CN1606403A - 液冷罩 - Google Patents
液冷罩 Download PDFInfo
- Publication number
- CN1606403A CN1606403A CNA2004100282502A CN200410028250A CN1606403A CN 1606403 A CN1606403 A CN 1606403A CN A2004100282502 A CNA2004100282502 A CN A2004100282502A CN 200410028250 A CN200410028250 A CN 200410028250A CN 1606403 A CN1606403 A CN 1606403A
- Authority
- CN
- China
- Prior art keywords
- fin
- cooling jacket
- liquid cooling
- pillar
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 93
- 239000007788 liquid Substances 0.000 title claims abstract description 93
- 238000005192 partition Methods 0.000 claims abstract description 27
- 239000012809 cooling fluid Substances 0.000 claims description 55
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000012546 transfer Methods 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000002826 coolant Substances 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 15
- 238000005452 bending Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241000278713 Theora Species 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003349701A JP3771233B2 (ja) | 2003-10-08 | 2003-10-08 | 液冷ジャケット |
JP349701/2003 | 2003-10-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1606403A true CN1606403A (zh) | 2005-04-13 |
CN100385653C CN100385653C (zh) | 2008-04-30 |
Family
ID=34373532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100282502A Expired - Fee Related CN100385653C (zh) | 2003-10-08 | 2004-03-10 | 液冷罩 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7021367B2 (zh) |
EP (1) | EP1524692A3 (zh) |
JP (1) | JP3771233B2 (zh) |
KR (1) | KR100610293B1 (zh) |
CN (1) | CN100385653C (zh) |
TW (1) | TWI302242B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107425323A (zh) * | 2017-08-28 | 2017-12-01 | 深圳市沃尔新能源电气科技股份有限公司 | 一种插接母端子及应用该母端子的充电枪、充电枪用插座 |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004012026B3 (de) * | 2004-03-11 | 2005-11-17 | Hüttinger Elektronik GmbH & Co. KG | Anordnung zum Kühlen |
TWM267825U (en) * | 2004-11-03 | 2005-06-11 | Forward Electronics Co Ltd | Improved heat sink structure of liquid-cooling type heat sink device |
JP2006286767A (ja) * | 2005-03-31 | 2006-10-19 | Hitachi Ltd | 冷却ジャケット |
JP4266959B2 (ja) * | 2005-06-08 | 2009-05-27 | Necディスプレイソリューションズ株式会社 | 電子機器の冷却装置および投写型光学装置 |
CN100499974C (zh) * | 2005-08-10 | 2009-06-10 | 富准精密工业(深圳)有限公司 | 整合式液冷散热装置 |
JP4593438B2 (ja) | 2005-10-24 | 2010-12-08 | 富士通株式会社 | 電子機器および冷却モジュール |
TWM289878U (en) * | 2005-11-11 | 2006-04-21 | Cooler Master Co Ltd | Heat-dissipation structure of water-cooling type parallel runner |
US20080310105A1 (en) * | 2007-06-14 | 2008-12-18 | Chia-Chun Cheng | Heat dissipating apparatus and water cooling system having the same |
KR100886951B1 (ko) * | 2007-07-12 | 2009-03-09 | 한국전기연구원 | 열전소자를 구비한 냉각장치 |
US8746330B2 (en) * | 2007-08-09 | 2014-06-10 | Coolit Systems Inc. | Fluid heat exchanger configured to provide a split flow |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
US9453691B2 (en) * | 2007-08-09 | 2016-09-27 | Coolit Systems, Inc. | Fluid heat exchange systems |
TW200910068A (en) * | 2007-08-20 | 2009-03-01 | Asustek Comp Inc | Heat dissipation apparatus |
JP5341549B2 (ja) * | 2009-02-19 | 2013-11-13 | 株式会社ティラド | ヒートシンク |
US8000101B2 (en) * | 2009-07-23 | 2011-08-16 | Hewlett-Packard Development Company, L.P. | System and method for attaching liquid cooling apparatus to a chassis |
EP2627988A4 (en) | 2010-10-14 | 2017-11-15 | Thermo Fisher Scientific (Bremen) GmbH | Optical chamber module assembly |
US9651488B2 (en) | 2010-10-14 | 2017-05-16 | Thermo Fisher Scientific (Bremen) Gmbh | High-accuracy mid-IR laser-based gas sensor |
US20120103575A1 (en) * | 2010-11-03 | 2012-05-03 | Hon Hai Precision Industry Co., Ltd. | Cooling device |
