CN1460572A - 一种无铅焊料 - Google Patents

一种无铅焊料 Download PDF

Info

Publication number
CN1460572A
CN1460572A CN 03126796 CN03126796A CN1460572A CN 1460572 A CN1460572 A CN 1460572A CN 03126796 CN03126796 CN 03126796 CN 03126796 A CN03126796 A CN 03126796A CN 1460572 A CN1460572 A CN 1460572A
Authority
CN
China
Prior art keywords
solder
scolder
fusing point
alloy
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 03126796
Other languages
English (en)
Other versions
CN1201896C (zh
Inventor
蔡烈松
谷兆彭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Super Copper Electronic Material Co ltd
Original Assignee
TETONG ELECTRONIC MATERIAL CO Ltd GUANGZHOU CITY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TETONG ELECTRONIC MATERIAL CO Ltd GUANGZHOU CITY filed Critical TETONG ELECTRONIC MATERIAL CO Ltd GUANGZHOU CITY
Priority to CN 03126796 priority Critical patent/CN1201896C/zh
Publication of CN1460572A publication Critical patent/CN1460572A/zh
Application granted granted Critical
Publication of CN1201896C publication Critical patent/CN1201896C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明公开了一种无铅焊料，含有重量比为0.05～1.2％的Ag，0.5～10％的Bi，0.01～1.5％的Cu，0.0001～0.0009％的P，0.002～0.8％的RE，其余为Sn。本发明的无铅焊料具有熔点低、抗氧化性能及可焊性能优良的特点，并具有明显的经济效益，适用于插件波峰焊、浸焊以及回流焊。

Description

一种无铅焊料
技术领域
本发明涉及一种焊接材料，尤其涉及一种以Sn为基体的无铅焊料合金。
背景技术
目前普遍使用的几种无铅焊料合金，如Sn-3.5wt％Ag、Sn-3.5(4.8)wt％Ag-0.7wt％Cu、Sn-0.7wt％Cu，其熔点分别为221℃、217～218℃、227℃，以致插件波峰焊或回流焊时的焊接工艺温度必须提高到250～270℃。由于焊接温度过高，使得目前所用的电子元件及线路板材料在焊接过程中会发生损坏和变形，同时在波峰焊和浸焊过程中必然会产生大量的锡渣，从而影响了焊点的质量，并增加了锡的损耗。此外，在无铅焊料合金的原料中Ag的价格最高，因此Ag的含量直接影响焊料的成本，当Ag的含量达到3～4wt％时焊料的价格则非常昂贵。对于Sn-0.7wt％Cu焊料合金，除熔点高外，还存在焊接性尚差的缺点。
发明内容
本发明的目的在于提供一种熔点低、抗氧化性能和可焊性能优良、材料成本低的无铅焊料。
本发明通过以下技术方案予以实现：本发明提供的一种无铅焊料，含有重量比为0.05～1.2％的Ag，0.5～10％的Bi，0.01～1.5％的Cu，0.0001～0.0009％的P，0.002～0.8％的RE，其余为Sn。
本发明提供的无铅焊料中，添加0.05～1.2％(wt％，下同)Ag能够保持焊料优良的可焊性能，而且大大降低了焊料的材料成本。在无铅焊料合金的原料中，Ag的价格最高，当Ag的含量从4％降低到1％时，原料的成本将呈几倍减少，具有明显的经济效益。
Bi元素在焊料中具有降低熔点的作用，但如果Bi的含量偏高，会出现片状粗大Bi相，造成焊料脆性和抗疲劳性能变差；当Bi含量超过20％时，则会出现焊料中不允许存在的熔点为139℃的低熔共晶组织。为此，本发明提供的无铅焊料中Bi的含量控制在0.5～10％，目的在于获得较低焊料熔点的同时避免出现低熔共晶组织。另外，通过添加微量的RE以防止焊料合金片状粗大Bi相的产生，并使得焊料晶粒组织细化，以提高焊料合金的塑性。
加入0.01～1.5％Cu元素能够抑制焊接过程中的熔Cu现象，可提高焊点的机械性能，尤其是抗疲劳性能，从而强化了焊料合金。
添加极微量的P可以使液态焊锡在焊接过程中有极好的抗氧化作用。由于P在液态焊锡过程中分布在液面上，使得P与Sn、O2等元素作用生成一层很薄又十分致密的含氧酸盐保护膜。该保护膜可阻碍O2对焊料的氧化，使焊锡在焊接过程中处于新鲜状态，从而确保了焊点的质量，并能够防止大量锡渣的产生，降低了锡的损耗。
通过采取上述技术方案，本发明具有以下有益效果：
(1)由于焊料合金熔点低，因此焊接过程中可采用偏低的工艺温度，与目前使用Sn-Pb焊料的电子元件及材料具有兼容性；
(2)焊料具有良好的抗氧化性能，焊接过程可不用N2气保护，而且降低了锡渣的损耗；
(3)RE的加入细化了合金晶粒组织，使焊料具有良好的力学性能和可焊性能；
(4)Ag用量减少，降低了原材料成本，经济效益显著。
下面结合实施例对本发明作进一步的描述。
具体实施方式
本发明的无铅焊料采用以Sn为基体无铅焊料的常规生产方法进行制备。为确保加入量的精确度，RE和P均采用中间合金法加入，即制备Sn-2～5％RE中间合金和Sn-1～3％P中间合金。
实施例1
Sn 93.45％、Ag 1％、Bi 5％、Cu 0.5％、P 0.0008％、RE 0.05％。
实施例2
Sn 91.8％、Ag 0.8％、Bi 7％、Cu 0.3％、P 0.0005％、RE 0.1％。
实施例3
Sn 92.12％、Ag 1.1％、Bi 6％、Cu 0.7％、P 0.0007％、RE 0.08％。
实施例4
Sn 95.25％、Ag 0.9％、Bi 3％、Cu 0.8％、P 0.0008％、RE 0.05％。
比较例1
Sn 93.5％、Ag 1％、Bi 5％、Cu 0.5％。
比较例2
Sn 95.8％、Ag 3.5％、Cu 0.7％。
表1为本发明实施例1与现有技术比较例1的试验比较数据；
表2为本发明实施例1与现有技术比较例2的试验比较数据。
          表1本发明实施例1与现有技术比较例1的熔点及延伸率比较
                        成分(wt％) 熔点(℃) 延伸率(％)
    Sn     Ag     Bi     Cu   P     RE
实施例1     93.45     1     5     0.5   0.0008     0.05   210～213   14
比较例1     93.5     1     5     0.5   210～213   8.5
                   表2本发明实施例1与现有技术比较例2的抗氧化效果比较
                   成分(wt％)   试验温度(℃)            波峰*3小时
Sn Ag Bi Cu P RE     渣量(g/14kg焊料) 渣样
实施例1  93.45   1   5   0.5   0.0008   0.05 250     45 黑粉状
比较例2  95.8   3.5   0.7     240 豆腐状
实施例1  93.45   1   5   0.5   0.0008   0.05 350     120 黑粉状
比较例2  95.8   3.5   0.7     510 豆腐状
*试验波峰机
试验结果表明，本发明的低熔点抗氧化无铅焊料具有熔点低、抗氧化性能及可焊性能优良的特点，并具有明显的经济效益。

