CN1269613C - 一种改进型Sn－0.7wt%Cu无铅焊料 - Google Patents

一种改进型Sn－0.7wt%Cu无铅焊料 Download PDF

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CN1269613C
CN1269613C CN 200410051200 CN200410051200A CN1269613C CN 1269613 C CN1269613 C CN 1269613C CN 200410051200 CN200410051200 CN 200410051200 CN 200410051200 A CN200410051200 A CN 200410051200A CN 1269613 C CN1269613 C CN 1269613C
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lead
welding flux
improved
solder
free
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CN1586792A (zh
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蔡烈松
陈明汉
陈湘平
赵跃
吴国仕
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Guangzhou Hanyuan Microelectronic Packaging Material Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C

Abstract

一种改进型Sn-0.7wt%Cu无铅焊料，该焊料是在Sn-0.7wt%Cu无铅焊料中添加0.05wt%的Ti元素及0.05wt%的Li、Na、K、Rb或Cs中的任意一种碱性元素制成。与普通的Sn-0.7wt%Cu无铅焊料相比，本发明具有焊点表面光亮和细腻、焊料合金的扩散率提高、焊料表面抗氧化性优良等特点。

Description

一种改进型Sn-0.7wt％Cu无铅焊料
技术领域
本发明涉及一种Sn-0.7wt％Cu无铅焊料。
背景技术
Sn-0.7wt％Cu焊料熔点为227℃的Sn-Cu共晶。目前，它被人们选择为无铅焊接材料之一。然而就其特性而言，它存在许多的不够理想之处，比如：焊点外观粗糙不光亮，可焊性、扩散率差，液态下易于氧化等，影响了该焊料的进一步应用。
发明内容
本发明的目的在于克服上述普通Sn-0.7wt％Cu无铅焊料的不足而提供一种焊点表面光亮和细腻、焊料合金的扩散率高、焊料表面抗氧化性优良的改进型Sn-0.7wt％Cu无铅焊料。
本发明的目的是通过下述技术方案予以实现：一种改进型Sn-0.7wt％Cu无铅焊料，其特征在于在Sn-0.7wt％Cu无铅焊料中添加有0.05wt％的Ti元素。
作为本发明的进一步改进，在添加有0.05wt％的Ti元素的基础上还添加有0.05wt％的Li、Na、K、Rb或Cs中的任意一种碱性元素。
与普通的Sn-0.7wt％Cu无铅焊料相比，本发明具有以下技术效果：
1、加入合适含量的Ti元素后，使焊点表面出现了十分光亮和极其细腻的结晶效果。
2、加入合适含量的Ti元素后，焊料合金的扩散率可提高5％，在该基础上再加入微量碱性元素(以K为例)后，可进一步提高焊料的扩散率达8-10％。
3、加有Ti元素的焊料，在温度240～270℃下，焊料表面有十分优良的抗氧化性，与不加Ti或Ti+碱性元素(以K为例)时相比，Sn-0.7wt％Cu合金的液态表面很快就出现由浅黄变成深棕的大量氧化层。
具体实施方式
本发明的无铅焊料制备时重点在于严格控制Ti及碱性元素(以K为例)的含量，工艺上采用先制备均匀的中间合金，配制Cu-20wt％Ti中间合金(共晶点：约880℃)和Sn-(1～3)wt％K中间合金，两种中间合金制备后，先经成分化学分析，确立Ti、K等的准确含量。按合金实际要求含量加入，合金焊料制备后进行元素Cu、Ti、K的实际含量分析，然后进行各项有关性能测试。
实施例1：Sn-0.7wt％Cu-0.05wt％Ti
实施例2：Sn-0.7wt％Cu-0.05wt％Ti-0.05wt％K
               表1  本发明实施例1、2与比较例性能比较
  成分(wt)％ 熔点℃ 比重g/cm3 抗拉强度MPa 延伸率％ 扩散率％   润湿性To-xFmax 电阻率μΩm
Sn Cu Ti K
实施例1 99.25 0.7 0.05 / ～227 ～7.4 35 24 76   0.3-0.4”60Dyn 0.12850
实施例2 99.20 0.7 0.05 0.05 ～227 ～7.4 38 21 80   0.3”65Dyn 0.12829
比较例 99.30 0.7 / / ～227 ～7.4 35 27 72   0.5”55Dyn 0.12601
                  表2  本发明实施例1、2与比较例抗腐蚀性能比较
  成分(wt)％   腐蚀增重mg/mm2   表面状态
  Sn   Cu   Ti   K
  实施例1   99.25   0.7   0.05   /   0.00054   光泽、结晶细腻
  实施例2   99.20   0.7   0.05   0.05   0.00050   光泽、结晶细腻
  比较例   99.30   0.7   /   /   0.00066   暗灰、无光泽、结晶粗糙
▲：腐蚀介质：NaCl 5wt％+H2O，200h，35℃
试验结果表明：
本发明的无铅焊料Sn-0.7wt％Cu-(0.001～1.5)wt％Ti或Sn-0.7wt％Cu-(0.001～1.5)wt％Ti-(0.0001～0.8)wt％K与普通Sn-0.7wt％Cu焊料合金相比，性能有很大提高。
本发明的Sn-0.7wt％Cu-(0.001～1.5)wt％Ti-(0.0001～0.8)wt％K焊料匹配优良的焊剂，分别可以应用于PCB的热风整平和THT的波峰焊中。