US20120305218A1 (en) * | 2011-06-01 | 2012-12-06 | Benjamin Masefield | Heat Sink |
CN102819303A (zh) * | 2011-06-09 | 2012-12-12 | 鸿富锦精密工业(深圳)有限公司 | 计算机机箱 |
WO2014141162A1 (en) | 2013-03-15 | 2014-09-18 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
DE102011052707A1 (de) * | 2011-08-15 | 2013-02-21 | Pierburg Gmbh | Kühlvorrichtung für ein thermisch belastetes Bauteil |
WO2013047975A1 (en) | 2011-09-26 | 2013-04-04 | Posco Led Company Ltd. | Optical semiconductor-based lighting apparatus |
TWM424749U (en) * | 2011-10-27 | 2012-03-11 | Enermax Technology Corp | Liquid-cooled heat exchange module improvement |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
US9818671B2 (en) * | 2015-02-10 | 2017-11-14 | Dynatron Corporation | Liquid-cooled heat sink for electronic devices |
US10107303B2 (en) * | 2015-05-22 | 2018-10-23 | Teza Technologies LLC | Fluid cooled server and radiator |
JP6482955B2 (ja) * | 2015-06-02 | 2019-03-13 | 昭和電工株式会社 | 液冷式冷却装置 |
DE102016204895B4 (de) * | 2016-03-23 | 2020-11-12 | Phoenix Contact E-Mobility Gmbh | Ladestecker mit einem Leistungskontaktsystem und Ladestation zur Abgabe elektrischer Energie an einen Empfänger elektrischer Energie |
US10634335B2 (en) * | 2017-01-18 | 2020-04-28 | Fujian Sanan Sino-Science Photobiotech Co., Ltd. | Easily formed liquid cooling module of an LED lamp |
US10582650B2 (en) * | 2017-10-13 | 2020-03-03 | Arista Networks, Inc. | Power supply with interchangeable fan module |
KR102329245B1 (ko) * | 2017-12-08 | 2021-11-22 | 주식회사 케이엠더블유 | 전장소자의 방열 장치 |
KR101990592B1 (ko) | 2018-05-28 | 2019-06-18 | 한국기계연구원 | 상변화 냉각모듈 및 이를 이용하는 배터리팩 |
TWM575882U (zh) * | 2018-11-22 | 2019-03-21 | 訊凱國際股份有限公司 | 外接式水冷裝置 |
KR102091698B1 (ko) | 2019-01-08 | 2020-03-20 | 한국기계연구원 | 상변화 냉각장치 및 상변화 냉각방법 |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US10874034B1 (en) * | 2019-11-05 | 2020-12-22 | Facebook, Inc. | Pump driven liquid cooling module with tower fins |
WO2021229365A1 (en) | 2020-05-11 | 2021-11-18 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
CN114485216B (zh) * | 2022-01-10 | 2023-06-23 | 中国科学院理化技术研究所 | 辐射翅片式换热器及自由活塞斯特林发电机 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
JPS55123153A (en) * | 1979-03-16 | 1980-09-22 | Fujitsu Ltd | Semiconductor device |
US4592415A (en) * | 1984-10-09 | 1986-06-03 | Howard Friedman | Thin flat heat exchanger and method of making same |
JPS6243054A (ja) * | 1985-08-20 | 1987-02-25 | Oki Electric Ind Co Ltd | 真空装置 |
JPS62274798A (ja) * | 1986-05-19 | 1987-11-28 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | ヒ−トシンク構造体 |
JP2635914B2 (ja) * | 1993-08-18 | 1997-07-30 | カワソーテクセル株式会社 | 液冷抵抗器 |
JP2833999B2 (ja) * | 1994-07-13 | 1998-12-09 | 日本電気株式会社 | Lsiの冷却モジュール |
DE69619217T2 (de) * | 1995-08-25 | 2002-08-22 | Kabushiki Kaisha Toyota Jidoshokki, Kariya | Viscositätsheizung |
US5763951A (en) * | 1996-07-22 | 1998-06-09 | Northrop Grumman Corporation | Non-mechanical magnetic pump for liquid cooling |
US6167948B1 (en) * | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
EP0889524A3 (en) * | 1997-06-30 | 1999-03-03 | Sun Microsystems, Inc. | Scalable and modular heat sink-heat pipe cooling system |
JPH11121667A (ja) * | 1997-10-20 | 1999-04-30 | Fujitsu Ltd | ヒートパイプ式冷却装置 |
JP2000340727A (ja) | 1999-05-26 | 2000-12-08 | Nissan Motor Co Ltd | 電子部品の冷却構造 |
US6199625B1 (en) * | 1999-06-11 | 2001-03-13 | Psc Computer Products, Inc. | Stackable heat sink for electronic components |
US6796370B1 (en) * | 2000-11-03 | 2004-09-28 | Cray Inc. | Semiconductor circular and radial flow cooler |
JP4634599B2 (ja) | 2000-11-30 | 2011-02-16 | 株式会社ティラド | 水冷ヒートシンク |
DE20111305U1 (de) * | 2001-07-11 | 2002-01-31 | innovatek OS GmbH, 85084 Reichertshofen | Wasserkühlsystem zur Kühlung von CPU's incl. Halterung |
