KR100661690B1 - Piezoelectric oscillator and production method thereof and portable phone device and electronic apparatus - Google Patents

Abstract

The piezoelectric oscillator that can be miniaturized by reducing the plane size is provided. The lead 32 for a connection with the piezoelectric vibrator 10 is formed in the upper lead frame 30 with respect to the laminated lead frame 50 which consists of two lead frames 30 and 40, and the connection lead 32 ), The connecting terminal 36 is formed on the upper side, and the mounting lead 42 to the mounting board is formed on the lower lead frame 40, and the mounting lead 42 is raised to the lower side to mount the mounting terminal ( 46 is formed, the IC 60 having the oscillation circuit is mounted on the laminated lead frame 50, and the piezoelectric vibrator 10 in which the piezoelectric vibrating element 12 is sealed inside the package 20 is laminated. The laminated lead frame 50 and the piezoelectric vibrator 10 were sealed and formed in the resin package, mounted on the frame 50 and exposing the main surface of the mounting terminal 46.

Description

Piezoelectric oscillator and its manufacturing method, a mobile telephone apparatus, and an electronic device {PIEZOELECTRIC OSCILLATOR AND PRODUCTION METHOD THEREOF AND PORTABLE PHONE DEVICE AND ELECTRONIC APPARATUS}             

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric oscillator, a method of manufacturing the same, a mobile telephone apparatus and an electronic device using the piezoelectric oscillator.

Piezoelectric oscillators are widely used to obtain constant frequency signals in electrical circuits. Japanese Utility Model Publication No. 1993-16724 discloses a conventional piezoelectric oscillator 501 shown in FIG. 9.

9A is a plan view during manufacturing, and FIG. 9B is a side cross-sectional view at a portion corresponding to the H-H line in FIG. 9A. In the piezoelectric oscillator 501 illustrated in FIG. 9B, the piezoelectric vibrator 510 is mounted on the lower surface of the lead frame 530, and the integrated circuit device (IC) 560 is mounted on the upper surface of the lead frame 530. The resin package 570 is formed so that the whole may be sealed by resin. Moreover, the cylindrical piezoelectric vibrator 510 shown to FIG. 9A and 9B seals the piezoelectric vibrating piece which formed the excitation electrode in the piezoelectric flat plate in the metal cylinder, and is electrically conductive with the said excitation electrode. The external lead 524 which extends is taken out to the exterior of a cylinder. On the other hand, the IC 560 forms an oscillation circuit.

9A shows a state just before forming the resin package 570. The die pad 552 is disposed in the center of the lead frame 530, and the IC 560 is mounted thereon. Further, mounting leads 542 of the piezoelectric oscillator 501 are disposed on all sides of the die pad 552, and each of them is electrically connected to the IC 560 by wire bonding. The outer portion of the mounting lead 542 is bent downward after the resin package 570 is formed to form a mounting terminal. In addition, the connecting lead 532 of the piezoelectric vibrator 510 and the IC 560 is formed in the intermediate part of the mounting lead 542 in the up-down direction of FIG. 9A. The external lead 524 of the piezoelectric vibrator 510 is connected to the lower surface of the connecting lead 532, and the upper surface of the connecting lead 532 is connected to the IC 560 by wire bonding. As a result, the piezoelectric vibrator 510 and the IC 560 are electrically connected.

The same configuration is also disclosed in Japanese Patent No. 2621828.

Piezoelectric oscillators are used in communication means such as mobile phones, but requests for downsizing for mobile phones and the like have become stronger. Accordingly, miniaturization and thinning of piezoelectric oscillators are strongly demanded. In recent years, a package type (plane mounted) piezoelectric vibrator has been developed in which a piezoelectric vibrating piece is sealed inside a package and an external electrode conducting with the excitation electrode of the piezoelectric vibrating piece is formed on the back surface of the package. Package piezoelectric vibrators have been developed in place of the cylindrical piezoelectric vibrators 510 shown in FIGS. 9A and 9B in order to meet the demand for miniaturization and thinning of piezoelectric oscillators.

However, as piezoelectric oscillators become smaller, mounting terminals and the like joined to the mounting substrate also become smaller. Therefore, as the piezoelectric oscillator becomes smaller, the joining area of the mounting terminal to the mounting board becomes smaller and the joining strength decreases. For this reason, when a piezoelectric oscillator is mounted in portable electronic devices, such as a mobile telephone, when they drop, a big impact force will act and the possibility of peeling in the junction part with a mounting substrate increases. This is the same also in the junction part of the resin which comprises a resin package, and the terminal of a lead frame. As the piezoelectric oscillator becomes smaller, it is a major problem to improve the bonding strength with the resin constituting the mounting substrate or the resin package.

By the way, in the piezoelectric oscillator mentioned above, since the connection lead needs to be arrange | positioned in the intermediate part of the mounting lead, there exists a problem that a plane size becomes large. Therefore, there is a limit in miniaturization of the piezoelectric oscillator.

Here, an object of the present invention is to provide a piezoelectric oscillator which can be miniaturized by reducing a plane size and a manufacturing method thereof.

Moreover, an object of this invention is to improve joining strength.

Summary of the Invention

In order to achieve the above object, the piezoelectric oscillator according to the present invention forms a lead for connection with a piezoelectric vibrator on one side of the lead frame with respect to the laminated lead frame composed of two lead frames, and the lead for connection. Is formed on the one side to form a connection terminal, a mounting lead to a mounting board is formed on the lead frame on the other side, the mounting lead is placed on the other side to form a mounting terminal, and an oscillation circuit is formed. The formed IC is mounted on the laminated lead frame, the piezoelectric vibrator whose piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, and the laminate is exposed while exposing the main surface of the mounting terminal to the outside. The lead frame and the piezoelectric vibrator were formed by sealing the inside of the resin package.

In this case, it becomes possible to arrange | position overlapping connection terminal and mounting terminal, and it is not necessary to arrange both. Therefore, the plane size of the piezoelectric oscillator can be made small. In addition, before the piezoelectric vibrator is mounted on the laminated lead frame, the piezoelectric oscillator can be formed by combining the piezoelectric vibrator of the good product and the IC of the good product by performing frequency adjustment of the piezoelectric vibrator and operation check of the IC. As a result, the IC of the good product is not discarded, the yield rate of the IC can be improved, and the manufacturing cost can be reduced.

Moreover, since the whole laminated lead frame and the piezoelectric vibrator were comprised for resin sealing, even if the combination of a kind of piezoelectric vibrator and IC changes, it is possible to use the same resin molding mold. Therefore, it is possible to cope with the production of small quantities of various varieties. In addition, it becomes possible to insulate the whole of the laminated lead frame and the piezoelectric vibrator, and also to prevent the ingress of dust and moisture. Thus, occurrence of electrical and chemical failures can be prevented.

Moreover, the piezoelectric oscillator which concerns on this invention forms the lead for connection with a piezoelectric vibrator in the said lead frame on one side, and the said lead for connection to the said one side with respect to the laminated lead frame which consists of two lead frames. A mounting lead having a mounting terminal to a mounting board is formed at the same time as the connecting terminal, and an IC having an oscillation circuit is mounted on the laminated lead frame, and a piezoelectric element is mounted inside the package. The piezoelectric vibrator sealed with the vibrating piece is mounted on the laminated lead frame, and the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package while exposing the main surface of the mounting terminal to the outside. The thickness of the lead frame on the other side, which is formed, is thinner than the mounting terminal formed on the mounting lead. It was formed.

According to the present invention as described above, the same effect as described above can be obtained, and the lead frame on the other side is formed thinner than the mounting terminal formed on the mounting lead, whereby the resin package can be thinned.

The mounting lead can have a thickness at the proximal end thinner than a mounting terminal at the distal end side. Thereby, the mounting terminal can be formed without setting (bending) the mounting lead. For this reason, since the area of a mounting terminal can be enlarged, the mounting strength (bonding strength) to a mounting board can be improved. The mounting terminal may be installed at a position higher than the lower end surface of the resin package. As a result, when the piezoelectric oscillator is mounted on the mounting board, the solder fills the gap formed between the mounting terminal and the mounting board, so that the bonding state of the mounting terminal can be easily visually confirmed.

Moreover, the piezoelectric oscillator which concerns on this invention forms the lead for connection with a piezoelectric vibrator in the said lead frame on one side, and the mounting lead to a mounting board is formed with respect to the laminated lead frame comprised by two lead frames. An IC in which the mounting lead is formed on the side, the mounting lead is raised on the other side to form a mounting terminal, and an IC having an oscillation circuit is mounted on the laminated lead frame, and the piezoelectric vibrating element is sealed inside the package. One side in which a piezoelectric vibrator is mounted on the laminated lead frame and the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package while the main surface of the mounting terminal is exposed to the outside, and the lead for connection is formed. Characterized in that the thickness of the lead frame is thinner than that of the connection terminal formed on the connection lead. I am doing it. Thereby, thickness reduction of a resin package can be aimed at.

The connecting lead may have a thickness at a proximal end thinner than that of the connecting terminal at a distal end side. Thereby, a connection terminal can be formed even if a connection lead is not raised, and an area becomes large and joining strength can be improved. Further, the laminated lead frame is provided with an adjustment terminal for inspecting the characteristics of the IC, adjusting the characteristics and / or confirming the conduction of the piezoelectric vibrator and the connection terminal, and exposing the adjustment terminal to the outside while The frame and the piezoelectric vibrator may be formed by sealing the inside of the resin package. Thereby, in the product state after resin sealing, the characteristic test of IC, a characteristic adjustment, and / or the conduction confirmation of the piezoelectric vibrator and a connection terminal can be performed.

The mounting terminal may be at a position higher or lower than the adjustment terminal, but may be formed at the same height as the adjustment terminal. Thereby, when processing the lead frame of the other side, in order to make a mounting terminal and an adjustment terminal into a different height, it is not necessary to raise a mounting lead on the other side, and can simplify a process.

