CN1461579A - 一种加热系统 - Google Patents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/683—Plates having their feeding circuit closed as the kettles, pans or the like are put on
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
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Abstract
公开了一种加热系统，至少包括基体和电阻层。电阻层包括充填了导电材料的热稳定树脂，另外还公开了一种制造这种加热系统的方法，至少包括步骤：提供陶瓷基体，和施加电阻层到所述基体。所述方法中的电阻层包括充填了导电材料的热稳定树脂。在施加电阻层步骤之前，将粘结促进剂施加到陶瓷基体上。
Description
本发明涉及一种加热系统，至少包括陶瓷基体和电阻层。
陶瓷基体上设置了电阻层的厚膜加热元件已为人熟悉。所述厚膜加热元件例如可用于家用开水壶。制造该元件通过喷涂玻璃料溶液到钢基体上，然后在大约900℃的温度下涂以瓷釉。然后导电迹线通过丝网印刷银/钯和玻璃颗粒的混合物形成。再次进行涂瓷釉步骤以便将两个材料烧结到一起时迹线和涂瓷釉基体之间可实现适当的连接。
国际申请WO96/17496涉及到一种制造陶瓷厚膜电阻加热元件的方法。所形成的层包括瓷釉。发热层通常是银/玻璃混合物，或银/钯/玻璃混合物，这些混合物烧结到涂瓷釉基体上。
使用银/钯迹线的重要缺点是所述材料的高价格，并且价格也变动很大。
因此，本发明的目的是提供一种平板式加热系统，其包括能够以低成本制作的陶瓷基体和电阻层，并可以提供与已知加热系统相比类似的或更好的效果。
为此目的，本发明提供了一种根据前言所述的加热系统。其特征在于，电阻层包括填充了导电材料的热稳定树脂。
使用热稳定树脂和导电材料混合物是为了形成发热迹线电阻层，具有良好性能的电阻层可以低价格进行制造。
热稳定树脂最好包括一种或多种从由聚酰亚胺、聚醚酰亚胺、聚苯醚砜、芬芳聚酰胺和硅树脂组成的一组材料中选出的材料。
在优选实施例中，热稳定树脂包括聚酰亚胺。
导电材料最好包括一种或多种从由碳、石墨、银、镍和镀银镍组成的一组材料中选出的材料。
在优选实施例中，导电材料包括碳。
尤其是，陶瓷基体包括玻璃基体。
通过在玻璃上施加电阻层或加热迹线，得到了简单的加热系统。所述系统的重要的优点是低能量密度和较低温度，这可防止咖啡过热。
在另一个优选的实施例中，陶瓷基体还包括设置了瓷釉层的钢基体。
加热系统的示例有用于家用开水壶的加热元件。
电阻层最好粘结到陶瓷基体上，粘结促进剂置于基体和电阻层之间。
所述粘结促进剂用于帮助聚酰亚胺粘结到陶瓷基体上。
粘结促进剂最好包括氨基硅烷和γ-氨丙基三甲氧基硅烷。
瓷釉和玻璃这样的材料的表面性质主要取决于这些材料中的硅石的质量。为了提高所述表面的粘结水平，氨基硅烷用作基体和电阻层之间的中间层，所述氨基硅烷用作促进化学键形成的介质。
本发明还涉及包括至少一个根据本发明的加热系统的电器装置。
尽管根据本发明的加热系统可以用于不同类型的家用电器装置，其特别适用于水壶、咖啡机、和泡茶机。加热件的形式可以是平板式加热元件或管式加热元件。
本发明还设涉及一种制造本发明的加热系统的方法，，所述方法至少包括步骤：
提供陶瓷基体；
施加电阻层到所述基体；
该方法的特征在于，电阻层包括充填了导电材料的热稳定树脂。
为了促进聚酰亚胺层和陶瓷基体之间的粘结，在施加电阻层步骤之前，将粘结促进剂施加到陶瓷基体上。所述粘结促进剂最好包括氨基硅烷。最好是γ-氨丙基三甲氧基硅烷。
通过参考下面的实施例来进一步说明本发明。水壶的加热系统的制备
水壶的加热系统通过下列程序进行制备。首先在钢基体上设置瓷釉绝缘层。瓷釉层含有较多的硅石。将聚酰亚胺粘结到覆盖了羟基的硅石表面时粘结强度不够，聚酰亚胺的粘结程度需要提高。这通过用粘结促进剂来改善硅石表面就可以实现，特别是使用氨基硅烷。
为了施加这种粘结促进剂，瓷釉层的硅石表面首先进行清洗。根据本示例，所述清洗程序包括步骤：
用95％异丙醇(IPA)清洗硅石表面，所用异丙醇是Merck-2Propanol pro analyze；C3H8O；M＝60.1g/mol.；b.p.82.4℃；然后在85℃进行空气干燥10分钟。
接下来，粘结促进剂γ-氨丙基三甲氧基硅烷(APS)旋涂到用IPA清洁的硅石层。为了这个目的，使用2％γ-氨丙基三甲氧基硅烷的水溶液。在室温下干燥后，非常薄的γ-氨丙基三甲氧基硅烷层覆盖到瓷釉的表面。
在硅胶表面γ-氨丙基三甲氧基硅烷液体与Si-OH基团反应形成氨丙基衍生物。产生的表面非常‘粘’，可促进聚酰亚胺薄膜粘结到硅胶表面。这种材料只需施加很少的单层就可以得到改进的粘结性。
在施加粘结促进剂后，聚酰胺酸/碳(PAA/C)的糊状物利用丝网印刷技术进行施加。由于碳具有较低的导电性(0.1-0.01欧姆·cm)，需要施加短而宽的迹线。这使得迹线的设计非常容易。在80℃温度下干燥10分钟后，另一种聚酰胺酸/银(PAA/Ag)接触层进行丝网印刷。这些层再次在80℃温度下干燥10分钟，其后是最终固化步骤，需要在375℃进行固化30分钟。在所述最终步骤，聚酰胺酸(PAA)转化成为聚酰亚胺。
