CN104955271A - Design method for combined PCB and jointed board thereof - Google Patents
Design method for combined PCB and jointed board thereof Download PDFInfo
- Publication number
- CN104955271A CN104955271A CN201410109028.9A CN201410109028A CN104955271A CN 104955271 A CN104955271 A CN 104955271A CN 201410109028 A CN201410109028 A CN 201410109028A CN 104955271 A CN104955271 A CN 104955271A
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- mainboard
- pcb
- board
- jigsaw
- designing
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Abstract
The invention discloses a design method for a combined PCB and a jointed board thereof. The design method comprises the following steps: designing a main board part, and pre-designing a hollow area according to a design need at first, then designing an auxiliary board, and minimizing the shape on the basis of meeting functions; finally placing the auxiliary board in the hollow area of the main board, and reducing the dimensions at the matched part of the main board and the auxiliary board to enable the gap thereof to be lower than a value A, wherein the value A is adjusted according to the processes of different PCB factories; when the jointed board is designed, the main board and the auxiliary board are combined together according to a board jointing rule to form the combined PCB, and finally the combined PCB is designed to obtain the final jointed board. The design method disclosed by the invention breaks through the limit of the traditional design, designs the various PCBs and the corresponding jointed boards according to overall product planning, achieves the purpose of reducing production waste to a greater degree, increases the efficiency of SMT and board splitting, and finally reduces the product cost.
Description
Technical field
Patent of the present invention relates to electronics field, particularly relate to a kind of composite type PCB and
The method for designing of jigsaw, comprises the electronics product of two and above PCB.
Background technology
Along with popularizing of electronic product, and the development of miniaturized mobile terminal, small and exquisite, powerful, the portable terminal electronic device of outward appearance is more and more subject to liking of consumer.In order to make full use of space, during internal framework design, usually need multiple PCB, to utilize all spaces.
Design traditional is at present each PCB is independent design, comprise: the structure of PCB, jigsaw and paster, carry out for the ease of SMT, the technique edges increasing auxiliary clamp is needed during jigsaw design, and these Material Costs not belonging to product itself finally all can be shared on product, product cost is caused to rise.Less pcb board reduces the efficiency of paster and point plate simultaneously.Patent of the present invention breaches the limitation of traditional design, according to the jigsaw of each PCB of product overall planning and correspondence, reaches and reduces production waste greatly, improves the efficiency of SMT and point plate, the final cost reducing product.
Summary of the invention
For the deficiency of existing method for designing, the object of patent of the present invention overcomes above shortcoming exactly, provides a kind of Combination Design scheme, according to the jigsaw of each PCB of product overall planning and correspondence.
Patent of the present invention is achieved by the following technical solution:
A kind of composite type PCB and jigsaw thereof comprise more than one PCB, a mainboard PCB, a subplate PCB, and hollow out is carried out in the mainboard PCB inside of described product.
While the subplate PCB content with funtion of described product, overall dimension is less than the full-size of mainboard hollow out; After the vacancy section size of mainboard PCB and the overall dimension matching design of subplate, the technical requirement of jigsaw design can be reached.
When designing the jigsaw of this project, first subplate is stitched together with mainboard, then they is regarded as a combination PCB, then carries out jigsaw design.
Described mainboard includes but not limited to: cell phone mainboard, PAD mainboard, the electronic product mainboards such as phase mainboard; Subplate includes but not limited to: antenna plate, deck plate, keypad, battery core baffle etc.The void region of mainboard may be inner at mainboard, also likely at the edge of mainboard.
The core technology of patent of the present invention is: mainboard realizes the major function of electronic product, and subplate realizes other miscellaneous functions, such as: antenna platelet, and deck platelet, side switch platelet etc.During motherboard design, according to actual needs, hollow out design is carried out in inside.Subplate on the basis meeting self function, overall dimension and mainboard void region size fit design.Major-minor plate is stitched together in advance by stamp hole, and then the PCB that this has been spelled is regarded as combination PCB, then carries out jigsaw design.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 subplate of the present invention and mainboard fit clearance A structural representation;
Fig. 3 is the inner hollow out of mainboard of the present invention and local interior's hollow out two kinds of structural representations;
Fig. 4 is the subplate structural representation of electronic product of the present invention;
Fig. 5 is that subplate of the present invention and mainboard are stitched together structural representation;
Fig. 6 is jigsaw structural representation of the present invention.
Number in the figure explanation
21-mainboard;
22-subplate;
23-combination PCB;
The jigsaw figure of 24-combination PCB;
The void region of 30-mainboard.
Embodiment
Further illustrate patent of the present invention below in conjunction with accompanying drawing how to realize:
Embodiment:
During product design, first design mainboard 21 part, according to design needs, the void region 30 of pre-designed mainboard, then design subplate 22, on the basis of content with funtion, profile is accomplished minimum.Finally subplate 22 is placed on mainboard void region 30, both refinements cooperation place size, makes gap between the two be not less than A value (see Fig. 2, wherein A value can adjust according to the technique of different PCB factory).During design jigsaw, first mainboard 21 and subplate 22 according to together with jigsaw principle combinations, form combination PCB 23, finally to combining the final jigsaw of PCB design.
