CN1516990A - Production device and production method for organic EL dispaly - Google Patents
Production device and production method for organic EL dispaly Download PDFInfo
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- CN1516990A CN1516990A CNA028118766A CN02811876A CN1516990A CN 1516990 A CN1516990 A CN 1516990A CN A028118766 A CNA028118766 A CN A028118766A CN 02811876 A CN02811876 A CN 02811876A CN 1516990 A CN1516990 A CN 1516990A
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- 238000004519 manufacturing process Methods 0.000 title claims description 50
- 239000000758 substrate Substances 0.000 claims abstract description 155
- 239000011521 glass Substances 0.000 claims abstract description 123
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 35
- 239000011261 inert gas Substances 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 13
- 230000027756 respiratory electron transport chain Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 230000011218 segmentation Effects 0.000 abstract 1
- 238000003860 storage Methods 0.000 description 19
- 239000007789 gas Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000012860 organic pigment Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A scribe line (S) is formed, for each area that is a potential organic EL display, on a glass substrate (2) prior to attaching a sealing cap (9). This can prevent the contact between a sealing cap (9) and a glass cutter (21) that poses a problem when a scribe line (S) is formed on a glass substrate (2) after a sealing cap (9) is set, and at the same time can eliminate a faulty segmentation by the effect of a residual stress caused by a pasted sealing cap (9).
Description
Technical field
The present invention relates to a kind of OLED display manufacturing installation and a kind of OLED display manufacture method, be used to make a kind of OLED display, this display has the organic luminous layer that forms by the structure of a seal cover sealing on a substrate of glass.
Background technology
Organic EL (electroluminescence) display has lot of advantages than the LCD of the main product of the present flat-panel monitor of conduct, and as estimating that the following flat-panel monitor of new generation that will replace LCD is receiving increasing concern.
Fig. 6 is the perspective view of the common structure of a typical OLED display of expression.
OLED display 1 has a clear glass substrate 2.On substrate of glass 2, with the striped pattern of predetermined space, by transparent conductive material, for example ITO or analog are formed with a plurality of positive electrode layers 3.On substrate of glass 2, the hole transmission layer 4 in hole is provided when applying dc voltage, comprise minute quantity as the organic luminous layer 5 of the organic pigment of dopant with the electron transfer layer 6 of electronics is provided when applying dc voltage, by being formed on each positive electrode layer 3 of order.At top layer, promptly on the electron transfer layer 6, form a plurality of positive electrode layer 7 with the striped pattern of predetermined space by electric conducting material, make the striped of positive electrode layer 7 extend along the direction of extending perpendicular to positive electrode layer 3.
Each positive electrode layer 3 on substrate of glass 2 all is connected to the anode of a DC power supply 8.Each positive electrode layer 7 in top layer all is connected to the negative terminal of DC power supply 8.
In having the OLED display of said structure, when DC power supply 8 applies dc voltage between positive electrode layer 3 and positive electrode layer 7, the hole transmission layer 4 of hole from the positive electrode layer 3 that is applied with dc voltage is injected into the organic luminous layer 5, and the electron transfer layer 6 of electronics under the positive electrode layer 7 that is applied with dc voltage is injected into the organic luminous layer 5.In respectively by the organic luminous layer 5 of hole transmission layer 4 and electron transfer layer 6 injected holes and electronics, hole and electronics are by combination again.Absorbed by the organic pigment that comprises in the organic luminous layer 5 in conjunction with the energy that is produced again, thus the emission bright dipping.The light of launching from organic luminous layer 5 is sent to hole transmission layer 4 by order, positive electrode layer 3 and substrate of glass 2, and from the back side output (bottom surface Fig. 6) of substrate of glass 2.
In OLED display 1, a plurality of positive electrode layer 7 in a plurality of positive electrode layers 3 on the substrate of glass 2 and the top layer are pitched with right angle intersection.Dc voltage is applied on each crosspoint by TFT or analog Be Controlled, thereby can be formed on the outside of substrate of glass 2 by the image that light produced, and each crosspoint has all formed a display unit.