在上面的示例中，对制造水壶加热系统的方法加以了说明。然而，根据本发明的加热系统可以类似地应用到其他类型的加热元件中，比如管状加热器。还有，加热系统可以置于咖啡机的玻璃罐上，聚酰亚胺/碳加热迹线直接接触所述玻璃罐。
Claims (15)
1.一种加热系统，至少包括基体和电阻层，其特征在于，所述电阻层包括充填了导电材料的热稳定树脂。
2.根据权利要求1所述的加热系统，其特征在于，所述热稳定树脂包括一种或多种从由聚酰亚胺、聚醚酰亚胺、聚苯醚砜、芬芳聚酰胺和硅树脂组成的一组材料中选出的材料。
3.根据权利要求1或2所述的加热系统，其特征在于，所述热稳定树脂包括聚酰亚胺。
4.根据权利要求1所述的加热系统，其特征在于，所述导电材料包括一种或多种从由碳、石墨、银、镍和镀银镍组成的一组材料中选出的材料。
5.根据权利要求1所述的加热系统，其特征在于，所述陶瓷基体还包括玻璃基体。
6.根据权利要求1所述的加热系统，其特征在于，所述陶瓷基体还包括设置了瓷釉层的钢基体。
7.根据前面权利要求中任一项所述的加热系统，其特征在于，所述电阻层粘结到所述基体，所述粘结促进剂设置在所述基体和所述电阻层之间。
8.根据权利要求7所述的加热系统，其特征在于，所述粘结促进剂包括氨基硅烷。
9.根据权利要求7所述的加热系统，其特征在于，所述粘结促进剂包括γ-氨丙基三甲氧基硅烷。
10.一种电器装置至少包括权利要求1到9中任一项所述的加热系统。
11.根据权利要求10所述的电器装置，其特征在于，所述装置包括咖啡机或开水壶。
12.一种制造权利要求1到9中任一项所述加热系统的方法，至少包括步骤：
提供陶瓷基体；
施加电阻层到所述基体；
其特征在于，所述电阻层包括充填了导电材料的聚酰亚胺，所述导电材料至少包括碳。
13.根据权利要求12所述的方法，其特征在于，在施加电阻层步骤之前，将粘结促进剂施加到所述陶瓷基体上。
14.根据权利要求13所述的方法，其特征在于，所述粘结促进剂包括氨基硅烷。
15.根据权利要求13所述的方法，其特征在于，所述粘结促进剂包括γ-氨丙基三甲氧基硅烷。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP01201400.7 | 2001-04-17 | ||
| EP01201400 | 2001-04-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1461579A true CN1461579A (zh) | 2003-12-10 |
| CN1295942C CN1295942C (zh) | 2007-01-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028012496A Expired - Fee Related CN1295942C (zh) | 2001-04-17 | 2002-04-09 | 一种加热系统和其制造方法 |
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| Country | Link |
|---|---|
| US (1) | US7041378B2 (zh) |
| EP (1) | EP1382225B1 (zh) |
| JP (1) | JP4094960B2 (zh) |
| CN (1) | CN1295942C (zh) |
| AT (1) | ATE308868T1 (zh) |
| DE (1) | DE60207063T2 (zh) |
| WO (1) | WO2002085071A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102781662A (zh) * | 2010-03-19 | 2012-11-14 | E·I·内穆尔杜邦公司 | 基于膜的加热装置及其相关方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009075838A2 (en) * | 2007-12-10 | 2009-06-18 | Meditrina Pharmaceuticals, Inc. | Treatment of menorrhagia with aromatase inhibitor |
| CN109417834B (zh) * | 2016-07-22 | 2022-04-12 | E.I.内穆尔杜邦公司 | 薄膜加热装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3359525A (en) * | 1964-10-14 | 1967-12-19 | Du Pont | Electric heating element |
| GB1416591A (en) * | 1973-02-06 | 1975-12-03 | Donetsu Kogyo Kk | Production of electrothermic heat-generating structures |
