along the D-D line among Figure 19 (1), the installation that is formed by downside lead frame 40E has welding disk 44E, rake 45E and mounting terminal 46E with the 42E that goes between.And, in installing with lead-in wire 42E, from than mounting terminal 46E near the rake 45E of base end side to welding disk 44E and on welding disk 44E, be provided with otch (recess) 48E that is used to make the resin that constitutes resin-encapsulated 70 to enter.In addition, resin-encapsulated 70 forms with the state of the interarea 230 that exposes mounting terminal 46E.Therefore, can the interarea 230 of mounting terminal 46E be joined to the electrode pattern of installation base plate by scolder.In addition, in this embodiment, the installation on the right side of Figure 19 (1) is connected on the earth terminal of installation base plate with lead-in wire 42E, and integrally formed with chip carrier 52E.
Under the situation of this execution mode, the adjusting terminal 54E that is formed by downside lead frame 40E is configured in the installation of the left and right directions that is positioned at Figure 19 (1) with between lead-in wire 42E, the 42E.Regulate terminal 54E by the 51E of end terminals portion and with the 51E of end terminals portion be that the base end part 53E of one constitutes, and form the T font.That is, the both sides of the end side of the lead wire by cutting away the width (length on the left and right directions of Fig. 9 (1)) with base end part 53E form otch 57E, form the T font thereby will regulate terminal 54E.In addition, the adjusting terminal 54E shown in this execution mode shows the adjusting operation of having finished piezoelectric oscillator 1E and has cut off the state of redundance of the end side of the 51E of end terminals portion.Shown in Figure 19 (3), in base end part 53E embedded resin encapsulation 70.
In having the 5th execution mode of said structure,, enter into these otch 37E, 48E so constitute the moulding resin of resin-encapsulated 70 because on connecting and on installing with lead-in wire 42E, formed otch 37E, 48E with lead-in wire 32E.Therefore, can prevent to connect with lead-in wire 32E and installation and from resin-encapsulated 70, deviate from, can improve bond strength with lead-in wire 42E.In addition, because it is wideer than the width of the 51E of end terminals portion to regulate the interior base end part 53E of the embedded resin of terminal 54E, so can from resin-encapsulated 70, not deviate from.Therefore, piezoelectric oscillator 1E can prevent the resin of resin-encapsulated and each goes between and terminal is peeled off, and can improve impact resistance.
Figure 20 is the decomposition diagram of the piezoelectric oscillator of the 6th execution mode.Except the downside lead frame 40E of the downside lead frame 40F that constitutes laminated type lead frame 50F and the 5th execution mode was different, the piezoelectric oscillator 1F of the 6th execution mode was identical with the piezoelectric oscillator of the 5th execution mode.In the downside lead frame 40F of the 6th execution mode, installing with lead-in wire 42F does not have rake.That is, not bending is installed with lead-in wire 42F, and makes the upper surface of welding disk 44F and mounting terminal 46F be positioned at same plane.Yet, as shown in Figure 20 (2) of the profile that is intercepted along the middle E-E line of Figure 20 (1), using among the lead-in wire 42F in installation, the welding disk 44F that becomes base end side is thinner than mounting terminal 46F.Therefore, in installing with lead-in wire 42F, formation end difference 234 between the lower surface 232 of the interarea 230 of mounting terminal 46F and welding disk 44F.In addition, in welding disk 44F, be provided with the otch 48E identical with the otch shown in the 5th execution mode.Other structures of downside lead frame 40F are identical with the 5th execution mode.In addition, come attenuate welding disk 44F, can easily form and install with lead-in wire 42F by compression moulding processing or etching.
Using among the lead-in wire 42F,, can increase the size of mounting terminal 46F because between welding disk 44F and mounting terminal 46F, do not form rake according to the installation of the 5th execution mode.Therefore, it is big that the bonding area of mounting terminal 46F and installation base plate becomes, and can improve the bond strength with installation base plate.In addition, because install rake is not set, so its size decreases on thickness direction can realize the slimming of piezoelectric oscillator 1F with lead-in wire 42F.
