CN1572383A - Cleansing device - Google Patents

Cleansing device Download PDF

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Publication number
CN1572383A
CN1572383A CNA200410042930XA CN200410042930A CN1572383A CN 1572383 A CN1572383 A CN 1572383A CN A200410042930X A CNA200410042930X A CN A200410042930XA CN 200410042930 A CN200410042930 A CN 200410042930A CN 1572383 A CN1572383 A CN 1572383A
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CN
China
Prior art keywords
gas
injection apparatus
cleaning device
cleaned
thing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200410042930XA
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Chinese (zh)
Inventor
吉田隆司
菊地长保
岩崎元明
幅谷仓夫
矢野达郎
城间贵浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJI ELECTRIC ELECTRONIC Co Ltd
Fuji Electric Co Ltd
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FUJI ELECTRIC ELECTRONIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJI ELECTRIC ELECTRONIC Co Ltd filed Critical FUJI ELECTRIC ELECTRONIC Co Ltd
Publication of CN1572383A publication Critical patent/CN1572383A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02Cleaning by the force of jets, e.g. blowing-out cavities
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/003Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning In General (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

This cleaning apparatus which cleans the object to be cleaned by injecting a solvent upon the object from a nozzle has a gas blowing means which blows a heated gas upon the surface of the object for preventing the occurrence of dew condensation on the surface of the object. This apparatus is constituted to move to the surface of the object at cleaning time and to retreat from the object at non-cleaning time. In addition, this apparatus is also constituted to blow the heated gas at a small flow rate at the non-cleaning time and at a large flow rate at the cleaning time.

Description

Cleaning device
Technical field
The present invention relates to clean and remove lip-deep minuteness particle and organic cleaning devices such as hard disk medium and silicon wafer.
Background technology
The glass plates of processing hard disk medium and silicon wafer or LCD etc. etc. require the concavo-convex minimum of making on surface, and because of the reason of microfabrication, the surface will be cleaned safely, can not remaining fine particle and organic matter.
The spy opens in the 2003-1208 communique and discloses the cleaning device that surfaces such as this silicon wafer are cleaned.
Fig. 5 is the pie graph of the cleaning device described in the above-mentioned communique.In the drawings, 11 is CO as cleaning agent (hereinafter referred to as solvent) 2High-pressure gas cylinder, the CO that it is inner 2Being divided into temperature is the liquid part 111 of T and the gas part 112 that pressure is Po.12 for remaining high-pressure gas cylinder 11 heater of uniform temperature.
13 is to take out gas CO to the outside 2Conduit.14 are the pressure gauge in the way that is arranged on conduit 13, are used to measure the pressure in the conduit 13.This pressure is identical with the pressure P o of gas part 112.15 for being installed in the valve on the conduit 13.16 is in-line filter, and 17 is pneumatic operated valve, and they all are installed on the conduit 13.In addition, CO 2High-pressure gas cylinder 11, in-line filter 16 and pneumatic operated valve 17 are installed by illustrated order.
19 for as the hard disk medium that are cleaned thing, drives rotation by main shaft 20.18 is nozzle, it be cleaned thing 19 and leave predetermined gap d and install.Nozzle 18 makes dual pipe.CO by conduit 13 conductings 2Gas feeds in the inboard pipe; N 2Gas feeds in the pipe in the outside.21 is infrared heater, is used for heating and is cleaned thing 19.22 for spraying N 2The scavenge pipe of gas.
In Fig. 5, the pressure that utilizes pressure gauge 14 to measure in the conduit 13, this pressure is certain, its control heater 12.Because CO in the high-pressure gas cylinder 11 2Liquids and gases coexistences, the pressure P o of gas part 112 becomes the saturated vapor pressure of the temperature T of liquid part 111.Owing to be 1 pair 1 relation between fluid temperature and the saturated vapor pressure, therefore, can control saturated vapor pressure, i.e. the pressure of conduit 13 by utilizing the temperature of heater 12 control liquid parts 111.For example, when fluid temperature was controlled to 22 ℃, saturated vapor pressure was 6.0MPa.
