CN111712043A - High-precision forming method for VCM flexible circuit board - Google Patents
High-precision forming method for VCM flexible circuit board Download PDFInfo
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- CN111712043A CN111712043A CN202010557056.2A CN202010557056A CN111712043A CN 111712043 A CN111712043 A CN 111712043A CN 202010557056 A CN202010557056 A CN 202010557056A CN 111712043 A CN111712043 A CN 111712043A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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Abstract
The invention discloses a high-precision forming method of a VCM flexible circuit board, which comprises the following specific operation methods: the method comprises the following steps of firstly, providing FPC flexible board jointed boards, and processing FPC single products on the FPC flexible board jointed boards, wherein the FPC flexible board jointed boards comprise jointed board bodies, effective areas and invalid areas are arranged on the jointed board bodies, the effective areas are multiple, the effective areas are arranged in a matrix mode, the invalid areas are distributed in a cross shape or a # -shaped mode, and the effective areas are internally provided with multiple FPC single products which are arranged in a matrix mode; step two, performing SMT (surface mount technology) surface mounting on a plurality of FPC (flexible printed circuit) single products on the whole jointed board; thirdly, performing operations such as dispensing and electrical property detection on a plurality of FPC assemblies of the whole jointed board; step four, punching the whole jointed board into a single product by adopting a punching die; and step five, loading the disc. The invention has the advantages of improving the FPC processing dimensional accuracy, having high die cutting accuracy and meeting the assembly requirement of the VCM component.
Description
Technical Field
The invention belongs to the technical field of production of mobile phone camera modules, and particularly relates to a high-precision forming method of a VCM flexible circuit board.
Background
As camera phones have advanced to high pixel, they have come to demand autofocus functions. In general, a user wants a camera phone having 200 ten thousand pixels or more to have an auto-focusing function. However, the traditional way is that the focusing function will greatly increase the size of the circuit board and the thickness of the mobile phone, and the pursuit of short, small, light and thin electronic products is more and more demanding in the modern times. Therefore, the high-precision VCM becomes the best choice for the mobile phone camera module. VCM (Voice Coil Motor), commonly known as voice Coil motor or voice Coil motor, the effect is the position of adjusting the camera lens, makes the video recording present the most clear state, and it has the circuit board area that occupies little, and the reliability is high, can support powerful advantage, can reduce system cost and volume, is applied to cell-phone camera auto focus in a large number at present.
The VCM subassembly mainly includes camera lens, voice coil motor, base, light filter, image sensor, flexible circuit board group spare (FPC group spare) etc. wherein, FPC group spare need carry on paster components and parts on FPC singleness in the course of working, then will whole makeup to carry out die-cut back and form single piece of product, because of the product is used for the VCM subassembly on, VCM subassembly assembly space is little, consequently has provided very high requirement to the overall dimension of FPC group spare. The existing FPC assembly process flow is as follows: processing the FPC single product on the whole jointed board → carrying out SMT paster on the FPC single product of the whole jointed board → carrying out glue dispensing, electrical property detection and the like on the FPC component of the whole jointed board → punching the whole jointed board into single products → loading the automatic machine into a delivery tray after appearance inspection. The factors influencing the overall dimension of the product mainly lie in the FPC processing dimension precision and the punching precision of the whole jointed board.
At present, FPC single products on the whole jointed board are uniformly distributed, the expansion and contraction are random, and the expansion and contraction of the FPC processing precision is controlled to be +/-0.05 mm due to the influence of materials; the machining precision of the punching die in the punching process is +/-0.05 mm, so that the precision deviation of the overall dimension of a single punched product is the sum of the two deviations, namely 0.1mm, and the deviation requirement of an FPC (flexible printed circuit) assembly used on the VCM assembly cannot be met.