In OLED display 1, the organic luminous layer 5 that is formed on the hole transmission layer 4 very easily makes moist.Therefore, when organic luminescent layer 5 is exposed to the open air in surrounding air, can form the stain that is called as blackening, this can cause the optical imagery fault, thereby can not display image.Therefore, in vacuum chamber or being full of the film of carrying out in the cavity of inert gas each layer forms after the step, a seal cover 9 is provided on the hierarchy that obtains, as shown in Figure 7, keep this hierarchy away from surrounding air simultaneously, thereby this organic luminous layer 5 insulate mutually with surrounding air.By this set, avoided moist and blackening that cause.
Fig. 8 shows the common structure of the organic EL manufacturing installation that is used to make OLED display.
Organic EL manufacturing installation 10 has: film forms chamber 11, carries out film therein and forms step to form the several layers that comprises organic luminous layer 5 and analog on substrate of glass 2; With annular seal space 12, wherein film formation step forms hierarchy on substrate of glass 2 after, on substrate of glass 2, also be provided with seal cover 9.Film forms chamber 11 and annular seal space 12 interconnects by interface channel 13.
And film forms each chamber 110 to 116 in chamber 11, and each chamber 120 to 126 of interface channel 13 and annular seal space 12 all is provided with an air supply pipe and a blast pipe (not shown).By these pipelines, can regulate each chamber, thereby make each chamber all be filled into required gas by required air pressure.
Utilizing organic EL manufacturing installation 10 to make under the situation of OLED display, substrate of glass 2 is sent to pretreatment chamber 112 by the conveying robot 110a of conveying chamber 110 from substrate storage chamber 111, and the preliminary treatment of being scheduled to.Then, substrate of glass 2 is sent to settling chamber 113 to 116, wherein sequentially is formed with positive electrode layer 3, hole transmission layer 4, organic luminous layer 5, electron transfer layer 6 and positive electrode layer 7 respectively.In the forming process of these layers, the valve 111a that is provided with between conveying chamber 110 and each chamber 111 to 116 is opened and closed to 116a, carry out the introduction and the discharge of predetermined gas simultaneously by air supply pipe and blast pipe (not shown), thereby the air pressure of each chamber is by suitable adjustment.This processing with under the contacted mode of surrounding air is not carried out in substrate of glass 2.
Form each layer in film formation chamber 11 after, substrate of glass 2 is transferred to annular seal space 12 by interface channel 13 under air tight condition.In annular seal space 12, the conveying robot 120a that substrate of glass 2 is transferred chamber 120 is transported to control laboratory 121, and the check of being scheduled to.Then, substrate of glass 2 is sent to seal cover fixed chamber 122, and the seal cover 9 of lid storage chamber 123 is set at the pre-position on the substrate of glass 2.
The substrate of glass 2 that is provided with seal cover 9 is taken out from output chamber 124, is used to make OLED display, and wherein each layer of substrate of glass 2 comprises organic luminous layer 5 and analog, all is under the condition of sealing.
If there is the moisture of minute quantity to be comprised in the organic luminous layer 5 of OLED display, then moisture can cause the generation of blackening.Therefore, it is to carry out in the cavity that does not comprise moisture that film forms step, thereby and the setting of seal cover 9 can not be exposed in the surrounding air in order to cover these layer of each layer just, promptly moisture can not be introduced in organic luminous layer 5.Will contact coating UV curable adhesive on the contact surface of substrate of glass 2 at seal cover 9, by to the UV curable adhesive with the UV irradiate light that sees through substrate of glass 2 and seal cover 9 is fixed on the substrate of glass 2.
As mentioned above, OLED display must be made under the condition of no moisture.In order to improve the mass productivity of OLED display, use very large-area substrate of glass, and film formation step is simultaneously many OLED display to be carried out.Each OLED display all is provided with seal cover, thereby, on very big substrate of glass, to all form line (scribe) to each OLED display that forms on it.Then, apply moment of flexure, make these many OLED display separated, thereby can make many OLED display at synchronization along line.
Yet, in this method, if line is formed on the same surface that substrate of glass 2 is provided with seal cover 9, because the appearance of seal cover 9 just is difficult near seal cover 9 positions and forms line.In this case, line just must be formed on the position away from seal cover 9 preset distances.
