MY135287A - Cleaning apparatus - Google Patents

Cleaning apparatus

Info

Publication number
MY135287A
MY135287A MYPI20042062A MYPI20042062A MY135287A MY 135287 A MY135287 A MY 135287A MY PI20042062 A MYPI20042062 A MY PI20042062A MY PI20042062 A MYPI20042062 A MY PI20042062A MY 135287 A MY135287 A MY 135287A
Authority
MY
Malaysia
Prior art keywords
cleaned
cleaning
injecting
cleaning apparatus
heated gas
Prior art date
Application number
MYPI20042062A
Inventor
Takashi Yoshida
Osayasu Kikuchi
Motoaki Iwasaki
Kurao Habaya
Tatsuro Yano
Takahiro Shiroma
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of MY135287A publication Critical patent/MY135287A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning In General (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

OBJECT TO PROVIDE A CLEANING APPARATUS WHICH IS CAPABLE OF SATISFACTORILY CLEANING AN OBJECT TO BE CLEANED BY REDUCING DUST SOURCES AND PREVENTING DEW CONDENSATION CAUSED BY CO2 JETTED TO THE OBJECT TO BE CLEANED.ARRANGEMENT FOR ATTAINING THE OBJECT TO PREVENT DEW CONDENSATION OF AN OBJECT TO BE CLEANED, A CLEANING APPARATUS WHICH CLEANS THE OBJECT TO BE CLEANED BY INJECTING A SOLVENT FROM A NOZZLE COMPRISES GAS INJECTING MEANS FOR INJECTING HEATED GAS TO A SURFACE OF THE OBJECT TO BE CLEANED, WHEREIN THE INJECTING MEANS IS CONFIGURED TO MOVE ON THE OBJECT TO BE CLEANED WHEN CLEANING IS PERFORMED, AND RETRACT FROM THE OBJECT TO BE CLEANED WHEN CLEANING IS NOT PERFORMED, SO THAT A SMALL QUANTITY OF HEATED GAS IS INJECTED, AND A LARGE QUANTITY OF HEATED GAS IS INJECTED WHEN CLEANING IS PERFORMED.(FIG 1)
MYPI20042062A 2003-06-02 2004-05-28 Cleaning apparatus MY135287A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003156321A JP4118194B2 (en) 2003-06-02 2003-06-02 Cleaning device

Publications (1)

Publication Number Publication Date
MY135287A true MY135287A (en) 2008-03-31

Family

ID=34050437

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20042062A MY135287A (en) 2003-06-02 2004-05-28 Cleaning apparatus

Country Status (5)

Country Link
US (1) US20050160552A1 (en)
JP (1) JP4118194B2 (en)
CN (1) CN1572383A (en)
MY (1) MY135287A (en)
SG (1) SG140459A1 (en)

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Also Published As

Publication number Publication date
CN1572383A (en) 2005-02-02
JP2004363145A (en) 2004-12-24
SG140459A1 (en) 2008-03-28
JP4118194B2 (en) 2008-07-16
US20050160552A1 (en) 2005-07-28

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