Adopt this structure, make solvent (CO 2) gas in in-line filter, pass through, remove particles such as dust, again from nozzle ejection, be transformed into solids or drop, be injected in and be cleaned on the thing, can wash particle or organic matter.In addition, by the control nozzle be cleaned gap between the thing, solvent can be become fixedly particle or droplet-like, therefore can select optimal solvent state according to the degree of pollution.Owing to utilize filter to remove the particle of dust in the solvent etc. easily, therefore need not use the high solvent of purity of high price, can reduce operating cost.
Patent documentation 1: the spy opens the 2003-1208 communique.
Yet, have following problem in this cleaning device.
1) owing to have and to be cleaned the infrared heater 21 that thing 19 is heated to set point of temperature, produces particles such as dust from this part.
2) pass through CO 2Adiabatic expansion during injection cools off the front end of nozzle 18, along with CO rapidly 2The reduction of temperature is liquefied in the stream, can not control the generation of dry ice.In order to prevent this point, utilize above-mentioned infrared heater 21 to carry out temperature control, but owing to can not control the temperature of nozzle 18 independently, therefore, CO sometimes 2The generation instability.
Summary of the invention
Therefore, in order to address this problem, the invention provides a kind of when reducing dust generation source, by preventing to blow CO being cleaned on the thing 2CO in dewfall that is cleaned thing that causes and the pipeline 2Dewfall, the cleaning device that can carry out cleaner cleaning.
In order to address this problem, the invention of first aspect present invention record, relate to a kind of can be with cleaning agent from nozzle ejection to being cleaned the cleaning device that thing cleans, the gas that it has heating is injected in the lip-deep gas injection apparatus that is cleaned thing, can move above-mentioned being cleaned on the thing during cleaning, keep out of the way from the above-mentioned thing that is cleaned when not cleaning, when cleaning and during non-cleaning, can control the emitted dose of gas after the above-mentioned heating.
A second aspect of the present invention is that the above-mentioned gas injection apparatus has a plurality of squit holes in the described cleaning device of first aspect present invention, simultaneously, is heated to the gas of set point of temperature from these squit hole ejections.
A third aspect of the present invention, be in the present invention first or the described cleaning device of second aspect, one end bearing of above-mentioned gas injection apparatus separates the distance of regulation with the above-mentioned surface that is cleaned thing on support unit, the gas of ejection is towards the above-mentioned surface ejection that is cleaned thing.
A fourth aspect of the present invention is in the described cleaning device of the present invention first~3rd either side, and the squit hole of above-mentioned gas injection apparatus is configured to the surface that is cleaned thing with respect to above-mentioned, has the angle of regulation.
A fifth aspect of the present invention, be in the described cleaning device of fourth aspect present invention, the above-mentioned gas spray device arrangement is between center that is cleaned thing and periphery edge, it has with respect to the surface that is cleaned thing, the squit hole of both direction at least in vertical direction and interior Zhou Fangxiang or peripheral direction.
A sixth aspect of the present invention is in the present invention first~described cleaning device of the 5th either side, is provided with the filter that is used to clean above-mentioned gas.
A seventh aspect of the present invention is that above-mentioned support unit and filter are configured in the moist closet with the heater of heating above-mentioned gas in the present invention the 3rd~described cleaning device of the 6th either side.
A eighth aspect of the present invention is in the present invention the 3rd~described cleaning device of the 7th either side, is provided with temperature control device at least one of above-mentioned support unit or filter.
A ninth aspect of the present invention is in the present invention the 3rd~described cleaning device of the 8th either side, and the gas injection apparatus that is bearing on the described support unit disposes two across central part ground at least being cleaned on the surface of thing.
A tenth aspect of the present invention is in the described cleaning device of ninth aspect present invention, in described at least two gas injection apparatus, flows from the gas shunting in same gas source.
A eleventh aspect of the present invention, be in the present invention second~described cleaning device of the tenth either side, near the center that is supported at least two gas injection apparatus on the above-mentioned support unit, above-mentioned solvent injection apparatus is installed, above-mentioned gas injection apparatus and solvent injection apparatus are driven as one.
A twelveth aspect of the present invention is in the present invention first~described cleaning device of the 11 either side, is provided with temperature control equipment in above-mentioned solvent injection apparatus, thereby the temperature of above-mentioned solvent is controlled at more than the dew point.
A thirteenth aspect of the present invention is in the present invention first~described cleaning device of the 12 either side, on the periphery that is arranged at the nozzle on the above-mentioned solvent injection apparatus, forms the gas squit hole of ejection gas.
A fourteenth aspect of the present invention is in the present invention first~described cleaning device of the 13 either side, and above-mentioned solvent injection apparatus forms bar-shaped, and the inclination of wedge shape is set on the length direction corresponding with above-mentioned cleaning surface.
Description of drawings
Fig. 1 is the major part structure chart of an example of expression embodiment of the present invention;
Fig. 2 is the figure of an example of the embodiment of expression solvent injection apparatus of the present invention;
Fig. 3 is the figure of an example of another embodiment of expression solvent injection apparatus of the present invention;
Fig. 4 uses the dry ice (CO of solvent injection apparatus of the present invention for expression 2) the figure that flows;
Fig. 5 is the structure chart of the existing example of expression.
Symbol description: 1-pipe; 2-support unit (house steward); The 3-filter; 4-heater block; The 5-pneumatic operated valve; 6-N 2Ingress pipe; 8-CO 2Injection apparatus; The 8a-metal blocks; The 8b-nozzle; 8c, 8f-CO 2Stream; 8d-N 2Stream; The 8e-temperature control equipment; The 9-wedge-shaped part; 10-overflows portion's (escaping げ portion).
Embodiment
Below with reference to the accompanying drawings, describe the present invention in detail.
Fig. 1 is the pie graph of the major part of an example of the embodiment of expression cleaning device of the present invention.Among the figure, the A portion that double dot dash line is surrounded is a moist closet, has omitted among the figure, and it uses heat-insulating material to prevent carrying out heat exchange with the outside.In this moist closet, place heater block 4, filter 3 and support unit 2.1 for constituting the pipe of gas injection apparatus, and the one end seals, and the other end is fixed on the support unit (house steward) 2.In the drawings, this pipe disposes one respectively between center that is cleaned thing 19 and periphery edge.Because with the dewfall that prevents to be cleaned thing 19 is main purpose, wish 4 pipes to be set on the surface and the back side.But, if can prevent dewfall, then at least one also passable.
On pipe 1, form the hole 1a of two series at length direction, 1b, these holes are for uniformly-spaced, and become the angle of regulation with respect to the surface that is cleaned thing 19, that is: the hole of 1a row forms in vertical direction with respect to the surface that is cleaned thing 19, and the Kong Ze of 1b row is forming towards 45 ° of center positions.
On support unit 2, form branched hole 2a, the fixing of the other end of two pipes 1 and this branched hole sealed at both endsly.The pipeline 3a that is connected with the outlet of filter 3 is connected with the regulation position of branched hole 2a.Import N 2The pipeline 4a of gas is connected with the inlet of heater block 4, and the pipeline 4b that is connected with the inlet of filter 3 is connected with outlet.
N 2Gas flows into to import from both direction N 2Among the pipeline 4a of gas, usual low discharge N 2Gas is from the inlet inflow of ingress pipe 6a often, the N of larger capacity during cleaning 2Gas is by pneumatic operated valve 5, and the ingress pipe 6b during from another root injection flows into.