The mounting lead can have a thickness at the proximal end thinner than a mounting terminal at the distal end side. As a result, when the mounting terminal is formed, it is not necessary to stand the mounting lead on the other side, and since the inclined portion is not formed in the mounting lead, the substantial bonding area of the mounting terminal can be increased, and the bonding strength to the mounting substrate is increased. Can improve. Moreover, the said connection lead can form thickness of a base end side thinner than the connection terminal of a front end side. Thereby, when forming a connection terminal, it is not necessary to set up a connection lead to one side, and since the inclination part is not formed in a connection lead, the substantial joint area of a connection terminal can be enlarged and the joining strength with a piezoelectric vibrator Can improve.

The IC may be mounted on one side of the laminated lead frame. This makes it difficult to reach the IC even if moisture enters from below the piezoelectric oscillator, for example, thereby preventing the IC from failing. When the temperature compensation circuit is added to the IC, the temperature sensor is arranged near the piezoelectric vibrator, so that the temperature difference between the temperature sensor and the piezoelectric vibrating piece can be reduced. Therefore, the temperature characteristic of a piezoelectric vibrating piece can be corrected correctly.

The laminated lead frame and the piezoelectric vibrator may be sealed inside the resin package while the upper surface of the lid of the piezoelectric vibrator is exposed to the outside. Since the product specification of a piezoelectric vibrator is described on the upper surface of a lid, it is not necessary to describe a product specification on the surface of a resin package by exposing a lid. In addition, since the position of the lid is fixed in the resin molding mold, the posture of the piezoelectric vibrator can be stabilized.

Further, the lid of the piezoelectric vibrator may be formed by sealing the inside of the resin package. Thereby, in the process of soldering the surface of a mounting terminal, since the exposed lid is prevented from being coat | covered by solder plating, it is unnecessary to mask the upper surface of a lid.

The laminated lead frame and the piezoelectric vibrator may be sealed inside the resin package while the main surface of the mounting terminal and the side surface of the mounting terminal are exposed to the outside. In this case, the solder pushed out from the main surface of the mounting terminal rises along the side surface of the mounting terminal. As a result, fillets are formed from the electrodes of the mounting substrate over the side surfaces of the mounting terminals. Thereby, connection of the electrode of a mounting board and the mounting terminal of a piezoelectric oscillator can be confirmed easily from an external appearance.

The mounting terminal may be provided with at least one concave portion or convex portion on the main surface. By forming the concave portion or the convex portion on the main surface, the substantial joining area with the mounting substrate increases, and the solder or the convex portion that enters the concave portion exhibits an anchor effect. For this reason, the joint strength of a mounting terminal and a mounting board | substrate can be improved, and a piezoelectric oscillator can be firmly fixed to a mounting board | substrate. Furthermore, the mounting terminal can form at least one concave portion or convex portion on the joining surface of the resin opposite to the main surface. As a result, the mounting terminal can substantially increase the bonding area with the resin constituting the resin package, and can improve the bonding strength with the resin due to the anchor effect of the resin entering the recess or the convex portion. Peeling can be prevented.

In addition, a latch in the height direction of the piezoelectric vibrator may be formed on the side of the package, and the laminated lead frame and the piezoelectric vibrator may be formed by sealing the inside of the resin package. As a result, the piezoelectric vibrator becomes hard to be pulled out of the piezoelectric oscillator and thus is firmly fixed.

In addition, in order to connect the terminal of the IC and the mounting terminal, a pair of wiring leads are formed in the lead frame on one side, and the wiring leads are erected on the one side to form a pair of wiring terminals. One of the pair of wiring leads is connected to one of the terminals or the mounting terminal, and the other of the pair of wiring leads is connected to the other of the IC terminal or the mounting terminal and connected to the pair of wiring terminals. A pair of electrode pads connected to each other and a wiring pattern for connecting the pair of electrode pads to each other may be formed on the piezoelectric vibrator. Thereby, even when the assignment order of the function of an IC terminal differs from the assignment order of the function of a mounting terminal, the corresponding terminal can be electrically connected. As a result, it is possible to use the same type of IC even among piezoelectric oscillators in which the order of the functions of the mounting terminals differs. Therefore, the kind of IC can be reduced, and manufacturing cost and product cost can be reduced.

An end portion of the mounting terminal can protrude from a side surface of the resin package. Thereby, when soldering a mounting terminal to a mounting board, solder rises to the part which protruded from the resin package of a mounting terminal, and forms a fillet, and visually, the quality of mounting (bonding) can be judged easily. In addition, since the solder covers the mounting terminal protruding from the resin package, the mounting strength can be improved.

In addition, the connection terminal can form at least one concave portion or convex portion on one or both of the main surface or the surface on the opposite side to which the piezoelectric vibrator is joined. As a result, the connection area of the connection terminal with the piezoelectric vibrator or the resin area of the resin package increases, and at the same time, the anchoring effect is caused by the concave or convex portions formed in the connection terminal. Bonding strength with can be improved.

Furthermore, the notch which introduce | transduces a resin can be formed in either or both of the said connection lead or the said mounting lead. Thereby, since resin which comprises a resin package enters a notch, and exhibits an anchor effect, the joining strength of resin and a connection lead or a mounting lead can improve, and impact resistance can be improved.

The lead frame on the other side can form the mounting terminal thicker than the other parts. As a result, when the mounting terminal is exposed from the resin package, other unnecessary portions other than the mounting terminal are thinner than the mounting terminal, and therefore are sealed in the resin package without bending the lead frame on the other side. Therefore, when joining a mounting terminal to a mounting board, since parts other than a mounting terminal are not exposed from a resin package, there is no possibility of shorting the pattern etc. which were provided in the mounting board.

On the other hand, the manufacturing method of the piezoelectric oscillator which concerns on this invention forms the lead for connection with a piezoelectric vibrator in the said lead frame on one side, with respect to the laminated lead frame which consists of two lead frames, The connection terminal is formed on one side, and a mounting lead to a mounting board is formed on the lead frame on the other side, the mounting lead is raised on the other side to form a mounting terminal, and the lead frames are Laminating to form the laminated lead frame, mounting an IC having an oscillation circuit to the laminated lead frame, and mounting the piezoelectric vibrator in which a piezoelectric vibrator is sealed inside the package to the laminated lead frame. And resin packaging the laminated lead frame and the piezoelectric vibrator while exposing the main surface of the mounting terminal to the outside. It made of a structure comprising the step of sealing the interior. Thereby, the plane size of a piezoelectric oscillator can be made small.

Moreover, in the manufacturing method of the piezoelectric oscillator which concerns on this invention, the lead for connection with a piezoelectric vibrator is formed in the said lead frame on one side with respect to the laminated lead frame which consists of two lead frames, The connection terminal is formed upright on one side, a mounting lead to a mounting board is formed on the lead frame on the other side, the proximal end of the mounting lead is made thin, and mounting terminals are formed on the front end side. Laminating a lead frame to form the laminated lead frame; mounting an IC having an oscillation circuit on the laminated lead frame; and piezoelectric vibrator in which a piezoelectric vibrator is sealed inside the package. And the laminate lead frame and the piezoelectric vibrator while exposing the main surface of the mounting terminal to the outside. It is characterized by including the process of sealing in the inside of a resin package. As a result, since the inclination portion is not formed in the mounting lead, the substantial bonding area of the mounting terminal can be increased, and the bonding strength to the mounting substrate can be increased. The thinning of the proximal end of the mounting lead can be easily performed by plastic working or etching by pressing.

Moreover, you may make it the structure further including the process of removing resin adhering to the main surface of the said mounting terminal. Thereby, solder plating can be performed on the main surface of a mounting terminal. Further, the step of sealing the inside of the resin package is performed by pressing the main surface of the mounting terminal against the mold surface, and in the step of separating the subsequent resin package from the frame portion of the lead frame, the mounting terminal is unnecessary. Wealth can be cut. Thereby, since the main surface of a mounting terminal adheres to a metal mold | die surface at the time of resin sealing, resin can be prevented from adhering to the main surface of a mounting terminal, and the process of removing resin adhering to a main surface can be skipped. When the resin package is separated from the frame portion of the lead frame, if the unnecessary portion of the mounting terminal is cut and removed, the mounting area can be prevented from increasing.

On the other hand, the mobile telephone apparatus of this invention forms the lead for connection with a piezoelectric vibrator in the said lead frame on one side, and the said lead for connection to the said one side with respect to the laminated lead frame comprised by two lead frames. An IC in which a connecting lead to a mounting board is formed upright, a mounting lead to a mounting board is formed in the lead frame on the other side, the mounting lead is standing on the other side to form a mounting terminal, and an oscillation circuit is formed. The laminate lead frame and the piezoelectric vibrator are mounted on a laminated lead frame, and the piezoelectric vibrator whose piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, and the main surface of the mounting terminal is exposed to the outside. A piezoelectric oscillator formed by sealing the inside of the circuit is characterized in that a clock signal for control is obtained.

Thereby, it becomes possible to arrange | position a connection terminal and a mounting terminal in superimposition, and it is not necessary to arrange both in a line, and since the plane size of a piezoelectric oscillator can be made small, a more compact mobile telephone apparatus can be provided.

Moreover, the mobile telephone apparatus of this invention forms the lead for connection with a piezoelectric vibrator in the said lead frame on one side, and the said lead for connection to the said one side with respect to the laminated lead frame which consists of two lead frames. A mounting lead having a mounting terminal to a mounting board is formed at the same time as the connecting terminal, and an IC having an oscillation circuit is mounted on the laminated lead frame, and a piezoelectric element is mounted inside the package. The piezoelectric vibrator sealed with the vibrating piece is mounted on the laminated lead frame, and the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package while exposing the main surface of the mounting terminal to the outside. The thickness of the lead frame on the other side where the recess is formed is thinner than the mounting terminal formed on the mounting lead. It characterized by a by a piezoelectric oscillator, which consists of, so as to obtain a clock signal for control.

