CN1564647A

CN1564647A - Method of making circuit board assembly from splitting boards of printed circuit board

Info

Publication number: CN1564647A
Application number: CN 200410017424
Authority: CN
Inventors: 楼方寿
Original assignee: Individual
Current assignee: Individual
Priority date: 2004-04-02
Filing date: 2004-04-02
Publication date: 2005-01-12

Abstract

The method includes following steps: 1) blanking, multi printed circuit board blocks are made at the relevant place of upper and bottom side of ccl plate; 2) perforating, boring through combined printed circuit boards; c) stamping and reposition, first multi printed circuit board are stamped away from the insulating board and are repositioned at once, only the impression are left; 4) welding and striking off fillet, the components are welded in the through-hole, then striking off fillet; 5) multi printed circuit boards that are tested and mounted in parts of apparatus are peeled off from insulation plate, and are made into the finished circuit board products.

Description

The method of printed substrate jigsaw circuit board manufacturing assembly

Technical field

The present invention relates to a kind of processing method of circuit board assemblies, particularly use the method for printed substrate jigsaw circuit board manufacturing assembly.

Background technology

External and domestic large enterprises all adopt machining, pile line operation, the full-automatic circuit board assemblies of producing, and floor space is big but this whole set of processing equipment costs an arm and a leg, and needs big factory building, domestic general in, the also unable investment of small enterprise.

In existing domestic, small enterprise adopts manual operations more, the method of single-piece production is made, be about to bulk insulation board Pork-pieces smallclothes that complete, then just at the fritter insulation board, reverse side prints on the relevant position, the etching electronic circuit fabrication becomes printed substrate, the single printed substrate that will be made into again is punched down from the fritter insulation board, break away from the fritter insulation board, enter next procedure again, manual punching, the grafting components and parts, leg, cut operations such as pin and be made into circuit board assemblies, the detection of again circuit board assemblies being taken away one by one at last, make qualified products, so process velocity is slow, production efficiency is low, and leftover pieces are many, and waste of material is big.

Patent No. 97107268.X " makes the manufacturing system and the method for pcb component " in the computer-controlled system, though also provide a kind of automaticity very high, production equipment highly efficient in productivity, but this equipment is not only expensive, and needing special technical staff's operation, the general operation worker also can not operate.

Summary of the invention

Technical problem to be solved by this invention is: the method that a kind of printed substrate jigsaw circuit board manufacturing assembly is provided, equipment needed thereby is few, and easily processing can be enhanced productivity and reduced production cost, again can more large batch of streamline production, suitable especially in, small enterprise's processing.

The present invention addresses the above problem the technical scheme that is adopted: the method for printed substrate jigsaw circuit board manufacturing assembly comprises, 1, blanking: fall the bulk copper-clad plate, on its positive and negative opposite position, printing, the required electronic-circuit diagram of etching, the plate that a plurality of printed substrates are arranged above producing is whole plate printed substrate;

2, punching: on the polylith printed substrate of combination, hole;

3, punching press, reset: a plurality of printed substrates that will put in order on the plate printed substrate dash from the bulk insulation board; Embedding is got back on the bulk insulation board again at once, sets back and only stays the punching press vestige;

4, welding, whole pin: in through hole, patch the pin of components and parts, and its welding is fixing, again the components and parts leg is flattened;

5, detect, peel off: will assemble the monoblock printed substrate that has components and parts and detect, a plurality of printed substrates that assembled the band components and parts after qualified strip down from the exhausted plate of bulk edge, make the product circuit board component.

Compared with prior art, the invention has the advantages that: under the prerequisite that does not increase new process equipment, changing original monolithic production is the method that polylith is produced simultaneously, and suitable carrying out not only improved work efficiency than streamline production in enormous quantities, shorten the production cycle, and reduced a lot of leftover pieces, save material greatly, thereby reduced production cost, the work efficiency raising is big more more at most for the jigsaw number, and material is economized more.Suitable to especially the complex-shaped circular or polygon processing that waits special shape printed substrate jigsaw to make up.

Description of drawings

Fig. 1, printed wire sheet reset jigsaw schematic diagram of the present invention.(the circular printed substrate of whole plate)

Fig. 2, printed wire sheet reset jigsaw schematic diagram of the present invention.(whole plate polygon printed substrate)

Embodiment

Below in conjunction with accompanying drawing embodiments of the invention are further described:

Embodiment 1 closes for circular schizophora.

Manufacture method is 1, blanking: fall bulk copper-clad plate 1, thereon on the opposite position of positive and negative, printing, the required electronic-circuit diagram of etching, the plate that includes polylith printed substrate 2 above being made into, be called whole plate printed substrate 3, generally can make, Figure 1 shows that the whole plate printed substrate 3 that is made into by 24 bar printing wiring boards, 2 jigsaw by the combination of 2～30 bar printing wiring boards, 2 jigsaw;

2, punching: with the multi-head numerical control drilling machine to the processing of holing simultaneously of the printed substrate 2 of 24 combinations;

3, punching press, reset: will put in order the 24 bar printing wiring boards 2 that comprised on the plate printed substrate 3 with working the insulation boards 1 that dash from bulk, the 24 bar printing wiring boards 2 that meanwhile will just sweep away reset at once simultaneously, again embedding is got back in the respective through hole on original bulk insulation board 1, return on the origin-location, on whole plate printed substrate 3, only stay the impression 4 of 24 bar printing wiring board outline lines;

4, weld, cut pin: components and parts are inserted into respectively on each piece combination jigsaw according to designing requirement; The jigsaw of inserting good components and parts is transported in the automatic ripple beacon welding machine welds, the jigsaw automatic transport that welds is cut pin to automatic cutter, make its length unanimity, neatly smooth;

5, detect, peel off: will assemble the whole plate printed substrate 3 that has components and parts, be transported on the on-line detector and detect, after qualified, with 24 printed substrates 2 that have components and parts on the whole plate printed substrate 3, push hard downwards along impression 4 and to grow down, break away from bulk insulation board 1 and make independently product, 24 circuit board assemblies.

Embodiment 2 is the seamless combination of polygon.

As shown in Figure 2, seamless between this polygon, few, the material-saving of seamless leftover pieces, cost is lower.Concrete processing method is identical with embodiment 1.

Claims

1, a kind of method of printed substrate jigsaw circuit board manufacturing assembly is characterized in that comprising:

A, blanking: fall the bulk copper-clad plate, on its positive and negative opposite position, printing, the required electronic-circuit diagram of etching have the plate of a plurality of printed substrates (2) above producing, and are whole plate printed substrate (3);

B, punching: the polylith printed substrate (2) in combination is gone up boring;

C, punching press, reset: will put in order a plurality of printed substrates (2) on the plate printed substrate (3), dash from bulk insulation board (1) at once again embedding get back on the bulk insulation board (1), set back and only stay punching press mark (4);

D, welding, whole pin: in through hole, patch the pin of components and parts, and its welding is fixing, again the components and parts leg is flattened;

E, detect, peel off: will assemble the monoblock printed substrate that has components and parts and detect, a plurality of printed substrates that assembled the band components and parts after qualified strip down from the exhausted plate (1) of bulk edge, make the product circuit board component.

2, method according to claim 1 is characterized in that and can be made into whole plate printed substrate (3) by 2～30 bar printing wiring board (2) jigsaw combinations, gappedly between each printed substrate (2) closes for schizophora.

3 methods according to claim 1 is characterized in that no gap is seamless combination between each printed substrate (2).