CN1468162A - 包括填充的半透明区域的抛光垫 - Google Patents

包括填充的半透明区域的抛光垫 Download PDF

Info

Publication number
CN1468162A
CN1468162A CNA018169481A CN01816948A CN1468162A CN 1468162 A CN1468162 A CN 1468162A CN A018169481 A CNA018169481 A CN A018169481A CN 01816948 A CN01816948 A CN 01816948A CN 1468162 A CN1468162 A CN 1468162A
Authority
CN
China
Prior art keywords
polishing pad
filler
matrix polymer
translucent
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA018169481A
Other languages
English (en)
Chinese (zh)
Inventor
J������Ŧ��
凯利·J·纽厄尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cabot Corp
Original Assignee
Cabot Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Corp filed Critical Cabot Corp
Publication of CN1468162A publication Critical patent/CN1468162A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
CNA018169481A 2000-10-06 2001-09-20 包括填充的半透明区域的抛光垫 Pending CN1468162A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23886200P 2000-10-06 2000-10-06
US60/238,862 2000-10-06

Publications (1)

Publication Number Publication Date
CN1468162A true CN1468162A (zh) 2004-01-14

Family

ID=22899630

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA018169481A Pending CN1468162A (zh) 2000-10-06 2001-09-20 包括填充的半透明区域的抛光垫

Country Status (7)

Country Link
US (1) US6537134B2 (enExample)
EP (1) EP1324858A1 (enExample)
JP (1) JP2004511108A (enExample)
CN (1) CN1468162A (enExample)
AU (1) AU2001291143A1 (enExample)
TW (1) TW531467B (enExample)
WO (1) WO2002030617A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100493847C (zh) * 2004-03-25 2009-06-03 卡伯特微电子公司 包含疏水区及终点检测口的抛光垫
CN100562402C (zh) * 2004-03-23 2009-11-25 卡伯特微电子公司 低表面能的化学机械抛光垫
CN1934208B (zh) * 2004-03-23 2011-08-10 卡伯特微电子公司 具有成分填充孔的多孔化学机械抛光垫
CN107685281A (zh) * 2016-08-04 2018-02-13 罗门哈斯电子材料Cmp控股股份有限公司 多孔性抛光垫的锥形化方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
WO2002070200A1 (en) * 2001-03-01 2002-09-12 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US6702866B2 (en) * 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US6960120B2 (en) * 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US20060199473A1 (en) * 2003-04-03 2006-09-07 Masao Suzuki Polishing pad, process for producing the same and method of polishing therewith
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US7764377B2 (en) * 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
TW200720017A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat Water-based polishing pads having improved adhesion properties and methods of manufacture
US20070294090A1 (en) * 2006-06-20 2007-12-20 Xerox Corporation Automated repair analysis using a bundled rule-based system
DE112010004350T5 (de) 2009-11-11 2012-12-20 Nuvasive, Inc. Chirurgisches zugangssystem und zugehörige verfahren
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2838889A (en) 1953-05-07 1958-06-17 Hans Deckel Device for observing an optical matching action
JPS5624934A (en) 1979-08-08 1981-03-10 Nec Corp Manufacture of semiconductor element
DE3273475D1 (en) 1982-10-14 1986-10-30 Ibm Deutschland Method to measure the thickness of eroded layers at subtractive work treatment processes
US4532738A (en) 1983-12-19 1985-08-06 General Electric Company Method of removing a coating
GB2173300B (en) 1985-04-06 1989-06-28 Schaudt Maschinenbau Gmbh Apparatus for optically monitoring the surface finish of ground workpieces
JPS61270060A (ja) 1985-05-27 1986-11-29 Nec Corp ウエハの研摩方法
GB8715530D0 (en) * 1987-07-02 1987-08-12 Ici Plc Microporous products
JPH0223617A (ja) 1988-07-13 1990-01-25 Mitsubishi Electric Corp 半導体基板ウェハの溝形成方法
US5137540A (en) * 1989-03-07 1992-08-11 United Technologies Corporation Composite monolithic lamp and a method of making the same
US5081796A (en) 1990-08-06 1992-01-21 Micron Technology, Inc. Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer
US5036015A (en) 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5411430A (en) * 1991-09-25 1995-05-02 Hitachi Ltd. Scanning optical device and method for making a hybrid scanning lens used therefor
US5240552A (en) 1991-12-11 1993-08-31 Micron Technology, Inc. Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection
US5196353A (en) 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
JP2770101B2 (ja) 1992-05-08 1998-06-25 コマツ電子金属株式会社 貼り合わせウェーハの研磨方法
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5499733A (en) 1992-09-17 1996-03-19 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US6614529B1 (en) 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5433650A (en) 1993-05-03 1995-07-18 Motorola, Inc. Method for polishing a substrate
US5337015A (en) 1993-06-14 1994-08-09 International Business Machines Corporation In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage
JP3326443B2 (ja) 1993-08-10 2002-09-24 株式会社ニコン ウエハ研磨方法及びその装置
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5486129A (en) 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
US5616650A (en) * 1993-11-05 1997-04-01 Lanxide Technology Company, Lp Metal-nitrogen polymer compositions comprising organic electrophiles
US5375064A (en) 1993-12-02 1994-12-20 Hughes Aircraft Company Method and apparatus for moving a material removal tool with low tool accelerations
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5413941A (en) 1994-01-06 1995-05-09 Micron Technology, Inc. Optical end point detection methods in semiconductor planarizing polishing processes
JP3270282B2 (ja) 1994-02-21 2002-04-02 株式会社東芝 半導体製造装置及び半導体装置の製造方法
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JP3313505B2 (ja) 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US6017265A (en) 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
JPH08174411A (ja) 1994-12-22 1996-07-09 Ebara Corp ポリッシング装置
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US5533923A (en) 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US5838447A (en) 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6010538A (en) * 1996-01-11 2000-01-04 Luxtron Corporation In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
US6074287A (en) 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
US5872633A (en) 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
US6022268A (en) 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
DE19720623C1 (de) 1997-05-16 1998-11-05 Siemens Ag Poliervorrichtung und Poliertuch
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US5985679A (en) 1997-06-12 1999-11-16 Lsi Logic Corporation Automated endpoint detection system during chemical-mechanical polishing
US6159073A (en) 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6190234B1 (en) 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6071177A (en) 1999-03-30 2000-06-06 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for determining end point in a polishing process
US6213845B1 (en) 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6146242A (en) 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
US6224460B1 (en) 1999-06-30 2001-05-01 Vlsi Technology, Inc. Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process
US6171181B1 (en) 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US6337101B1 (en) * 1999-11-23 2002-01-08 Valence Technology (Nevada), Inc. Method of treating separator for use in electrochemical cell devices