8 is bar-shaped CO 2Injection apparatus, its length are 50mm, by thermal capacity about 15mm big metal blocks 8a constitute on one side, an end is fixed on the support unit 2, and the other end forms the nozzle 8b with the squit hole about 0.3mm.
Fig. 2 is the sectional view (a) of an example of the embodiment of expression injection apparatus 8, side view (b) and (a) amplification sectional view of figure (c).
In these figure, 8c is the CO as solvent 2The CO that flows 2Stream, 8d are N 2The N that gas flows into 2Stream.Import N 2N among the stream 8d 2Gas is from the periphery ejection of nozzle 8b.
Nozzle 8b can make another parts, is fixed on the front end of metal blocks 8a by be pressed into or welding etc.8e is a temperature control equipment, has omitted among the figure, pack on this part heater, temperature sensor and temperature control loop.
Fig. 3 is sectional view (a), side view (b) and the upward view (c) of an example of another embodiment of expression injection apparatus 8.In the drawings, 8f is the CO as solvent 2The CO that flows 2Stream.8e is a temperature control equipment, has omitted in the drawings, pack on this part heater, temperature sensor and temperature control loop.
With CO shown in Figure 2 2The injection apparatus difference is in order to spray N 2Gas does not have N 2Stream 8d (with reference to Fig. 2) and with the surperficial corresponding surface that is cleaned thing 19 on, be provided with wedge-shaped part 9 and overflow portion 10.
(a~c) expression utilizes CO shown in Figure 3 to Fig. 4 2Injection apparatus (metal blocks 8a) sprays CO 2The time CO 2Flow.(a) being front view, (b) is side view, (c) is stereogram.According to these figure, from the CO of nozzle 8b ejection 2Not can and metal blocks 8a between rebound, and flow reposefully.
Being back to Fig. 1 can find out, with support unit 2, filter 3, heater block 4, the CO in the moist closet A of double dot dash line encirclement 2Injection apparatus 8 and pipe 1 drive as one.When cleaning was cleaned thing 19, this moist closet A moved in the arrow B direction, sought to be cleaned thing.Along with searching, spray CO from nozzle 8a 2To being cleaned on the thing.Pneumatic operated valve and CO 2The time synchronized of spraying is opened, and makes the N of big flow 2The ingress pipe 6b ejection of gas when spraying.
When cleaning end, be cleaned thing in order to take out, moist closet A keeps out of the way along the arrow C direction.When keeping out of the way,, be heated to the N of the low discharge of set point of temperature by ingress pipe 6a → heater block 4 → filter 3 → support unit 2 often 2Gas is ejected in the pipe 1, will manage 1 and itself be maintained until set point of temperature.
During cleaning, from N with respect to the squit hole 1a ejection that is cleaned thing 19 vertical formation 2Gas mainly carries out the heating on surface.Equally, the N that comes out from the hole 1b that side direction in 45 ° forms 2Gas can heat the whole surface that is cleaned thing equably.In addition, N 2The temperature of gas is controlled to the temperature of regulation by being located at temperature control equipment on heater block 4 and the filter 3.
As mentioned above, as injection apparatus, can use Fig. 2 and device shown in Figure 3.That shown in Figure 2 is CO 2Gas is from CO 2Stream 8c sprays by nozzle 8b; N 2Gas is from N 2Stream 8d is by the hole ejection that forms on the periphery of nozzle 8b.
Here, N 2Gas be the reasons are as follows from the ejection of nozzle periphery.
CO from nozzle ejection 2Gas is cooled by adiabatic expansion, and the temperature of nozzle periphery reduces.Because like this, the temperature of nozzle block body portion integral body compares CO 2The condensing temperature of gas (when spraying pressure for 6MPa is 22 ℃) is low, the result, and in the pipeline portions in the nozzle block, CO 2Gas liquefaction, CO 2Gas is liquid injection.As a result, the growing amount instability of dry ice etc. can not be controlled.
Temperature control equipment 8e controls CO 2And N 2The temperature of gas, the above-mentioned phenomenon of unlikely generation.
Embodiment shown in Figure 3 has omitted N 2The CO of the nozzle 8b that simplifies has only been represented in the injection of gas 2Injection apparatus.Utilize temperature control equipment 8e to heat the big metal blocks part of whole thermal capacity, to remain on CO 2More than the condensing temperature of gas.
Adopt this structure, owing to do not need the N that is used to clean as shown in Figure 2 2Gas can be cut down filter and valve class that this system uses, can make more miniaturization and of whole system.In addition, owing to do not need the joint of nozzle 8b, can make nozzle more easily.
In addition, in this embodiment, will form wedge shape with a side that is cleaned the thing opposite.As a result, from the dry ice of nozzle 8b ejection, not can and metal blocks 8a between rebound, can clean reposefully.In addition, wedge-shaped part 9 also can be formed on CO shown in Figure 2 2In the injection apparatus.
Above explanation of the present invention is only to illustrate and to be exemplified as the specific preferred embodiment of purpose.Therefore, many changes and the distortion done under conditions without departing from the spirit of the invention, apparent to those skilled in the art.For example, in the present embodiment, with CO 2The shape of injection apparatus makes rectangle, uses pipe as N 2Injection apparatus, but these shapes all are arbitrarily.
In addition, the temperature control equipment that is used to heat be located at filter 3 and heater block 4 both, be located on any one also passable.In an embodiment, get the gas of heating usefulness as N 2Gas, the air that use is dry etc. also can.
Defined scope of the present invention in the claim scope has comprised change and distortion in this scope.
Find out from above-mentioned, adopt the present invention can obtain following effect. According to the present invention, Cleaning agent from the cleaning device that nozzle ejection to cleaned material is cleaned, is had and will add The gas of heat is injected in the lip-deep gas injection apparatus of cleaned material, can be above-mentioned during cleaning Mobile on the cleaned material, keep out of the way from above-mentioned cleaned material when not cleaning, when cleaning and non-clear When washing, can control the emitted dose of the gas of above-mentioned heating. Therefore, reducing the dust generating source The time, by preventing from blowing out the CO to the cleaned material2The dewfall that causes can realize clean Defecate the cleaning device of washing.
According to the present invention, the above-mentioned gas injection apparatus has a plurality of squit holes, simultaneously, and from these sprays The ejection of portalling is heated to the gas of set point of temperature. Owing to separate regulation on the surface with cleaned material In the time of the distance configuration, at least two sides with vertical direction and interior Zhou Fangxiang or lateral direction To squit hole, outside the heating cleaning of carrying out the surface, can also improve the temperature of cleaned material The degree spot.
According to the present invention, owing to be provided with the filter that the cleaning above-mentioned gas is used, therefore can prevent Sprayed the pollution of the cleaned material that causes by heated air.
According to the present invention, because the heater one of support unit and filter and heating above-mentioned gas Rise, be configured in the moist closet. On at least one of support unit or filter, be provided with temperature Controlling organization. Therefore, can more correctly control the N that sends to gas injection apparatus2The temperature of gas Degree.
According to the present invention, owing to be bearing in pipe on the support unit at least on the surface of cleaned material Upper dispose two across central part ground, in above-mentioned at least two pipes, from the same gas source Gas distribution flows, and near the central authorities of pipe above-mentioned injection apparatus is installed, and makes pipe and injection Device drives as one, therefore, can make the designs simplification of device integral body.
According to the present invention, owing in the above-mentioned solvent injection apparatus that sprays solvent, be provided with the temperature control Device processed is controlled at the temperature of above-mentioned solvent more than the dew point. Therefore, can more correctly control CO processed2Temperature.