Perhaps, if line is formed on the opposed surface that substrate of glass 2 is provided with seal cover 9, then because seal cover 9 from substrate of glass 2 certain height that risen, just is difficult to stable support substrate of glass 2.Therefore be difficult to form reliably line.And, because there is the bonding agent after solidifying in the contact surface of seal cover 9, wherein this contact surface contacts with the opposite side surfaces that substrate of glass 2 is formed with line, the separation of substrate of glass 2 (fracture) direction is not necessarily identical with the institute's target direction of ruling, therefore, because the influence of bonding agent can not obtain desirable release surface.
The present invention considers the problems referred to above and proposes, and the purpose of this invention is to provide a kind of OLED display manufacturing installation and a kind of OLED display manufacture method, for substrate being separated into each OLED display, can on the ideal position of substrate of glass, form line reliably, wherein on substrate of glass, be provided with many seal covers, be used to cover a plurality of layers that comprise organic luminous layer and analog.
In order to address the above problem, OLED display manufacturing installation of the present invention comprises: film forming device, be used in vacuum or inert gas, to becoming each part of separating the fragility substrate of OLED display, in the fragility substrate, form a positive electrode layer, a hole transmission layer, an organic luminous layer, an electron transfer layer and a positive electrode layer; And sealing device, be used in vacuum or inert gas, a potted component is provided, be used under air tight condition, each part being sealed in each layer that forms in the fragility substrate, wherein before potted component is set, line is formed in the suprabasil predetermined portions of the fragility zone, and this predetermined portions zone is corresponding to becoming a part of separating the fragility substrate of OLED display.
Summary of the invention
In above-mentioned OLED display manufacturing installation of the present invention, preferably also comprise chalker, be used in vacuum or inert gas, form the suprabasil line of fragility, wherein each layer is formed in the suprabasil predetermined portions of the fragility zone by film forming device, and this predetermined portions zone is corresponding to becoming a part of separating the fragility substrate of OLED display.
In above-mentioned OLED display manufacturing installation of the present invention, preferably this chalker comprises that a glass cuts tool, and this glass is cut tool and had: the cutting blade of a double cone shape, and its maximum gauge is at core; With a support, being used to support this cutting blade can and rotate around the axle of this circular cone.
And, OLED display manufacture method of the present invention comprises: film forms step, be used in vacuum or inert gas, to becoming each part of the fragility substrate that separates OLED display, in the fragility substrate, form a positive electrode layer, a hole transmission layer, an organic luminous layer, an electron transfer layer and a positive electrode layer; With the potted component additional step, be used in vacuum or inert gas, additional potted component, be used for being used for each layer that in the fragility substrate, forms of each part at the air tight condition lower seal, wherein before the potted component additional step, line is formed in the suprabasil predetermined portions of the fragility zone, and this predetermined portions zone is corresponding to the part that will become the fragility substrate that separates OLED display.
In above-mentioned OLED display manufacture method of the present invention, preferably also comprise scribe step, be used in vacuum or inert gas, in the suprabasil predetermined portions of fragility zone, form line, wherein each layer is formed in the fragility substrate in film formation step, and this predetermined portions zone is corresponding to becoming a part of separating the fragility substrate of OLED display.
Description of drawings
Fig. 1 is the floor map of expression according to the common structure of OLED display manufacturing installation of the present invention.
Fig. 2 is an end view of cutting tool at the glass that line is provided with in the chamber.
Fig. 3 (a) is a cutaway view to 3 (e), shows on a plurality of layers that form on the substrate of glass seal cover is set, and substrate of glass is separated into the step of a plurality of OLED display.
Fig. 4 is the floor map of expression according to the common structure of another OLED display manufacturing installation of the present invention.
Fig. 5 is the floor map of expression according to the common structure of another OLED display manufacturing installation of the present invention.
Fig. 6 is the perspective view of the common structure of an OLED display of expression.
Fig. 7 is a cutaway view that is provided with the OLED display of seal cover.
Fig. 8 is the floor map of the common structure of a traditional OLED display manufacturing installation of expression.
Embodiment
Below, illustrate with reference to the accompanying drawings according to OLED display manufacturing installation of the present invention.
Fig. 1 shows the common structure according to OLED display manufacturing installation 100 of the present invention.The OLED display of manufacturing is identical with structure shown in Figure 6.
