CN1506551A - 夹物模压有接线板的塑料部件的粘结结构及其粘结方法 - Google Patents
夹物模压有接线板的塑料部件的粘结结构及其粘结方法 Download PDFInfo
- Publication number
- CN1506551A CN1506551A CNA031588247A CN03158824A CN1506551A CN 1506551 A CN1506551 A CN 1506551A CN A031588247 A CNA031588247 A CN A031588247A CN 03158824 A CN03158824 A CN 03158824A CN 1506551 A CN1506551 A CN 1506551A
- Authority
- CN
- China
- Prior art keywords
- plastic components
- around
- terminal
- supporting hole
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP266903/2002 | 2002-09-12 | ||
JP2002266903A JP4102624B2 (ja) | 2002-09-12 | 2002-09-12 | 配線板がインサート成形されたプラスチック部品の接合構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1506551A true CN1506551A (zh) | 2004-06-23 |
CN1266364C CN1266364C (zh) | 2006-07-26 |
Family
ID=32265583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031588247A Expired - Fee Related CN1266364C (zh) | 2002-09-12 | 2003-09-12 | 夹物模压有接线板的塑料部件的粘结结构及其粘结方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7172469B2 (zh) |
JP (1) | JP4102624B2 (zh) |
CN (1) | CN1266364C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104411497A (zh) * | 2012-04-27 | 2015-03-11 | 弗兰霍菲尔运输应用研究公司 | 具有临时保护膜的组件 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITTO20030846A1 (it) * | 2003-10-28 | 2005-04-29 | Intier Automotive Closures Spa | Procedimento per la realizzazione di un corpo di supporto per una serratura di un autoveicolo e corpo di supporto cosi' ottenuto. |
KR200467469Y1 (ko) * | 2011-12-12 | 2013-06-14 | 금산전자 주식회사 | Bldc모터의 방수형 커넥터 및 이를 위한 몰드 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5452948A (en) * | 1994-10-07 | 1995-09-26 | The Whitaker Corporation | Apparatus and method for electronically controlled hydraulic actuator |
US5766026A (en) * | 1994-10-07 | 1998-06-16 | The Whitaker Corporation | Electrical connector assembly with sealed and spring biased electrical component |
JP3535009B2 (ja) * | 1998-04-10 | 2004-06-07 | 矢崎総業株式会社 | 回路成形体 |
JP4135310B2 (ja) | 2000-10-26 | 2008-08-20 | アイシン精機株式会社 | ドアロックアクチュエータ |
-
2002
- 2002-09-12 JP JP2002266903A patent/JP4102624B2/ja not_active Expired - Lifetime
-
2003
- 2003-09-12 CN CNB031588247A patent/CN1266364C/zh not_active Expired - Fee Related
- 2003-09-12 US US10/660,739 patent/US7172469B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104411497A (zh) * | 2012-04-27 | 2015-03-11 | 弗兰霍菲尔运输应用研究公司 | 具有临时保护膜的组件 |
CN104411497B (zh) * | 2012-04-27 | 2017-02-15 | 弗兰霍菲尔运输应用研究公司 | 具有临时保护膜的组件 |
Also Published As
Publication number | Publication date |
---|---|
US20040123947A1 (en) | 2004-07-01 |
JP2004098615A (ja) | 2004-04-02 |
CN1266364C (zh) | 2006-07-26 |
US7172469B2 (en) | 2007-02-06 |
JP4102624B2 (ja) | 2008-06-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: MITSUI KINZOKU ACT CORP. Free format text: FORMER NAME: K.K. OI SEISUKOSHO |
|
CP01 | Change in the name or title of a patent holder |
Address after: Yokohama City, Kanagawa Prefecture, Japan Co-patentee after: Chengnan Industrial Co.,Ltd. Patentee after: MITSUI KINZOKU ACT Corp. Address before: Yokohama City, Kanagawa Prefecture, Japan Co-patentee before: Chengnan Industrial Co.,Ltd. Patentee before: Ohi Seisakusho Co.,Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20161226 Address after: Yokohama City, Kanagawa Prefecture, Japan Patentee after: MITSUI KINZOKU ACT Corp. Address before: Yokohama City, Kanagawa Prefecture, Japan Patentee before: MITSUI KINZOKU ACT Corp. Patentee before: Valeo Japan Co.,Ltd. Effective date of registration: 20161226 Address after: Yokohama City, Kanagawa Prefecture, Japan Patentee after: MITSUI KINZOKU ACT Corp. Patentee after: Valeo Japan Co.,Ltd. Address before: Yokohama City, Kanagawa Prefecture, Japan Patentee before: MITSUI KINZOKU ACT Corp. Patentee before: NILES CO.,LTD. Effective date of registration: 20161226 Address after: Yokohama City, Kanagawa Prefecture, Japan Patentee after: MITSUI KINZOKU ACT Corp. Patentee after: NILES CO.,LTD. Address before: Yokohama City, Kanagawa Prefecture, Japan Patentee before: MITSUI KINZOKU ACT Corp. Patentee before: Chengnan Industrial Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060726 |