Claims (5)
1. a method for designing for composite type PCB and jigsaw thereof, is characterized in that: the method comprises following steps:
The first step: design more than one PCB;
Second step: the main board designing described product, motherboard design has void region;
3rd step: the subplate part designing described product;
4th step: described subplate puts into mainboard void region, the size of adjustment subplate and vacancy section, make peripheral clearance be greater than set point A, wherein A value adjusts according to the technique of different PCB factory;
5th step: according to jigsaw designing requirement, is stitched together described subplate and mainboard, forms combination PCB;
6th step: combinations thereof PCB is regarded as an entirety, designs the jigsaw figure of described product.
2. the method for designing of a kind of composite type PCB and jigsaw thereof according to claim 1, is characterized in that: described subplate overall dimension is less than the size of mainboard.
3. a kind of composite type PCB according to claims 1 or 2 and the method for designing of jigsaw thereof, is characterized in that: described mainboard includes but not limited to: cell phone mainboard, PAD mainboard, the electronic product mainboards such as phase mainboard.
4. the design side of a kind of composite type PCB and jigsaw thereof according to claims 1 or 2, it is characterized in that, described subplate includes but not limited to: antenna plate, deck plate, keypad, battery core baffle.
5. the design side of a kind of composite type PCB and jigsaw thereof according to claims 1 or 2, is characterized in that, the void region of mainboard may be inner at mainboard, also likely at the edge of mainboard.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410109028.9A CN104955271A (en) | 2014-03-24 | 2014-03-24 | Design method for combined PCB and jointed board thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410109028.9A CN104955271A (en) | 2014-03-24 | 2014-03-24 | Design method for combined PCB and jointed board thereof |
Publications (1)
Publication Number | Publication Date |
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CN104955271A true CN104955271A (en) | 2015-09-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201410109028.9A Pending CN104955271A (en) | 2014-03-24 | 2014-03-24 | Design method for combined PCB and jointed board thereof |
Country Status (1)
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CN (1) | CN104955271A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107770956A (en) * | 2016-08-16 | 2018-03-06 | 光宝电子(广州)有限公司 | Board structure of circuit |
CN108174511A (en) * | 2018-02-08 | 2018-06-15 | 广州视源电子科技股份有限公司 | PCB construction and its processing method and electronic product |
Citations (8)
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CN1564647A (en) * | 2004-04-02 | 2005-01-12 | 楼方寿 | Method of making circuit board assembly from splitting boards of printed circuit board |
CN1956630A (en) * | 2005-10-28 | 2007-05-02 | 诠脑电子(深圳)有限公司 | Method of transplating and splicing single board of printed circuit board |
CN201438782U (en) * | 2009-05-19 | 2010-04-14 | 深圳市正基电子有限公司 | Multiple-printed-panel for circuit board |
CN201674726U (en) * | 2010-03-08 | 2010-12-15 | 深南电路有限公司 | Printed circuit board |
CN102036493A (en) * | 2010-12-29 | 2011-04-27 | 上海华勤通讯技术有限公司 | Method for effectively utilizing leftover materials of jointing PCB board |
CN201957341U (en) * | 2011-03-22 | 2011-08-31 | 上海欣丰卓群电路板有限公司 | Back-off jointed board |
CN202475940U (en) * | 2012-01-06 | 2012-10-03 | 惠州Tcl移动通信有限公司 | Make-up PCB |
CN202873189U (en) * | 2012-10-18 | 2013-04-10 | 上海欣丰卓群电路板有限公司 | Pieced board of heterotype circuit board |
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2014
- 2014-03-24 CN CN201410109028.9A patent/CN104955271A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1564647A (en) * | 2004-04-02 | 2005-01-12 | 楼方寿 | Method of making circuit board assembly from splitting boards of printed circuit board |
CN1956630A (en) * | 2005-10-28 | 2007-05-02 | 诠脑电子(深圳)有限公司 | Method of transplating and splicing single board of printed circuit board |
CN201438782U (en) * | 2009-05-19 | 2010-04-14 | 深圳市正基电子有限公司 | Multiple-printed-panel for circuit board |
CN201674726U (en) * | 2010-03-08 | 2010-12-15 | 深南电路有限公司 | Printed circuit board |
CN102036493A (en) * | 2010-12-29 | 2011-04-27 | 上海华勤通讯技术有限公司 | Method for effectively utilizing leftover materials of jointing PCB board |
CN201957341U (en) * | 2011-03-22 | 2011-08-31 | 上海欣丰卓群电路板有限公司 | Back-off jointed board |
CN202475940U (en) * | 2012-01-06 | 2012-10-03 | 惠州Tcl移动通信有限公司 | Make-up PCB |
CN202873189U (en) * | 2012-10-18 | 2013-04-10 | 上海欣丰卓群电路板有限公司 | Pieced board of heterotype circuit board |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107770956A (en) * | 2016-08-16 | 2018-03-06 | 光宝电子(广州)有限公司 | Board structure of circuit |
CN108174511A (en) * | 2018-02-08 | 2018-06-15 | 广州视源电子科技股份有限公司 | PCB construction and its processing method and electronic product |
CN108174511B (en) * | 2018-02-08 | 2020-12-22 | 广州视源电子科技股份有限公司 | PCB structure, processing method thereof and electronic product |
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Application publication date: 20150930 |