OLED display manufacturing installation 100 has: a film forms chamber 11, carries out film therein and forms step to form several layers on substrate of glass (fragility substrate) 2, for example organic luminous layer 5 and analog; With annular seal space 20, wherein on substrate of glass 2, form after the hierarchy, substrate of glass 2 is provided with seal cover 9.Film forms chamber 11 and annular seal space 20 interconnects by interface channel 13.
Fig. 2 show be provided with in the line chamber 30 cut tool 21.
Cut tool 21 and have a cutting blade 22, make, for example superhard metal, sintered diamond, or analog by high hardness material.Cutting blade 22 has double cone shape, and has maximum gauge at core.The opposite end of cutting blade 22 is supported by support 23, and the lower surface of support 23 is open, thereby cutting blade 22 can center on the axle of circular cone and rotate.
To cut tool 21 form line on substrate of glass 2 in order to use, the core of the cutting blade 22 that extends from the downside of support 23 is pulled to the desired location on the substrate of glass 2, and moves along predetermined direction when cutting blade 22 is rotated.
When utilizing OLED display manufacturing installation 100 to make an OLED display, substrate of glass 2 is sent to pretreatment chamber 112 by the conveying robot 110a of conveying chamber 110 from substrate storage chamber 111, and the preliminary treatment of being scheduled to.Then, substrate of glass 2 is sent to settling chamber 113 to 116, in each settling chamber under the predetermined pressure of predetermined gas, form positive electrode layer 3 in a sequential manner respectively, hole transmission layer 4, organic luminous layer 5, electron transfer layer 6, with positive electrode layer 7, thus the hierarchy on the acquisition substrate of glass 2.In the forming process of these layers, the valve 111a that is provided with between conveying chamber 110 and each chamber 111 to 116 is to 116a, be opened and closed, carry out the introduction and the discharge of predetermined gas simultaneously by air supply pipe and blast pipe (not shown), thereby substrate of glass 2 do not contact with surrounding air.
Form each layer in film formation chamber 11 after, substrate of glass 2 is transferred to annular seal space 20 by interface channel 13 under air tight condition.
Below, illustrate to 3 (e) with reference to Fig. 3 (a) seal cover 9 is appended to step on the substrate of glass 2 that is formed with a plurality of layers on it.
Be sent to by interface channel 13 on the substrate of glass 2 of annular seal space 20, be formed with the hierarchy that comprises positive electrode layer 3 with predetermined interval, shown in Fig. 3 (a).After substrate of glass 2 was sent to conveying chamber 210, the conveying robot 210a of conveying chamber 210 sent substrate of glass 2 into control laboratory 216.Carry out in control laboratory 216 after the predetermined check, substrate of glass 2 is sent to line chamber 30.
In line chamber 30, the position of substrate of glass 2 is corrected by carrying out optical correction, then, intersects line according to the line pitch data that preset along X and Y direction.In this intersected the line processing, the cutting blade 22 shown in Fig. 2 moved in rotation, thereby formed line S to becoming each part of separating OLED display on substrate of glass 2, shown in Fig. 3 (b).
Subsequently, the conveying robot 210a of conveying chamber 210 will be formed with the line S substrate of glass 2 deliver in the seal cover fixed chamber 212.In seal cover fixed chamber 212, thereby seal cover 9 is placed in the hierarchy that cover glass substrate 2 forms on the substrate of glass 2 from lid storage chamber 213.Seal cover 9 is placed on the substrate of glass 2 by the UV curable adhesive that applies on seal cover 9 and substrate of glass 2 contacted surfaces.
Subsequently, the conveying robot 210a of conveying chamber 210 substrate of glass 2 that will be placed with seal cover 9 is delivered in the UV exposure cell 214.In UV exposure cell 214, the back side of substrate of glass 2 is by the UV rayed, and shown in Fig. 3 (d), thereby the UV curable adhesive that applies on the surface of seal cover 9 adjacent substrate of glass 2 is cured, thereby seal cover 9 is fixed on the precalculated position of substrate of glass 2.
Subsequently, the conveying robot 210a of conveying chamber 210 substrate of glass 2 that will be fixed with seal cover 9 is delivered in the output chamber 215.By opening the reduced pressure that valve 215b output chamber 215 is made into to equal atmospheric pressure, then, the substrate of glass 2 that has seal cover 9 is sent output chamber 215.