As a result, the same effect as described above can be obtained, and the lead frame on the other side can be made thinner than the mounting terminal formed on the mounting lead, so that the resin package of the piezoelectric oscillator can be made thinner, thereby making it more compact. A telephone apparatus can be provided. Furthermore, the mounting lead can have a thickness at the proximal end thinner than a mounting terminal at the distal end side. Thereby, the mounting terminal can be formed without setting (bending) the mounting lead. For this reason, the area of a mounting terminal can be enlarged, the mounting strength (bonding strength) to a mounting board | substrate can be improved, and the reliability in the mobile telephone apparatus which may be impacted, for example by falling, etc. Can be further improved.

Moreover, the mobile telephone apparatus of this invention forms the lead for connection with a piezoelectric vibrator in the said lead frame on one side, and the mounting lead to a mounting board is made with respect to the laminated lead frame comprised from two lead frames. An IC in which the mounting lead is formed on the side, the mounting lead is raised on the other side to form a mounting terminal, and an IC having an oscillation circuit is mounted on the laminated lead frame, and the piezoelectric vibrating element is sealed inside the package. One side in which a piezoelectric vibrator is mounted on the laminated lead frame and the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package while the main surface of the mounting terminal is exposed to the outside, and the lead for connection is formed. The piezoelectric oscillator in which the thickness of the lead frame is thinner than the connecting terminal formed in the connecting lead. To further characterized in that one so as to obtain a clock signal for control.

As a result, the thickness of the resin package of the piezoelectric oscillator can be reduced, whereby a more compact mobile telephone apparatus can be provided. The connecting lead may have a thickness at the proximal end thinner than the connecting terminal at the distal end side. Thereby, a connection terminal can be formed even if a connection lead is not erected, the area becomes large, the joining strength can be improved, for example, the reliability of the mobile telephone apparatus which may be subjected to the impact of falling etc. further improves the reliability. You can.

On the other hand, the electronic apparatus of this invention forms the lead for connection with a piezoelectric vibrator in the said lead frame on one side, and the said lead for connection is stood on the said one side with respect to the laminated lead frame comprised by two lead frames. The IC is formed by forming a connection terminal, forming a mounting lead to a mounting board in the lead frame on the other side, forming the mounting terminal by standing the mounting lead on the other side, and forming an oscillating circuit. The laminate lead frame and the piezoelectric vibrator are mounted on a lead frame, the piezoelectric vibrator whose piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, and the main surface of the mounting terminal is exposed to the outside. A piezoelectric oscillator formed by sealing the inside thereof is characterized in that a clock signal for control is obtained.

Thereby, it becomes possible to arrange | position a connection terminal and a mounting terminal in superimposition, and it is not necessary to arrange both in a line, and since the plane size of a piezoelectric oscillator can be made small, a more compact electronic device can be provided.

Moreover, the electronic device of this invention forms the lead for connection with a piezoelectric vibrator in the said lead frame on one side, and the said lead for connection is stood on the said one side with respect to the laminated lead frame comprised by two lead frames. The connecting lead is formed, and a mounting lead having mounting terminals to a mounting board is formed in the lead frame on the other side, and an IC having an oscillation circuit is mounted on the laminated lead frame, and piezoelectric vibrations inside the package. The laminated lead frame and the piezoelectric vibrator are sealed inside the resin package while the piezoelectric vibrator with the side sealed is mounted on the laminated lead frame, and the main surface of the mounting terminal is exposed to the outside. The lead frame formed on the other side is formed to be thinner than the mounting terminal formed on the mounting lead. By a control oscillator which is characterized in that one so as to obtain a clock signal for control.

As a result, the same effect as described above can be obtained, and the lead frame on the other side can be made thinner than the mounting terminal formed on the mounting lead, so that the resin package of the piezoelectric oscillator can be made thinner, which leads to more compact electronics. A device can be provided. Further, the mounting lead can have a thickness at the proximal end thinner than a mounting terminal at the distal end side. Thereby, the mounting terminal can be formed without setting (bending) the mounting lead. For this reason, it is possible to increase the area of the mounting terminal, thereby improving the mounting strength (bonding strength) to the mounting substrate, and for example, the reliability of the electronic device which may be subjected to impacts such as drops. It can improve more.

Moreover, the electronic device of this invention forms the lead for connection with a piezoelectric vibrator in the said lead frame on one side, and the lead for mounting to a mounting board with respect to the laminated lead frame comprised of two lead frames. The piezoelectric element formed on the lead frame of the present invention, the mounting lead is placed on the other side to form a mounting terminal, and an IC having an oscillation circuit is mounted on the laminated lead frame, and the piezoelectric vibrating element sealed inside the package. The oscillator is mounted on the laminated lead frame, and the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package while exposing the main surface of the mounting terminal to the outside. By the piezoelectric oscillator in which the thickness of the said lead frame is formed thinner than the connection terminal formed in the said connection lead, Characterized in that one so as to obtain a clock signal of fish farming.

Thereby, since the resin package of a piezoelectric oscillator can be made thin, a smaller electronic device can be provided. The connecting lead may have a thickness at the proximal end thinner than the connecting terminal at the distal end side. As a result, the connecting terminal can be formed without setting up the connecting lead, the area is increased, and the bonding strength can be improved. For example, in an electronic device which may be subjected to an impact such as a drop, the reliability can be further improved. Can be.

1 is a perspective view of a state in which the piezoelectric oscillator according to the first embodiment is disassembled;

2 is a side cross-sectional view of the piezoelectric oscillator according to the first embodiment,

3a and 3b are plan views of a lead frame,

4A-4H are perspective views of recess portions of the package,

5A and 5B are explanatory views of mounting terminals;

6A and 6B are explanatory diagrams of a frequency adjustment process;

7 is a perspective view of a state in which the piezoelectric oscillator according to the second embodiment is disassembled;

8 is an explanatory diagram of a wiring state;

9A and 9B are explanatory diagrams of a piezoelectric oscillator according to the prior art,

10 is an explanatory diagram of a lead frame of a third embodiment;

11A and 11B are explanatory views of resin sealing in the lead frame of the third embodiment,

12 is an explanatory diagram of a method of cutting a press margin in an embodiment;

13A to 13C are explanatory diagrams of a piezoelectric oscillator according to a third embodiment,

14 is a view showing a mounted state of the piezoelectric oscillator of the third embodiment,

15A and 15B are explanatory diagrams of a lead frame of a fourth embodiment;

16 is an explanatory diagram of a resin seal in a lead frame of a fourth embodiment;

17A to 17C are explanatory diagrams of the piezoelectric oscillator of the fourth embodiment;

18A and 18B are explanatory views of a method of mounting a piezoelectric oscillator according to a fourth embodiment;

19A to 19C are exploded perspective views of a piezoelectric oscillator according to a fifth embodiment;

20A to 20C are exploded perspective views of a piezoelectric oscillator according to a sixth embodiment;

21A to 21C are exploded perspective views of a piezoelectric oscillator according to a seventh embodiment;

22 is an explanatory diagram of a mounting lead according to another embodiment;

23A to 23C are explanatory diagrams of a lead for connection according to another embodiment;

Fig. 24 is a diagram showing a schematic configuration of a digital cellular phone device as an example of an electronic device using a piezoelectric oscillator according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of a piezoelectric oscillator and a manufacturing method thereof according to the present invention will be described in detail with reference to the accompanying drawings. In addition, what is described below is only one form of the Example of this invention, and this invention is not limited to these.

First, the first embodiment will be described.

1 is a perspective view showing a state where the piezoelectric oscillator according to the first embodiment is disassembled. 2 is a side cross sectional view taken along the line A-A of FIG. 1. 2 shows a state where the resin package 70 is removed. That is, although the cross section of the part of the laminated lead frame 50 in FIG. 2 attaches the terminal part of the position which is not cut | disconnected actually, since it attached for convenience of understanding, it does not show a cut surface, It shows the position of the up-down direction (vertical direction), such as each terminal part. In the piezoelectric oscillator 1 according to the first embodiment, the lead 32 for connecting with the piezoelectric vibrator 10 is connected to the upper lead frame with respect to the laminated lead frame 50 including the two lead frames 30 and 40. 30, the connecting lead 32 is erected on the upper side to form the connecting terminal 36, and the mounting lead 42 to the mounting substrate is formed on the lower lead frame 40. The mounting lead 46 is formed under the mounting lead 42, and the IC 60 having the oscillation circuit is mounted on the laminated lead frame 50, and the piezoelectric vibrating element ( The piezoelectric vibrator 10 sealed 12 is mounted on the laminated lead frame 50, and the laminated lead frame 50 and the piezoelectric vibrator 10 are mounted on the resin package 70 while exposing the main surface of the mounting terminal 46. ) (See Fig. 2) is formed by sealing inside. The IC may be an electronic component such as a resistor or a capacitor.

3A to 3B show a plan view of the lead frame. 3A is a plan view of the upper lead frame, and FIG. 3B is a plan view of the lower lead frame. In the first embodiment, two lead frames 30 and 40 are superimposed to form a laminated lead frame 50. Each of the lead frames 30 and 40 is provided with the metal frame portions 31 and 41 on a conductive metal sheet, and the same pattern is repeatedly formed inside the frame portions 31 and 41.

In the upper lead frame 30 shown in FIG. 3A, the lead 32 for connecting with a piezoelectric vibrator is formed in four corners of the inside of the frame part 31. As shown in FIG. In addition, at least three external electrodes are formed in the piezoelectric vibrator by combining an external electrode conducting with a pair of excitation electrodes and an external electrode for GND, so that at least three connection leads 32 are formed in the upper lead frame 30. . And the pad 34 for wire bonding is formed in the inner edge part of each connection lead 32 in the longitudinal direction of the frame part 31. As shown in FIG. Moreover, the pad 34 is connected to the long side of the frame part 31 so that the pad 34 may be supported on the same plane as the frame part 31. As a result, the connecting lead 32 is fixed to the frame portion 31. On the other hand, the inclined portion 35 is formed outside the pad 34, and the connection terminal 36 is formed outside the inclined portion 35. As shown in FIG. 1, by connecting the inclined portion 35 upward from the pad 34, the connection terminals 36 are arranged in parallel with a predetermined distance from the upper lead frame 30. The predetermined distance is a distance larger than the maximum height of the wire 62 bonded to the IC 60.