Disclosure of Invention
The invention aims to provide a high-precision forming method of a VCM flexible circuit board, and aims to solve the problems that the FPC processing size precision is low, the die cutting precision is low, and a product cannot meet the assembly requirement of a VCM component in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a high-precision forming method of a VCM flexible circuit board comprises the following specific operation methods:
providing an FPC flexible board jointed board, and processing an FPC single product on the FPC flexible board jointed board;
the FPC flexible board jointed board comprises a jointed board body, wherein the jointed board body is provided with a plurality of effective areas and invalid areas, and the effective areas are arranged in a matrix manner, so that the invalid areas are distributed in a cross shape or a groined shape;
a plurality of FPC single products arranged in a matrix manner are arranged in the effective area;
step two, performing SMT (surface mount technology) paster on a plurality of FPC single products on the whole FPC flexible board jointed board to form a plurality of FPC assemblies;
thirdly, performing operations such as dispensing, electrical property detection and the like on a plurality of FPC assemblies of the whole FPC flexible board jointed board;
step four, punching the whole jointed board into a single product by adopting a punching die;
the punching die comprises an upper die and a lower die, the whole jointed board is placed on the lower die, the upper die moves downwards to be matched with the lower die to punch the jointed board, a plurality of single products are separated from the jointed board body, the punched single products are adsorbed on the upper die, and the single products are manually unloaded through a carrier and transferred to the next process;
and step five, carrying out appearance inspection on a plurality of single products, and then loading the single products into a delivery tray through an automatic machine.
Furthermore, one side of the FPC single product in the first step is provided with an optical positioning point.
Furthermore, the invalid region in the first step adopts a general panel common mode structure.
Furthermore, in the third step, a dispensing device is used for dispensing the FPC assemblies;
the glue dispensing device comprises a glue dispensing device operating platform, an adjusting mechanism is arranged on the glue dispensing device operating platform, a glue dispensing mechanism is erected on the rear side of the adjusting mechanism, a material conveying mechanism is arranged on the front side frame of the adjusting mechanism, a glue dispensing device carrying platform is arranged on the adjusting mechanism, a glue dispensing device placing groove is formed in the glue dispensing device carrying platform, a semi-finished product to be dispensed is placed in the glue dispensing device placing groove, the adjusting mechanism is used for adjusting the semi-finished product to be dispensed to a plurality of angle positions which are beneficial to glue flowing, and the material conveying mechanism is used for conveying the glue-dispensed finished product to a next procedure for quality inspection.
Furthermore, adjustment mechanism is including setting up in the longitudinal rail of adhesive deposite device operation panel top surface, sliding connection has a transverse rail on the longitudinal rail, sliding connection has adjustment mechanism to remove the seat on the transverse rail, and adjustment mechanism removes the four corners of seat and all wears to be equipped with the adjusting bolt of directional top spin, is provided with angle adjusting plate between four adjusting bolt's the top, be provided with the adhesive deposite device microscope carrier on the angle adjusting plate.
Furthermore, a first screw rod is arranged on the longitudinal guide rail along the length direction of the longitudinal guide rail, a first motor is arranged at one end of the first screw rod, a first nut seat is arranged on the first screw rod, and the first nut seat is connected with the bottom surface of the transverse guide rail.
Furthermore, a second screw rod is arranged on the transverse guide rail along the length direction of the transverse guide rail, a second motor is arranged at one end of the second screw rod, a second nut seat is arranged on the second screw rod, and the second nut seat is connected with the bottom surface of the adjusting mechanism moving seat.
Furthermore, the lower die in the fourth step comprises a lower die body, a vacuum adsorption component is embedded in the lower die body and comprises a vacuum main pipeline and a vacuum branch pipeline, the vacuum main pipeline is provided with a left end and a right end, one end of the vacuum main pipeline is connected with an air source through a pipeline, the other end of the vacuum main pipeline is communicated with the vacuum branch pipeline, and suction nozzle heads are arranged at the left end and the right end of the vacuum branch pipeline.