According to the present invention, on the periphery that is arranged at the nozzle on the above-mentioned injection apparatus, make spray Go out the structure of gas. Owing to be provided with temperature control equipment at injection apparatus, can control solvent With the temperature of gas, therefore can more correctly control CO2Temperature.
According to the present invention, because that mentioned solution matchmaker injection apparatus forms is bar-shaped, with above-mentioned clear The inclination of wedge shape is set on the length direction of the surface correspondence of washing, and therefore, the dry ice of ejection can not And metal blocks between rebound, can clean stably.

Claims (14)

1. cleaning device, it can clean from nozzle ejection cleaning agent to being cleaned thing, it is characterized by, the gas that has heating is injected in the lip-deep gas injection apparatus that is cleaned thing, can move described being cleaned on the thing during cleaning, keep out of the way from the described thing that is cleaned when not cleaning, can control the emitted dose of the gas of described heating when cleaning and during non-cleaning.
2. cleaning device as claimed in claim 1 is characterized by, and described gas injection apparatus has a plurality of squit holes, and is heated to the gas of set point of temperature from these squit hole ejections.
3. cleaning device as claimed in claim 1 or 2 is characterized by, and an end bearing of described gas injection apparatus separates the configuration of predetermined distance ground with the described surface that is cleaned thing on support unit, and the gas of ejection is towards the described surface ejection that is cleaned thing.
4. as each described cleaning device in the claim 1~3, it is characterized by, the squit hole of described gas injection apparatus is configured to the surface that is cleaned thing with respect to described, has the angle of regulation.
5. cleaning device as claimed in claim 4, it is characterized by, described gas injection apparatus is configured between the center and periphery edge that is cleaned thing, and with respect to the surface that is cleaned thing, has the squit hole of the both direction at least of vertical direction and interior Zhou Fangxiang or peripheral direction.
6. as each described cleaning device in the claim 1~5, it is characterized by, be provided with the filter that is used to clean described gas.
7. as each described cleaning device in the claim 3~6, it is characterized by, described support unit and filter are configured in the moist closet with the heater of the described gas of heating.
8. as each described cleaning device in the claim 3~7, it is characterized by, at least one of described support unit or filter, be provided with temperature control device.
9. as each described cleaning device in the claim 3~8, it is characterized by, the gas injection apparatus that is bearing on the described support unit disposes two across central part ground at least being cleaned on the surface of thing.
10. cleaning device as claimed in claim 9 is characterized by, and in described at least two gas injection apparatus, flows from the gas shunting in same gas source.
11. as each described cleaning device in the claim 2~10, it is characterized by, near the center that is supported at least two gas injection apparatus on the described support unit, described solvent injection apparatus is installed, described gas injection apparatus and solvent injection apparatus are driven as one.
12., it is characterized by as each described cleaning device in the claim 1~11, in described solvent injection apparatus, be provided with temperature control equipment, the temperature of described solvent is controlled at more than the dew point.
13. as each described cleaning device in the claim 1~12, it is characterized by,, form the gas squit hole of ejection gas in the periphery that is arranged at the nozzle on the described solvent injection apparatus.
14. as each described cleaning device in the claim 1~13, it is characterized by, described solvent injection apparatus forms bar-shaped, with the surperficial corresponding length direction of described cleaning body on the inclination of wedge shape is set.
CNA200410042930XA 2003-06-02 2004-06-01 Cleansing device Pending CN1572383A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003156321 2003-06-02
JP2003156321A JP4118194B2 (en) 2003-06-02 2003-06-02 Cleaning device

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Publication Number Publication Date
CN1572383A true CN1572383A (en) 2005-02-02

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US (1) US20050160552A1 (en)
JP (1) JP4118194B2 (en)
CN (1) CN1572383A (en)
MY (1) MY135287A (en)
SG (1) SG140459A1 (en)

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CN108188112A (en) * 2018-01-08 2018-06-22 迪普干冰制造(大连)有限公司 Liquid CO 2 cleaning system
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