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100562402C (zh) * 2004-03-23 2009-11-25 卡伯特微电子公司 低表面能的化学机械抛光垫
CN1934208B (zh) * 2004-03-23 2011-08-10 卡伯特微电子公司 具有成分填充孔的多孔化学机械抛光垫
CN100493847C (zh) * 2004-03-25 2009-06-03 卡伯特微电子公司 包含疏水区及终点检测口的抛光垫
CN107685281A (zh) * 2016-08-04 2018-02-13 罗门哈斯电子材料Cmp控股股份有限公司 多孔性抛光垫的锥形化方法
CN107685281B (zh) * 2016-08-04 2019-06-04 罗门哈斯电子材料Cmp控股股份有限公司 多孔性抛光垫的锥形化方法

Also Published As

Publication number Publication date
TW531467B (en) 2003-05-11
AU2001291143A1 (en) 2002-04-22
EP1324858A1 (en) 2003-07-09
JP2004511108A (ja) 2004-04-08
WO2002030617A1 (en) 2002-04-18
US6537134B2 (en) 2003-03-25
US20020049033A1 (en) 2002-04-25

Similar Documents

Publication Publication Date Title
CN1468162A (zh) 包括填充的半透明区域的抛光垫
US6840843B2 (en) Method for manufacturing a polishing pad having a compressed translucent region
JP5986268B2 (ja) 化学機械的研磨のための透明な多孔性材料
JP5090732B2 (ja) Ｃｍｐ用多層研磨パッド材料
KR101195276B1 (ko) 소수성 영역 및 종말점 검출구를 포함하는 연마 패드
JP2007506280A (ja) 引っ込んだ窓を有する研磨パッド
TWI311512B (en) Multi-layer polishing pad material for cmp
JP2003535484A (ja) 化学機械研磨（ｃｍｐ）ツールで用いる研磨パッドの窓
DE60201515T2 (de) Polierscheibe mit endpunkterfassungsöffnung
JP2007531276A (ja) 成分を満たした複数の孔を有するｃｍｐ多孔質パッド
US7273407B2 (en) Transparent polishing pad
JP2008546550A (ja) Ｃｍｐのための透過性微細多孔質材料
WO1993001914A1 (en) Superpolishing agent, process for polishing hard materials, and polished hard materials
TW200422141A (en) CMP pad with composite transparent window
TW200424035A (en) CMP pad with composite transparent window
JP4542647B2 (ja) 研磨パッド
JP2003285259A (ja) 研磨パッド、研磨装置及び半導体デバイスの製造方法
JP2003285257A (ja) 研磨パッド、研磨装置および半導体の製造方法
JP2003285258A (ja) 研磨パッド、研磨装置および半導体デバイスの製造方法
JP2019047022A (ja) 機能性チップを備える基板を研磨する方法
Li et al. Colloidal photonic crystal mirrors for high-resolving-power Fabry-Perots
KR20070021929A (ko) 투명한 연마 패드
Pipat Study on Variable Rotation Polishing Method in Chemical Mechanical Polishing

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication