CN1459513A - Covering plate in film plating apparatus - Google Patents

Covering plate in film plating apparatus Download PDF

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Publication number
CN1459513A
CN1459513A CN02120249A CN02120249A CN1459513A CN 1459513 A CN1459513 A CN 1459513A CN 02120249 A CN02120249 A CN 02120249A CN 02120249 A CN02120249 A CN 02120249A CN 1459513 A CN1459513 A CN 1459513A
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China
Prior art keywords
shield
coatings
thickness
coating apparatus
camber line
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CN02120249A
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Chinese (zh)
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CN1261615C (en
Inventor
张智能
余安华
陈明华
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Prodisc Technology Inc
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Prodisc Technology Inc
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Priority to CNB021202494A priority Critical patent/CN1261615C/en
Publication of CN1459513A publication Critical patent/CN1459513A/en
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Publication of CN1261615C publication Critical patent/CN1261615C/en
Anticipated expiration legal-status Critical
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Abstract

A masking plate in film coater for coating more than two films with particular thicknesses on a substrate features that its shape is formed by several concentric circular arc lines, whose radian is determined by said particular thickness. It can precisely control the thickness of each dot on film.

Description

Shield in the film coating apparatus
Technical field
The invention relates to the shield in a kind of film coating apparatus, particularly be used on the substrate shield in a kind of film coating apparatus of the coatings that forms two or more specific thicknesses.
Background technology
Along with industry constantly develops, and under the compact day by day demand of sci-tech product, coating technique is also extensive and important day by day in the application of various industries.Because plated film quality and functional requirement diverse trends, how accurate control coating technique becomes one of important key in the application.
In coating technique, on same substrate, plate the coatings of two or more different thickness, or even the gradual change rete of specific gradual change slope, it is to have the certain difficulty degree.As shown in Figure 1, in a traditional film coating apparatus 5, be the top that inclination substrate 51 is positioned over pedestal 52, and on the surface of pedestal 52, place the target 53 of desire plating, utilize the vacuum evaporation or the mode of sputter to carry out plated film.At this, the placement location of substrate 51 is not parallel with pedestal 52, but tilts to be an angle.This technology promptly is to utilize the thickness of coatings 54 to be inversely proportional to (different and different according to board) with the 1.5-1.9 power of pedestal 52 to distance between the substrate 51, so near more substrate 51 parts of pedestal 52, its rete is thick more; Otherwise from pedestal 52 substrate 51 parts far away, its rete is thin more.
With regard to above-mentioned film coating apparatus and method, distance between substrate and the sputter source is to be certain relation with the thickness of coatings in theory, but in fact the dealer can't accurately control the thickness of coatings each several part on substrate, only can utilize the method for inclination substrate, control coatings certain thickness of 2 on substrate is more undesirable.In other words, can't control the thickness of coatings in these 2 centres or exterior portion arbitrarily, such result has limited the application of this film coating apparatus and method, and can't satisfy the accurate day by day demand of specification.
Summary of the invention
The purpose of this invention is to provide the shield in a kind of film coating apparatus, overcome the drawback of prior art, make its coatings that on a substrate, forms two or more specific thicknesses, be able to accurately control the purpose of coating film thickness.
The object of the present invention is achieved like this: the shield in a kind of film coating apparatus is characterized in that: the shape of shield is made of most bar concentric arc lines, and the radian of this concentric arc line is specific thick being set as according to this coatings.
The relation of the radian of this concentric arc line and the specific thicknesses of coatings meets following equation:
Tn=(1-θn/360)×T n≥2
Wherein, this Tn is the formed coatings thickness of n bar camber line of shield, T when not having shield, the rotating disk formed coatings thickness that rotates a circle, θ n is that n bar concentric(al) circles is by the angle at the pairing angle of camber line that shield hid.
Compare with conventional art, the present invention provides the shield that a kind of plated film is used, and utilizes the thickness that this shield can accurate control coatings every bit.The shape of shield of the present invention is that the thickness according to the coatings every bit is set as, and in other words, can change the shape of shield according to the thickness of required coatings; Moreover the change that sees through coatings thickness also can change its spectrographic characteristic.
Describe in detail below in conjunction with preferred embodiment and accompanying drawing.
Description of drawings
Fig. 1 is the synoptic diagram of traditional film coating apparatus.
Fig. 2 is the synoptic diagram of film coating apparatus of the present invention
Fig. 3-Figure 10 is the synoptic diagram of the coatings relation of shield shape of the present invention and formation.
Embodiment
Consult shown in Figure 2, the shield 1 in the film coating apparatus of the present invention, it is the coatings 3 that is used on the substrate 2 to form two or more specific thicknesses, film coating apparatus 1 comprises a rotating disk 11, a shield 12 and a plating source 13.Wherein, the shape of shield 1 is made of most bar concentric arc lines, and the radian of this concentric arc line is the specific thicknesses decision of control coatings 3.
