CN1402036A - 图象模块 - Google Patents

图象模块 Download PDF

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CN1402036A
CN1402036A CN01136236A CN01136236A CN1402036A CN 1402036 A CN1402036 A CN 1402036A CN 01136236 A CN01136236 A CN 01136236A CN 01136236 A CN01136236 A CN 01136236A CN 1402036 A CN1402036 A CN 1402036A
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CN1203362C (zh
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崔云河
金永俊
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Samsung Electro Mechanics Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
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Abstract

本发明提供了小型化及一体化的COB方式的自动调焦的图象模块，它包括：包括感知画面图象数据的传感器、包括上述传感器的基板、将在外部包揽上述传感器和基板的传感器壳以及阻隔外部环境，仅通过上述传感器壳与传感器之间的光线的传感滤光器形成的图象封装组件；包括中心部位设置通过光线的镜片、外侧缠绕驱动线圈的镜片翼、为上述镜片翼的驱动线圈上提供电流并支持镜片翼的弹性部件以及形成磁场以通过电磁力上下移动上述镜片翼的磁铁的镜片翼单元。从而达到节俭电消耗量、节省制作费用及提高产品的信誉度等目的。

Description

图象模块
技术领域
本发明涉及自动镜片聚焦方式的小型薄型图象模块。
背景技术
一般的图象模块用于数码照相机及可视通信用终端器中捕获图象，将此连接于电脑，具备使可视通信或所需的内容更容易进行接受的功能。并且最近此种图象模块的使用频率也逐渐增加。
尤其是最近使用电脑的通信方法的发达与为此而组成的基础设施，其增加速度越来越大。
一般用于数码照相机或画面通信用终端器的图象传感器大致可分为电荷耦合方式(以下称为CCD)和高封装密度互补金属-氧化物半导体方式(以下称为CMOS)。
CCD方式是基于模拟线路的光学系统的典型例子。此系统中，当通过镜片进来的光照射到各种集光元件时，储存此电荷变化。并利用此电荷的大小检测明暗程度，将此输送到模拟/数码变换器以显示色彩。
另一方面，CMOS(互补性金属氧化膜半导体)图象传感器与CMOS半导体工程完全相同的系统集成于芯片上的方式。因此，通过CMOS系统，在半导体中将模拟信号和数码信号处理电路集中在一起。
CMOS图象传感器采用一般的CMOS工艺制造，生产中需要复杂的工程，与生产率较低的CCD相比，具有所需生产费用较少的优点。但是CMOS处理影象信号时，因区域小，不能象CCD一样显示微细的影象和区分精细的色彩，具有总体上画质偏差的缺点。
CMOS图象传感器因具有上述缺点，大部分的数码照相机领域中一直受冷遇。但是最近随着CMOS图象传感器技术的快速发展，在总体上短期内在大部分应用机器中代替CCD，CCD主要用于需要高分辨率图象的部分。
为适应上述技术的发展趋势，本发明是关于如上述所说明的，包括图象传感器的镜片中自动调焦装置。以下以过去的镜片部结构为参照图进行说明。
图1是根据过去技术，数码照相机或画面通信用终端器的图象传感器及镜片的焦点调整器的结构图。
首先，如图1所示，过去技术镜片焦点调整器的结构为：包括感知画面图象数据的传感器1、包括上述传感器的基板2以及在外部包揽上述传感器和基板的传感器壳3，阻挡外部光，仅通过上述传感器壳与传感器之间的光线的传感器滤光器4形成的图象封装组件；具有与上述图象封装组件相结合的螺纹的壳5；位于上述壳5的内面与螺纹5a相接合的螺纹6a的筒体6以及设置于上述筒体内的镜片7。
对于上述过去式镜片焦点调整器的工作原理，以下参照附图1详细说明。
首先使用者对准焦点时如图1所示，其特点为在内部包括镜片7的筒体6的外面形成螺纹6a，用手动调整与相对物之间的距离。
即，使用者一手抓镜片外壳部分，旋转上述螺纹6a调整焦点的方式，使用者直接看画面，将镜片7放置于离图象传感器1或远或近的地方有很多不方便，而且精密度亦不够。
发明内容
本发明为了解决上述过去技术所存在的问题而提出的，以提供具有小型化及一体化的COB方式的自动调焦调整功能的图象模块，从而达到降低功耗、节省制作费用及提高产品的信誉度的目的。