In the lower lead frame 40 shown in FIG. 3B, the mounting leads 42 to the mounting substrate are formed in four corners of the inside of the frame portion 41. Moreover, the pad 44 for wire bonding is formed in the inner edge part of each mounting lead 42 in the short side direction of the frame part 41. As shown in FIG. Moreover, the pad 44 is connected to the short side of the frame part 41 so that the pad 44 may be supported on the same plane as the frame part 41. As a result, the mounting lead 42 is fixed to the frame portion 41. On the other hand, the inclined portion 45 is formed outside the pad 44, and the mounting terminal 46 is formed outside the inclined portion 45. As shown in FIG. 1, by mounting the inclined portion 45 downward from the pad 44, the mounting terminals 46 are arranged in parallel with a predetermined distance from the lower lead frame 40.

In addition, in the intermediate part of each mounting lead 42 in the short side direction of the frame part 41, an adjustment terminal for conducting characteristic test of IC, characteristic adjustment, and / or confirming the conduction of a piezoelectric vibrator and a connection terminal is carried out 54 is formed. In addition, the characteristic test means the operation | movement check of IC after resin molding, the characteristic test as a piezoelectric oscillator, etc. In addition, the characteristic adjustment means that when the temperature compensation circuit is added to the IC, when the function of correcting the frequency change due to the temperature of the piezoelectric oscillator or changing the frequency by the input voltage is added to the IC, the change sensitivity is measured. To adjust, etc. The adjustment terminal 54 is connected to the short side of the frame part 41 and is supported on the same plane as the lower lead frame 40. In addition, since the mounting terminal 46 is arranged at a lower distance from the lower lead frame 40, the adjustment terminal 54 does not short-circuit with the electrode or the like of the mounting substrate. On the other hand, the die pad 52 is formed in the center part in the frame part 41 in the lower lead frame 40. As shown in FIG. The die pad 52 is connected to the long side of the frame portion 41 and is supported on the same plane as the lower lead frame 40. In addition, the adjustment terminal 54 and the die pad 52 may be formed in the upper lead frame. In addition, the position where a connection terminal, a mounting terminal, an adjustment terminal, and a die pad are connected to each frame part is not limited to a long side or a short side. For example, when there are many adjustment terminals, an adjustment terminal is connected to a long side and a die pad is connected to a short side.

Then, the upper lead frame 30 and the lower lead frame 40 are overlapped to form a laminated lead frame. The upper lead frame 30 and the lower lead frame 40 are fixed by performing spot welding or the like on the respective frame portions 31 and 41. Moreover, inside the frame parts 31 and 41, each lead of each lead frame is formed so that the upper lead frame 30 and the lower lead frame 40 may not contact.

On the other hand, as shown in FIG. 1, the integrated circuit element (IC) 60 is provided in the upper surface of the die pad 52. As shown in FIG. An oscillation circuit is formed in the IC 60, and a temperature compensation circuit and a voltage control circuit are added as necessary. Then, the IC 60 is mounted on the upper surface of the die pad 52 via the adhesive. The IC 60 may be mounted on the bottom surface of the die pad 52. However, when the IC 60 is mounted on the upper surface of the die pad 52, it is difficult to reach the IC 60 even if moisture enters from below the piezoelectric oscillator, thereby preventing the IC 60 from failing. . In addition, when the temperature compensation circuit is added to the IC 60, the temperature sensor is disposed near the piezoelectric vibrator 10, so that the temperature difference between the temperature sensor and the piezoelectric vibrating piece 12 can be reduced. Therefore, the temperature characteristic of the piezoelectric vibrating piece 12 can be corrected correctly.

Furthermore, each terminal of the laminated lead frame 50 and each terminal on the upper surface of the IC 60 are electrically connected. Specifically, the pad 34 of the connection terminal 36, the pad 44 and the adjustment terminal 54 of the mounting terminal 46, and respective terminals on the upper surface of the IC 60 are connected by wire bonding. Moreover, since the notch 38 was formed in the connection lead 32, the pad 44 of the mounting terminal 46 is exposed upwards. Thereby, wire bonding can be performed with respect to the pad 44 of the mounting terminal 46.

On the other hand, the piezoelectric vibrator 10 which encloses the piezoelectric vibrating piece 12 in the package 20 is formed. As shown in FIG. 2, the package 20 is formed by stacking and firing a plurality of sheets made of a ceramic material or the like. Specifically, each sheet is blanked in a predetermined shape, and not only a predetermined wiring pattern is formed on the surface of each sheet, but also each sheet is laminated and fired. A cavity 21 is formed in the package 20, and a mounting electrode 22 is formed on the bottom surface of the cavity 21. In addition, an external electrode 24 is formed on the rear surface of the package 20 to secure conduction with the mounting electrode 22 via the wiring patterns 23 and 24a. Moreover, you may connect up and down via the through hole instead of the side electrode 24a.

As shown in FIG. 1, the piezoelectric vibrating piece 12 forms the excitation electrode 14 on both surfaces of the flat plate which consists of piezoelectric materials, such as quartz. In addition, connection electrodes 15 which conduct with the respective excitation electrodes 14 are formed at the ends of the piezoelectric flat plates. As shown in FIG. 2, the piezoelectric vibrating piece 12 is mounted in a cantilever state inside the cavity 21 of the package 20. Specifically, the conductive adhesive 13 is apply | coated to the mounting electrode 22 of the package 20, and the connection electrode 15 (refer FIG. 1) of the piezoelectric vibrating piece 12 is adhere | attached. Thereby, it becomes possible to energize the excitation electrode 14 (refer FIG. 1) of the piezoelectric vibrating piece 12 from the external electrode 24 of the package 20. FIG. In addition, the piezoelectric vibrating piece 12 may be mounted in a straddle state.

Furthermore, the lid 28 is attached to the opening of the cavity 21 in the package 20, and the inside of the cavity 21 is hermetically sealed in a nitrogen atmosphere or a vacuum atmosphere. In addition, in the case of a metal lid, it mounts to the package 20 by seam welding, and in the case of a glass lid, via low melting glass. The piezoelectric vibrator 10 is completed as mentioned above. The inside of the package 20 is not limited to the AT cut piezoelectric vibrating piece, but may be a tuning fork piezoelectric vibrating piece or a SAW chip.

In addition, before mounting the piezoelectric vibrator 10 to the laminated lead frame 50, the frequency adjustment of the piezoelectric vibrator 10 and the operation check of the IC 60 are executed. Thereby, a piezoelectric oscillator can be formed by combining the good piezoelectric vibrator 10 and the good IC 60. Moreover, in the piezoelectric oscillator of the type which first mounts the IC inside the package and mounts the piezoelectric vibrating piece thereon, a failure of the piezoelectric vibrating piece has been found in the frequency adjustment step after the piezoelectric vibrating piece is mounted. In this case, the ICs of both products are discarded together with the piezoelectric vibrating pieces of the defective products. On the other hand, in the first embodiment, since the IC of the good product is not discarded, the yield rate of the IC can be improved and the manufacturing cost can be reduced.

Then, the piezoelectric vibrator 10 is mounted on the laminated lead frame 50. Specifically, the external electrode 24 of the piezoelectric vibrator 10 is connected to the connecting terminal of the laminated lead frame via the solder 25 or the conductive adhesive. In addition, although the external electrode 24 of the piezoelectric vibrator 10 may be formed only in the back surface of the package 20, it is preferable to extend the external electrode 24a over the side surface from the back surface. In this case, the solder pushed out from the back surface of the package 20 rises along the external electrode 24a of the side surface. As a result, the fillet 25a is formed from the connection terminal 36 of the laminated lead frame 50 to the external electrode 24a of the package side surface. Thereby, the connection of the connection terminal 36 of the laminated lead frame 50, and the external electrode 24 of the piezoelectric vibrator 10 can be confirmed easily from an external appearance. In addition, the external electrode 24 of the piezoelectric vibrator 10 may be formed only on the side surface of the package 20. In addition, in the present embodiment, the piezoelectric vibrator is supported only by the connection terminal. However, when the piezoelectric vibrator is supported by adding an electrically independent dummy connection terminal or the like, it is possible to improve the supporting force and prevent the deformation of the lead frame.

Then, the laminated lead frame 50 and the piezoelectric vibrator 10 are sealed in the resin package 70. Specifically, the laminated lead frame 50 in which the piezoelectric vibrator 10 is mounted is placed in a resin molding mold, and the resin package 70 is formed by injection molding a thermosetting resin. As shown in FIG. 3, the resin package 70 is formed inside the frame portions 31 and 41 of the lead frames 30 and 40. After molding the resin package 70, the frame portions 31 and 41 of the lead frames 30 and 40 and the connection portions of the leads are cut. It is preferable that the cutting positions 39 and 49 be near the surface of the resin package 70. In addition, the adjustment terminal 54 of the IC protrudes from the resin package 70 and cuts it.

As shown in FIG. 2, the relative position of both can be fixed by sealing the laminated lead frame 50 and the piezoelectric vibrator 10 inside the resin package 70. As shown in FIG. In addition, when the unevenness is formed on the side surface of the package 20 of the piezoelectric vibrator 10 and resin-sealed, the unevenness becomes a latch portion, and the piezoelectric vibrator becomes hard to be pulled out of the piezoelectric oscillator. 4 shows a recess formed in the side edge portion of the package of the piezoelectric vibrator. Recesses 18 are generally formed on the sides of the package 20. Here, the latch portion 19 is formed in the recess 18. In order to form the latch portion 19, with respect to the portion 20b of the ceramic sheet constituting the package 20, as shown in Figs. 4A to 4H, the diameter of the through hole to be recessed is changed, You can change the drilling position. 4A to 4C show an example in which a latch portion is formed in a recess in the corner portion of the package, and FIGS. 4D to 4H show an example in which a latch portion is formed in the recess in the side surface of the package.

