CN1385276A - Laser holing device and two-step holing method - Google Patents
Laser holing device and two-step holing method Download PDFInfo
- Publication number
- CN1385276A CN1385276A CN01113609A CN01113609A CN1385276A CN 1385276 A CN1385276 A CN 1385276A CN 01113609 A CN01113609 A CN 01113609A CN 01113609 A CN01113609 A CN 01113609A CN 1385276 A CN1385276 A CN 1385276A
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- laser
- output
- processed
- wavelength laser
- pulse
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The laser-beam drilling equipment includes a long wavelength laser with long pulse and a short wavelength laser with short pulse, and a transmitting/reflecting plane mirror making an angle of 45 deg. with optical axises of two laser-beams is set at the place where two laser-beams are mutually perpendicular and rendezvous, and a focussing loens capable of moving along the direction of optical circuit is set on the output optical circuit of said mirror. Its hole-drilling process includes two steps; (1) regulating position of focusing lens, starting long wavelength laser to output laser pulse, after the workpiece is drilled, closing the output; (2). regulating the position of focusing lens to make laser focal spot focused on the workpiece surface to be processed equal to the pore size required for process, starting the short-wavelength laser to output laser pulse.
Description
The present invention relates to the laser application apparatus, also relate to laser processing technology.
In the prior art, Laser Processing has become the important manufacturing process of industries such as automobile, aviation, electronics, and it not only can be used for making the micro-structure that conventional method is difficult to make, and can be used for processing the unmanageable high hardness material of conventional method.For example at microelectronic industry, laser has been used to cut silicon chip, the semiconductor p-n junction of making alloying and the encapsulation of integrated circuit etc.Laser boring is mature technique the most at present.It often is used in the perforation processing to sheet metal, pottery, composite, and it can get all adjustable through hole in a series of apertures and inclination angle quickly and easily on superhard material.For example be used for the perforation processing on the turbo blade of aircraft engine and thermoelectric generator.
Laser boring generally is to adopt high-power Pulse Nd: the YAG laser instrument is as LASER Light Source, and workpiece to be processed is placed on the light path of shoot laser.Laser drilling process is an ablation process.At first, when a branch of High Power Laser Pulses is bombarded surface of the work, workpiece surface temperature sharply raises, and the surface mass of workpiece can absorb the portion of energy of laser pulse in a short period of time vaporizes, and inferior surface mass can absorb remaining energy generation fusing.Then, after laser pulse disappears, because the cooling of surface of the work, make that inferior surface portion temperature is the highest, the fusing of inferior surface mass, evaporation can produce very high pressure, and it is external that the partial melting material is expressed to workpiece, and spray from surface of the work with the form of gasification plasma.Repeat laser pulse again and again, workpiece promptly is perforated.In the process of laser boring, because conduction of heat can form the heat affected area usually in the peripheral region in hole, and produces phenomenons such as re cast layer, micro-crack, this will directly have influence on the performance and the service life of workpiece.Therefore, the high-energy that how to make full use of laser carries out hole processing, reduces the negative effect that it brings because of high temperature as far as possible simultaneously, is the key subjects that the scientific worker faces always.
Studies show that in recent years adopts short wavelength's ultra-short pulse laser can help improving the quality of punching.For example the method that the disclosed two frequency multiplication 532nm laser that utilize Q impulse Nd:YAG punch among the US6172331 can reduce the heat affected area, re cast layer and the micro-crack phenomenon that form in the punching effectively.Workpiece for same thickness, same material, use conventional long wavelength laser, for example the Pulse Nd of uncomfortable Q: YAG fundamental frequency 1064nm laser boring, only need can bore a hole less than 1 second, its punching speed is fast, but hole quality is poor; And adopt short wavelength laser punching, for example above-mentioned long wavelength laser to transfer the 266nm laser after Q and 4 frequencys multiplication, and but needing ability perforation in 2～3 minutes, its punching speed is slow, but hole quality is good.These defectives are used to heavy industrialization and are brought adverse effect.
The objective of the invention is to, a kind of laser drilling device and drilling method thereof that can improve drilling quality and have higher punching speed is provided.