The shield 1 of present embodiment is to be used for a film coating apparatus 4, this film coating apparatus 4 comprises a rotating disk 41 and plating source 42, and rotating disk 41 is relative with plating source 42 and establish, as shown in Figure 2, rotating disk 41 is with fixed angles speed rotation, in other words, is used as distance with angle, cycle is used as the time, and rotating disk 41 is certain around circle institute's time spent whenever.
Moreover plating source 42 can be changed according to different demands.When utilizing the vacuum evaporation mode, its plating source 42 can be a vapor deposition source (Source) that places high-temperature crucibles (Crucible), also can be the vapor deposition source of utilizing electron beam (ElectronBeam) heating simultaneously; When utilizing sputtering way, its plating source 42 can be one and is positioned at the cathode targets that direct current is starched (DCPlasma).Certainly, plating source 42 also can be one and is filled with the ejaculation device that plates material.
In addition, as shown in Figure 2, substrate 2 is to be arranged on the rotating disk 41, and shield 1 is to be arranged between rotating disk 41 and the plating source 42, and the position of close substrate 2.
In the present embodiment, the relation of the specific thicknesses of coatings 3 and the radian of this concentric arc line is with equation decision, that is the shape of shield 1 is to be set as according to the specific thicknesses of coatings 3.It is main to change speech, and the shape of shield 1 is made of most bar concentric arc lines, and the radian of this concentric arc line is the specific thicknesses of control coatings 3 in plated film.The relation of the specific thicknesses of the radian of this concentric arc line and coatings 3, research by experiment, can represent with following equation:
Tn=(1-θn/360)×T n≥2
Wherein, Tn represents at formed coatings 3 thickness of the n bar camber line of shield 1, and when T representative did not have shield 12, rotating disk 41 formed coatings 3 thickness that rotate a circle, θ n were represented the angle at the pairing angle of camber line that n bar concentric(al) circles hidden by shield 1.
Consult Fig. 3-shown in Figure 4, substrate 1 is to be arranged on the rotating disk 41, and shield 1 is arranged at the position near substrate 2, the shape of shield 1 as shown in Figure 3, in illustrated shield 12, the pairing angle of the camber line that A is ordered is 0, and calculate gained as can be known according to equation: coatings 3 thickness at A point place are T; The pairing angle of camber line of ordering at B is 90 degree, and coatings 3 thickness that calculate B point place according to equation are 3/4T; And be 0 in the pairing angle of camber line that C is ordered, so coatings 3 thickness at C point place are T.Wherein, the thickness of T is decided by the number of plating source 42 material that plates.As shown in Figure 4, the coatings 3 of utilizing this shield 1 to be plated out is the thicker and middle thin gradual change type rete in both sides.
Consult Fig. 5-shown in Figure 6, in illustrated shield 1, the pairing angle of the camber line that A is ordered is 90, calculates gained according to equation, and coatings 3 thickness at A point place are 3/4T as can be known; The pairing angle of camber line of ordering at B is 0, calculates gained as can be known according to equation, and coatings 3 thickness at B point place are T; And be 90 in the pairing angle of camber line that C is ordered, so coatings 3 thickness at C point place are 3/4T.As shown in Figure 6, the coatings 3 of utilizing this shield 1 to be plated out is the thin middle thicker gradual change type rete in both sides.
Consult Fig. 7-shown in Figure 8, in illustrated shield 1, the pairing angle of the camber line that A is ordered is 0, calculates gained as can be known according to equation, and coatings 3 thickness at A point place are T; The pairing angle of camber line of ordering at B is 45, calculates gained as can be known according to equation, and coatings 3 thickness at B point place are 7/8T; And be 90 in the pairing angle of camber line that C is ordered, so coatings 3 thickness at C point place are 3/4T.As shown in Figure 8, the coatings 3 of utilizing this shield 1 and being plated out for by the A point to C point thickness gradual change type rete decrescence.
Consult Fig. 9-shown in Figure 10, the present invention also can plate out the rete of terraced variant, and in illustrated shield 1, the pairing angle of the camber line of A section is 0, and coatings 3 thickness that calculate the A section according to equation are T; In the pairing angle of the camber line of B section is 45, and coatings 3 thickness that calculate the B section according to equation are 7/8T; And be 90 in the pairing angle of the camber line of C section, coatings 3 thickness of C section are 3/4T.As shown in figure 10, the coatings 3 of utilizing this shield 1 to be plated out is the rete of terraced variant.
By the foregoing description as can be known, shield 1 is to utilize the thickness of measuring the coatings each point, and with equation the pairing angle of every bit camber line is calculated, and then is set as shield 1.And the coatings 3 of utilizing shield 1 to be plated to is not limited to any form, no matter be that gradual change type rete, abrupt change formula rete or terraced variant rete can use shield 1 of the present invention to implement.
Compare with conventional art, the present invention provides the shield in a kind of film coating apparatus, utilize this shield can accurate control basal plate on the every bit thickness of plated film.At this, the thickness of the shape of shield and coatings every bit is to convert with an equation, and in other words, the shape of shield can be set as according to the thickness of desiring the plating each point.Compare with conventional art, the present invention can accurate control and the definition coatings on the thickness of every bit, that is can accurate define two or more different thickness, make gradual change type, abrupt change formula or the controllable rete of terraced variant equal thickness according to this, have worth in fact in industrial application.
Above-mentioned only for preferred embodiment, anyly do not break away from equivalent modifications or the variation that spirit of the present invention and category carry out, all should be contained within protection scope of the present invention.