Claims (1)

1.一种无铅焊料，其特征是含有重量比为0.05～1.2％的Ag，0.5～10％的Bi，0.01～1.5％的Cu，0.0001～0.0009％的P，0.002～0.8％的RE，其余为Sn。
CN 03126796 2003-06-09 2003-06-09 一种无铅焊料 Expired - Lifetime CN1201896C (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03126796 CN1201896C (zh) 2003-06-09 2003-06-09 一种无铅焊料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03126796 CN1201896C (zh) 2003-06-09 2003-06-09 一种无铅焊料

Publications (2)

Publication Number Publication Date
CN1460572A true CN1460572A (zh) 2003-12-10
CN1201896C CN1201896C (zh) 2005-05-18

Family

ID=29591096

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03126796 Expired - Lifetime CN1201896C (zh) 2003-06-09 2003-06-09 一种无铅焊料

Country Status (1)

Country Link
CN (1) CN1201896C (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2275224A1 (en) * 2008-04-23 2011-01-19 Senju Metal Industry Co., Ltd Lead-free solder alloy suppressed in occurrence of shrinkage cavity
CN105345305A (zh) * 2015-10-28 2016-02-24 仲恺农业工程学院 一种Sn-Ag-Cu-Tc低银无铅钎料
CN106808110A (zh) * 2015-11-30 2017-06-09 千住金属工业株式会社 软钎料合金

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2275224A1 (en) * 2008-04-23 2011-01-19 Senju Metal Industry Co., Ltd Lead-free solder alloy suppressed in occurrence of shrinkage cavity
CN102066043A (zh) * 2008-04-23 2011-05-18 千住金属工业株式会社 抑制缩孔的无铅焊料合金
EP2275224A4 (en) * 2008-04-23 2011-11-09 Senju Metal Industry Co LEAD-FREE LOT ALLOY WITH REDUCED PRESENCE OF SCRATCHING LUNKERS
CN102066043B (zh) * 2008-04-23 2014-05-07 千住金属工业株式会社 抑制缩孔的无铅焊料合金
US9227258B2 (en) 2008-04-23 2016-01-05 Senju Metal Industry Co., Ltd. Lead-free solder alloy having reduced shrinkage cavities
CN105345305A (zh) * 2015-10-28 2016-02-24 仲恺农业工程学院 一种Sn-Ag-Cu-Tc低银无铅钎料
CN106808110A (zh) * 2015-11-30 2017-06-09 千住金属工业株式会社 软钎料合金
US10213879B2 (en) 2015-11-30 2019-02-26 Senju Metal Industry Co., Ltd. Solder alloy