Laser drilling device of the present invention is characterized in that, it includes the long wavelength laser (S of director's pulse
1) and the short wavelength laser (S of a short pulse
2), two laser instruments are installed on the same base, and the laser axis of its output is at same horizontal plane and vertical mutually; Two bundle laser intersections are provided with the transmission all at 45 with a two-beam axis/plane of reflection mirror, and this level crossing is transmission S fully
1The long wavelength laser of being exported, and can reflect S fully
2The optical flat mirror of the short wavelength laser of being exported, or transmission S fully
2The short wavelength laser of being exported can reflect S simultaneously fully
1The optical flat mirror of the long wavelength laser of being exported; Be provided with a condenser lens on the light path of described level crossing output laser, this condenser lens is placed on can be along on the guide rail of optical path direction shift position.
The method of using above-mentioned laser drilling device to punch, comprise above-mentioned laser drilling device is placed to be processed nearby, and the laser axis is mapped on to be processed of workpiece, it is characterized in that, the punching process was divided into for two steps: (1) regulates the front and back position of condenser lens, make it focus on laser focal spot on to be processed of the workpiece, generally get 80%～90% of aperture to be processed, open long wavelength laser S then less than aperture to be processed
1Output laser pulse is closed long wavelength laser S after the workpiece perforation
1Output; (2) front and back position of regulating condenser lens makes the laser focal spot that focuses on to be processed of the workpiece equal aperture to be processed, makes short wavelength laser S
2Output laser pulse, its output is closed in the end of punching when not having tangible plasma jet phenomenon.
The method of laser drilling device of the present invention and punching, be that two different wavelength of laser devices are assembled on the same base, to be placed in order to the convex lens that focus on can be on the guide rail that base is done to move, thereby its position is adjusted in front and back easily, be adjusted in the size of the laser focal spot of surface of the work, shorten the adjustment time effectively, help realizing within a short period of time the punching of two steps.The method of punching of the present invention, its processing to each hole were divided equally for two steps and are carried out, and its process is to bore a hole fast with long wavelength laser earlier, and then adopted short wavelength laser to expand shaped hole.In the ream forming process, laser can be repaired the defective that quick perforation procedure forms simultaneously, promptly removes re cast layer, micro-crack and the heat affected area etc. of this hole periphery of inner wall, thereby has finally realized using the hole of getting better quality than the short time.Its reason is that optical maser wavelength is short more, and photon energy is high more, and is big more to the energy of metal function, and simultaneously material is to the absorptivity height of short wavelength laser, so the coupling efficiency height of its laser energy, the ratio of the energy of the workpiece material that really is used for vaporizing is also high.If melt substance reaches the degree of vaporization fully, then will in the hole, spray fully, can not condense upon and form re cast layer and micro-crack etc. in the hole wall.Perforating device of the present invention and drilling method, the perforation fast of middle compared to existing technology use long wavelength laser, the present invention has improved the quality of machining hole effectively; The simple situation that adopts short wavelength laser to punch compared to existing technology, the present invention has improved operating efficiency greatly.Therefore the method for laser processing device of the present invention and punching helps industrial applications more.
Be described further below by embodiment and accompanying drawing thereof.
Fig. 1 is the structural representation of a kind of embodiment of laser drilling device of the present invention.
Fig. 2 is a structural representation of placing the guide rail mechanism that focuses on convex lens described in the laser drilling device of the present invention.
Among Fig. 1, (1) is long wavelength laser S
1, (2) are short wavelength laser S
2, (3) are transmission/plane of reflection mirror M
1, it is transmission S fully
1The laser of being exported, and can reflect S fully
2The transmission of the laser of being exported/anacamptics level crossing, (4) are for focusing on convex lens M
2, (5) are base plate, S
1, S
2, M
1, M
2Be installed on this base plate long wavelength laser S
1With short wavelength laser S
2The laser axis of output is in same horizontal plane and vertical mutually, transmission/anacamptics level crossing M
1Place the intersections with two bundle laser axis, and respectively with two axial lines angle at 45.(6) focus on convex lens M for placing
2Guide rail mechanism.(7) be workpiece to be processed, the laser axis that focuses on convex lens output is with to be processed vertical.For easy to adjust and make laser focal spot reach maximum power density, make laser instrument S in the present embodiment
1Distance L with the level crossing center
1Equal laser instrument S
2Distance L with the level crossing center
2, and the distance L of level crossing center and condenser lens
3Between 8-15cm.In actual use, as with long wavelength laser S
1With short wavelength laser S
2Location swap, then used transmission/plane of reflection mirror M
1Should be transmission S fully
2The short wavelength laser of being exported can reflect S simultaneously fully
1The optical flat mirror of the long wavelength laser of being exported.