On the other hand, the upper surface of the lid 28 of the piezoelectric vibrator 10 is exposed on the upper surface of the resin package 70. Since the product specification of the piezoelectric vibrator 10 is described on the upper surface of the lid 28, by exposing the lid 28, it is unnecessary to describe the product specification on the surface of the resin package 70. In addition, the posture of the piezoelectric vibrator 10 in the resin molding mold can be stabilized. On the other hand, as will be described later, in the step of performing solder plating on the surface of the mounting terminal 46, the exposed lid 28 is prevented from being coated by solder plating, so it is necessary to mask the upper surface of the lid 28. There is. In contrast, when the lid 28 is sealed inside the resin package 70, it is not necessary.

Moreover, the main surface of the mounting terminal 46 is exposed on the lower surface of the resin package 70. The figure seen from the arrow D of FIG. 2 in FIG. 5A is shown, and the bottom cross section in the F-F line of FIG. 5A is shown in FIG. 5B. As shown in FIG. 5A, the piezoelectric oscillator 1 according to the present embodiment is mounted on the electrode 8 of the mounting substrate through the solder 9. Here, it is preferable that the mounting terminal 46 also exposes the main surface and the side surface 46a. In this case, the solder 9 pushed out from the main surface of the mounting terminal 46 goes up along the side surface 46a. As a result, the fillet 9a is formed from the electrode 8 of the mounting board from the side surface 46a of the mounting terminal. Thereby, the connection of the electrode 8 of the mounting board | substrate and the mounting terminal 46 of the piezoelectric oscillator 1 can be confirmed easily from an external appearance.

In addition, as illustrated in FIG. 5B, a dimple 47 may be formed on the main surface of the mounting terminal 46 in advance. The dimple 47 is formed by masking portions other than the formation portion of the dimple 47 on the main surface of the mounting terminal 46 and half-etching the main surface of the mounting terminal 46. When the piezoelectric oscillator 1 having such a mounting terminal 46 is mounted, solder is introduced into the dimple 47 to exhibit an anchor effect. Therefore, the mounting terminal 46 of the piezoelectric oscillator 1 can be firmly fixed to the electrode 8 of the mounting substrate, and the mounting strength of the piezoelectric oscillator 1 can be improved.

In addition, as shown in FIG. 5A, in order to expose the main surface of the mounting terminal 46 to the bottom surface of the resin package 70, the resin is brought into surface contact with the main surface of the mounting terminal 46 on the bottom surface of the resin molding mold. Injection molding. By the way, the resin is introduced between the main surface of the mounting terminal 46 and the resin molding mold by the injection pressure of the resin, and the resin adheres to the main surface of the mounting terminal 46. As will be described later, solder plating is performed on the main surface of the mounting terminal 46. However, if the resin is attached to the main surface of the mounting terminal 46, the solder plating is not attached. Here, the operation | movement which removes resin adhered to the main surface of the mounting terminal 46 is performed. Removal of the resin is performed by spraying the abrasive-containing liquid, water, or the like toward the mounting terminal 46. Moreover, you may remove resin by the method of irradiating a laser toward the mounting terminal 46, the method of apply | coating a chemical | medical agent, etc.

Next, solder plating is applied to the lower surface of the mounting terminal 46. At that time, the upper surface of the lid 28 is masked so that the upper surface of the exposed lid 28 (see FIG. 2) is not covered by solder plating.

Next, frequency adjustment of the piezoelectric oscillator is performed. 6 is an explanatory diagram of a frequency adjustment step. 6A and 6B are side cross sectional views taken along the line A-A in FIG. 1. As shown in FIG. 6A, the probe 80 is brought into contact with the adjustment terminal 54 exposed to the outside of the resin package 70 from the lower side, and the writing to the IC 60 is performed to execute the recording of the piezoelectric oscillator 1. Perform frequency adjustment. In addition, the probe 80 may be contacted from the upper side. In addition, the adjustment terminal 54 after frequency adjustment is cut off in the vicinity of the surface of the resin package 70. Moreover, the frequency adjustment of the piezoelectric oscillator 1 may be performed by bending the adjustment terminal 54 by the probe 80, and it may be made as it is, without cutting the adjustment terminal 54 after frequency adjustment. 6B is a modification of the resin package. In this modification, the resin package 72 is expanded and molded above the adjustment terminal 55. The frequency adjustment of the piezoelectric oscillator 1 is also performed in the same manner as described above, but the product is produced as it is without cutting the adjustment terminal 55 after the frequency adjustment.

As described above, the piezoelectric oscillator according to the first embodiment is completed.

The plane size can be reduced by the piezoelectric oscillator according to the first embodiment described above.

That is, in the first embodiment, a lead for connecting with a piezoelectric vibrator is formed in the upper lead frame with respect to the laminated lead frame composed of two lead frames, and the connecting lead is placed on the upper side to form a connection terminal. The lead for mounting to a mounting board | substrate was formed in the lower lead frame, and the mounting lead was raised to the lower side, and it was set as the structure which forms a mounting terminal. In this case, it becomes possible to arrange | position a connection terminal and a mounting terminal up and down, and it is not necessary to arrange both in a line. Therefore, the plane size of the piezoelectric oscillator can be made small. Moreover, the area of a mounting terminal can be ensured widely.

In the first embodiment, the entire piezoelectric vibrator and the laminated lead frame were sealed in the resin package. In this case, even if the combination of the types of piezoelectric vibrator and IC changes, it is possible to use the same resin molding mold, and it is possible to cope with the production of small quantities of many kinds. In addition, since the position of the connection terminal can be accurately determined with respect to the external shape of the resin package, the piezoelectric oscillator can be accurately mounted on the mounting substrate by positioning the piezoelectric oscillator on the external reference. Furthermore, by sealing the resin, it is possible to insulate the piezoelectric vibrator and the whole of the laminated lead frame, and to prevent the intrusion of dust and moisture. Thus, occurrence of electrical and chemical failures can be prevented.

Next, a second embodiment will be described.

8 is an explanatory diagram of a wiring state. The piezoelectric oscillator according to the second embodiment forms a pair of wiring leads 132r and 132u in the upper lead frame 130 so as to connect the terminal b and the mounting terminal B of the IC 160. A pair of wiring terminals 156r and 156u are formed by standing each wiring lead 132r and 132u on the upper side, and the wiring lead 132r is connected to the IC terminal b, while the wiring lead ( 132u are connected to each other, and the pair of electrode pads 127r and 127u connected to the pair of wiring terminals 156r and 156u and the wiring pattern 126x for connecting the pair of electrode pads 127r and 127u to each other are piezoelectric. It is formed on the vibrator. In addition, the description is abbreviate | omitted about the part which becomes the same structure as 1st Example.

In the second embodiment, when the terminals on the upper surface of the IC 160 have the functions a, b, c, and d in sequence, when the functions of A, D, C, and B are sequentially assigned to the mounting terminals. Consider. In addition, such a case may occur if a function of the mounting terminal is assigned to the electrode of the mounting board while using a general-purpose IC. Here, when between b-B and d-D is connected by wire bonding, there exists a possibility that a wire may cross | intersect and short-circuit. Therefore, these terminals cannot be wired by wire bonding. Here, in the second embodiment, the wiring pattern 126 from the IC terminal to the mounting terminal is formed in the pattern of the piezoelectric vibrator.

7 is a perspective view of the piezoelectric oscillator according to the second embodiment in a disassembled state. Also in the second embodiment, the two lead frames 130 and 140 are overlapped to form the stacked lead frame 150. The connection lead 132 is formed in all directions of the upper lead frame 130, and the connection part 136 is formed by standing the outer part on the upper side. And the wiring lead 152 is formed in the intermediate part of each connection lead 132 in the depth direction of FIG. Further, the outer portion of the wiring lead 152 is erected upward to form the wiring terminal 156. In the second embodiment, two wiring terminals 156 are formed in a line in the middle of each connection terminal 136. On the other hand, the mounting lead 142 is formed in all directions of the lower lead frame 140, and the mounting terminal 146 is formed by standing the outer part below.

On the other hand, the external electrode 124 is formed in four corners of the back surface of the package 120 in the piezoelectric vibrator 110. And the electrode pad 127 is formed in the intermediate part of each external electrode 124 in the depth direction of FIG. In the second embodiment, two electrode pads 127 are formed in a line at the middle of each external electrode 124. In addition, the wiring pattern 126 which connects the electrode pads 127 arranged in the left-right direction of FIG. 7 with each other is formed. In the second embodiment, two wiring patterns 126 are formed in a line. In addition, the wiring pattern does not necessarily need to be formed on the back surface of the package, but may be formed on the side or inside of the package 120.

As shown in FIG. 8, the IC 160 and each lead are connected as follows. 8 omits the connection terminal of the laminated lead frame and the external electrodes of the piezoelectric vibrator. First, the IC terminal a and the mounting terminal A, and the IC terminal c and the mounting terminal C are electrically connected by wire bonding. The IC terminal b is connected to the wiring lead 132r, and the mounting terminal B is connected to the wiring lead 132u by wire bonding. Here, when the piezoelectric vibrator is mounted on the laminated lead frame, and the electrode pad 127r is connected to the wiring terminal 156r and the electrode pad 127u is connected to the wiring terminal 156u, the wiring pattern formed on the back surface of the package ( The IC terminal b and the mounting terminal B are electrically connected via 126x. Similarly, the IC terminal d is connected to the wiring terminal 156t, and the wiring terminal 156s is connected to the mounting terminal D, respectively. Here, when the piezoelectric vibrator is mounted on the laminated lead frame, and the electrode pad 127t is connected to the wiring terminal 156t and the electrode pad 127s is connected to the wiring terminal 156s, the wiring pattern formed on the back surface of the package ( IC terminal d and mounting terminal D are electrically connected via 126y).