At last, substrate of glass 2 is split along the line S that is scheduled to form on the substrate of glass 2 in the pattern, thereby is separated into each OLED display, shown in Fig. 3 (e).
As mentioned above, in EL display manufacturing apparatus 100 according to the present invention, after a plurality of layers that comprise positive electrode layer 3 and analog have been formed, but before seal cover 9 was placed on a plurality of layers, line S was formed on and is used for becoming each part of separating OLED display on the substrate of glass 2.Therefore, after seal cover 9 had been set on the substrate of glass 2, what occur when line S is formed on the substrate of glass 2 had just been avoided with seal cover 9 contacted problems of cutting tool 21.And, also avoided because the residual stress of fixing seal cover 9 influences the unfavorable situation of separation of caused substrate of glass 2.
Fig. 4 shows the common structure according to the alternative of OLED display manufacturing installation 100 of the present invention.The OLED display of manufacturing is identical with structure as shown in Figure 6.
In OLED display manufacturing installation 100, line chamber 30 is set at the outside that film forms chamber 11 and annular seal space 20, and in the line chamber, line S is formed on and is used on the substrate of glass 2 substrate of glass 2 is separated into each OLED display.Annular seal space 20 has a preparation room 211.Other elements of this OLED display manufacturing installation 100 are identical with OLED display manufacturing installation shown in Figure 1, therefore repeat no more.
Using the OLED display manufacturing installation to make under the situation of OLED display, at first, line S is on the desired location that is formed in line chamber 30 on the substrate of glass 2.Subsequently, the substrate of glass 2 that has been formed with line S is sent to the substrate storage chamber 111 that film forms chamber 11.Then, substrate of glass 2 is sent to each chamber 112 to 116 that film forms chamber 11 by the conveying robot 110a of conveying chamber 110, thereby forms a plurality of layers of OLED display, and for example positive electrode layer 3.
After each layer was formed, substrate of glass 2 was sent to annular seal space 20 by interface channel 13.In annular seal space 20, the conveying robot 210a of conveying chamber 210 delivers to substrate of glass 2 among each chamber 211-216 of annular seal space 20, is used for becoming a step on each zone of separating OLED display on the substrate of glass 2 thereby carry out seal cover 9 is attached to.Additional have the substrate of glass 2 of seal cover 9 to be removed from output chamber 215.
Fig. 5 shows the common structure according to the another alternative of OLED display manufacturing installation 100 of the present invention.The OLED display of these OLED display manufacturing installation 100 manufacturings is identical with structure as shown in Figure 6.
In this OLED display manufacturing installation 100, line chamber 30 is set at film and forms in the chamber 11, and in the line chamber, line S is formed on and is used on the substrate of glass 2 substrate of glass 2 is separated into each OLED display.Annular seal space 20 has a preparation room 211.
Under the situation of utilizing these OLED display manufacturing installation 100 manufacturing OLED display, substrate of glass 2 is sent to each chamber 112 to 116 that film forms chamber 11 in a sequential manner by the conveying robot 110a of conveying chamber 110 from substrate locker room 111, thereby forms a plurality of layers of OLED display.Subsequently, the substrate of glass 2 that has formed a plurality of floor of OLED display is sent to line chamber 30.In line chamber 30, line S is formed on the desired location on substrate of glass 2 surfaces.It should be noted that, consider that film forms the film of carrying out in the chamber 11 and forms step and line formation step on substrate of glass 2, line S should be formed on above-mentioned film and form after the step, but selectable, film formation step is carried out also can form line S on substrate of glass 2 after again.
Be formed and after the S that rules also had been formed, substrate of glass 2 was sent to annular seal space 20 by interface channel 13 at each layer.In annular seal space 20, the conveying robot 210a of conveying chamber 210 delivers to substrate of glass 2 among each chamber 212-216 of annular seal space 20, thereby execution is attached to seal cover 9 step on each zone that will become a separation OLED display on the substrate of glass 2.Additional have the substrate of glass 2 of seal cover 9 to be removed from output chamber 215.
As mentioned above, in OLED display manufacturing installation according to the present invention, before seal cover 9 was formed on the substrate of glass 2, line S just was formed on the substrate of glass 2.In the case, as above-mentioned Fig. 1 and shown in Figure 5, after each layer of OLED display had been formed on the substrate of glass 2, the step that forms line S just can be carried out in a vacuum or in the inert gas.Selectable, as above-mentioned shown in Figure 4, line S can be formed on the substrate of glass 2 in the outside of OLED display manufacturing installation before film forms step.
