CN1525535A - Method and apparatus for wafer drying - Google Patents
Method and apparatus for wafer drying Download PDFInfo
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- CN1525535A CN1525535A CNA031155308A CN03115530A CN1525535A CN 1525535 A CN1525535 A CN 1525535A CN A031155308 A CNA031155308 A CN A031155308A CN 03115530 A CN03115530 A CN 03115530A CN 1525535 A CN1525535 A CN 1525535A
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Abstract
The invention refers to a kind of crystal plate drying method and device, the method includes: several crystal plates are carried on the crystal plate carrier which has several slots in a crystal plate process box; uses deioned water to clean the crystal plate; transmits nitrogen with isopropyl (IPA) steam into the crystal process box in order to eliminate the water on the crystal plate or in the process box; after the nitrogen has been transmitted into the box for a while, it transmits heated nitrogen into the box in order to evaporate IPA and dry the crystal plate; discharges the nitrogen with IPA out of the box; carries on the subsequent process to the crystal plate after taking them out of the box, the crystal plate has an inclining angle with the vertical direction..
Description
Technical field
The present invention is about a kind of wafer drying method and device, and wafer wherein to be dried has a little inclination angle with respect to vertical direction.
Background technology
In the manufacture process of wafer, generally with deionized water (DIW) clean wafers.After with the washed with de-ionized water wafer, generally wafer surface moisture content is dehydrated with isopropyl alcohol (IPA).In known IPA drier 10, as shown in Figure 1, moist wafer 12 is transferred in the IPA steam chamber.IPA is with nitrogen (N
2) as transport gas, import in the vapour seasoning chamber 15, by bottom heater 11 IPA is heated and is evaporated to steam to be filled in this vapour seasoning chamber 15.By this, the high volatile volatile of IPA can be avoided washmarking with wafer surface moisture content dehydration, the adhering on the wafer surface of particulate and metal impurities.But in this known technology, being carried on that wafer carries in part wafers 12 in the device 14 carry device 14 because of the wafer that submerges the groove can't bone dry, so partly forms remarkable influence for spendable wafer.
In another known technology, as shown in Figure 2, it is a Marangoni drier 20, and it utilizes IPA and deionized water capillary different, wafer 21 remained on surface is got the moisture content absorption flow back to tank, to dehydrate.In the Marangoni drier, after cleaning finishes, wafer is slowly pulled out in deionized water (among the figure from a position to the b position), as transport gas IPA24 is blowed to moist wafer with nitrogen 23, because the IPA concentration of wafer surface is greater than deionized water concentration, so surface tension reduces, so the sucked back tank of hydrone.But in this known technology, even utilize surface tension poor, the wafer that is carried in the groove that wafer carries device partly also is difficult to dewater fully.
Generally speaking, the washmarking of wafer is restricted to from Waffer edge 1.5mm, and when making wafer, gets rid of usually and use Waffer edge 3 to 5mm.But if desire enlarges when using wafer, because known technology can't make the washmarking drying of Waffer edge fully, therefore using wafer for expansion is to form a bottleneck.
Summary of the invention
Because the shortcoming of above-mentioned known technology, that is can't make Waffer edge be carried on the part drying that wafer carries the device place fully, the present invention discloses a kind of wafer drying method and device, and wherein Waffer edge is carried on the part that wafer carries device groove place and can obtains intensive drying.
In order to reach above-mentioned purpose, the present invention discloses a kind of wafer drying method, comprises: in a processing of wafers case, the wafer that vertical being carried on of a plurality of wafers is had a plurality of grooves carries on the device; With deionized water (DIW) clean wafers; The nitrogen that transmission contains isopropyl alcohol (IPA) steam to the processing of wafers case to remove on wafer and at the moisture content on the inner surface of processing of wafers case; The nitrogen that contains the IPA steam in transmission to processing of wafers case a period of time, transmit heated nitrogen to the processing of wafers case with evaporation IPA with make the wafer drying; The nitrogen that will contain IPA is discharged the processing of wafers case; With wafer is shifted out from treatment box to carry out other subsequent treatment of wafer, wherein this wafer has a little inclination angle with respect to vertical direction.