Among Fig. 2, (8) are and focus on convex lens M
2The moving slider that is connected, (9) are guiderail base, and its both sides are provided with the locating hole that is used for fixing.Moving slider is provided with the V-type groove that cooperates, the guide rail mechanism that formation can be slided relatively with the contact-making surface of guiderail base.(10) be screw rod, the internal thread in it and the moving slider hole matches, and constitutes screw rod, nut body, and the screw rod two supports is on guiderail base, and its right-hand member extends the guiderail base outside, and is connected with the main shaft of stepper motor (11).When starting stepper motor,, play to regulate focusing on convex lens M because the effect of screw rod, nut body then makes moving slider drive thus and to focus on the convex lens displacement relative to moving as guiderail base
2The effect of position.
Claims (5)
1. a laser drilling device is characterized in that, it includes the long wavelength laser (S of director's pulse
1) and the short wavelength laser (S of a short pulse
2), two laser instruments are installed on the same base, and the laser axis of its output is at same horizontal plane and vertical mutually; Two bundle laser intersections are provided with the transmission all at 45 with a two-beam axis/plane of reflection mirror; Be provided with a condenser lens on the light path of described level crossing output laser, this condenser lens is placed on can be along on the guide rail of optical path direction shift position.
2. laser drilling device as claimed in claim 1 is characterized in that, described transmission/plane of reflection mirror is transmission S fully
1The long wavelength laser of being exported, and can reflect S fully
2The optical flat mirror of the short wavelength laser of being exported.
3. laser drilling device as claimed in claim 1 is characterized in that, described transmission/plane of reflection mirror is transmission S fully
2The short wavelength laser of being exported, and can reflect S fully
1The optical flat mirror of the long wavelength laser of being exported.
4. use the described laser drilling device of claim 1 to carry out the method for two steps punching, comprise above-mentioned laser drilling device is placed to be processed nearby, and the face to be processed that makes workpiece is placed on the laser axis of its output, it is characterized in that, the punching process was divided into for two steps: (1) regulates the front and back position of condenser lens, make it focus on laser focal spot on to be processed of the workpiece, open long wavelength laser S then less than aperture to be processed
1Output laser pulse is closed long wavelength laser S after the workpiece perforation
1Output; (2) front and back position of regulating condenser lens makes the laser focal spot that focuses on to be processed of the workpiece equal aperture to be processed, makes short wavelength laser S
2Output laser pulse is closed its output when not having tangible plasma jet phenomenon.
