CN1393910A - Injecting device for treating glass substrate or wafer - Google Patents
Injecting device for treating glass substrate or wafer Download PDFInfo
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- CN1393910A CN1393910A CN 01124801 CN01124801A CN1393910A CN 1393910 A CN1393910 A CN 1393910A CN 01124801 CN01124801 CN 01124801 CN 01124801 A CN01124801 A CN 01124801A CN 1393910 A CN1393910 A CN 1393910A
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- glass substrate
- liquid
- wafer
- injection device
- solution
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Abstract
The invented filler includes following parts. The injection part is used for injecting the vaporous IPA and steam of solutions. The supply part regenerates the residual liquid or provides the new liquid. The producer is used to vaporize IPA and solution. The injection part possesses the filling hole and the overhead tank. The filling hole located at the one end is utilized to inject the vaporous IPA and steam of solutions. The overhead tank possesses the entrance-guiding piece and the exit-guiding piece formed at the ends of the two sides of let the substrate glass pass in and out freely. The supply part possesses the evaporation unit and condensation unit, which transfer the residual liquid and vaporize the transferred liquid. The producer possesses the heater and supply part for heating and supply IPA and solutions so as to provide the liquid for the substrate glass through the filling hole.
Description
Technical field
The present invention relates to a kind of injection device, and relate to the injection device that is used to handle glass substrate or wafer especially, can be dry, grow, clean, peel off and etching is used for glass substrate or the semiconductor wafer that liquid crystal illustrates device.
Background technology
The glass substrate that liquid crystal illustrates device must need clean, and this is the process that is used to remove particle on the substrate.Doing like this is in order to make the minimization of loss of thin-film transistor, and improves output.Clean is utilized physical force, ultrasonic wave, UV/O by using pure water
3Or the like mode remove or be decomposed to form organic or inorganic material on glass substrate.Thus, the drying of glass is necessary.
Traditionally, air doctor blade or rotary drier illustrate the device of the glass substrate of device as dry liquid crystal.
Fig. 1 a illustrates in general by using the method for air doctor blade drying mobile glass substrate on cleaning unit.As shown in Figure 1a, by the glass substrate that brush, M/S (vibration accelerator) and/or high-pressure installation clean on cleaning unit 11, utilize air doctor blade dry on drying unit.The air doctor blade that is used for residual pure water on the dry glass substrate shown in Fig. 1 c, comprising: inlet hole 13b, be arranged on the side of main body 13a, and be used to suck air; Hand-hole 13d; With slit control assembly 13c, be used to control the size of hand-hole 13d.Fig. 1 b shows the operation by air doctor blade dry glass substrate.Shown in Fig. 1 b, glass substrate moves on the direction of cleaning unit 11 upper edge solid arrows by the machine 11a that packs into.Air doctor blade 13 is arranged to form with respect to the main shaft of glass substrate 10 and the constant inclined-plane of injection air along the direction of dotted arrow.A series of operation disperses clean solution, and as pure water residual on the glass substrate 10, dry substrate 10 thus.
Yet in the superincumbent structure, when the discharge gas on chamber top and when being used for pressure between the dry injecting gas/instability of flow, the front-end and back-end between substrate 10 and air doctor blade 13 are by the unsteadiness generation whirlpool of air-flow.Thus, clean solution is stayed on the substrate 10, and residual clean solution forms stain on the surface of glass substrate 1, and these stains make display quality worsen.Equally, the dust in the chamber makes cleaning effect not good because whirlpool is bonded on the surface of substrate 10 once more.And the drying unit with said structure is difficult to be applied on the large-area glass substrate, and in this case, the unsteadiness of air-flow increases the weight of more.