In above-mentioned wafer drying method, this little inclination angle is about 3 to 5 degree.
In above-mentioned wafer drying method, the supporting part that this wafer carries device provides a suitable oblique angle, so that wafer has this little inclination angle with respect to the vertical direction that wafer carries device.
In above-mentioned wafer drying method, the bottom front that this wafer carries device provides a pad, so that wafer carries device front end bed hedgehopping to provide wafer this little inclination angle.
In another viewpoint of the present invention, the invention provides a kind of wafer drying device, comprise: a processing of wafers case, wherein hold a wafer and carry device, this wafer carries has a plurality of grooves to carry a plurality of wafers on the device; One steam generator, it is arranged on the treatment box top, contains the nitrogen of IPA steam in order to generation; One tube connector, it is connected between steam generator and treatment box, to transmit the steam produced to treatment box; With a delivery pipe, it is arranged on the treatment box bottom, and with the discharging steam, wherein this wafer has a little inclination angle with respect to vertical direction.
In above-mentioned wafer drying device, this little inclination angle is about 3 to 5 degree.
In above-mentioned wafer drying device, the supporting part that this wafer carries device provides a suitable oblique angle, so that wafer has this little inclination angle with respect to the vertical direction that wafer carries device.
In above-mentioned wafer drying device, the bottom front that this wafer carries device provides a pad, so that wafer carries the front end bed hedgehopping of device to provide wafer this little inclination angle.
In another viewpoint of the present invention, the invention provides a kind of wafer and carry device, wherein this wafer has a little inclination angle with respect to vertical direction.
Carry in the device at above-mentioned wafer, this little inclination angle is about 3 to 5 degree.
Carry in the device at above-mentioned wafer, the supporting part that this wafer carries device provides a suitable oblique angle, so that wafer has this little inclination angle with respect to the vertical direction that wafer carries device.
Carry in the device at above-mentioned wafer, the bottom front that this wafer carries device provides a pad, so that wafer carries the front end bed hedgehopping of device to provide wafer this little inclination angle.
Follow the description of accompanying drawing by following explanation, preferred embodiment wherein of the present invention shows with illustrative examples, can more understand above and other objects of the present invention, feature and advantage.
Description of drawings
Fig. 1 is the schematic diagram of known IPA drier;
Fig. 2 is the schematic diagram of known Marangoni drier;
Fig. 3 is the schematic diagram of wafer drier of the present invention;
Fig. 4 carries the enlarged diagram of device for the wafer of wafer drier of the present invention; With
Fig. 5 carries the enlarged diagram of device for another wafer of wafer drier of the present invention.
Embodiment
Below with reference to Fig. 3 to 5 explanation embodiments of the invention.
As shown in Figure 3, in wafer drying device 1 of the present invention, comprise a processing of wafers case 2, wherein hold a wafer and carry device 3, this wafer carries has a plurality of grooves 4 (seeing Fig. 4 or 5) to carry a plurality of wafers 5 on the device 3; One steam generator 6, it is arranged on treatment box 2 tops, contains the nitrogen of IPA steam in order to generation; One heater 7 contains the nitrogen of IPA in order to heating; One tube connector 8, it is connected 2 of steam generator 6 and treatment boxes, to transmit the steam that produced to treatment box 2; With a delivery pipe 9, it is arranged on treatment box 2 bottoms, with the discharging steam.
Next illustrates method of the present invention.
In a processing of wafers case 2, the wafer that a plurality of wafer 5 vertical being carried on are had a plurality of grooves 4 carries on the device 3, then with deionized water (DIW) clean wafers.Then, transmit contain isopropyl alcohol (IPA) steam nitrogen to processing of wafers case 2, to remove on wafer 5 and at the moisture content on processing of wafers case 2 inner surfaces.The nitrogen that contains the IPA steam in transmission is to processing of wafers case after 2 a period of times, transmit heated nitrogen to the processing of wafers case 2 with evaporation IPA with make wafer 5 dryings.Then, the nitrogen that will contain IPA is discharged outside the processing of wafers case 2 via delivery pipe 9.After finishing above-mentioned steps, wafer 5 is shifted out from treatment box 2, to carry out other subsequent treatment of wafer.