为达到上述目的，本发明所提供的具备自动调焦功能的图象模块包括：包括感知画面图象数据的传感器、包括上述传感器的基板、将在外部包揽上述传感器和基板的传感器壳以及阻隔外部环境，仅通过上述传感器壳与传感器之间的光线的传感滤光器形成的图象封装组件；包括中心部位设置通过光线的镜片，外侧缠绕驱动线圈的镜片翼、为上述镜片翼的驱动线圈上提供电流并支持镜片翼的弹性部件以及形成磁场以通过电磁力上下移动上述镜片翼的磁铁的镜片翼单元。
附图说明
图1为过去技术所示的镜片焦点调整器的结构图；
图2为根据本发明所示的具备自动调焦功能的图象模块透视图；
图3为根据图2所示的图象模块的截面图；
图4为本发明的另一实施例的截面图；
图5为根据图4截面图。*对于图面主要部分的符号说明
1，11：传感器              2，12：基板
3，13：传感器壳            4，14：滤光器
5：外壳                    5a：外壳螺纹
6：筒体                    6a：筒体螺纹
7.17：镜片                 15：托架
16：弹性部件               18：镜片翼
19：线圈                   20：磁铁
21：磁轭
具体实施方式
以下参照附图详细说明本发明的最佳实例。在以下说明中，不同附图中的相同构件采用相同符号。
下面根据本发明制作的PC照相机的实施例，参照附图详细说明。
图2为根据本发明所示的具备自动调焦功能的图象模块透视图；图3为根据图2所示的图象模块的截面图。
如图3所示，根据本发明具备自动调焦功能的图象模块可分为图象封装组件和镜片翼单元。上述图象封装组件包括传感器11、基板12、传感器外壳13以及传感滤光器14。此时上述传感器11的作用为感知画面图象数据。并且上述传感器位于基板12上形成COB方式。上述传感器外壳13由外部罩住传感器11及基板12，传感滤光器14阻隔外部环境，仅通过上述传感器外壳13与传感器11之间的光线。
并且上述镜片翼单元起着执行机构的作用。此镜片翼单元包括由外部施加电流的弹性部件16；通过上述弹性部件流入感应电流的绕线线圈19；通过流过上述线圈的电流，形成电磁场而设置的磁铁20；受到上下方向由上述线圈及磁铁产生的电磁力的镜片翼18及连接于上述镜片翼的中央部位上下移动的镜片17。
为了本发明的正确实施，并为提高上述磁铁的效率而设置磁轭21。图4为设置磁轭的本发明的另一实施例，图5为显示附图4中安装磁轭的本发明的另一实施例的截面图。图4及图5中的上述磁轭21为‘u’字形状，增强了磁通量，从而加大了驱动力。
上述滤光器可由玻璃制成，最好是使用覆膜玻璃。并且为了支持弹性部件，在传感器外壳外侧设置托架15。
上述弹性部件可采用线圈弹簧等，必要时也可采用板型弹簧。上述托架15和上述弹性部件16相互组装时，在组装托架周围插入减振器，以防止外部振动冲击。
本发明的实施例，为支持上述弹性部件，4个上述托架位于其两端，其上、下两侧分别设置2个托架。实施时可选择多种状态，如可用两个托架支持上述弹性部件，其顶部及底部分别设置一个托架。
以下详细说明上述结构的具备自动调焦功能的图象模块的工作原理。
如图2所示，在外部上述弹性部件16的末端连接电线，并接通电流。电流通过上述弹性部件16流入缠绕于镜片翼18外部的卷轴式线圈19中。由线圈产生感应电磁力，连接于上述线圈19周围的磁铁20或永久磁铁形成磁场，在上述磁场中产生电磁力，根据弗莱明的左手定律，将上述镜片翼18沿上下方向移动。因此，调整了上述镜片翼18中连接的镜片17与图象传感器11之间的距离。
上述镜片17的驱动方向随弹性部件16中流过的电流方向的改变而改变。此时可改变的移动距离范围大约为1/10mm至1/2mm，足以满足在图象传感器11中正确形成画面的需求。可根据图象传感器上的画面图象数据来感知镜片的远近距离，利用此电流的方向和强度可调整镜片的驱动方向和移动距离。
如上述所讲，根据本发明具备自动调焦功能的图象模块可适用于与PC连接的PC照相机上，用户可利用自动化的图象分析程序根据感应电流的变化自动调整焦点，或通过观察显示器画面调整焦点，例如使用鼠标感知感应电流的变化。
本发明具备自动调焦功能的图象模块可适用于各种包括过去简单的移动显示器在内的要求调整焦点的镜片传感器装置。过去使用者用手动调整镜片或电动机、螺线管等驱动方式调整焦点，现在均可自动或简单操作按钮来调整焦点。
本发明出具的自动调焦图象模块与过去的相比，结构简单，趋于小型、薄型化，其广泛适用于PC照相机、数码照相机或画像通信用终端等多领域，且易于安装，今后大量小型、价格低廉等各种图象装置上均可广泛采用本发明的图象模块。
如同上述，本发明提供小型化及一体化的COB方式的自动调焦的图象模块，可广泛适用于小型、价格低廉的各种图象应用装置，达到节俭用电消耗量、节省制作费用及提高产品的信誉度等效果。
以上说明根据本发明特定的实施例及适用领域相关而进行了图示及说明，在专利申请范围中显示的发明主题及领域不超越的限度内可多样改造或变化。其适用也可分为多种形状表现，此种现象在该领域中掌握通常知识的人是必知的。

