CN1497954A - 固体摄像器件及使用该固体摄像器件的设备 - Google Patents
固体摄像器件及使用该固体摄像器件的设备 Download PDFInfo
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- CN1497954A CN1497954A CNA031603998A CN03160399A CN1497954A CN 1497954 A CN1497954 A CN 1497954A CN A031603998 A CNA031603998 A CN A031603998A CN 03160399 A CN03160399 A CN 03160399A CN 1497954 A CN1497954 A CN 1497954A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1302—Disposition
- H01L2224/13025—Disposition the bump connector being disposed on a via connection of the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2002287609 | 2002-09-30 | ||
JP287609/2002 | 2002-09-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1497954A true CN1497954A (zh) | 2004-05-19 |
CN1234234C CN1234234C (zh) | 2005-12-28 |
Family
ID=32280335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031603998A Expired - Fee Related CN1234234C (zh) | 2002-09-30 | 2003-09-29 | 固体摄像器件及使用该固体摄像器件的设备 |
Country Status (3)
Country | Link |
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US (1) | US7164113B2 (zh) |
CN (1) | CN1234234C (zh) |
TW (1) | TWI279132B (zh) |
Cited By (8)
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CN101501853B (zh) * | 2006-08-22 | 2011-06-22 | 松下电器产业株式会社 | 摄像装置芯片组及图像拾取系统 |
CN1981515B (zh) * | 2004-07-01 | 2012-07-04 | 索尼株式会社 | 摄像装置、摄像元件及摄像装置的控制方法 |
CN102917184A (zh) * | 2011-08-02 | 2013-02-06 | 佳能株式会社 | 摄像装置和摄像设备 |
CN103258831A (zh) * | 2012-02-21 | 2013-08-21 | 索尼公司 | 固态成像器件及其制造方法以及相机系统 |
CN104702825A (zh) * | 2013-12-09 | 2015-06-10 | 佳能株式会社 | 图像捕获装置和图像捕获装置的控制方法 |
CN104717467A (zh) * | 2015-03-05 | 2015-06-17 | 广州市吉星信息科技有限公司 | 无线现场教学系统 |
CN106449679A (zh) * | 2011-04-19 | 2017-02-22 | 阿尔塔传感器公司 | 具有混合型异质结构的图像传感器 |
CN110148605A (zh) * | 2012-03-30 | 2019-08-20 | 株式会社尼康 | 拍摄单元、拍摄装置及拍摄控制程序 |
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US7916180B2 (en) * | 2004-08-25 | 2011-03-29 | Protarius Filo Ag, L.L.C. | Simultaneous multiple field of view digital cameras |
US7795577B2 (en) * | 2004-08-25 | 2010-09-14 | Richard Ian Olsen | Lens frame and optical focus assembly for imager module |
US8124929B2 (en) | 2004-08-25 | 2012-02-28 | Protarius Filo Ag, L.L.C. | Imager module optical focus and assembly method |
WO2006026354A2 (en) | 2004-08-25 | 2006-03-09 | Newport Imaging Corporation | Apparatus for multiple camera devices and method of operating same |
US7564019B2 (en) | 2005-08-25 | 2009-07-21 | Richard Ian Olsen | Large dynamic range cameras |
JP4277216B2 (ja) * | 2005-01-13 | 2009-06-10 | ソニー株式会社 | 撮像装置及び撮像結果の処理方法 |
JP4538337B2 (ja) * | 2005-02-15 | 2010-09-08 | 富士フイルム株式会社 | 固体撮像素子 |
US20060186315A1 (en) * | 2005-02-22 | 2006-08-24 | Kany-Bok Lee | Active pixel image sensors |
TW201101476A (en) | 2005-06-02 | 2011-01-01 | Sony Corp | Semiconductor image sensor module and method of manufacturing the same |
US20070102622A1 (en) * | 2005-07-01 | 2007-05-10 | Olsen Richard I | Apparatus for multiple camera devices and method of operating same |
US7268334B2 (en) * | 2005-08-03 | 2007-09-11 | Lite-On Semiconductor Corp. | Image sensor device and a method for outputting digital signals |
US7566855B2 (en) * | 2005-08-25 | 2009-07-28 | Richard Ian Olsen | Digital camera with integrated infrared (IR) response |
US7964835B2 (en) | 2005-08-25 | 2011-06-21 | Protarius Filo Ag, L.L.C. | Digital cameras with direct luminance and chrominance detection |
US20070258006A1 (en) * | 2005-08-25 | 2007-11-08 | Olsen Richard I | Solid state camera optics frame and assembly |
JP2007103401A (ja) * | 2005-09-30 | 2007-04-19 | Matsushita Electric Ind Co Ltd | 撮像装置及び画像処理装置 |
US7361989B1 (en) | 2006-09-26 | 2008-04-22 | International Business Machines Corporation | Stacked imager package |
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- 2003-09-30 US US10/676,136 patent/US7164113B2/en active Active
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Also Published As
Publication number | Publication date |
---|---|
TW200405726A (en) | 2004-04-01 |
US7164113B2 (en) | 2007-01-16 |
CN1234234C (zh) | 2005-12-28 |
TWI279132B (en) | 2007-04-11 |
US20040095495A1 (en) | 2004-05-20 |
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