Fig. 2 illustrates in general by using traditional rotary drier to come drying to peel off the method for the glass substrate on the unit.Rotary drier is to peel off emulsion by stripping machine, cleans emulsion, the device of dry then residual on-chip clean solution (as pure water).As shown in Figure 2, rotary drier 20 comprises: rotary driving part 21; Base sheet rack 23,35 is used for rotating along with the rotation of rotary driving part, and supports glass substrate 10; With spray nozzle of the gas supply parts 27, be used for providing N from the upper and lower of rotary substrate 10
2Gas.
Function by rotary drier dry glass substrate is better than the function by air doctor blade dry glass substrate, but has following problem by rotary drier dry glass substrate.
In the superincumbent structure, as the trickle balance of chamber bottom exhaust, the N of upper and lower
2When the flow of gas, rotating speed and acceleration are unstable, between substrate 10 and the swivelling cover 21a and on the rear surface of substrate 10 owing to the unsteadiness generation whirlpool of air-flow, clean solution is stayed on the substrate 10.Residual clean solution forms substrate 10 lip-deep stains, and stain makes display quality worsen.Equally, the dust in the chamber makes cleaning effect not good because whirlpool is bonded on the surface of substrate 10 again.And when the drying unit of the structure above having was applied on the large-area glass substrate, because the fracture of substrate, mechanical measurement was difficult, and the unsteadiness of air-flow increases the weight of more.In other words, because the restriction of area that is used to provide and rotary speed, improvement is limited.
Summary of the invention
The present invention is intended to address the above problem, and an object of the present invention is to provide a kind of injection device that is used to handle glass substrate, by using mechanical force and chemical force, can handle, particularly can the dry glass substrate, and do not damage substrate.
Another object of the present invention is to inject a spot of liquid by little hand-hole, prevents bad drying, as water spot, thus dry glass substrate and do not form whirlpool.
Another object of the present invention is, by with growth-promoting media, be used for etched etchant, remover, clean solution or the like and substitute and be used for dry liquid, the injection device with various functions beyond the dry substrate is provided.
Another object of the present invention is the amount of utilizing minimizing liquid again by liquid.
Another object of the present invention be with injection device except being applied on the glass substrate, also be applied on the semiconductor wafer.
Another object of the present invention be by in conjunction with one, two or more are used to clean, grow, peel off or dry injection device, constitute the system with various functions.
In order to realize top purpose, injection device according to the present invention comprises: injection part is used to inject the IPA and the solution vapor of vaporization; Supply part, residual liquid or new liquid is provided is used to regenerate; And generator, be used to provide IPA steam and solution vapor.
Injection part has the hand-hole that is arranged on the one end, is used to inject IPA steam and solution vapor, and has pressurized tank, at its end, two sides inlet porting and export orientation spare, is used to make glass substrate to free in and out.Supply part has evaporation element and condensing unit, is used for staying the liquid of pressurized tank export orientation spare side by the pump transmission, and makes the liquid boiling of transmission.
Generator has heater and the feeding unit that is arranged on wherein, heats and IPA and solution are provided, and thus liquid is offered glass substrate by hand-hole.At this moment, the fluid pressure that offers glass substrate must be equal to each other in the upper surface and the lower surface Be Controlled of glass substrate, and glass substrate moves with constant interval with respect to the inside of pressurized tank like this.
Can replace glass substrate by using semiconductor wafer, and replace IPA steam and solution vapor to come treatment substrate, thereby realize other purpose of the present invention with growth solution, clean solution or stripping solution or the like.
Description of drawings
Embodiments of the invention will explain with reference to the accompanying drawings, wherein:
Fig. 1 a illustrates in general by using traditional air doctor blade, comes the method for glass substrate mobile on the dry cleansing unit, and Fig. 1 b is the plane graph of Fig. 1 a, and Fig. 1 c is the phantom of conventional air scraper;
Fig. 2 illustrates in general by using traditional rotary drier to come drying to peel off the method for the glass substrate on the unit;
Fig. 3 illustrates in general the method by using injection device according to the present invention to take the dry glass substrate.
Embodiment
Now, the referenced in schematic accompanying drawing is explained the present invention.
Fig. 3 illustrates in general the method by using injection device according to the present invention to take the dry glass substrate.According to the present invention, be used to handle the injection device of glass substrate, provide the IPA of vaporization and solution vapor to take the dry glass substrate.
Injection device comprises: injection part 120 has and is arranged on that the one side is used to inject the IPA of vaporization and the hand-hole 101 and the two ends of solution vapor are provided with the pressurized tank 103 that entrance and exit guide 105a, 105b make that the glass nodal plate frees in and out; Generator 109 is owing to produce the IPA and the solution vapor of vaporization; With supply part 111, be used for providing once more the residual IPA and the solution vapor of discharging by export orientation spare 105b.
Heater and provide the unit to provide wherein is provided generator 109, heats and IPA and solution are provided, and thus along dotted arrow, by hand-hole 101 steam is offered glass substrate 100.At this moment, be applied to the fluid pressure on the glass substrate 100, on the upper surface of glass substrate 100 and lower surface, equate, glass substrate 100 is moved along the direction of solid arrow, keep constant interval with the inside of pressurized tank 103.Just, glass substrate 100 no machineries move with quick condition contiguously.
The spout of hand-hole 101 has the size of 0.1～10mm on predetermined interval, do not form whirlpool by injecting small amount of liquid like this.
The export orientation spare 105b of pressurized tank 103 seals, and draw shown in the arrow as the double dotted line among Fig. 3, and the liquid of staying wherein is transferred on the supply part 111 by pump 117.The liquid of transmission is regenerated in generator 109 by evaporator 113 and condenser 115.
Kinetic energy that injection device produces when using the compression of IPA steam and solution vapor to inject and the lower surface tension drying objects of coming together.
Although do not illustrate in the drawings, the nozzle configuration that solution vapor is therefrom injected is restriction especially not, as long as can keep constant pressure and solution to spray continuously, can use any rectangle, circle, ellipse or trickle porous disc.
Equally, although only described the process of dry glass substrate in the above embodiments,, also can replace solution vapor to come treatment substrate with growth solution, etchant, stripping solution or clean solution according to the present invention.
In other words, can be by using injection device growth glass substrate or wafer, the grown solution of IPA steam that wherein uses in the dry run or solution vapor replaces; Can adopt injection device as the Etaching device that uses etchant; Perhaps can adopt injection device as the stripping off device that uses stripping solution.
Equally, at the injection device separately that cleans, grows, peels off, uses in etching and the dried, can constitute a system in conjunction with two or more with various functions.In this case, because whole process can be carried out by single line,, can reduce the material allocated costs like this so the move operation between each processing can reduce.
According to the present invention, because use IPA steam and solution vapor in dry substrate, and small amount of liquid injects by hand-hole, and do not form whirlpool, thus can prevent bad drying, as water spot etc.
Equally, can be by re-using residual liquid, and reduce the amount of liquid.
And, the growth solution that replaces dry liquid be can use, etched etchant, stripping solution, clean solution or the like are used for, obtain various application thus.Equally, constitute a system, can reduce the move operation between the variety of processes by connecting two or more corresponding injection devices.
Claims (6)
1. injection device is used for comprising by injecting liquid handling glass substrate or wafer:
Injection part is used to inject IPA steam and solution vapor as liquid; With
Supply part is used to regenerate and injects the residual liquid in back or new liquid is provided,
Wherein, by when described IPA steam or described solution vapor is compressed and the kinetic energy and the surface tension thereof that produce when injecting by spout, described glass substrate or described wafer are dried with quick condition in liquid.
2. the injection device that is used to handle glass substrate or wafer according to claim 1 is characterized in that described injection part comprises pressurized tank, and pressurized tank at one end is provided with hand-hole, is used to inject described IPA steam and described solution vapor.
3. the injection device that is used to handle glass substrate or wafer according to claim 2 is characterized in that the entrance and exit guide is arranged on the both sides of described pressurized tank, and described glass substrate or wafer are freed in and out.