In the above-described piezoelectric oscillator according to the second embodiment, even when the assignment order of the functions of the IC terminals differs from the assignment order of the functions of the mounting terminals, the corresponding terminals can be electrically connected. As a result, it is possible to use the same type of IC even among piezoelectric oscillators having different order of function of mounting terminals. Therefore, the kind of IC can be reduced, and manufacturing cost and product cost can be reduced.

10 is a plan view of a lower lead frame according to the third embodiment. The lower lead frame 40A together with the upper lead frame 30 shown in FIG. 3A constitutes a laminated lead frame. The lower lead frame 40A of the third embodiment differs from the mounting lead 42 of the lower lead frame 40 of the first embodiment in which the mounting lead 42A is shown in FIG. Same as 40). That is, in the lower lead frame 40A, the mounting terminal 46A of each mounting lead 42A is formed larger than the length in the left and right directions of FIG. 10 of the inclined portion 45, so that the frame is lower than the inclined portion 45. It has a pressing allowance 170 which protrudes on the short side of the part 41. As shown in FIG. The pressurizing margin 170 is a top frame of the mold when the lower lead frame 40A becomes a laminated frame together with the upper lead frame 30 to seal the mounted piezoelectric vibrator 10 and the IC 60 with each other. Is pressed downward by. 11A and 11B schematically show a mold for forming the resin package 70.

As shown in FIG. 11A, four pressing convex portions 174 are formed in the upper mold 172 corresponding to four pressing clearance portions 170 provided in the lower lead frame 40A. When the pressurizing convex part 174 forms the resin package 70, the pressurizing margin 170 of the mounting lead 42A is pressed from the upper side, and the main surface (lower surface) of the mounting terminal 46A is lowered ( 176 is in close contact with the upper surface 178. For this reason, when forming the resin package 70, resin can be prevented from adhering to the main surface of the mounting terminal 46A, and the process of removing resin adhered to the main surface can be skipped. In addition, the upper mold | type 172 and the lower mold | type 176 are set in the height position of the adjustment terminal 54 as shown in FIG. 11B in the part in which the press convex part 174 is not formed.

The mounting lead 42A of the lower lead frame 40A forms the resin package 70 as described above, and then the resin package 70 is laminated to the laminated lead frame (the frame portion 41 of the lower lead frame 40A). ) In the cutting step, cut by the cutting line 49A shown by the dashed-dotted line in FIG. 10, and the press margin 170 is cut. However, as shown in FIG. 10, the press margin part 170 is cut | disconnected so that the front-end | tip part of the mounting terminal 46A may protrude a little from the side surface of the resin package 70 (for example, about 0.1 mm to 0.2 mm). .

FIG. 12 schematically shows a cutting state of the press margin 170 when separating the piezoelectric oscillator (resin package 70) from the laminated lead frame. The laminated lead frame in which the resin package 70 is formed is arrange | positioned, for example on the lower edge 190 of a cutter, and the press margin part 170 is cut | disconnected by the upper edge 192 falling like arrow 194. . At this time, the laminated lead frame is positioned such that the mounting terminal 46A protrudes from the resin package 70 by a predetermined length d so that the pressing clearance 170 is cut. By cutting the press margin 170 in this way, even when the position shift of a laminated lead frame occurs and it cuts in the position of the dashed-dotted line 196 of FIG. 12, the side surface (end surface) of the mounting terminal 46A is resin. Since it is exposed from the package 70, a solder fillet can be visually seen and a joining state can be confirmed easily.

13A to 13C illustrate a piezoelectric oscillator 180 having a mounting terminal 46A separated from a laminated lead frame, and FIG. 13A schematically illustrates a mounting state of the piezoelectric vibrator 10 and the IC 60. 13B is a top view and FIG. 13C is a bottom view.

13A to 13C show a case where four adjustment terminals 54 are provided each side. In the piezoelectric oscillator 180, the tip of the solder-plated mounting terminal 46A protrudes from the side surface of the resin package 70. Therefore, as shown in FIG. 14, when the piezoelectric oscillator 180 is bonded with the mounting terminal 46A to the electrode 184 of the mounting substrate 182 by the solder 186, the mounting terminal 46A is connected to the piezoelectric oscillator 180. Since the solder is plated, the solder 186 is raised to cover the protrusion of the mounting terminal 46A to form a fillet. For this reason, the piezoelectric oscillator 180 can visually confirm the bonding (mounting) state to the mounting substrate 182 easily. In addition, since the solder 186 covers the protruding portion of the mounting terminal 46A, the mounting strength can be improved. In addition, you may cut | disconnect the press margin part 170 when cut | disconnecting the adjustment terminal 54. FIG. In addition, the mounting terminal 46A may protrude a portion along the long side of the resin package 70 or may protrude in an L shape.

15A and 15B show a lower lead frame according to the fourth embodiment, FIG. 15A is a plan view, and FIG. 15B is a cross-sectional view taken along the line C-C in FIG. 15A. The lower lead frame 40B together with the upper lead frame 30 shown in FIG. 3A constitutes a laminated lead frame. In the lower lead frame 40B of this fourth embodiment, as shown in Fig. 15B, the mounting lead 42B does not have an inclined portion, and the mounting terminal 46B and the pad 44 are formed in the same plane. It is formed at the same height as the adjustment terminal 54. For this reason, the lower lead frame 40B does not require the bending process for positioning the mounting terminal 46B below the adjustment terminal 54, and can simplify the process of forming the lower lead frame 40B. Can be.

Resin sealing in the laminated lead frame using the lower lead frame 40B of the fourth embodiment is carried out as shown in FIG. That is, the upper mold | type 200 and lower mold | type 202 which form the resin package 70B are matched at the position of the height of the mounting terminal 46B. In the lower mold 202, a recess 204 is formed in a surface forming a cavity, and the lower end surface 206 of the resin package 70B is a main surface of the adjustment terminal 54, that is, the mounting terminal 46B. It is located underneath. That is, the resin package 70B has the shape in which the recessed part 208 was formed in the position corresponding to each mounting terminal 46B, and the mounting terminal 46B was provided in the ceiling surface of this recessed part 208. As shown in FIG. This is for preventing the adjustment terminal 54 after cutting | disconnecting from contacting with a mounting board and short-circuiting with the wiring pattern and other components provided in the mounting board. In addition, the height of the recessed part 208 should just be the height which the adjustment terminal 54 does not contact the surface of a mounting board | substrate, for example, about 0.1 mm may be sufficient.

17A to 17C show a piezoelectric oscillator 210 having a mounting terminal 46B, and FIG. 17A is a schematic diagram showing a mounting state of the piezoelectric vibrator 10 and the IC 60, and FIG. 17B is a plan view. 17C is a bottom view. The piezoelectric oscillator 210 can be mounted on the mounting substrate 182 as shown in Figs. 18A and 18B, for example. In this mounting method, as shown in FIG. 18A, a solder ball 212 is first provided at each mounting terminal 46B of the piezoelectric oscillator 210. The solder balls 212 are then disposed on the electrodes 184 of the mounting substrate 182. Thereafter, as shown in FIG. 18B, the piezoelectric oscillator 210 can be mounted on the mounting substrate 182 by melting the solder balls 212.

In this way, the piezoelectric oscillator 210 mounted on the mounting board 182 has a gap between the mounting terminal 46B and the mounting board 182 because the mounting terminal 46B is provided on the ceiling surface of the recess 208. (g) is formed. The gap g is filled by the solder 220 that constitutes the solder ball 212. For this reason, by visually observing whether or not the gap g is filled with the solder 220, it is possible to easily determine whether the mounting (joining) state is good.

19A to 19C are exploded perspective views illustrating the fifth embodiment, and correspond to FIG. 1. However, in FIGS. 19A to 19C, the laminated lead frame 50E is rotated by 90 ° in plane relative to FIG. 1. In Fig. 19A, the piezoelectric oscillator 1E includes a piezoelectric vibrator 10 in which the piezoelectric vibrating element 12 is housed in a package 20, and an IC 60 having an oscillation circuit or the like is stacked lead frame 50E. It is formed by integrating with). The laminated lead frame 50E consists of an upper lead frame 30E serving as one side and a lower lead frame 40E serving as the other side.

The four connection leads 32E formed by the upper lead frame 30E each have a pad portion 34E, an inclined portion 35E, and a connection terminal 36E. And the piezoelectric vibrator 10 is mounted (joined) to the connection terminal 36E via the external electrode which is not shown in this figure provided in the bottom surface of the package 20. FIG. Moreover, the connection lead 32E has the notch (concave part) 37E in the inclined part 35E. The notch 37E is for introducing resin when the resin package 70 is formed, and the connection lead 32E is pulled out of the resin package by the anchor effect of the resin introduced into the notch 37E. prevent.

The mounting lead 42E formed by the lower lead frame 40E has a pad portion 44E, an inclined portion 45E, and a mounting terminal as shown in FIG. 19B which is a sectional view taken along the line DD of FIG. 19A. 46E). And the mounting lead 42E has resin which comprises the resin package 70 from the inclined part 45E which becomes the base end side rather than the mounting terminal 46E to the pad part 44E from the pad part 44E. A notch (concave portion) 48E to be drawn in is formed. In addition, the resin package 70 is formed so that the main surface 230 of the mounting terminal 46E is exposed. Therefore, as for the mounting terminal 46E, the main surface 230 can be joined to the electrode pattern of a mounting substrate through solder. In this embodiment, the mounting lead 42E on the right side of FIG. 19A is connected to the ground terminal of the mounting board, and is integrally formed with the die pad 52E.

The adjustment terminal 54E formed by the lower lead frame 40E is disposed between the mounting leads 42E and 42E located in the left and right directions in FIG. 19A in this embodiment. The adjustment terminal 54E consists of the tip terminal part 51E, the base terminal part 53E integrated with the tip terminal part 51E, and is formed in T shape. That is, the adjustment terminal 54E cuts both sides of the front end side of the lead piece having the width of the base end portion 53E (the length in the left and right directions in FIG. 9A) to form the notch portion 57E to form a T shape. In addition, the adjustment terminal 54E shown in this embodiment shows a state in which the adjustment process of the piezoelectric oscillator 1E is finished, and the unnecessary portion on the front end side of the tip terminal portion 51E is cut off, as shown in Fig. 19C. As described above, the base end portion 53E is embedded in the resin package 70.