In addition, there is not rake because install, so, during processing or in the time spent of doing that is subjected to impulsive force, can not break even its size reduces with lead-in wire 42F yet.That is,, install with lead-in wire and also can realize miniaturization and slimming along with the miniaturization and the slimming of piezoelectric oscillator.Then, when forming mounting terminal by Bending Processing (moulding) installation with lead-in wire, it is thinner than other parts that rake becomes.Therefore, by carrying out Bending Processing with lead-in wire and forming under the situation of mounting terminal, when installing, perhaps be hit the power effect and when peeling off with resin, sloping portion may break at piezoelectric oscillator with the Bending Processing that goes between to installing.On the contrary, because do not have rake with lead-in wire 42F, so this breaking can not taken place according to the installation of present embodiment.
In addition, in downside lead frame 40F, also can only form the part of mounting terminal 46F thicklyer, and by the part that comprises chip carrier outside the attenuate mounting terminal such as etching.In this case, shown in Figure 20 (2), the interarea 230 of mounting terminal 46F is positioned at the below of the lower surface of other parts that are thinned.Thus, even do not form mounting terminal, also can be sealed in the redundance of the thin thickness outside the mounting terminal 46 in the resin-encapsulated 70 when resin molded being undertaken by bending by the interarea 230 that exposes mounting terminal 46F.Therefore, when mounting terminal 46F joined on the installation base plate, other parts can not be short-circuited with wiring pattern of installation base plate etc., can realize the slimming of piezoelectric oscillator.
In addition, in the 6th execution mode, can utilize the connection shown in Figure 20 (3) to replace connecting with lead-in wire 32E with lead-in wire 32F.In this connects with lead-in wire 32F, between welding disk 34F and splicing ear 36F, rake is not set, and the lower surface of welding disk 34F and splicing ear 36F is positioned at same plane.In addition, connection is littler than the thickness of splicing ear 36F with the thickness of the welding disk 34F on the lead-in wire 32F.Therefore, the upper surface 236 of welding disk 34F is lower than the interarea 238 of splicing ear 36F.This connection with lead-in wire 32F on, can increase the area of splicing ear 36F, and can improve the bond strength with piezoelectric vibrator 10.In addition, can realize the slimming of piezoelectric oscillator.Can similarly form this with lead-in wire 42F with installation is connected with lead-in wire 32F.
Figure 21 is the decomposition diagram of the piezoelectric oscillator of the 7th execution mode.In this piezoelectric oscillator 1G, constitute the downside lead frame 40G of laminated type lead frame 50G, particularly install different with the mounting terminal 46E of the downside lead frame 40G of the 5th execution mode with the mounting terminal of lead-in wire.Other are identical with the 5th execution mode.As shown in Figure 21 (2) of the profile that is intercepted along the F-F line among Figure 21 (1), the installation of the 7th execution mode has welding disk 44E, rake 45E and mounting terminal 46G with the 42G that goes between.And, on the interarea 230 of mounting terminal 46G, be formed with protuberance 240.In addition, mounting terminal 46G opposite with interarea 230, with the composition surface 242 of resin-bonded on, with protuberance 240 corresponding positions on be formed with recess 244.Can be by mounting terminal 46F be carried out extrusion forming and forms these protuberances 240 and recess 244 easily.
Because on the interarea 230 of the mounting terminal 46G of this structure, formed protuberance 240, so when joining to mounting terminal on the installation base plate, increased the contact area with scolder, simultaneously, because the fixation that protuberance 240 produces has improved the bond strength with installation base plate.In addition, because on the composition surface 242 of mounting terminal 46G and resin-bonded, be formed with recess 244, thus can increase effective bonding area with resin, simultaneously, because resin enters in the recess 244, so can improve bond strength with resin.
In addition, the installation shown in also can image pattern 21 (1) right sides forms mounting terminal like that with lead-in wire 42H.That is,, on the interarea 230 of installation, be formed with recess 246 with the mounting terminal 46H of lead-in wire 42H as shown in Figure 21 (3) of the profile that is intercepted along the G-G line among Figure 21 (1).In addition, in the side opposite of mounting terminal 46H with interarea 230, with the composition surface 242 of resin-bonded on be formed with protuberance 248.The protuberance 248 of the recess 246 of interarea 230 sides and composition surface 242 sides in correspondence with each other can be by formation such as pressurization bending machining.The mounting terminal 46H of Xing Chenging can produce and the same effect of mounting terminal 46G shown in Figure 21 (2) like this.