Claims (2)

1、一种改进型Sn-0.7wt％Cu无铅焊料，其特征在于在Sn-0.7wt％Cu无铅焊料中添加有0.05wt％的Ti元素。
2、根据权利要求1所述的一种改进型Sn-0.7wt％Cu无铅焊料，其特征在于还添加有0.05wt％的Li、Na、K、Rb或Cs中的任意一种碱性元素。
CN 200410051200 2004-08-24 2004-08-24 一种改进型Sn－0.7wt%Cu无铅焊料 Active CN1269613C (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN 200410051200 CN1269613C (zh) 2004-08-24 2004-08-24 一种改进型Sn－0.7wt%Cu无铅焊料
PCT/CN2004/001025 WO2006021130A1 (fr) 2004-08-24 2004-09-07 Alliage de soudure sans plomb sn-0,7cu performant

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Application Number Priority Date Filing Date Title
CN 200410051200 CN1269613C (zh) 2004-08-24 2004-08-24 一种改进型Sn－0.7wt%Cu无铅焊料

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CN1269613C true CN1269613C (zh) 2006-08-16

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7749336B2 (en) 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
JP4569423B2 (ja) * 2005-08-31 2010-10-27 株式会社日立製作所 半導体装置の製造方法
US9260768B2 (en) 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
KR100903026B1 (ko) * 2007-04-12 2009-06-16 중앙대학교 산학협력단 솔더링용 무연합금
CN101244492B (zh) * 2008-03-21 2011-05-04 天津市松本环保科技有限公司 一种含有助焊剂的无铅焊料焊锡丝及其助焊剂的制备方法
CN102476251A (zh) * 2010-11-25 2012-05-30 中国科学院金属研究所 一种耐大气腐蚀的Sn-Cu无铅焊料
CN101987402B (zh) * 2010-11-30 2012-09-05 哈尔滨工业大学 使用Cu-Sn-Ti钎料钎焊Ti2AlC陶瓷和铜的方法
CN104353840B (zh) * 2014-11-25 2017-11-03 北京康普锡威科技有限公司 一种led用低成本无铅焊料合金粉末及其制备方法
CN104588911A (zh) * 2014-12-11 2015-05-06 徐国华 一种无铅焊料及其制备方法
CN104588910A (zh) * 2014-12-11 2015-05-06 徐国华 一种含镨铯锌锡的无铅焊料及其制备方法
CN104526180A (zh) * 2014-12-11 2015-04-22 徐国华 一种含铈铷锌的无铅焊料及其制备方法
CN104607817A (zh) * 2014-12-11 2015-05-13 徐国华 一种镧硒铯锌锡合金焊料及其制备方法
CN107309574B (zh) * 2017-06-20 2020-09-01 华北水利水电大学 一种含有石墨烯的高强度银基钎料及其熔炼方法

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JP3363393B2 (ja) * 1998-12-21 2003-01-08 千住金属工業株式会社 鉛フリーはんだ合金
JP2001358458A (ja) * 2000-06-12 2001-12-26 Hitachi Ltd Ｐｂフリーはんだ接続を有する電子機器
JP2002076029A (ja) * 2000-08-25 2002-03-15 Hitachi Ltd ろう材とそれを用いた半導体装置および電子装置
CN1239290C (zh) * 2003-04-11 2006-02-01 深圳市亿铖达工业有限公司 波峰焊用无铅软钎焊料合金

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