CN1586792A - 一种改进型Sn-0.7wt%Cu无铅焊料 - Google Patents
一种改进型Sn-0.7wt%Cu无铅焊料 Download PDFInfo
- Publication number
- CN1586792A CN1586792A CN 200410051200 CN200410051200A CN1586792A CN 1586792 A CN1586792 A CN 1586792A CN 200410051200 CN200410051200 CN 200410051200 CN 200410051200 A CN200410051200 A CN 200410051200A CN 1586792 A CN1586792 A CN 1586792A
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- Prior art keywords
- lead
- welding flux
- improved
- solder
- free
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000003466 welding Methods 0.000 title abstract description 8
- 230000004907 flux Effects 0.000 title abstract description 7
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 8
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 3
- 229910052701 rubidium Inorganic materials 0.000 claims abstract description 3
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 229910052792 caesium Inorganic materials 0.000 abstract 1
- 238000010301 surface-oxidation reaction Methods 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
成分(wt)% | 熔点℃ | 比重g/cm3 | 抗拉强度MPa | 延伸率% | 扩散率% | 润湿性To-xFmax | 电阻率μΩm | ||||
Sn | Cu | Ti | K | ||||||||
实施例1 | 99.25 | 0.7 | 0.05 | / | ~227 | ~7.4 | 35 | 24 | 76 | 0.3-0.4”60Dyn | 0.12850 |
实施例2 | 99.20 | 0.7 | 0.05 | 0.05 | ~227 | ~7.4 | 38 | 21 | 80 | 0.3”65Dyn | 0.12829 |
比较例 | 99.30 | 0.7 | / | / | ~227 | ~7.4 | 35 | 27 | 72 | 0.5”55Dyn | 0.12601 |
成分(wt)% | 腐蚀增重mg/mm2 | 表面状态 | ||||
Sn | Cu | Ti | K | |||
实施例1 | 99.25 | 0.7 | 0.05 | / | 0.00054 | 光泽、结晶细腻 |
实施例2 | 99.20 | 0.7 | 0.05 | 0.05 | 0.00050 | 光泽、结晶细腻 |
比较例 | 99.30 | 0.7 | / | / | 0.00066 | 暗灰、无光泽、结晶粗糙 |
Claims (2)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200410051200 CN1269613C (zh) | 2004-08-24 | 2004-08-24 | 一种改进型Sn-0.7wt%Cu无铅焊料 |
PCT/CN2004/001025 WO2006021130A1 (fr) | 2004-08-24 | 2004-09-07 | Alliage de soudure sans plomb sn-0,7cu performant |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200410051200 CN1269613C (zh) | 2004-08-24 | 2004-08-24 | 一种改进型Sn-0.7wt%Cu无铅焊料 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1586792A true CN1586792A (zh) | 2005-03-02 |
CN1269613C CN1269613C (zh) | 2006-08-16 |
Family
ID=34602394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200410051200 Active CN1269613C (zh) | 2004-08-24 | 2004-08-24 | 一种改进型Sn-0.7wt%Cu无铅焊料 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN1269613C (zh) |
WO (1) | WO2006021130A1 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1977022A2 (en) * | 2005-12-13 | 2008-10-08 | Indium Corporation of America | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
US7749336B2 (en) | 2005-08-30 | 2010-07-06 | Indium Corporation Of America | Technique for increasing the compliance of tin-indium solders |
CN101987402A (zh) * | 2010-11-30 | 2011-03-23 | 哈尔滨工业大学 | 一种Cu-Sn-Ti钎料及使用其钎焊Ti2AlC陶瓷和铜的方法 |
CN101244492B (zh) * | 2008-03-21 | 2011-05-04 | 天津市松本环保科技有限公司 | 一种含有助焊剂的无铅焊料焊锡丝及其助焊剂的制备方法 |
CN102476251A (zh) * | 2010-11-25 | 2012-05-30 | 中国科学院金属研究所 | 一种耐大气腐蚀的Sn-Cu无铅焊料 |
CN102324405B (zh) * | 2005-08-31 | 2014-10-15 | 株式会社日立功率半导体 | 半导体装置的制造方法 |
CN104353840A (zh) * | 2014-11-25 | 2015-02-18 | 北京康普锡威科技有限公司 | 一种led用低成本无铅焊料合金粉末及其制备方法 |
CN104526180A (zh) * | 2014-12-11 | 2015-04-22 | 徐国华 | 一种含铈铷锌的无铅焊料及其制备方法 |
CN104607817A (zh) * | 2014-12-11 | 2015-05-13 | 徐国华 | 一种镧硒铯锌锡合金焊料及其制备方法 |
CN107309574A (zh) * | 2017-06-20 | 2017-11-03 | 华北水利水电大学 | 一种含有石墨烯的高强度银基钎料及其熔炼方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100903026B1 (ko) * | 2007-04-12 | 2009-06-16 | 중앙대학교 산학협력단 | 솔더링용 무연합금 |
CN104588910A (zh) * | 2014-12-11 | 2015-05-06 | 徐国华 | 一种含镨铯锌锡的无铅焊料及其制备方法 |
CN104588911A (zh) * | 2014-12-11 | 2015-05-06 | 徐国华 | 一种无铅焊料及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3363393B2 (ja) * | 1998-12-21 | 2003-01-08 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
JP2001358458A (ja) * | 2000-06-12 | 2001-12-26 | Hitachi Ltd | Pbフリーはんだ接続を有する電子機器 |
JP2002076029A (ja) * | 2000-08-25 | 2002-03-15 | Hitachi Ltd | ろう材とそれを用いた半導体装置および電子装置 |
CN1239290C (zh) * | 2003-04-11 | 2006-02-01 | 深圳市亿铖达工业有限公司 | 波峰焊用无铅软钎焊料合金 |
-
2004
- 2004-08-24 CN CN 200410051200 patent/CN1269613C/zh active Active