Compared with the prior art, the invention provides a high-precision forming method of a VCM flexible circuit board, which has the following beneficial effects:
1. the jointed board with a special structure comprises a plurality of effective areas, wherein the effective areas are arranged in a matrix manner, so that the ineffective areas are distributed in a cross shape or a groined shape, and the expansion and shrinkage can be obviously reduced, namely, the expansion and shrinkage are reduced from +/-0.05 to +/-0.03 mm; in addition, the invalid areas distributed in a cross shape or a # -shaped shape are changed into a full-panel common mode from the existing grid plate mode, the strength of the whole jointed board can be improved, the flatness of the whole jointed board is not affected after circulation of a plurality of processes, and the flexible circuit board on the whole jointed board can be flatly placed on a punching die in the punching process, so that the gap between the flexible circuit board and the die is reduced, and the die cutting precision is improved;
2. according to the invention, the vacuum adsorption component is additionally arranged in the lower die of the punching die, so that the displacement of the flexible circuit board in the die cutting process can be reduced, the die cutting precision of the flexible circuit board after close fitting can be within +/-0.05 mm, and the cpk (process capability index) value of the flexible circuit board on the whole jointed board with the same size is improved to more than 1.0 from 0.3 before improvement.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention without limiting the invention in which:
FIG. 1 is a processing flow chart of a high-precision forming method of a VCM flexible circuit board provided by the invention;
FIG. 2 is a schematic structural view of a first embodiment of a panel of the present invention;
FIG. 3 is a schematic structural view of a second embodiment of a panel of the present invention;
FIG. 4 is a schematic structural view of a dispensing device;
FIG. 5 is a schematic structural view of the adjustment mechanism of FIG. 4;
fig. 6 is a schematic structural view of a lower die of the punching die.
In the figure:
FPC flexible board splicing board 1; a panel body 101; an active area 102; an invalid region 103; an optical locating point 104; positioning holes 105;
a glue dispensing device 2; a dispensing device console 201; an adjustment mechanism 202; longitudinal rails 202.1; cross rails 202.2; the adjusting mechanism moving seat 202.3; adjusting bolts 202.4; an angle adjusting plate 202.5; a longitudinal runner 202.6; a first slide 202.7; a first lead screw 202.8; a first nut seat 202.9; a second lead screw 202.10; a second nut seat 202.11; a transverse chute 202.12; a second slider 202.13; a second motor 202.14; a glue dispensing mechanism 203; a dispensing device carrier 204; a dispensing device placement slot 205;
FPC singles 3;
a lower die 4; a lower die body 401; a vacuum adsorption assembly 402; main vacuum path pipe 402.1; vacuum bypass tubes 402.2; a nozzle head 402.3.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution:
example one
A high-precision forming method of a VCM flexible circuit board comprises the following specific operation methods:
providing an FPC flexible board jointed board 1, and processing an FPC single product on the FPC flexible board jointed board 1;
the FPC flexible board jointed board 1 comprises a jointed board body 101, wherein effective areas 102 and invalid areas 103 are arranged on the jointed board body 101, the number of the effective areas 102 is four, and the four effective areas 102 are arranged in a matrix mode, so that the invalid areas 103 are distributed in a cross mode;
a plurality of FPC single products 3 arranged in a matrix manner are arranged in the effective area 102, and one side of each FPC single product 3 is provided with an optical positioning point 104;
the invalid region 103 adopts a general panel common mode structure;
a plurality of positioning holes 105 are formed in the invalid region 103;
step two, performing SMT (surface mount technology) surface mounting on a plurality of FPC single products on the whole FPC flexible board jointed board 1 to form a plurality of FPC assemblies;
thirdly, performing operations such as dispensing and electrical property detection on a plurality of FPC components of the whole FPC flexible board jointed board 1;
preferably, the dispensing device 2 is adopted to perform dispensing operation on a plurality of FPC assemblies;