5. the method for two step punchings as claimed in claim 5 is characterized in that, regulates the front and back position of condenser lens in the first step of described punching process, and making its laser focal spot that focuses on to be processed of the workpiece is 80%～90% of processing aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01113609A CN1131122C (en) | 2001-05-10 | 2001-05-10 | Laser Holing device and two-step holing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01113609A CN1131122C (en) | 2001-05-10 | 2001-05-10 | Laser Holing device and two-step holing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1385276A true CN1385276A (en) | 2002-12-18 |
| CN1131122C CN1131122C (en) | 2003-12-17 |
Family
ID=4660323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN01113609A Expired - Fee Related CN1131122C (en) | 2001-05-10 | 2001-05-10 | Laser Holing device and two-step holing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1131122C (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2458475A (en) * | 2008-03-18 | 2009-09-23 | Xsil Technology Ltd | Pulsed laser etching of silicon wafers |
| CN101561546B (en) * | 2008-04-15 | 2010-11-17 | 中国科学院安徽光学精密机械研究所 | Electric translatory mirror with controllable speed |
| CN101733559B (en) * | 2009-12-28 | 2012-11-07 | 沈阳黎明航空发动机(集团)有限责任公司 | Laser drilling method of titanium alloy with coating |
| CN101909804B (en) * | 2008-01-10 | 2014-10-22 | 以色列商奥宝科技股份有限公司 | Laser drilling method having simultaneity of changes in one baseboard |
| CN104227243A (en) * | 2014-09-11 | 2014-12-24 | 深圳英诺激光科技有限公司 | Laser deep processing equipment and processing method for hard material |
| CN105555038A (en) * | 2016-02-02 | 2016-05-04 | 深圳光韵达光电科技股份有限公司 | Method for forming circuit on nonmetallic substrate |
| CN105880842A (en) * | 2015-01-22 | 2016-08-24 | 通用电气公司 | System And Method For Cutting A Passage In An Airfoil |
| CN106735943A (en) * | 2016-12-16 | 2017-05-31 | 江苏大学 | A kind of laser auxiliary heating Long Pulse LASER perforating device and its method |
| CN110587124A (en) * | 2019-03-30 | 2019-12-20 | 苏州福唐智能科技有限公司 | Femtosecond laser processing device |
| CN111014943A (en) * | 2019-12-23 | 2020-04-17 | 西安中科微精光子制造科技有限公司 | Double-light-source composite laser processing equipment and processing method |
-
2001
- 2001-05-10 CN CN01113609A patent/CN1131122C/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101909804B (en) * | 2008-01-10 | 2014-10-22 | 以色列商奥宝科技股份有限公司 | Laser drilling method having simultaneity of changes in one baseboard |
| GB2458475B (en) * | 2008-03-18 | 2011-10-26 | Xsil Technology Ltd | Processing of multilayer semiconductor wafers |
| GB2458475A (en) * | 2008-03-18 | 2009-09-23 | Xsil Technology Ltd | Pulsed laser etching of silicon wafers |
| CN101561546B (en) * | 2008-04-15 | 2010-11-17 | 中国科学院安徽光学精密机械研究所 | Electric translatory mirror with controllable speed |
| CN101733559B (en) * | 2009-12-28 | 2012-11-07 | 沈阳黎明航空发动机(集团)有限责任公司 | Laser drilling method of titanium alloy with coating |
| CN104227243A (en) * | 2014-09-11 | 2014-12-24 | 深圳英诺激光科技有限公司 | Laser deep processing equipment and processing method for hard material |
| CN105880842A (en) * | 2015-01-22 | 2016-08-24 | 通用电气公司 | System And Method For Cutting A Passage In An Airfoil |
| CN105555038A (en) * | 2016-02-02 | 2016-05-04 | 深圳光韵达光电科技股份有限公司 | Method for forming circuit on nonmetallic substrate |
| CN105555038B (en) * | 2016-02-02 | 2018-07-31 | 深圳光韵达光电科技股份有限公司 | The method that circuit is formed on non-metallic substrate |
| CN106735943A (en) * | 2016-12-16 | 2017-05-31 | 江苏大学 | A kind of laser auxiliary heating Long Pulse LASER perforating device and its method |
| CN106735943B (en) * | 2016-12-16 | 2018-10-09 | 江苏大学 | A kind of laser auxiliary heating Long Pulse LASER perforating device and its method |
| CN110587124A (en) * | 2019-03-30 | 2019-12-20 | 苏州福唐智能科技有限公司 | Femtosecond laser processing device |
| CN111014943A (en) * | 2019-12-23 | 2020-04-17 | 西安中科微精光子制造科技有限公司 | Double-light-source composite laser processing equipment and processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1131122C (en) | 2003-12-17 |
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| AR01 | Abandonment of patent right to avoid double patenting |
According to article 9 of the patent law and article 13 of the detailed rules for the implementation of the patent law: The invention patent of 01113609.X is authorized in this issue. At the same time, the 1237763.5 utility model patent shall be given up, and the patent right abandonment announcement shall be made on the 19 edition of the 51 edition of the utility model. |
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