Also Published As

Publication number Publication date
CN1201896C (zh) 2005-05-18

Similar Documents

Publication Publication Date Title
CN1175956C (zh) 锡锌基含稀土元素的无铅钎料合金
CN100534699C (zh) 无铅焊料合金
CN102699563A (zh) 一种低银无铅软钎料
CN103008919A (zh) 一种低银无卤无铅焊锡膏
CN115041864A (zh) 一种高可靠性低温无铅焊料及制备方法
CN113714677A (zh) 一种可实现CSP器件高强度互连的Sn基钎料
CN1269613C (zh) 一种改进型Sn－0.7wt%Cu无铅焊料
CN1201896C (zh) 一种无铅焊料
CN101486133A (zh) 用于铝软钎焊的无铅焊料
CN1654159A (zh) 无铅钎料活性合金添加剂及无铅合金钎料
CN1203960C (zh) 具有抗氧化能力的无铅焊料
CN106001991A (zh) 一种含铟的低银多元钎料及其制备方法
CN1238153C (zh) 抗氧化无铅焊料
CN1730696A (zh) 锡锌铜镍无铅钎料合金
CN1242869C (zh) 无铅焊料
CN1313631C (zh) 一种锡银铜镍铝系无铅焊料合金
CN101417374B (zh) 一种无铅焊料减渣方法
CN101239424A (zh) 低银无铅钎料及其制备方法
CN1239290C (zh) 波峰焊用无铅软钎焊料合金
CN101879667A (zh) 通用型低银无铅电子钎料
CN1562553A (zh) 锡锌铜无铅焊料
CN1803376A (zh) 无铅软钎焊料
CN1974110A (zh) 一种多元无铅焊锡
CN1317101C (zh) 一种抗氧化的锡银共晶无铅焊料
CN1974109A (zh) 一种波峰焊用稀土无铅焊料合金

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: GUANGZHOU TETONG ELECTRONIC MATERIAL CO., LTD.

Free format text: FORMER NAME: TETONG ELECTRONIC MATERIAL CO., LTD., GUANGZHOU CITY

CP03 Change of name, title or address

Address after: 510663, science and Technology Industrial Development Zone, Guangzhou, Guangdong Province, No. two, No. 58, Cloud Road, South City, Guangzhou

Patentee after: Guangzhou super copper electronic material Co.,Ltd.

Address before: Lingshan Road, Guangdong Industrial Park, 510660 Eton city of Guangzhou province Dongpu Pearl Village building three

Patentee before: TETONG ELECTRONIC MATERIAL Co.

PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Lead free solder alloy and its preparation method

Effective date of registration: 20150215

Granted publication date: 20050518

Pledgee: China Minsheng Banking Corp Guangzhou branch

Pledgor: Guangzhou super copper electronic material Co.,Ltd.

Registration number: 2015440000003

C56 Change in the name or address of the patentee
CP02 Change in the address of a patent holder

Address after: 510663, Guangzhou hi tech Industrial Development Zone, Guangzhou, Guangdong Province, science, South Road, No. five, No. 11, R & D center, 302

Patentee after: Guangzhou super copper electronic material Co.,Ltd.

Address before: 510663, science and Technology Industrial Development Zone, Guangzhou, Guangdong Province, No. two, No. 58, Cloud Road, South City, Guangzhou

Patentee before: Guangzhou super copper electronic material Co.,Ltd.

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160918

Address after: 510000, science and Technology Industrial Development Zone, Guangdong, Guangzhou Province, science, South Road, No. two, cloud 58

Patentee after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd.

Address before: 510663, Guangzhou hi tech Industrial Development Zone, Guangzhou, Guangdong Province, science, South Road, No. five, No. 11, R & D center, 302

Patentee before: Guangzhou super copper electronic material Co.,Ltd.

PC01 Cancellation of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20170607

Granted publication date: 20050518

Pledgee: China Minsheng Banking Corp Guangzhou branch

Pledgor: Guangzhou super copper electronic material Co.,Ltd.

Registration number: 2015440000003

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20170619

Address after: 510000, Guangdong hi tech Industrial Development Zone, Guangzhou Province, science, South Road, cloud five, No. 11 R & D center 302

Patentee after: Guangzhou super copper electronic material Co.,Ltd.

Address before: 510000, science and Technology Industrial Development Zone, Guangdong, Guangzhou Province, science, South Road, No. two, cloud 58

Patentee before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd.

PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Lead free solder alloy and its preparation method

Effective date of registration: 20170621

Granted publication date: 20050518

Pledgee: China Minsheng Banking Corp Guangzhou branch

Pledgor: Chen Minghan|Guangzhou super copper electronic material Co.,Ltd.|GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd.

Registration number: 2017440000035

PC01 Cancellation of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20200429

Granted publication date: 20050518

Pledgee: China Minsheng Banking Corp Guangzhou branch

Pledgor: Guangzhou super copper electronic material Co.,Ltd.

Registration number: 2017440000035

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20050518