the glue dispensing device 2 comprises a glue dispensing device operating platform 201, an adjusting mechanism 202 is arranged on the glue dispensing device operating platform 201, a glue dispensing mechanism 203 is arranged on a rear side frame of the adjusting mechanism 202, a material conveying mechanism is arranged on a front side frame of the adjusting mechanism 202, a glue dispensing device carrying platform 204 is arranged on the adjusting mechanism 202, a glue dispensing device placing groove 205 is arranged on the glue dispensing device carrying platform 204, a semi-finished product to be subjected to glue dispensing is placed in the glue dispensing device placing groove 205, the adjusting mechanism 202 is used for adjusting the semi-finished product to be subjected to glue dispensing to a plurality of angle positions which are beneficial to glue flowing, different varieties adopt different angle positions so that the glue can naturally flow to the periphery and the bottom of an IC, and the material conveying mechanism is used for conveying a finished product subjected to glue dispensing to a next process and waiting for quality inspection;
the adjusting mechanism 202 comprises a longitudinal guide rail 202.1 arranged on the top surface of the operating platform 201 of the glue dispensing device, a transverse guide rail 202.2 is connected to the longitudinal guide rail 202.1 in a sliding manner, an adjusting mechanism moving base 202.3 is connected to the transverse guide rail 202.2 in a sliding manner, adjusting bolts 202.4 which are upwards screwed penetrate through four corners of the adjusting mechanism moving base 202.3, an angle adjusting plate 202.5 is arranged between the top ends of the four adjusting bolts 202.4, and a glue dispensing device carrying platform 204 is arranged on the angle adjusting plate 202.5;
the top surface of the longitudinal guide rail 202.1 is provided with two longitudinal sliding grooves 202.6 which are parallel left and right, a first sliding block 202.7 is arranged in the longitudinal sliding groove 202.6, and the first sliding block 202.7 is connected with the bottom surface of the transverse guide rail 202.2;
a first screw rod 202.8 is arranged in the middle of the longitudinal guide rail 202.1 along the length direction of the longitudinal guide rail, a first motor is arranged at one end of the first screw rod 202.8, a first nut seat 202.9 is arranged on the first screw rod 202.8, and the first nut seat 202.9 is connected with the bottom surface of the transverse guide rail 202.2;
the top surface of the transverse guide rail 202.2 is provided with two transverse sliding grooves 202.12 which are parallel front and back, a second sliding block 202.13 is arranged in the transverse sliding groove 202.12, and the second sliding block 202.13 is connected with the bottom surface of the adjusting mechanism moving seat 202.3;
a second lead screw 202.10 is arranged in the middle of the transverse guide rail 202.2 along the length direction thereof, a second motor 202.14 is arranged at one end of the second lead screw 202.10, a second nut seat 202.11 is arranged on the second lead screw 202.10, and the second nut seat 202.11 is connected with the bottom surface of the adjusting mechanism moving seat 202.3;
step four, punching the whole jointed board into a single product by adopting a punching die;
the punching die comprises an upper die and a lower die 4, the whole jointed board is placed on the lower die 4, the upper die moves downwards to be matched with the lower die 4 for punching, a plurality of single products are separated from the jointed board body, the punched single products are adsorbed on the upper die, and the single products are manually unloaded through a carrier and transferred to the next process;
preferably, the lower mold 4 comprises a lower mold body 401, a vacuum adsorption component 402 is embedded in the lower mold body 401, the vacuum adsorption component 402 comprises a main vacuum path pipe 402.1 and a branch vacuum path pipe 402.2, the main vacuum path pipe 402.1 is provided with a left end and a right end, one end of the main vacuum path pipe 402.1 is connected with an air source through a pipeline, the other end of the main vacuum path pipe 402.1 is communicated with the branch vacuum path pipe 402.2, and the left end and the right end of the branch vacuum path pipe 402.2 are both provided with a nozzle 402.3;
and step five, carrying out appearance inspection on a plurality of single products, and then loading the single products into a delivery tray through an automatic machine.
The expansion and contraction coefficients and the process capability index (cpk) of the FPC flexible board jointed board (comprising four effective areas, and FPC single products arranged in a 3X 7 matrix are distributed in each effective area) and the original FPC flexible board jointed board (FPC single products arranged in an 8X 16 matrix) are shown in the following table:
| specification of jointed board | Coefficient of expansion and contraction | Index of process capability |
| 4×(3×7) | ±0.027 | 1.2 |
| 8×16 | ±0.048 | 0.3 |
Example two
The difference between this embodiment and the first embodiment is: the FPC flexible board jointed board 1 in the first step comprises a jointed board body 101, wherein effective areas 102 and ineffective areas 103 are arranged on the jointed board body 101, six effective areas 102 are arranged, and the six effective areas 102 are arranged in a matrix mode, so that the ineffective areas 103 are distributed in a # -shaped mode.