Industrial applicibility
According to OLED display manufacturing installation of the present invention and OLED display manufacture method, line It is aobvious for becoming the organic EL of separation to be formed on substrate of glass before potted component is set Show on each zone of device. Therefore, after potted component has been arranged on the substrate of glass, work as line Tool cut by the glass that occurs when being formed on the substrate of glass and the contacted problem of potted component is just avoided . And, because the separation that the residual stress of fixing potted component affects caused substrate of glass is not Ideal situation has also been avoided.
Claims (5)
1, a kind of OLED display manufacturing installation comprises:
Film forming device is used in vacuum or inert gas, to becoming each part of separating the fragility substrate of OLED display, in the fragility substrate, form a positive electrode layer, a hole transmission layer, an organic luminous layer, an electron transfer layer and a positive electrode layer; With
Sealing device is used in vacuum or inert gas, and a potted component is provided, and is used for being used at the air tight condition lower seal each layer that forms in the fragility substrate of each part,
Wherein before potted component was set, line was formed in the suprabasil predetermined portions of the fragility zone, and this predetermined portions zone is corresponding to the part that will become the fragility substrate that separates OLED display.
2, according to the OLED display manufacturing installation of claim 1, also comprise chalker, be used in vacuum or inert gas, in the suprabasil predetermined portions of fragility zone, form line, wherein each layer is formed in the fragility substrate by film forming device, and this predetermined portions zone is corresponding to the part that will become the fragility substrate that separates OLED display.
3, according to the OLED display manufacturing installation of claim 2, wherein this chalker comprises that a glass cuts tool, and this glass is cut tool and had: the cutting blade of a double cone shape, and its maximum gauge is at core; With a support, being used to support this cutting blade can and rotate around the axle of this circular cone.
4, a kind of OLED display manufacture method, comprise: film forms step, be used in vacuum or inert gas, to becoming each part of the fragility substrate that separates OLED display, in the fragility substrate, form a positive electrode layer, a hole transmission layer, an organic luminous layer, an electron transfer layer and a positive electrode layer; With
The potted component additional step is used in vacuum or inert gas, adds a potted component, is used for being used at the air tight condition lower seal each layer that forms in the fragility substrate of each part,
Wherein before the potted component additional step, line is formed in the suprabasil predetermined portions of the fragility zone, and this predetermined portions zone is corresponding to the part that will become the fragility substrate that separates OLED display.
5, according to the OLED display manufacture method of claim 4, also comprise scribe step, be used in vacuum or inert gas, in the suprabasil predetermined portions of fragility zone, form line, wherein each layer is formed in the fragility substrate in film formation step, and this predetermined portions zone is corresponding to becoming a part of separating the fragility substrate of OLED display.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001180899 | 2001-06-14 | ||
| JP180899/2001 | 2001-06-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1516990A true CN1516990A (en) | 2004-07-28 |
| CN100346498C CN100346498C (en) | 2007-10-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028118766A Expired - Fee Related CN100346498C (en) | 2001-06-14 | 2002-06-03 | Production device and production method for organic EL dispaly |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3602846B2 (en) |
| KR (1) | KR100549099B1 (en) |
| CN (1) | CN100346498C (en) |
| TW (1) | TWI257265B (en) |
