CN1201896C - 一种无铅焊料 - Google Patents

一种无铅焊料 Download PDF

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CN1201896C
CN1201896C CN 03126796 CN03126796A CN1201896C CN 1201896 C CN1201896 C CN 1201896C CN 03126796 CN03126796 CN 03126796 CN 03126796 A CN03126796 A CN 03126796A CN 1201896 C CN1201896 C CN 1201896C
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solder
lead
scolder
weld
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CN1460572A (zh
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蔡烈松
谷兆彭
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Guangzhou Super Copper Electronic Material Co ltd
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TETONG ELECTRONIC MATERIAL CO Ltd GUANGZHOU CITY
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Abstract

本发明公开了一种无铅焊料，含有重量比为0.8～1.1%的Ag，3～7%的Bi，0.3～0.8%的Cu，0.0005～0.0008%的P，0.05～0.1%的Re，其余为Sn。本发明的无铅焊料具有熔点低、抗氧化性能及可焊性能优良的特点，并具有明显的经济效益，适用于插件波峰焊、浸焊以及回流焊。

Description

一种无铅焊料
技术领域
本发明涉及一种焊接材料，尤其涉及一种以Sn为基体的无铅焊料合金。
背景技术
目前普遍使用的几种无铅焊料合金，如Sn-3.5wt％Ag、Sn-3.5(4.8)wt％Ag-0.7wt％Cu、Sn-0.7wt％Cu，其熔点分别为221℃、217～218℃、227℃，以致插件波峰焊或回流焊时的焊接工艺温度必须提高到250～270℃。由于焊接温度过高，使得目前所用的电子元件及线路板材料在焊接过程中会发生损坏和变形，同时在波峰焊和浸焊过程中必然会产生大量的锡渣，从而影响了焊点的质量，并增加了锡的损耗。此外，在无铅焊料合金的原料中Ag的价格最高，因此Ag的含量直接影响焊料的成本，当Ag的含量达到3～4wt％时焊料的价格则非常昂贵。对于Sn-0.7wt％Cu焊料合金，除熔点高外，还存在焊接性尚差的缺点。
发明内容
本发明的目的在于提供一种熔点低、抗氧化性能和可焊性能优良、材料成本低的无铅焊料。
本发明通过以下技术方案予以实现：一种无铅焊料，含有重量比为0.8～1.1％的Ag，3～7％的Bi，0.3～0.8％的Cu，0.0005～0.0008％的P，0.05～0.1％的RE，其余为Sn。
本发明提供的无铅焊料中，添加0.8～1.1％(wt％，下同)Ag能够保持焊料优良的可焊性能，而且大大降低了焊料的材料成本。在无铅焊料合金的原料中，Ag的价格最高，当Ag的含量从4％降低到1％时，原料的成本将呈几倍减少，具有明显的经济效益。
Bi元素在焊料中具有降低熔点的作用，但如果Bi的含量偏高，会出现片状粗大Bi相，造成焊料脆性和抗疲劳性能变差；当Bi含量超过20％时，则会出现焊料中不允许存在的熔点为139℃的低熔共晶组织。为此，本发明提供的无铅焊料中Bi的含量控制在3～7％，目的在于获得较低焊料熔点的同时避免出现低熔共晶组织。另外，通过添加微量的RE以防止焊料合金片状粗大Bi相的产生，并使得焊料晶粒组织细化，以提高焊料合金的塑性。
加入0.3～0.8％Cu元素能够抑制焊接过程中的熔Cu现象，可提高焊点的机械性能，尤其是抗疲劳性能，从而强化了焊料合金。
添加极微量的P可以使液态焊锡在焊接过程中有极好的抗氧化作用。由于P在液态焊锡过程中分布在液面上，使得P与Sn、O2等元素作用生成一层很薄又十分致密的含氧酸盐保护膜。该保护膜可阻碍O2对焊料的氧化，使焊锡在焊接过程中处于新鲜状态，从而确保了焊点的质量，并能够防止大量锡渣的产生，降低了锡的损耗。
通过采取上述技术方案，本发明具有以下有益效果：
(1)由于焊料合金熔点低，因此焊接过程中可采用偏低的工艺温度，与目前使用Sn-Pb焊料的电子元件及材料具有兼容性；
(2)焊料具有良好的抗氧化性能，焊接过程可不用N2气保护，而且降低了锡渣的损耗；
(3)RE的加入细化了合金晶粒组织，使焊料具有良好的力学性能和可焊性能；
(4)Ag用量减少，降低了原材料成本，经济效益显著。
下面结合实施例对本发明作进一步的描述。
具体实施方式
本发明的无铅焊料采用以Sn为基体无铅焊料的常规生产方法进行制备。为确保加入量的精确度，RE和P均采用中间合金法加入，即制备Sn-2～5％RE中间合金和Sn-1～3％P中间合金。
实施例1
Sn 93.45％、Ag 1％、Bi 5％、Cu 0.5％、P 0.0008％、RE 0.05％。
实施例2
Sn 91.8％、Ag 0.8％、Bi 7％、Cu 0.3％、P 0.0005％、RE 0.1％。
实施例3
Sn 92.12％、Ag 1.1％、Bi 6％、Cu 0.7％、P 0.0007％、RE 0.08％。
实施例4
Sn 95.25％、Ag 0.9％、Bi 3％、Cu 0.8％、P 0.0008％、RE 0.05％。
比较例1
Sn 93.5％、Ag 1％、Bi 5％、Cu 0.5％。
比较例2
Sn 95.8％、Ag 3.5％、Cu 0.7％。
表1为本发明实施例1与现有技术比较例1的试验比较数据；
表2为本发明实施例1与现有技术比较例2的试验比较数据。
               表1本发明实施例1与现有技术比较例1的熔点及延伸率比较
                          成分(wt％) 熔点(℃) 延伸率(％)
  Sn     Ag     Bi     Cu   P   RE
实施例1   93.45     1     5     0.5   0.0008    0.05   210～213     14
比较例1   93.5     1     5     0.5   210～213     8.5
                表2本发明实施例1与现有技术比较例2的抗氧化效果比较
                     成分(wt％)   试验温度(℃)           波峰*3小时
Sn Ag Bi Cu P RE     渣量(g/14kg焊料) 渣样
实施例1  93.45  1     5  0.5   0.0008   0.05 250     45 黑粉状
比较例2  95.8  3.5  0.7     240 豆腐状
实施例1  93.45  1     5  0.5   0.0008   0.05 350     120 黑粉状
比较例2  95.8  3.5  0.7     510 豆腐状
*试验波峰机
试验结果表明，本发明的低熔点抗氧化无铅焊料具有熔点低、抗氧化性能及可焊性能优良的特点，并具有明显的经济效益。

Claims (1)

1.一种无铅焊料，其特征是含有重量比为0.8～1.1％的Ag，3～7％的Bi，0.3～0.8％的Cu，0.0005～0.0008％的P，0.05～0.1％的RE，其余为Sn。
CN 03126796 2003-06-09 2003-06-09 一种无铅焊料 Expired - Lifetime CN1201896C (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY153585A (en) 2008-04-23 2015-02-27 Senju Metal Industry Co Lead-free solder alloy having reduced shrinkage cavities
CN105345305A (zh) * 2015-10-28 2016-02-24 仲恺农业工程学院 一种Sn-Ag-Cu-Tc低银无铅钎料
JP6011709B1 (ja) * 2015-11-30 2016-10-19 千住金属工業株式会社 はんだ合金

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