In addition, as shown in figure 22, can form and install with lead-in wire.Be the lower face side of welding disk 44J of lead wire of t and the upper surface side of mounting terminal 46J by etched thickness, make installation shown in Figure 22 form crank-like with lead-in wire 42J.This installation can reduce the size on the thickness direction with the area that lead-in wire 42J also can increase mounting terminal 46J.
In addition, in the 7th execution mode, the situation that a protuberance or recess are set has been described on mounting terminal, but also a plurality of protuberances or recess can be set.In addition, can form connection lead-in wire as shown in figure 23, to replace the connection 32E that goes between.Use on the lead-in wire 32G in the connection shown in Figure 23 (1), the interarea 238 that engages with piezoelectric vibrator 10 of splicing ear 36G is provided with protuberance 250.In addition, on splicing ear 36G, on a side and composition surface resin-bonded opposite, be formed with recess (this is not shown) with interarea 238.The splicing ear 36G of Xing Chenging like this, can improve with the bond strength of piezoelectric vibrator 10 and with the bond strength of the resin of resin-encapsulated.
The connection shown in Figure 23 (2) with lead-in wire 32H on, on the interarea 238 of splicing ear 36H, be formed with recess 252, and on its opposition side and composition surface resin-bonded, be formed with protuberance 254.In addition, use on the lead-in wire 32J, on the interarea 238 of splicing ear 36J, be formed with recess 256, and on the surface of its opposition side, be formed with protuberance 258 in the connection shown in Figure 23 (3).In addition, recess 256 is at the end side opening of splicing ear 36J, and formation U word shape.These splicing ears 36H, 36J also can obtain the effect same with splicing ear 36G.
Figure 24 is the summary construction diagram of expression as the digital mobile telephone device of an example of the electronic equipment of the piezoelectric oscillator that utilizes embodiments of the present invention.
In the drawings, be converted to the sender's of the signal of telecommunication sound, in demodulator and codec, carry out digital modulation by microphone 308, then, in sending part 307, be converted to RF (radio frequency) frequency band after, by antenna transmission to base station (this is not shown).In addition, in acceptance division 306, carry out frequency conversion from the RF signal of base station after, in demodulator and codec, be transformed to voice signal, then by loud speaker 309 outputs.In addition, CPU (CPU) 301 controls comprise the action of the whole digital mobile telephone device 300 of the input and output portion 302 that is made of LCD and keyboard.Memory 303 is to be subjected to information-storing device CPU 301 control, that be made of RAM 1 and ROM 1, information such as the control program of wherein in store digital mobile telephone device 300 and telephone directory.
Example as the piezoelectric oscillator of using embodiments of the present invention for example has TCXO (Temperature Compensated X ' stal Oscillator temperature compensated piezoelectric oscillator) 305.This TCXO 305 is that frequency changes the less piezoelectric oscillator that fluctuates with environment temperature, and in portable phone unit, it is widely used as the reference frequency source of acceptance division shown in Figure 24 306 and emission part 307.In recent years, also strong further along with the miniaturization of portable phone unit to the requirement of the miniaturization of this TCXO 305, so the miniaturization of the piezoelectric oscillator of embodiments of the present invention is very useful.
In addition, for example can also be used for real-time clock 310 according to the piezoelectric oscillator of embodiment of the present invention, this real-time clock 310 is used for providing Time of Day information to the portable phone unit that comprises CPU 301.
Piezoelectric oscillator according to the embodiment of the present invention not only can be used for above-mentioned portable phone unit, and can be used to utilize piezoelectric oscillator to obtain to control the clock signal of usefulness and the electronic equipment of reference signal, for example, personal computer, work station and PDA (Personal Digital[data] Assisitants: portable data assistance) etc.
Like this, by in electronic equipment, using the piezoelectric oscillator of above-mentioned execution mode, can realize electronic equipment more small-sized, that reliability is high.
Claims (32)
1. a piezoelectric oscillator is characterized in that,
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, described connection is formed splicing ear with lead-in wire to described one edge-on, and on the described lead frame of opposite side, be formed for being installed to installation on the installation base plate with lead-in wire, described installation is erected and forms mounting terminal to described opposite side with going between;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame;
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside.
2. a piezoelectric oscillator is characterized in that,
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, described connection is formed splicing ear with lead-in wire to described one edge-on, and formation has the installation lead-in wire that is used to be installed to the mounting terminal on the installation base plate on the described lead frame of opposite side;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame;
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside, and makes and be formed with described installation with the thickness of the described lead frame on the opposite side of lead-in wire thickness less than the described mounting terminal that forms on lead-in wire in described installation.
3. piezoelectric oscillator according to claim 1 and 2 is characterized in that,
The described installation thickness of the thickness of the base end side that goes between less than the described mounting terminal of end side.
4. according to any one described piezoelectric oscillator in the claim 1 to 3, it is characterized in that described mounting terminal is arranged on the position higher than the lower surface of described resin-encapsulated.
5. a piezoelectric oscillator is characterized in that,
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, on the described lead frame of opposite side, be formed for being installed to installation on the installation base plate with lead-in wire, described installation is erected and forms mounting terminal to described opposite side with going between;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame;
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside, and makes and be formed with described connection with the thickness of the described lead frame of a side of lead-in wire thickness less than the splicing ear that forms on lead-in wire in described connection.
6. according to any one described piezoelectric oscillator in the claim 1 to 5, it is characterized in that,
The described connection thickness of the thickness of the base end side that goes between less than the described splicing ear of end side.
7. according to any one described piezoelectric oscillator in the claim 1 to 6, it is characterized in that,
On described laminated type lead frame, the attribute inspection, characteristic that is formed for carrying out described IC regulate and/or described piezoelectric vibrator and described splicing ear between the adjusting terminal of conducting affirmation;
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and described adjusting terminal is exposed to the outside.
8. piezoelectric oscillator according to claim 7 is characterized in that,
Described mounting terminal forms with described adjusting terminal has same height.
9. according to any one described piezoelectric oscillator in the claim 1 to 8, it is characterized in that,
The described installation thickness of the thickness of the base end side that goes between less than the described mounting terminal of end side.
10. according to any one described piezoelectric oscillator in the claim 1 to 9, it is characterized in that,
The described connection thickness of the thickness of the base end side that goes between less than the described splicing ear of end side.
11. according to any one described piezoelectric oscillator in the claim 1 to 10, it is characterized in that,
Described IC is installed on the described side of described laminated type lead frame.
12. according to any one described piezoelectric oscillator in the claim 1 to 11, it is characterized in that,
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the upper surface of the lid of described piezoelectric vibrator is exposed to the outside.
13. according to any one described piezoelectric oscillator in the claim 1 to 11, it is characterized in that,
The lid of described piezoelectric vibrator is sealed in the inside of described resin-encapsulated.
14. according to any one described piezoelectric oscillator in the claim 1 to 13, it is characterized in that,
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal and the side of described mounting terminal are exposed to the outside.
15. according to any one described piezoelectric oscillator in the claim 1 to 14, it is characterized in that,
Described mounting terminal is formed with at least one recess or protuberance on described interarea.
16. according to any one described piezoelectric oscillator in the claim 1 to 15, it is characterized in that,
Described mounting terminal is formed with at least one recess or protuberance on opposition side and composition surface resin-bonded of described interarea.
17. according to any one described piezoelectric oscillator in the claim 1 to 16, it is characterized in that,
The fastener that on the short transverse that is formed with on the side of described encapsulation at described piezoelectric vibrator, works,
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated.
18. according to any one described piezoelectric oscillator in the claim 1 to 17, it is characterized in that,
For terminal and the described mounting terminal that connects described IC, on the lead frame of a described side, form a pair of wiring with lead-in wire, described each wiring is formed a pair of cloth line terminals with lead-in wire to described one edge-on;
Described a pair of wiring with of being connected in described IC terminal and the described mounting terminal in the lead-in wire, is connected in described IC terminal and the described mounting terminal another with in the described a pair of cloth line terminals another;
On described piezoelectric vibrator, be formed for being connected respectively to the pair of electrodes pad of described a pair of cloth line terminals and be used for the interconnective wiring pattern of described pair of electrodes pad.
19. according to any one described piezoelectric oscillator in the claim 1 to 18, it is characterized in that,
Described mounting terminal makes the end outstanding from the side of described resin-encapsulated.
20. according to any one described piezoelectric oscillator in the claim 1 to 19, it is characterized in that,
Described splicing ear in the face of the interarea that engages with described piezoelectric vibrator and its opposition side any one side or two on, be formed with at least one recess or protuberance.
21. according to any one described piezoelectric oscillator in the claim 1 to 20, it is characterized in that,
Described connection with lead-in wire and described installation with lead-in wire one or both of on, be formed with and be used to otch that resin is entered.
22. according to any one described piezoelectric oscillator in the claim 1 to 21, it is characterized in that,
The described mounting terminal of the lead frame of described opposite side is thicker than other parts.
23. a method of making piezoelectric oscillator may further comprise the steps:
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, described connection is formed splicing ear with lead-in wire to described one edge-on, and on the described lead frame of opposite side, be formed for being installed to the installation of installation base plate with going between, described installation is erected and forms mounting terminal to described opposite side with lead-in wire, described lead frame is stacked and form described laminated type lead frame;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame; And
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside.
24. a method of making piezoelectric oscillator may further comprise the steps:
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, described connection is formed splicing ear with lead-in wire to described one edge-on, and on the described lead frame of opposite side, be formed for being installed to the installation of installation base plate with going between, with described installation with the base end side attenuate of lead-in wire endways side form mounting terminal, described lead frame is stacked and form described laminated type lead frame;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame; And
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside.
25. the method according to claim 23 or 24 described manufacturing piezoelectric oscillators is characterized in that,
Comprise the step of removal attached to the resin on the interarea of described mounting terminal.
26. the method according to any one described manufacturing piezoelectric oscillator in the claim 23 to 25 is characterized in that,
Be pressed in the step that is sealed to described resin-encapsulated inside on the die surface by interarea with described mounting terminal,
The framework from described lead frame thereafter downcuts the step of described resin-encapsulated the nonuseable part that cuts off described mounting terminal.
27. a portable phone unit is characterized in that,
Utilize following piezoelectric oscillator to obtain the control clock signal:
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, described connection is formed splicing ear with lead-in wire to described one edge-on, and the installation that is formed for being installed to installation base plate on the described lead frame of opposite side is with lead-in wire, and described installation is erected and forms mounting terminal to described opposite side with going between;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame;
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside.
28. a portable phone unit is characterized in that,
Utilize following piezoelectric oscillator to obtain the control clock signal:
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, described connection is formed splicing ear with lead-in wire to described one edge-on, and on the described lead frame of opposite side, form installation with lead-in wire with the mounting terminal that is used to be installed to installation base plate;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame;
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside, and makes and be formed with described installation with the thickness of the described lead frame of the opposite side of lead-in wire thickness less than the described mounting terminal that forms on lead-in wire in described installation.
29. a portable phone unit is characterized in that,
Utilize following piezoelectric oscillator to obtain the control clock signal:
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, the installation that is formed for being installed to installation base plate on the described lead frame of opposite side is with lead-in wire, and described installation is erected and forms mounting terminal to described opposite side with going between;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame;
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside, and makes and be formed with described connection with the thickness of the described lead frame of a side of lead-in wire thickness less than the splicing ear that forms on lead-in wire in described connection.
30. an electronic equipment is characterized in that,
Utilize following piezoelectric oscillator to obtain the control clock signal:
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, described connection is formed splicing ear with lead-in wire to described one edge-on, and the installation that is formed for being installed to installation base plate on the described lead frame of opposite side is with lead-in wire, and described installation is erected and forms mounting terminal to described opposite side with going between;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame;
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside.
31. an electronic equipment is characterized in that,
Utilize following piezoelectric oscillator to obtain the control clock signal:
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, described connection is formed splicing ear with lead-in wire to described one edge-on, and on the described lead frame of opposite side, form installation with lead-in wire with the mounting terminal that is used to be installed to installation base plate;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame;
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside, and makes and be formed with described installation with the thickness of the described lead frame of the opposite side of lead-in wire thickness less than the described mounting terminal that forms on lead-in wire in described installation.