In the fifth embodiment, the notches 37E and 48E are formed in the connection lead 32E and the mounting lead 42E, so that the resin package 70 is formed in these notches 37E and 48E. Mold resin constituting the resin is introduced. For this reason, the connection lead 32E and the mounting lead 42E can be prevented from coming out of the resin package 70, and joining strength can be enlarged. Moreover, since the base end part 53E which is embedded with resin is formed wider than the front end terminal part 51E, the adjustment terminal 54E does not come out of the resin package 70. FIG. Accordingly, the piezoelectric oscillator 1E can prevent the bonding between the resin, the lead, and the terminal of the resin package to be peeled off, thereby improving the impact resistance.

20A to 20C are exploded perspective views of the piezoelectric oscillator according to the sixth embodiment. In the piezoelectric oscillator 1F of the sixth embodiment, the lower lead frame 40F constituting the laminated lead frame 50F is different from the lower lead frame 40E of the fifth embodiment, and the other is the same as that of the fifth embodiment. Do. In the lower lead frame 40F according to the sixth embodiment, the mounting lead 42F does not have an inclined portion. That is, the mounting lead 42F is not bent, and the upper surface of the pad portion 44F and the mounting terminal 46F is located in the same plane. However, in the mounting lead 42F, as shown in Fig. 20B, which is a sectional view taken along the line E-E in Fig. 20A, the pad portion 44F on the proximal side is formed thinner than the mounting terminal 46F. For this reason, in the mounting lead 42F, a step 234 is formed between the main surface 230 of the mounting terminal 46F and the lower surface 232 of the pad portion 44F. The pad portion 44F is formed with the same notch 48E as shown in the fifth embodiment. The other structure of the lower lead frame 40F is the same as that of the fifth embodiment. In addition, the mounting lead 42F can be easily formed by thinning the pad portion 44F by plastic working or etching by pressing.

In the mounting lead 42F of the fifth embodiment, the inclined portion is not formed between the pad portion 44F and the mounting terminal 46F, so that the mounting terminal 46F can be enlarged. Therefore, the mounting terminal 46F has a large bonding area with the mounting board, and can improve the bonding strength with the mounting board. Moreover, since the mounting lead 42F is not provided with an inclined portion, the dimension in the thickness direction is reduced, and the piezoelectric oscillator 1F can be thinned.

Furthermore, since the mounting lead 42F does not have an inclined portion, even when it is downsized, it does not break when machining or when an impact force is applied. That is, as the piezoelectric oscillator becomes smaller and thinner, the mounting lead becomes smaller and thinner. When the mounting terminal is formed by bending the mounting lead, the inclined portion becomes thinner than other portions. Therefore, when the mounting lead is bent to form the mounting terminal, when the mounting lead is bent or when the impact force is applied to the piezoelectric oscillator and peeling with the resin occurs, there is a fear that the mounting lead is broken. On the other hand, since the mounting lead 42F of the embodiment does not have an inclined portion, such breakage does not occur.

In addition, the lower lead frame 40F may form only a portion of the mounting terminal 46F thick, and may thin a portion other than the mounting terminal including the die pad by etching or the like. In this case, as shown in FIG. 20B, the main surface 230 of the mounting terminal 46F is lower than the lower surface of the other thinned portion. Thus, even when the mounting terminal is not bent and formed, when the resin mold is formed by exposing the main surface 230 of the mounting terminal 46F, a thin unnecessary portion other than the mounting terminal 46F is sealed in the resin package 70. Therefore, when the mounting terminal 46F is bonded to the mounting substrate, the piezoelectric oscillator can be reduced in thickness without causing other parts to short-circuit with the wiring pattern of the mounting substrate.

In the sixth embodiment, instead of the connecting lead 32E, the connecting lead 32F as shown in Fig. 20C may be used. In this connection lead 32F, no inclined portion is formed between the pad portion 34F and the connection terminal 36F, and the bottom surface of the pad portion 34F and the connection terminal 36F are located in the same plane. In the connection lead 32F, the thickness of the pad portion 34F is thinner than the thickness of the connection terminal 36F. For this reason, the upper surface 236 of the pad portion 34F is lower than the main surface 238 of the connection terminal 36F. Such a connection lead 32F can increase the area of the connection terminal 36F, and can increase the bonding strength with the piezoelectric vibrator 10. In addition, the piezoelectric oscillator can be thinned. This connection lead 32F can be formed similarly to the mounting lead 42F.

21A to 21C are exploded perspective views of the piezoelectric oscillator according to the seventh embodiment. The piezoelectric oscillator 1G has a lower lead frame 40G constituting the laminated lead frame 50G, in particular, a mounting terminal of the mounting lead differs from the mounting terminal 46E of the lower lead frame 40G of the fifth embodiment. Do. The other is the same as in the fifth embodiment. The mounting lead 42G according to the seventh embodiment includes the pad portion 44E, the inclined portion 45E, and the mounting terminal 46G, as shown in FIG. 21B, which is a sectional view along the FF line in FIG. 21A. Have In the mounting terminal 46G, a convex portion 240 is formed on the main surface 230. The mounting terminal 46G is provided with a recess 244 at a position corresponding to the convex portion 240 of the joining surface 242 of the main surface 230 and the resin on the opposite side. These protrusions 240 and 244 can be easily formed by press molding the mounting terminal 46F.

Since the convex part 240 is formed in the main surface 230 in the mounting terminal 46G which is in this way, when joining to a mounting substrate, the contact area with solder becomes large, and the anchor by the convex part 240 is carried out. By the effect, the bonding strength with the mounting substrate can be improved. In addition, since the recessed part 244 is formed in the joining surface 242 with resin, since the substantial joining area with resin becomes large, the mounting terminal 46G has resin entering in the recessed part 244, Bonding strength with resin can be raised.

The mounting terminal may be formed like the mounting lead 42H shown on the right side in Fig. 21A. That is, as shown in FIG. 21C which is a sectional view along the G-G line of FIG. 21A, the mounting lead 42H has the recessed part 246 formed in the main surface 230 of the mounting terminal 46H. In the mounting terminal 46H, the convex portion 248 is formed on the bonding surface 242 with the resin on the opposite side of the main surface 230. The concave portion 246 on the main surface 230 side and the convex portion 248 on the joining surface 242 side correspond to each other, and are formed by bending by press or the like. The mounting terminal 46H thus formed can achieve the same effect as the mounting terminal 46G of FIG. 21B.

Furthermore, the mounting lead can be formed as shown in FIG. The mounting lead 42J shown in FIG. 22 is formed by etching the lower surface side of the pad portion 44J of the lead piece of thickness t and the upper surface side of the mounting terminal 46J to form a crank shape. . Also in this mounting lead 42J, the area of the mounting terminal 46J can be enlarged, and the dimension of the thickness direction can be made small.

In the seventh embodiment, the case where one convex portion or concave portion is formed in the mounting terminal has been described, but a plurality of these may be formed. Instead of the connecting lead 32E, the connecting lead 32E may be formed like the connecting lead shown in Figs. 23A to 23C. In the connection lead 32G shown in FIG. 23A, the convex part 250 is formed in the main surface 238 which joins the piezoelectric vibrator 10 of the connection terminal 36G. And the connection terminal 36G is formed with the recessed part (not shown) in the joining surface of the main surface 238 and resin on the opposite side. The connection terminal 36G thus formed can improve the bonding strength with the piezoelectric vibrator 10 and the bonding strength with the resin of the resin package.

In the connecting lead 32H shown in FIG. 23B, a recess 252 is formed in the main surface 238 of the connecting terminal 36H, and a convex portion 254 is formed in a joint surface with the resin on the opposite side. have. In addition, in the connection lead 32J shown in FIG. 23C, the recessed part 256 is formed in the main surface 238 of the connection terminal 36J, and the convex part 258 is formed in the surface on the opposite side. And the recessed part 256 is open at the front end side of the connection terminal 36J, and is U-shaped. These connection terminals 36H and 36J can also obtain the same effects as the connection terminal 36G.

FIG. 24 is a diagram showing a schematic configuration of a digital cellular phone apparatus as an example of an electronic apparatus using a piezoelectric oscillator according to the embodiment of the present invention.

In the figure, the voice of a sender converted into an electric signal by the microphone 308 is digitally modulated by a demodulator and a codec unit, and the frequency unit is converted by a transmitter unit 307 into a radio frequency (RF) band. Then, it is transmitted to a base station (not shown) via an antenna. In addition, the RF signal at the base station is converted into an audio signal at the demodulator and the CODEC unit after the frequency conversion at the receiving unit 306, and is output from the speaker 309. In addition, the CPU (Central Processing Unit) 301 controls the overall operation of the digital cellular phone device 300, including the input / output unit 302 formed of a liquid crystal display device and a keyboard. The memory 303 is information storage means composed of RAM1 and ROM1 controlled by the CPU 301, among which information such as a control program of the digital cellular phone device 300, a telephone book, and the like are stored.

As a piezoelectric oscillator according to an embodiment of the present invention is applied, there is, for example, TCXO (Temperature Compensated X'stal Oscillator) 305. The TCXO 305 is a piezoelectric oscillator having a small frequency fluctuation due to a change in ambient temperature, and is widely used as a frequency reference source of the receiver 306 and the transmitter 307 in FIG. 24. With the recent miniaturization of the TCXO 305, the demand for miniaturization is increasing, and miniaturization of the piezoelectric oscillator according to the embodiment of the present invention is very useful.

In addition, the piezoelectric oscillator according to the embodiment of the present invention can also be applied to a real time clock 310 for supplying date time information to, for example, a mobile telephone apparatus including a CPU 301.