In said method of the present invention and device, as shown in Figure 3, this wafer 5 has a little inclination angle with respect to vertical direction (as shown by arrow A).
In one embodiment of this invention, the crystal chip bearing portion 31 that this wafer carries device 3 has a little inclination alpha, has a little inclination alpha so that be carried on the wafer 5 that wafer carries on the device 3 with respect to the vertical direction that wafer carries device.
In another embodiment of the present invention, the bottom front that this wafer carries device 3 is provided with a pad 32, provides this wafer required little inclination alpha so that wafer carries device 3.
Preferable, this little inclination alpha is about 3 to 5 degree.
The present invention is by providing wafer with respect to vertical direction one little inclination angle, and the edge of the wafer in the groove that submerges can obtain dry more fully, and therefore the use for Waffer edge can provide greatest benefiting.
The present invention is not limited to the foregoing description, and still can reach various changes and modification in this, but it still belongs to spirit of the present invention and category.Therefore, spirit of the present invention and category should be defined by following claims.
Claims (12)
1. wafer drying method comprises:
In a processing of wafers case, the wafer that vertical being carried on of a plurality of wafers is had a plurality of grooves carries on the device;
With the washed with de-ionized water wafer;
The nitrogen that transmission contains methanol vapor to the processing of wafers case to remove on wafer and at the moisture content on the inner surface of processing of wafers case;
The nitrogen that contains methanol vapor in transmission to processing of wafers case a period of time, transmit heated nitrogen to the processing of wafers case with evaporation IPA with make the wafer drying;
The nitrogen that will contain isopropyl alcohol is discharged the processing of wafers case; With
Wafer is shifted out from treatment box carrying out other subsequent treatment of wafer,
Wherein this wafer has a little inclination angle with respect to vertical direction.
2. wafer drying method as claimed in claim 1 is characterized in that, this little inclination angle is 3 to 5 degree.
3. wafer drying method as claimed in claim 1 is characterized in that, the supporting part that this wafer carries device provides a suitable oblique angle, so that wafer has this little inclination angle with respect to the vertical direction that wafer carries device.
4. wafer drying method as claimed in claim 1 is characterized in that, the bottom front that this wafer carries device provides a pad, provides this little inclination angle so that wafer carries device to wafer.
5. wafer drying device comprises:
One processing of wafers case wherein holds a wafer and carries device, and this wafer carries has a plurality of grooves to carry a plurality of wafers on the device;
One steam generator, it is arranged on the treatment box top, contains the nitrogen of methanol vapor in order to generation;
One tube connector, it is connected between steam generator and treatment box, to transmit the steam produced to treatment box; With
One delivery pipe, it is arranged on the treatment box bottom, with the discharging steam,
Wherein this wafer has a little inclination angle with respect to vertical direction.
6. wafer drying device as claimed in claim 5 is characterized in that, this little inclination angle is 3 to 5 degree.
7. wafer drying device as claimed in claim 5 is characterized in that, the supporting part that this wafer carries device provides a suitable oblique angle, so that wafer has this little inclination angle with respect to the vertical direction that wafer carries device.
8. wafer drying device as claimed in claim 5 is characterized in that, the bottom front that this wafer carries device provides a pad, provides this little inclination angle so that wafer carries device to wafer.
9. a wafer carries device, it is characterized in that, this wafer has a little inclination angle with respect to vertical direction.
10. wafer as claimed in claim 9 carries device, it is characterized in that, this little inclination angle is 3 to 5 degree.
11. wafer as claimed in claim 9 carries device, it is characterized in that, the supporting part that this wafer carries device provides a suitable oblique angle, so that wafer has this little inclination angle with respect to the vertical direction that wafer carries device.