32. an electronic equipment is characterized in that,
Utilize following piezoelectric oscillator to obtain the control clock signal:
In the laminated type lead frame that constitutes by two lead frames, the connection that is formed for being connected with piezoelectric vibrator on the described lead frame of a side is with going between, the installation that is formed for being installed to installation base plate on the described lead frame of opposite side is with lead-in wire, and described installation is erected and forms mounting terminal to described opposite side with going between;
The IC that will be formed with oscillating circuit is installed on the described laminated type lead frame;
The described piezoelectric vibrator that will be sealed with piezoelectric vibration piece in encapsulation is installed on the described laminated type lead frame;
Described laminated type lead frame and described piezoelectric vibrator are sealed in the inside of resin-encapsulated, and the interarea of described mounting terminal is exposed to the outside, and makes and be formed with described connection with the thickness of the described lead frame of a side of lead-in wire thickness less than the splicing ear that forms on lead-in wire in described connection.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP358392/2002 | 2002-12-10 | ||
| JP2002358392 | 2002-12-10 | ||
| JP2003106598 | 2003-04-10 | ||
| JP106598/2003 | 2003-04-10 | ||
| JP171195/2003 | 2003-06-16 | ||
| JP2003171195 | 2003-06-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1630977A true CN1630977A (en) | 2005-06-22 |
| CN100471037C CN100471037C (en) | 2009-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB038035960A Expired - Lifetime CN100471037C (en) | 2002-12-10 | 2003-07-15 | Piezoelectric oscillator, manufacturing method thereof, and electronic equipment |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100661690B1 (en) |
| CN (1) | CN100471037C (en) |
| TW (1) | TW200414676A (en) |
| WO (1) | WO2004054089A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103155590A (en) * | 2010-11-01 | 2013-06-12 | 日本电气株式会社 | Oscillator and portable device |
| CN103681522A (en) * | 2012-09-18 | 2014-03-26 | 三菱电机株式会社 | Semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6643213B2 (en) * | 2016-09-16 | 2020-02-12 | 新光電気工業株式会社 | Lead frame, manufacturing method thereof and electronic component device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01189151A (en) * | 1988-01-25 | 1989-07-28 | Oki Electric Ind Co Ltd | Outer lead of surface mounting type semiconductor device |
| JPH01145140U (en) * | 1988-03-28 | 1989-10-05 | ||
| JPH04116416U (en) * | 1991-03-28 | 1992-10-19 | 京セラ株式会社 | crystal oscillator |
| WO1996001524A1 (en) * | 1994-07-04 | 1996-01-18 | Seiko Epson Corporation | Piezoelectric oscillator |
| JPH09219491A (en) * | 1996-02-08 | 1997-08-19 | Toshiba Corp | Lead frame and semiconductor device |
| KR100214561B1 (en) * | 1997-03-14 | 1999-08-02 | 구본준 | Buttom lead package |
| JP2000170568A (en) * | 1998-09-28 | 2000-06-20 | Toyota Motor Corp | Engine automatic stopping/restarting controller for vehicle |
| JP2000150720A (en) * | 1998-11-05 | 2000-05-30 | Fuji Electric Co Ltd | Plastic molded type semiconductor device |
| JP2001332932A (en) * | 2000-05-22 | 2001-11-30 | Daishinku Corp | Piezoelectric oscillator |
| JP3436249B2 (en) * | 2000-11-21 | 2003-08-11 | 株式会社大真空 | Package and piezoelectric oscillator for piezoelectric vibration device |
| JP2002330027A (en) * | 2001-04-27 | 2002-11-15 | Nippon Dempa Kogyo Co Ltd | Temperature compensating crystal oscillator for surface mounting |
-
2003
- 2003-07-15 KR KR1020047012285A patent/KR100661690B1/en active IP Right Grant
- 2003-07-15 CN CNB038035960A patent/CN100471037C/en not_active Expired - Lifetime
- 2003-07-15 WO PCT/JP2003/008996 patent/WO2004054089A1/en active Application Filing
- 2003-07-15 TW TW092119310A patent/TW200414676A/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103155590A (en) * | 2010-11-01 | 2013-06-12 | 日本电气株式会社 | Oscillator and portable device |
| CN103155590B (en) * | 2010-11-01 | 2016-05-04 | 日本电气株式会社 | Oscillator device and portable equipment |
| CN103681522A (en) * | 2012-09-18 | 2014-03-26 | 三菱电机株式会社 | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040078692A (en) | 2004-09-10 |
| TWI311857B (en) | 2009-07-01 |
| KR100661690B1 (en) | 2006-12-26 |
| CN100471037C (en) | 2009-03-18 |
| WO2004054089A1 (en) | 2004-06-24 |
| TW200414676A (en) | 2004-08-01 |
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