| WO (1) | WO2002104078A1 (en) |
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| CN102487069A (en) * | 2010-12-01 | 2012-06-06 | 塔工程有限公司 | Supplement sealing device used for flat display unit |
| CN106715347A (en) * | 2014-05-30 | 2017-05-24 | 三星钻石工业股份有限公司 | Method for splitting brittle substrate |
| WO2017181593A1 (en) * | 2016-04-19 | 2017-10-26 | 京东方科技集团股份有限公司 | Sintering apparatus, packaging system for organic light-emitting-diode device, and sintering method |
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| JP4736642B2 (en) * | 2005-09-05 | 2011-07-27 | コニカミノルタホールディングス株式会社 | Method for sealing organic electroluminescent element, method for manufacturing organic electroluminescent element |
| JP2011060749A (en) * | 2009-09-07 | 2011-03-24 | Samsung Electro-Mechanics Co Ltd | Method for forming organic electrode for transparent electrode |
| US10351461B2 (en) | 2014-05-30 | 2019-07-16 | MITSUBOSHI DIAMOND INDUSTRlAL CO., LTD. | Method for dividing brittle substrate |
| CN107108322B (en) | 2014-10-29 | 2020-01-14 | 三星钻石工业股份有限公司 | Method for dividing brittle substrate |
| JP2016098154A (en) | 2014-11-25 | 2016-05-30 | 三星ダイヤモンド工業株式会社 | Cutting method of brittle substrate |
| JP6413693B2 (en) | 2014-11-25 | 2018-10-31 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle substrate |
| JP6413694B2 (en) | 2014-11-25 | 2018-10-31 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle substrate |
| TWI605024B (en) | 2015-08-07 | 2017-11-11 | Mitsuboshi Diamond Ind Co Ltd | Breaking method of brittle substrate |
| JP6555002B2 (en) | 2015-08-19 | 2019-08-07 | 三星ダイヤモンド工業株式会社 | Scribe line inspection method |
| JP6544179B2 (en) | 2015-09-25 | 2019-07-17 | 三星ダイヤモンド工業株式会社 | Method of dividing brittle substrate |
| TWI609754B (en) | 2015-09-29 | 2018-01-01 | 三星鑽石工業股份有限公司 | Fragmentation method of brittle substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07130472A (en) * | 1993-11-04 | 1995-05-19 | Nippondenso Co Ltd | Electroluminescent element |
| JP3353699B2 (en) * | 1998-04-28 | 2002-12-03 | 株式会社豊田中央研究所 | Organic electroluminescent device |
| JP2000003782A (en) * | 1998-06-12 | 2000-01-07 | Casio Comput Co Ltd | Electroluminescent element |
| JP4342039B2 (en) * | 1999-06-15 | 2009-10-14 | 三星ダイヤモンド工業株式会社 | Glass scriber and scribing method |
| JP2001068265A (en) * | 1999-08-24 | 2001-03-16 | Toyota Motor Corp | Organic el element, and manufacture thereof |
-
2002
- 2002-06-03 KR KR1020037011171A patent/KR100549099B1/en not_active IP Right Cessation
- 2002-06-03 JP JP2003506246A patent/JP3602846B2/en not_active Expired - Fee Related
- 2002-06-03 CN CNB028118766A patent/CN100346498C/en not_active Expired - Fee Related
- 2002-06-03 WO PCT/JP2002/005461 patent/WO2002104078A1/en active IP Right Grant
- 2002-06-07 TW TW091112378A patent/TWI257265B/en not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101242688B (en) * | 2008-02-29 | 2010-06-23 | 东莞宏威数码机械有限公司 | A making system for straight-lined organic luminescent display |
| CN102487069A (en) * | 2010-12-01 | 2012-06-06 | 塔工程有限公司 | Supplement sealing device used for flat display unit |
| CN102487069B (en) * | 2010-12-01 | 2014-10-15 | 塔工程有限公司 | Supplement sealing device used for flat display unit |
| CN106715347A (en) * | 2014-05-30 | 2017-05-24 | 三星钻石工业股份有限公司 | Method for splitting brittle substrate |
| CN106715347B (en) * | 2014-05-30 | 2019-08-27 | 三星钻石工业股份有限公司 | The method for dividing of brittle base |
| WO2017181593A1 (en) * | 2016-04-19 | 2017-10-26 | 京东方科技集团股份有限公司 | Sintering apparatus, packaging system for organic light-emitting-diode device, and sintering method |
| US11730045B2 (en) | 2016-04-19 | 2023-08-15 | Boe Technology Group Co., Ltd. | Sintering apparatus, packaging system for organic light emitting diode device and sintering method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2002104078A1 (en) | 2004-10-07 |
| WO2002104078A1 (en) | 2002-12-27 |
| TWI257265B (en) | 2006-06-21 |
| JP3602846B2 (en) | 2004-12-15 |
| KR100549099B1 (en) | 2006-02-02 |
| KR20030096263A (en) | 2003-12-24 |
| CN100346498C (en) | 2007-10-31 |
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