| DE2306250A1 (de) * | 1973-02-08 | 1974-08-15 | Donetsu Kogyo K K | Verfahren zur herstellung eines elektrischen heizelements |
| JPS60124652A (ja) * | 1983-12-09 | 1985-07-03 | Toshiba Silicone Co Ltd | プライマ−組成物 |
| CN1019244B (zh) * | 1988-08-13 | 1992-11-25 | 西安市光电仪器厂 | 低温电热材料 |
| US5181006A (en) * | 1988-09-20 | 1993-01-19 | Raychem Corporation | Method of making an electrical device comprising a conductive polymer composition |
| US5198639A (en) * | 1990-11-08 | 1993-03-30 | Smuckler Jack H | Self-regulating heated mirror and method of forming same |
| JPH06118829A (ja) * | 1992-10-02 | 1994-04-28 | Fuji Xerox Co Ltd | 局所発熱デバイス及びこれを搭載した装置 |
| GB9423901D0 (en) | 1994-11-26 | 1995-01-11 | Pifco Ltd | Improvements to thick film elements |
| US5501881A (en) * | 1994-12-01 | 1996-03-26 | Xerox Corporation | Coated fuser member processes |
| US6086791A (en) * | 1998-09-14 | 2000-07-11 | Progressive Coatings, Inc. | Electrically conductive exothermic coatings |
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2002
- 2002-04-09 WO PCT/IB2002/001298 patent/WO2002085071A1/en active IP Right Grant
- 2002-04-09 CN CNB028012496A patent/CN1295942C/zh not_active Expired - Fee Related
- 2002-04-09 DE DE60207063T patent/DE60207063T2/de not_active Expired - Fee Related
- 2002-04-09 AT AT02720388T patent/ATE308868T1/de not_active IP Right Cessation
- 2002-04-09 EP EP02720388A patent/EP1382225B1/en not_active Expired - Lifetime
- 2002-04-09 JP JP2002582664A patent/JP4094960B2/ja not_active Expired - Fee Related
- 2002-04-15 US US10/122,741 patent/US7041378B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102781662A (zh) * | 2010-03-19 | 2012-11-14 | E·I·内穆尔杜邦公司 | 基于膜的加热装置及其相关方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002085071A1 (en) | 2002-10-24 |
| JP4094960B2 (ja) | 2008-06-04 |
| US20020158059A1 (en) | 2002-10-31 |
| DE60207063D1 (de) | 2005-12-08 |
| CN1295942C (zh) | 2007-01-17 |
| EP1382225A1 (en) | 2004-01-21 |
| EP1382225B1 (en) | 2005-11-02 |
| US7041378B2 (en) | 2006-05-09 |
| JP2004519831A (ja) | 2004-07-02 |
| DE60207063T2 (de) | 2006-08-03 |
| ATE308868T1 (de) | 2005-11-15 |
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