4. the injection device that is used to handle glass substrate or wafer according to claim 1 is characterized in that, described liquid is select from growth solution, etchant, stripping solution and clean solution a kind of.
5. according to the described injection device that is used to handle glass substrate or wafer one of in the claim 1 to 4, it is characterized in that the corresponding injection device of be used for drying, growth, etching, peeling off or clean described glass substrate or described wafer forms a system in conjunction with two or more.
6. the injection device that is used to handle glass substrate or wafer according to claim 1 is characterized in that, its shape of nozzle is selected a kind of from rectangle, circle, ellipse or trickle porous disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01124801 CN1393910A (en) | 2001-06-29 | 2001-06-29 | Injecting device for treating glass substrate or wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01124801 CN1393910A (en) | 2001-06-29 | 2001-06-29 | Injecting device for treating glass substrate or wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1393910A true CN1393910A (en) | 2003-01-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01124801 Pending CN1393910A (en) | 2001-06-29 | 2001-06-29 | Injecting device for treating glass substrate or wafer |
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| CN (1) | CN1393910A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100352565C (en) * | 2003-12-24 | 2007-12-05 | 显示器生产服务株式会社 | Panel processing system |
| CN101045233B (en) * | 2006-03-31 | 2010-09-08 | 细美事有限公司 | Apparatus and methods for treating substrates |
| CN102856238A (en) * | 2011-06-27 | 2013-01-02 | 均豪精密工业股份有限公司 | Surface treatment device and method |
| CN101718487B (en) * | 2009-12-04 | 2013-07-31 | 有研半导体材料股份有限公司 | Method and device for rapidly drying cleaned silicon wafers |
| CN105127140A (en) * | 2015-08-28 | 2015-12-09 | 武汉华星光电技术有限公司 | Cleaning equipment for glass substrate |
| CN107032625A (en) * | 2016-02-03 | 2017-08-11 | 阳程科技股份有限公司 | sheet surface processing method and structure |
| US10654171B2 (en) | 2017-04-26 | 2020-05-19 | Fanuc Corporation | Operation device for operating robot, robot system, and operation method |
| CN112404005A (en) * | 2020-11-16 | 2021-02-26 | 邱敏 | Spherical lens cleaning machine |
| CN113154862A (en) * | 2021-02-26 | 2021-07-23 | 刘曼曼 | Electronic circuit board assembly piston drying air knife |
-
2001
- 2001-06-29 CN CN 01124801 patent/CN1393910A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100352565C (en) * | 2003-12-24 | 2007-12-05 | 显示器生产服务株式会社 | Panel processing system |
| CN101045233B (en) * | 2006-03-31 | 2010-09-08 | 细美事有限公司 | Apparatus and methods for treating substrates |
| CN101718487B (en) * | 2009-12-04 | 2013-07-31 | 有研半导体材料股份有限公司 | Method and device for rapidly drying cleaned silicon wafers |
| CN102856238A (en) * | 2011-06-27 | 2013-01-02 | 均豪精密工业股份有限公司 | Surface treatment device and method |
| CN105127140A (en) * | 2015-08-28 | 2015-12-09 | 武汉华星光电技术有限公司 | Cleaning equipment for glass substrate |
| CN105127140B (en) * | 2015-08-28 | 2017-03-22 | 武汉华星光电技术有限公司 | Cleaning equipment for glass substrate |
| CN107032625A (en) * | 2016-02-03 | 2017-08-11 | 阳程科技股份有限公司 | sheet surface processing method and structure |
| US10654171B2 (en) | 2017-04-26 | 2020-05-19 | Fanuc Corporation | Operation device for operating robot, robot system, and operation method |
| CN112404005A (en) * | 2020-11-16 | 2021-02-26 | 邱敏 | Spherical lens cleaning machine |
| CN113154862A (en) * | 2021-02-26 | 2021-07-23 | 刘曼曼 | Electronic circuit board assembly piston drying air knife |
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