Claims (2)

1, the shield in a kind of film coating apparatus is characterized in that: the shape of shield is made of most bar concentric arc lines, and the radian of this concentric arc line is specific thick being set as according to this coatings.
2, the shield in the film coating apparatus according to claim 1 is characterized in that: the relation of the radian of this concentric arc line and the specific thicknesses of coatings meets following equation:
Tn=(1-θn/360)×T n≥2
Wherein, this Tn is the formed coatings thickness of n bar camber line of shield, T when not having shield, the rotating disk formed coatings thickness that rotates a circle, θ n is that n bar concentric(al) circles is by the angle at the pairing angle of camber line that shield hid.
CNB021202494A 2002-05-17 2002-05-17 Covering plate in film plating apparatus Expired - Fee Related CN1261615C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB021202494A CN1261615C (en) 2002-05-17 2002-05-17 Covering plate in film plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB021202494A CN1261615C (en) 2002-05-17 2002-05-17 Covering plate in film plating apparatus

Publications (2)

Publication Number Publication Date
CN1459513A true CN1459513A (en) 2003-12-03
CN1261615C CN1261615C (en) 2006-06-28

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102605328A (en) * 2012-03-14 2012-07-25 赫得纳米科技(昆山)有限公司 Evaporation coating uniformity baffle
CN106987820A (en) * 2017-05-19 2017-07-28 信利光电股份有限公司 A kind of film coating jig and filming equipment
CN108193167A (en) * 2017-12-11 2018-06-22 中国航空工业集团公司洛阳电光设备研究所 The planet coating clamp shutter and production method that plated film thicknesses of layers arbitrarily changes

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102605328A (en) * 2012-03-14 2012-07-25 赫得纳米科技(昆山)有限公司 Evaporation coating uniformity baffle
CN106987820A (en) * 2017-05-19 2017-07-28 信利光电股份有限公司 A kind of film coating jig and filming equipment
CN106987820B (en) * 2017-05-19 2019-06-07 信利光电股份有限公司 A kind of film coating jig and filming equipment
CN108193167A (en) * 2017-12-11 2018-06-22 中国航空工业集团公司洛阳电光设备研究所 The planet coating clamp shutter and production method that plated film thicknesses of layers arbitrarily changes
CN108193167B (en) * 2017-12-11 2019-10-25 中国航空工业集团公司洛阳电光设备研究所 The planet coating clamp shutter and production method that plated film thicknesses of layers arbitrarily changes

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Granted publication date: 20060628