- 2004-09-07 WO PCT/CN2004/001025 patent/WO2006021130A1/zh active Application Filing
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7749336B2 (en) | 2005-08-30 | 2010-07-06 | Indium Corporation Of America | Technique for increasing the compliance of tin-indium solders |
CN102324405B (zh) * | 2005-08-31 | 2014-10-15 | 株式会社日立功率半导体 | 半导体装置的制造方法 |
EP1977022A4 (en) * | 2005-12-13 | 2008-12-31 | Indium Corp America | LEAD-FREE LOT ALLOYS AND SOLDERING COMPOUNDS THEREOF WITH IMPROVED FALLING ACTIVITY |
US9260768B2 (en) | 2005-12-13 | 2016-02-16 | Indium Corporation | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
EP1977022A2 (en) * | 2005-12-13 | 2008-10-08 | Indium Corporation of America | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
CN101244492B (zh) * | 2008-03-21 | 2011-05-04 | 天津市松本环保科技有限公司 | 一种含有助焊剂的无铅焊料焊锡丝及其助焊剂的制备方法 |
CN102476251A (zh) * | 2010-11-25 | 2012-05-30 | 中国科学院金属研究所 | 一种耐大气腐蚀的Sn-Cu无铅焊料 |
CN101987402B (zh) * | 2010-11-30 | 2012-09-05 | 哈尔滨工业大学 | 使用Cu-Sn-Ti钎料钎焊Ti2AlC陶瓷和铜的方法 |
CN101987402A (zh) * | 2010-11-30 | 2011-03-23 | 哈尔滨工业大学 | 一种Cu-Sn-Ti钎料及使用其钎焊Ti2AlC陶瓷和铜的方法 |
CN104353840A (zh) * | 2014-11-25 | 2015-02-18 | 北京康普锡威科技有限公司 | 一种led用低成本无铅焊料合金粉末及其制备方法 |
CN104526180A (zh) * | 2014-12-11 | 2015-04-22 | 徐国华 | 一种含铈铷锌的无铅焊料及其制备方法 |
CN104607817A (zh) * | 2014-12-11 | 2015-05-13 | 徐国华 | 一种镧硒铯锌锡合金焊料及其制备方法 |
CN107309574A (zh) * | 2017-06-20 | 2017-11-03 | 华北水利水电大学 | 一种含有石墨烯的高强度银基钎料及其熔炼方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006021130A1 (fr) | 2006-03-02 |
CN1269613C (zh) | 2006-08-16 |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20050302 Assignee: Guangzhou Solderwell Enterprise Co.,Ltd. Assignor: Chen Minghan Contract record no.: 2010440000438 Denomination of invention: An improved Sn-0.7wt%Cu lead-free solder Granted publication date: 20060816 License type: Exclusive License Record date: 20100422 |
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Change date: 20150216 Contract record no.: 2010440000438 Assignee after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Assignee before: Guangzhou Solderwell Enterprise Co.,Ltd. |
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Denomination of invention: An improved Sn-0.7wt%Cu lead-free solder Effective date of registration: 20150215 Granted publication date: 20060816 Pledgee: China Minsheng Banking Corp Guangzhou branch Pledgor: Chen Minghan Registration number: 2015440000004 |
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Assignee: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Assignor: Chen Minghan Contract record no.: 2010440000438 Date of cancellation: 20170614 |
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Change date: 20170613 Contract record no.: 2010440000438 Assignee after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Assignee before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. |
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Denomination of invention: An improved Sn-0.7wt%Cu lead-free solder Effective date of registration: 20170621 Granted publication date: 20060816 Pledgee: China Minsheng Banking Corp Guangzhou branch Pledgor: Chen Minghan|Guangzhou super copper electronic material Co.,Ltd.|GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Registration number: 2017440000035 |
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Date of cancellation: 20200429 Granted publication date: 20060816 Pledgee: China Minsheng Banking Corp Guangzhou branch Pledgor: Chen Minghan Registration number: 2017440000035 |
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Effective date of registration: 20220907 Address after: Room 404, Building B, No. 58, Nanyun 2nd Road, Science City, Huangpu District, Guangzhou City, Guangdong Province, 510663 Patentee after: Guangzhou Hanyuan microelectronic packaging material Co.,Ltd. Address before: Lingshan Road, Guangdong Industrial Park, 510660 Eton city of Guangzhou province Tianhe District Dongpu Pearl Village three building the first floor of the East Guangzhou special copper electronic materials Co. Ltd. Patentee before: Chen Minghan |
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