12. wafer as claimed in claim 9 carries device, it is characterized in that, the bottom front that this wafer carries device provides a pad, provides this little inclination angle so that wafer carries device to wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03115530 CN1278390C (en) | 2003-02-26 | 2003-02-26 | Method and apparatus for wafer drying |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03115530 CN1278390C (en) | 2003-02-26 | 2003-02-26 | Method and apparatus for wafer drying |
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| Publication Number | Publication Date |
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| CN1525535A true CN1525535A (en) | 2004-09-01 |
| CN1278390C CN1278390C (en) | 2006-10-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03115530 Expired - Fee Related CN1278390C (en) | 2003-02-26 | 2003-02-26 | Method and apparatus for wafer drying |
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| Country | Link |
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| CN (1) | CN1278390C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100383912C (en) * | 2005-01-11 | 2008-04-23 | 中芯国际集成电路制造(上海)有限公司 | High temperature wafer test oven |
| CN101210769B (en) * | 2006-12-25 | 2010-04-07 | 中芯国际集成电路制造(上海)有限公司 | Method and device for drying wafer |
| CN101245968B (en) * | 2007-02-13 | 2010-05-26 | 中芯国际集成电路制造(上海)有限公司 | Method for removing water in quartz sheath equipped with thermocouple |
| CN101879756A (en) * | 2010-04-01 | 2010-11-10 | 浙江硅宏电子科技有限公司 | Silicon wafer stripping machine |
| CN102569024A (en) * | 2010-12-29 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | Drying method and drying equipment after grinding and cleaning TSV (Temperature Safety Valve) through hole |
| CN101957124B (en) * | 2009-07-16 | 2012-08-08 | 中芯国际集成电路制造(上海)有限公司 | Method for drying wafer |
| CN101730924B (en) * | 2007-06-26 | 2013-02-13 | Afco有限公司 | Drying apparatus and method for silicon-based electronic circuits |
| CN103575075A (en) * | 2012-07-25 | 2014-02-12 | 中国科学院微电子研究所 | Silicon wafer spin-drying system |
| CN107516694A (en) * | 2017-07-31 | 2017-12-26 | 常州市杰洋精密机械有限公司 | A kind of wet-cleaning thing carrier predrainage method and hoisting mechanism used |
-
2003
- 2003-02-26 CN CN 03115530 patent/CN1278390C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100383912C (en) * | 2005-01-11 | 2008-04-23 | 中芯国际集成电路制造(上海)有限公司 | High temperature wafer test oven |
| CN101210769B (en) * | 2006-12-25 | 2010-04-07 | 中芯国际集成电路制造(上海)有限公司 | Method and device for drying wafer |
| CN101245968B (en) * | 2007-02-13 | 2010-05-26 | 中芯国际集成电路制造(上海)有限公司 | Method for removing water in quartz sheath equipped with thermocouple |
| CN101730924B (en) * | 2007-06-26 | 2013-02-13 | Afco有限公司 | Drying apparatus and method for silicon-based electronic circuits |
| CN101957124B (en) * | 2009-07-16 | 2012-08-08 | 中芯国际集成电路制造(上海)有限公司 | Method for drying wafer |
| CN101879756A (en) * | 2010-04-01 | 2010-11-10 | 浙江硅宏电子科技有限公司 | Silicon wafer stripping machine |
| CN101879756B (en) * | 2010-04-01 | 2012-08-22 | 浙江硅宏电子科技有限公司 | Silicon wafer stripping machine |
| CN102569024A (en) * | 2010-12-29 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | Drying method and drying equipment after grinding and cleaning TSV (Temperature Safety Valve) through hole |
| CN103575075A (en) * | 2012-07-25 | 2014-02-12 | 中国科学院微电子研究所 | Silicon wafer spin-drying system |
| CN103575075B (en) * | 2012-07-25 | 2015-08-26 | 中国科学院微电子研究所 | A kind of silicon chip dries system |
| CN107516694A (en) * | 2017-07-31 | 2017-12-26 | 常州市杰洋精密机械有限公司 | A kind of wet-cleaning thing carrier predrainage method and hoisting mechanism used |
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| Publication number | Publication date |
|---|---|
| CN1278390C (en) | 2006-10-04 |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111129 |
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Effective date of registration: 20111129 Address after: 201203 No. 18 Zhangjiang Road, Shanghai Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 No. 18 Zhangjiang Road, Shanghai Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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Granted publication date: 20061004 Termination date: 20190226 |
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