CN1617653A - 三维成形的电路板,组件及其制造方法 - Google Patents
三维成形的电路板,组件及其制造方法 Download PDFInfo
- Publication number
- CN1617653A CN1617653A CNA2004100957283A CN200410095728A CN1617653A CN 1617653 A CN1617653 A CN 1617653A CN A2004100957283 A CNA2004100957283 A CN A2004100957283A CN 200410095728 A CN200410095728 A CN 200410095728A CN 1617653 A CN1617653 A CN 1617653A
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- CN
- China
- Prior art keywords
- resin
- dimensional
- circuit board
- circuit
- printing ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
树脂油墨的类型 | 树脂油墨的量 | 银粉的量 | 体积电阻值(Ω·cm) | 电阻值>300mΩ时的伸长α | 粘结性 | ||
实施例 | 1 | 聚碳酸酯基 | 100 | 150 | 4.475×10-4 | 127 | 好 |
2 | 聚碳酸酯基 | 100 | 250 | 8.276×10-5 | 73 | 好 | |
3 | 聚碳酸酯基 | 100 | 350 | 1.507×10-4 | 83 | 好 | |
4 | 环氧基 | 100 | 250 | 4.848×10-4 | 97 | 好 | |
5 | 丙烯酸聚氨酯基 | 100 | 250 | 3.874×10-4 | 93 | 好 | |
6 | 聚氯乙烯/丙烯酸聚氨酯基 | 100 | 250 | 1.856×10-4 | 130 | 好 | |
对比实施例 | 1 | 聚氯乙烯基 | 100 | 250 | 1.073×10-4 | 53 | 不好 |
2 | 氯乙烯/醋酸乙烯共聚物基 | 100 | 250 | 7.213×10-5 | 33 | 不好 | |
3 | 聚烯烃基 | 100 | 250 | 2.371×10-4 | 30 | 不好 |
聚碳酸酯基 | Noriphan(Bayer Ltd.) |
环氧基 | 1690N(Seiko Advance Ltd.)基树脂:三羟甲基丙烷型环氧树脂(50%)+双酚A(28%)固化剂:改性脂肪族多胺 |
丙烯酸聚氨酯基 | MS8(Seiko advance Ltd.)+D-110N(Mitsui TakedaChemicals,Inc.)*重量比=MS8∶D-110N=1∶1 |
聚氯乙烯/丙烯酸聚氨酯基 | VIC(Seiko advance Ltd.)+D-110N(Mitsui TakedaChemicals,Inc.)*重量比=MS8∶D-110N=1∶1 |
聚氯乙烯基 | VIC(Seiko advance Ltd.) |
氯乙烯/醋酸乙烯酯共聚物基 | CAV Meiban(Seiko advance Ltd.) |
聚烯烃基油墨 | PP油墨(Seiko advance Ltd.) |
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003382844 | 2003-11-12 | ||
JP2003382844 | 2003-11-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1617653A true CN1617653A (zh) | 2005-05-18 |
CN100473254C CN100473254C (zh) | 2009-03-25 |
Family
ID=34431456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100957283A Active CN100473254C (zh) | 2003-11-12 | 2004-11-11 | 三维成形的电路板,组件及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7262489B2 (zh) |
EP (1) | EP1531654B1 (zh) |
KR (1) | KR100699119B1 (zh) |
CN (1) | CN100473254C (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101460012B (zh) * | 2007-12-13 | 2011-04-06 | 住友金属矿山株式会社 | 立体电路板的形成装置及形成方法 |
CN103489500A (zh) * | 2012-06-11 | 2014-01-01 | 三星电机株式会社 | 用于外部电极的导电胶组合物和使用该导电胶组合物制造的多层陶瓷电子元件 |
CN107006120A (zh) * | 2014-12-12 | 2017-08-01 | 凸版印刷株式会社 | 配线印刷物及其制造方法 |
CN108885916A (zh) * | 2016-03-29 | 2018-11-23 | 东洋纺株式会社 | 延展性导电性浆料和曲面印刷线路板的制造方法 |
CN109390175A (zh) * | 2017-08-04 | 2019-02-26 | 神讯电脑(昆山)有限公司 | 立体电路膜、其按键及其制造方法 |
WO2020154949A1 (zh) * | 2019-01-30 | 2020-08-06 | 深圳市柔宇科技有限公司 | 触控装置、电子设备、触控装置制备方法及加压治具 |
WO2021213190A1 (zh) * | 2020-04-21 | 2021-10-28 | 上海宝银电子材料有限公司 | 一种移印工艺用导电油墨其制备方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008024761A2 (en) * | 2006-08-21 | 2008-02-28 | Innotec Corporation | Electrical device having boardless electrical component mounting arrangement |
US8408773B2 (en) | 2007-03-19 | 2013-04-02 | Innotec Corporation | Light for vehicles |
EP1978791A3 (de) * | 2007-04-04 | 2009-12-30 | Hirschmann Car Communication GmbH | Antenneneinrichtung für Fahrzeuge |
US20090011060A1 (en) * | 2007-07-06 | 2009-01-08 | Peter Koepke | Campsiandra angustifolia extract and methods of extracting and using such extract |
US7879369B2 (en) | 2007-09-18 | 2011-02-01 | Selvamedica, Llc | Combretum laurifolium Mart. extract and methods of extracting and using such extract |
US8230575B2 (en) | 2007-12-12 | 2012-07-31 | Innotec Corporation | Overmolded circuit board and method |
DE102010044598B3 (de) * | 2010-09-07 | 2012-01-19 | Leonhard Kurz Stiftung & Co. Kg | Antennen-Bauelement sowie Verfahren zur Herstellung eines Antennen-Bauelements |
WO2012102793A2 (en) | 2010-12-10 | 2012-08-02 | Zirus, Inc. | Mammalian genes involved in toxicity and infection |