The expansion and contraction coefficients and the process capability index (cpk) of the FPC flexible board jointed board (comprising six effective areas, and FPC single products arranged in a 2X 4 matrix are distributed in each effective area) and the original FPC flexible board jointed board (FPC single products arranged in an 8X 16 matrix) are shown in the following table:
| specification of jointed board | Coefficient of expansion and contraction | Index of process capability |
| 6×(2×4) | ±0.029 | 1.4 |
| 8×16 | ±0.048 | 0.3 |
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A high-precision forming method of a VCM flexible circuit board is characterized by comprising the following steps: the specific operation method comprises the following steps:
providing an FPC flexible board jointed board (1), and processing an FPC single product on the FPC flexible board jointed board (1);
the FPC flexible board jointed board (1) comprises a jointed board body (101), wherein effective areas (102) and invalid areas (103) are arranged on the jointed board body (101), a plurality of effective areas (102) are arranged, and the effective areas (102) are arranged in a matrix manner, so that the invalid areas (103) are distributed in a cross shape or a groined shape;
a plurality of FPC single products (3) arranged in a matrix manner are arranged in the effective area (102);
step two, performing SMT (surface mount technology) surface mounting on a plurality of FPC single products on the whole FPC flexible board jointed board (1) to form a plurality of FPC assemblies;
thirdly, performing operations such as dispensing and electrical property detection on a plurality of FPC assemblies of the whole FPC flexible board jointed board (1);
step four, punching the whole jointed board into a single product by adopting a punching die;
the punching die comprises an upper die and a lower die (4), the whole jointed board is placed on the lower die (4), the upper die moves downwards to be matched with the lower die (4) to punch the jointed board, a plurality of single products are separated from the jointed board body, the punched single products are adsorbed on the upper die, and the single products are manually unloaded through a carrier and transferred to a next process;
and step five, carrying out appearance inspection on a plurality of single products, and then loading the single products into a delivery tray through an automatic machine.
2. The high-precision forming method of the VCM flexible circuit board according to claim 1, wherein: and one side of the FPC single product (3) in the first step is provided with an optical positioning point (104).
3. The high-precision forming method of the VCM flexible circuit board according to claim 1, wherein: the invalid region (103) in the first step adopts a general panel common mode structure.
4. The high-precision forming method of the VCM flexible circuit board according to claim 1, wherein: in the third step, a glue dispensing device (2) is adopted to perform glue dispensing operation on the FPC assemblies;
the glue dispensing device (2) comprises a glue dispensing device operating platform (201), an adjusting mechanism (202) is arranged on the glue dispensing device operating platform (201), a glue dispensing mechanism (203) is erected on the rear side of the adjusting mechanism (202), a material conveying mechanism is arranged on a front side frame of the adjusting mechanism (202), a glue dispensing device carrying platform (204) is arranged on the adjusting mechanism (202), a glue dispensing device placing groove (205) is arranged on the glue dispensing device carrying platform (204), a semi-finished product to be subjected to glue dispensing is placed in the glue dispensing device placing groove (205), the adjusting mechanism (202) is used for adjusting the semi-finished product to be subjected to glue dispensing to a plurality of angle positions which are beneficial to glue flowing, and the material conveying mechanism is used for conveying a finished product to be subjected to glue dispensing to a waiting quality inspection in a next procedure.
5. The high-precision forming method of the VCM flexible circuit board according to claim 4, wherein: adjustment mechanism (202) is including setting up in longitudinal rail (202.1) of adhesive deposite device operation panel (201) top surface, sliding connection has transverse guide (202.2) on longitudinal rail (202.1), sliding connection has adjustment mechanism to remove seat (202.3) on transverse guide (202.2), and adjusting mechanism removes the four corners of seat (202.3) and all wears to be equipped with adjusting bolt (202.4) of directional upward spin, is provided with angle adjusting plate (202.5) between the top of four adjusting bolt (202.4), be provided with adhesive deposite device microscope carrier (204) on angle adjusting plate (202.5).