US6707676B1 (en) * | 2002-08-30 | 2004-03-16 | Ehood Geva | Heat sink for automatic assembling |
US6712128B1 (en) * | 2002-11-20 | 2004-03-30 | Thermal Corp. | Cylindrical fin tower heat sink and heat exchanger |
DE20302201U1 (de) * | 2003-02-12 | 2003-04-24 | May, Stefan, 37077 Göttingen | Sequentiell umflossene Temperiereinrichtung |
US6793009B1 (en) * | 2003-06-10 | 2004-09-21 | Thermal Corp. | CTE-matched heat pipe |
-
2003
- 2003-10-08 JP JP2003349701A patent/JP3771233B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-03 TW TW093105571A patent/TWI302242B/zh not_active IP Right Cessation
- 2004-03-08 EP EP04005471A patent/EP1524692A3/en not_active Withdrawn
- 2004-03-09 KR KR1020040015680A patent/KR100610293B1/ko active IP Right Grant
- 2004-03-10 CN CNB2004100282502A patent/CN100385653C/zh not_active Expired - Fee Related
- 2004-03-10 US US10/796,045 patent/US7021367B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107425323A (zh) * | 2017-08-28 | 2017-12-01 | 深圳市沃尔新能源电气科技股份有限公司 | 一种插接母端子及应用该母端子的充电枪、充电枪用插座 |
CN107425323B (zh) * | 2017-08-28 | 2022-07-05 | 深圳市沃尔新能源电气科技股份有限公司 | 一种插接母端子及应用该母端子的充电枪、充电枪用插座 |
Also Published As
Publication number | Publication date |
---|---|
JP3771233B2 (ja) | 2006-04-26 |
EP1524692A2 (en) | 2005-04-20 |
US20050077028A1 (en) | 2005-04-14 |
TW200513832A (en) | 2005-04-16 |
KR100610293B1 (ko) | 2006-08-09 |
TWI302242B (en) | 2008-10-21 |
US7021367B2 (en) | 2006-04-04 |
JP2005116815A (ja) | 2005-04-28 |
KR20050034526A (ko) | 2005-04-14 |
EP1524692A3 (en) | 2009-12-23 |
CN100385653C (zh) | 2008-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1606403A (zh) | 液冷罩 | |
CN1455953A (zh) | 电子装置 | |
CN1302543C (zh) | 用于电子设备的冷却机构 | |
CN1296671C (zh) | 传热装置和电子装置 | |
CN1310317C (zh) | 备有冷却机构的电子设备 | |
US20050241806A1 (en) | Radiator plate rapid cooling apparatus | |
CN1545001A (zh) | 电子机器冷却装置 | |
CN1658122A (zh) | 电子设备的冷却系统及使用该冷却系统的电子设备 | |
US20060034055A1 (en) | Compact cooling device | |
US20100328951A1 (en) | Luminaire system with thermal chimney effect | |
CN1490696A (zh) | 具有冷却发热元件的冷却液循环管路的电子装置 | |
CN1525810A (zh) | 带有用液体冷却剂冷却的发热元件的电子设备 | |
CN1627510A (zh) | 散热片、冷却装置、电子设备、冷却装置的制造方法 | |
CN1320357A (zh) | 对其内容纳有发热元件的箱体进行冷却的装置及其冷却方法 | |
CN1691880A (zh) | 电子设备 | |
CN1929727A (zh) | 一种远程被动式循环相变散热方法和散热系统 | |
CN101749968B (zh) | 散热器及冷却单元 | |
CN1853269A (zh) | 冷却装置和电子装置 | |
CN2834122Y (zh) | 一种异地风冷式微槽群相变散热系统 | |
CN1591849A (zh) | 电子仪器装置 | |
CN1828875A (zh) | 液冷式散热模块 | |
CN2691053Y (zh) | 液冷式散热模组 | |
CN1921093A (zh) | 一种散热装置及其散热方法 | |
CN2594507Y (zh) | 散热结构 | |
CN2882204Y (zh) | 直立式风扇散热器结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI LTD. Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20130723 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130723 Address after: Tokyo, Japan Patentee after: HITACHI CONSUMER ELECTRONICS Co.,Ltd. Address before: Tokyo, Japan Patentee before: Hitachi, Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: HITACHI MAXELL LTD. Free format text: FORMER OWNER: HITACHI LTD. Effective date: 20150401 |
|
TR01 | Transfer of patent right |
Effective date of registration: 20150401 Address after: Osaka, Japan Patentee after: Hitachi Maxell, Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Consumer Electronics Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171213 Address after: Kyoto Japan Patentee after: MAXELL, Ltd. Address before: Osaka, Japan Patentee before: Hitachi Maxell, Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: MAXELL, Ltd. Address before: Kyoto Japan Patentee before: MAXELL HOLDINGS, Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220602 Address after: Kyoto Japan Patentee after: MAXELL HOLDINGS, Ltd. Address before: Kyoto, Japan Patentee before: MAXELL, Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080430 |