DE102011050585B4 (de) * | 2011-05-24 | 2014-05-08 | Kunststoff Helmbrechts Ag | Verfahren zur Herstellung eines Kunststoffformkörpers als Anzeige- und/oder Funktionselement und Kunststoffformkörper |
US9022631B2 (en) | 2012-06-13 | 2015-05-05 | Innotec Corp. | Flexible light pipe |
DE102013003541A1 (de) * | 2013-03-02 | 2014-09-04 | Leopold Kostal Gmbh & Co. Kg | Verfahren zur Herstellung einer funktionalisierten thermoplastischen Kunststofffolie mit hybriden Schichtstrukturen und gemäß diesem Verfahren bearbeitete Kunststofffolie |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH071824B2 (ja) * | 1986-03-05 | 1995-01-11 | 大日本印刷株式会社 | 印刷回路を有する成形品の製造方法およびその製造に使用する転写シ−ト |
EP0477981A3 (en) | 1990-09-27 | 1992-05-06 | Toshiba Lighting & Technology Corporation | Multi-layer circuit substrate having a non-planar shape, and a method for the manufacture thereof |
DE4036592A1 (de) | 1990-11-16 | 1992-05-21 | Bayer Ag | Spritzgegossene leiterplatten durch hinterspritzen von flexiblen schaltungen mit thermoplastischen materialien |
JPH06188537A (ja) | 1992-12-22 | 1994-07-08 | Toshiba Corp | 配線基板の製造方法 |
DE4421561A1 (de) | 1994-06-20 | 1995-12-21 | Bayer Ag | Hochtemperaturbeständige flexible Siebdruckfarben |
JPH09129995A (ja) | 1995-10-26 | 1997-05-16 | Yazaki Corp | 3次元電気回路体及びその製造方法 |
JPH09319068A (ja) | 1996-03-25 | 1997-12-12 | Hitachi Cable Ltd | フォトマスク及びこれを用いた立体回路成形体の製造方法 |
NL1008460C2 (nl) | 1998-03-03 | 1999-09-06 | Acheson Colloiden B V | Geleidende inkt of verf. |
DE19812880A1 (de) * | 1998-03-24 | 1999-09-30 | Bayer Ag | Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung |
JP3513452B2 (ja) * | 1999-07-02 | 2004-03-31 | 新光電気工業株式会社 | 非接触型icカードと非接触型icカードの製造方法と非接触型icカード用平面コイル |
JP2001036240A (ja) | 1999-07-23 | 2001-02-09 | Hitachi Cable Ltd | 成形回路部品の製造方法 |
DE10023015A1 (de) | 2000-05-05 | 2002-01-24 | Inst Chemo Biosensorik | Verdahren zur Herstellung eines dreidimensionalen Sensorelementes |
-
2004
- 2004-11-08 US US10/983,934 patent/US7262489B2/en not_active Expired - Fee Related
- 2004-11-09 KR KR1020040090924A patent/KR100699119B1/ko not_active IP Right Cessation
- 2004-11-09 EP EP04445115A patent/EP1531654B1/en not_active Expired - Fee Related
- 2004-11-11 CN CNB2004100957283A patent/CN100473254C/zh active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101460012B (zh) * | 2007-12-13 | 2011-04-06 | 住友金属矿山株式会社 | 立体电路板的形成装置及形成方法 |
CN103489500A (zh) * | 2012-06-11 | 2014-01-01 | 三星电机株式会社 | 用于外部电极的导电胶组合物和使用该导电胶组合物制造的多层陶瓷电子元件 |
CN107006120A (zh) * | 2014-12-12 | 2017-08-01 | 凸版印刷株式会社 | 配线印刷物及其制造方法 |
CN107006120B (zh) * | 2014-12-12 | 2019-08-20 | 凸版印刷株式会社 | 配线印刷物及其制造方法 |
CN108885916A (zh) * | 2016-03-29 | 2018-11-23 | 东洋纺株式会社 | 延展性导电性浆料和曲面印刷线路板的制造方法 |
CN109390175A (zh) * | 2017-08-04 | 2019-02-26 | 神讯电脑(昆山)有限公司 | 立体电路膜、其按键及其制造方法 |
WO2020154949A1 (zh) * | 2019-01-30 | 2020-08-06 | 深圳市柔宇科技有限公司 | 触控装置、电子设备、触控装置制备方法及加压治具 |
WO2021213190A1 (zh) * | 2020-04-21 | 2021-10-28 | 上海宝银电子材料有限公司 | 一种移印工艺用导电油墨其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20050098857A1 (en) | 2005-05-12 |
CN100473254C (zh) | 2009-03-25 |
EP1531654B1 (en) | 2011-12-28 |
KR100699119B1 (ko) | 2007-03-21 |
US7262489B2 (en) | 2007-08-28 |
KR20050045859A (ko) | 2005-05-17 |
EP1531654A1 (en) | 2005-05-18 |
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Effective date of registration: 20160215 Address after: Saitama City, Saitama Prefecture in Japan Sakura District Tajima eight chome 10 No. 1 Patentee after: Polymatech Japan Co Ltd Address before: Tokyo, Japan Patentee before: Polymatech Co., Ltd., |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Saitama City, Saitama Prefecture in Japan Sakura District Tajima eight chome 10 No. 1 Patentee after: Jishui Baoli Ma Technology Co., Ltd. Address before: Saitama City, Saitama Prefecture in Japan Sakura District Tajima eight chome 10 No. 1 Patentee before: Polymatech Japan Co Ltd |