6. The high-precision forming method of the VCM flexible circuit board according to claim 4, wherein: the longitudinal guide rail (202.1) is provided with a first screw rod (202.8) along the length direction thereof, one end of the first screw rod (202.8) is provided with a first motor, the first screw rod (202.8) is provided with a first nut seat (202.9), and the first nut seat (202.9) is connected with the bottom surface of the transverse guide rail (202.2).
7. The high-precision forming method of the VCM flexible circuit board according to claim 4, wherein: a second lead screw (202.10) is arranged on the transverse guide rail (202.2) along the length direction of the transverse guide rail, a second motor (202.14) is arranged at one end of the second lead screw (202.10), a second nut seat (202.11) is arranged on the second lead screw (202.10), and the second nut seat (202.11) is connected with the bottom surface of the adjusting mechanism moving seat (202.3).
8. The high-precision forming method of the VCM flexible circuit board according to claim 1, wherein: the lower die (4) in the fourth step comprises a lower die body (401), a vacuum adsorption component (402) is embedded in the lower die body (401), the vacuum adsorption component (402) comprises a vacuum main pipeline (402.1) and a vacuum branch pipeline (402.2), the vacuum main pipeline (402.1) is arranged at the left and the right, one end of the vacuum main pipeline (402.1) is connected with an air source through a pipeline, the other end of the vacuum main pipeline (402.1) is communicated with the vacuum branch pipeline (402.2), and suction nozzle heads (402.3) are arranged at the left and the right ends of the vacuum branch pipeline (402.2).
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| CN202010557056.2A CN111712043B (en) | 2020-06-17 | 2020-06-17 | High-precision forming method for VCM flexible circuit board |
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| CN202010557056.2A CN111712043B (en) | 2020-06-17 | 2020-06-17 | High-precision forming method for VCM flexible circuit board |
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| CN1564647A (en) * | 2004-04-02 | 2005-01-12 | 楼方寿 | Method of making circuit board assembly from splitting boards of printed circuit board |
| US8141240B2 (en) * | 1999-08-04 | 2012-03-27 | Super Talent Electronics, Inc. | Manufacturing method for micro-SD flash memory card |
| CN104244573A (en) * | 2014-08-21 | 2014-12-24 | 世一电子科技（惠州）有限公司 | Flexible printed circuit board and flexible printed circuit board reflow soldering method |
| JP2015130507A (en) * | 2013-12-31 | 2015-07-16 | 台湾嘉碩科技股▲ふん▼有限公司 | Conductive package structure and manufacturing method of the same |
| CN105437318A (en) * | 2015-12-29 | 2016-03-30 | 无锡名豪印业有限公司 | Three-in-one die cutting device |
| CN208727878U (en) * | 2018-07-19 | 2019-04-12 | 厦门海维尔自动化设备有限公司 | A kind of automatic dispensing machine |
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2020
- 2020-06-17 CN CN202010557056.2A patent/CN111712043B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8141240B2 (en) * | 1999-08-04 | 2012-03-27 | Super Talent Electronics, Inc. | Manufacturing method for micro-SD flash memory card |
| CN1564647A (en) * | 2004-04-02 | 2005-01-12 | 楼方寿 | Method of making circuit board assembly from splitting boards of printed circuit board |
| JP2015130507A (en) * | 2013-12-31 | 2015-07-16 | 台湾嘉碩科技股▲ふん▼有限公司 | Conductive package structure and manufacturing method of the same |
| CN104244573A (en) * | 2014-08-21 | 2014-12-24 | 世一电子科技（惠州）有限公司 | Flexible printed circuit board and flexible printed circuit board reflow soldering method |
| CN105437318A (en) * | 2015-12-29 | 2016-03-30 | 无锡名豪印业有限公司 | Three-in-one die cutting device |
| CN208727878U (en) * | 2018-07-19 | 2019-04-12 | 厦门海维尔自动化设备有限公司 | A kind of automatic dispensing machine |
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| CN111712043B (en) | 2021-08-20 |
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