The piezoelectric oscillator according to the embodiment of the present invention is not limited to the above-mentioned mobile telephone apparatus, but is a reference signal or a clock for controlling by a piezoelectric oscillator such as a personal computer, a workstation, and a PDA (Personal Digital (Data) Assistants). It can be applied to the electronic device to obtain

In this way, by using the piezoelectric oscillator according to the above-described embodiment for an electronic device, a smaller and more reliable electronic device can be realized.

Claims (32)

In the laminated lead frame composed of two lead frames, a lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, the lead for the connection is placed on the one side, and a connection terminal is formed. A mounting lead on the other side is formed in the lead frame on the other side, and the mounting lead is raised on the other side to form a mounting terminal. An IC in which an oscillation circuit is formed is mounted on the laminated lead frame, The piezoelectric vibrator in which the piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, Characterized in that the laminated lead frame and the piezoelectric vibrator are sealed to the inside of the resin package while the main surface of the mounting terminal is exposed to the outside. Piezoelectric oscillator. In the laminated lead frame composed of two lead frames, a lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, the lead for the connection is placed on the one side, and a connection terminal is formed. A mounting lead having mounting terminals to the lead frame on the other side; An IC in which an oscillation circuit is formed is mounted on the laminated lead frame, The piezoelectric vibrator in which the piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, While exposing the main surface of the mounting terminal to the outside, the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package, and the thickness of the lead frame on the other side where the mounting lead is formed is increased. It is formed thinner than the said mounting terminal formed in the Piezoelectric oscillator. The method according to claim 1 or 2, The mounting lead has a thickness at the base end side that is thinner than the mounting terminal at the distal end side. Piezoelectric oscillator. The method according to claim 1 or 2, The mounting terminal is installed at a position higher than the bottom surface of the resin package Piezoelectric oscillator. A lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, and a lead for mounting to a mounting substrate is formed in the lead frame on the other side, with respect to the laminated lead frame composed of two lead frames. A mounting lead is erected on the other side to form a mounting terminal, An IC in which an oscillation circuit is formed is mounted on the laminated lead frame, The piezoelectric vibrator in which the piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, While exposing the main surface of the mounting terminal to the outside, the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package, and the thickness of the lead frame on one side where the connecting lead is formed is increased. It is formed thinner than the connection terminal formed in the Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, The connecting lead has a thickness at the proximal end thinner than the connecting terminal at the distal end side. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, In the laminated lead frame, an adjustment terminal for inspecting characteristics of the IC, adjusting characteristics, and / or confirming conduction between the piezoelectric vibrator and the connection terminal is formed Characterized in that the laminated lead frame and the piezoelectric vibrator is sealed inside the resin package while exposing the adjustment terminal to the outside. Piezoelectric oscillator. The method of claim 7, wherein The mounting terminal is formed at the same height as the adjustment terminal. Piezoelectric oscillator. The method of claim 5, The mounting lead has a thickness at the proximal end thinner than the mounting terminal at the distal end side. Piezoelectric oscillator. The method of claim 9, The connecting lead has a thickness at the proximal end thinner than the connecting terminal at the distal end side. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, The IC is mounted on one side of the laminated lead frame. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, Characterized in that the laminated lead frame and the piezoelectric vibrator is sealed inside the resin package while exposing the upper surface of the lid of the piezoelectric vibrator to the outside. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, And a lid of the piezoelectric vibrator sealed inside the resin package. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, The laminated lead frame and the piezoelectric vibrator are sealed inside the resin package while the main surface of the mounting terminal and the side surface of the mounting terminal are exposed to the outside. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, The mounting terminal is characterized in that at least one concave portion or convex portion is formed on the main surface Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, The mounting terminal is characterized in that at least one concave portion or convex portion is formed on a joining surface of the resin opposite to the main surface. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, A latch in the height direction of the piezoelectric vibrator is formed on the side of the package, The laminated lead frame and the piezoelectric vibrator is formed by sealing the inside of the resin package Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, In order to connect the terminal of the IC and the mounting terminal, a pair of wiring leads is formed in the lead frame on one side, and the wiring leads are erected on the one side to form a pair of wiring terminals. One of the pair of wiring leads is connected to one of the IC terminal or the mounting terminal, and the other of the pair of wiring leads is connected to the other of the IC terminal and the mounting terminal. A pair of electrode pads respectively connected to the pair of wiring terminals and a wiring pattern for connecting the pair of electrode pads to each other are formed in the piezoelectric vibrator. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, An end portion of the mounting terminal is protruded from the side surface of the resin package. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, The connecting terminal is provided with at least one concave portion or convex portion on one or both of the main surface or the surface on the opposite side to which the piezoelectric vibrator is joined. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, A notch for introducing resin into one or both of the connecting lead or the mounting lead is formed. Piezoelectric oscillator. The method according to any one of claims 1, 2 or 5, The lead frame on the other side is characterized in that the mounting terminal is formed thicker than other portions. Piezoelectric oscillator. In the laminated lead frame composed of two lead frames, a lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, the lead for the connection is placed on the one side, and a connection terminal is formed. Forming a mounting lead on the other side of the lead frame, standing the mounting lead on the other side to form mounting terminals, and stacking the lead frames to form the laminated lead frame; Mounting the IC having the oscillation circuit formed on the laminated lead frame; Mounting the piezoelectric vibrator in which a piezoelectric vibrator is sealed in the package to the laminated lead frame; Sealing the laminated lead frame and the piezoelectric vibrator inside the resin package while exposing the main surface of the mounting terminal to the outside. Method of manufacturing piezoelectric oscillator. In the laminated lead frame composed of two lead frames, a lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, the lead for the connection is placed on the one side, and a connection terminal is formed. To form a mounting lead on the other side of the lead frame, to reduce the proximal end of the mounting lead to form a mounting terminal on the front end side, and to stack the lead frames to form the laminated lead frame. and, Mounting the IC having the oscillation circuit formed on the laminated lead frame; Mounting the piezoelectric vibrator in which a piezoelectric vibrator is sealed in the package to the laminated lead frame; Sealing the laminated lead frame and the piezoelectric vibrator inside the resin package while exposing the main surface of the mounting terminal to the outside. Method of manufacturing piezoelectric oscillator. The method of claim 23 or 24, And removing the resin attached to the main surface of the mounting terminal. Method of manufacturing piezoelectric oscillator. The method of claim 23 or 24, The step of sealing the inside of the resin package is carried out by pressing the main surface of the mounting terminal to the mold surface, In the step of separating the resin package thereafter from the frame portion of the lead frame, an unnecessary portion of the mounting terminal is cut. Method of manufacturing piezoelectric oscillator. In the laminated lead frame composed of two lead frames, a lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, the lead for the connection is placed on the one side, and a connection terminal is formed. A mounting lead to the other side is formed in the lead frame on the other side, and the mounting lead is raised on the other side to form a mounting terminal, An IC in which an oscillation circuit is formed is mounted on the laminated lead frame, The piezoelectric vibrator in which the piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, A control clock signal is obtained by a piezoelectric oscillator formed by sealing the laminated lead frame and the piezoelectric vibrator inside the resin package while exposing the main surface of the mounting terminal to the outside. Mobile phone devices. In the laminated lead frame composed of two lead frames, a lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, the lead for the connection is placed on the one side, and a connection terminal is formed. A mounting lead having mounting terminals to the lead frame on the other side; An IC in which an oscillation circuit is formed is mounted on the laminated lead frame, The piezoelectric vibrator in which the piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, While exposing the main surface of the mounting terminal to the outside, the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package, and the thickness of the lead frame on the other side where the mounting lead is formed is increased. The clock signal for control is obtained by the piezoelectric oscillator formed thinner than the said mounting terminal provided in the Mobile phone devices. A lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, and a lead for mounting to a mounting substrate is formed in the lead frame on the other side, with respect to the laminated lead frame composed of two lead frames. A mounting lead is erected on the other side to form a mounting terminal, An IC in which an oscillation circuit is formed is mounted on the laminated lead frame, The piezoelectric vibrator in which the piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, While exposing the main surface of the mounting terminal to the outside, the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package, and the thickness of the lead frame on one side where the connecting lead is formed is increased. Characterized in that the control clock signal is obtained by a piezoelectric oscillator formed thinner than the connection terminal formed in the Mobile phone devices. In the laminated lead frame composed of two lead frames, a lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, the lead for the connection is placed on the one side, and a connection terminal is formed. A mounting lead to the other side is formed in the lead frame on the other side, and the mounting lead is raised on the other side to form a mounting terminal, An IC in which an oscillation circuit is formed is mounted on the laminated lead frame, The piezoelectric vibrator in which the piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, A control clock signal is obtained by a piezoelectric oscillator formed by sealing the laminated lead frame and the piezoelectric vibrator inside the resin package while exposing the main surface of the mounting terminal to the outside. Electronics. In the laminated lead frame composed of two lead frames, a lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, the lead for the connection is placed on the one side, and a connection terminal is formed. A mounting lead having mounting terminals to the lead frame on the other side; An IC in which an oscillation circuit is formed is mounted on the laminated lead frame, The piezoelectric vibrator in which the piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, While exposing the main surface of the mounting terminal to the outside, the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package, and the thickness of the lead frame on the other side where the mounting lead is formed is increased. The clock signal for control is obtained by the piezoelectric oscillator formed thinner than the said mounting terminal provided in the Electronics. A lead for connection with a piezoelectric vibrator is formed in the lead frame on one side, and a lead for mounting to a mounting substrate is formed in the lead frame on the other side, with respect to the laminated lead frame composed of two lead frames. A mounting lead is erected on the other side to form a mounting terminal, An IC in which an oscillation circuit is formed is mounted on the laminated lead frame, The piezoelectric vibrator in which the piezoelectric vibrating element is sealed inside the package is mounted on the laminated lead frame, While exposing the main surface of the mounting terminal to the outside, the laminated lead frame and the piezoelectric vibrator are sealed inside the resin package, and the thickness of the lead frame on one side where the connecting lead is formed is increased. Characterized in that the control clock signal is obtained by a piezoelectric oscillator formed thinner than the connection terminal formed in the Electronics.

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