Claims (8)

1.一种具备自动调焦功能的图象模块，其特征在于：包括：
感知画面图象数据的传感器；
包括上述传感器的基板；
将在外部包揽上述传感器和基板的传感器壳；
阻隔外部环境，仅通过上述传感器壳与传感器之间的光线的传感滤光器；
中心部位设置通过光线的镜片，外侧缠绕驱动线圈的镜片翼；
为上述镜片翼的驱动线圈上提供电流并支持镜片翼的弹性部件；
以及形成磁场以通过电磁力上下移动上述镜片翼的磁铁。
2.根据权利要求1所述的图象模块，其特征在于：上述滤光器由玻璃制成。
3.根据权利要求1所述的图象模块，其特征在于：传感器外壳外侧设置托架以支持上述弹性部件。
4.根据权利要求1所述的图象模块，其特征在于：为增强磁铁的效率还设置有磁轭。
5.一种具备自动调焦功能的图象模块，其特征在于：包括：
包括感知画面图象数据的传感器；包括上述传感器的基板；将在外部包揽上述传感器和基板的传感器壳；阻隔外部环境，仅通过上述传感器壳与传感器之间的光线的传感滤光器形成的图象封装组件；
包括中心部位设置通过光线的镜片，外侧缠绕驱动线圈的镜片翼；为上述镜片翼的驱动线圈上提供电流并支持镜片翼的弹性部件；以及形成磁场以通过电磁力上下移动上述镜片翼的磁铁的镜片翼单元。
6.根据权利要求5所述的图象模块，其特征在于：上述滤光器由玻璃制成。
7.根据权利要求5所述的图象模块，其特征在于：传感器外壳外侧设置托架以支持上述弹性部件。
8.根据权利要求5所述的图象模块，其特征在于：为增强磁铁的效率还设置有磁轭。
CNB011362367A 2001-08-29 2001-10-11 图象模块 Expired - Lifetime CN1203362C (zh)

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Cited By (10)

* Cited by examiner, † Cited by third party
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WO2006119693A1 (fr) 2005-05-11 2006-11-16 Beijing Huaqi Digital Technology Lab Co., Ltd. Systeme de focalisation automatique
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