CN2474263Y - Laser boring device - Google Patents
Laser boring device Download PDFInfo
- Publication number
- CN2474263Y CN2474263Y CN 01237763 CN01237763U CN2474263Y CN 2474263 Y CN2474263 Y CN 2474263Y CN 01237763 CN01237763 CN 01237763 CN 01237763 U CN01237763 U CN 01237763U CN 2474263 Y CN2474263 Y CN 2474263Y
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- China
- Prior art keywords
- laser
- wavelength laser
- utility
- long wavelength
- short
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility mode relates to a laser action device and laser process technology, comprising a long wavelength laser with long pulse and a short wavelength laser with short pulse. Laser axial traces output by the utility model are in the same horizontal surface and are mutually perpendicular. A transmitting or reflecting flat mirror is disposed in the connecting position of two bunches of lasers, and the transmitting or reflecting flat mirror forms angle of 45 degrees with the two bunches of laser axial traces. A light path of the laser output by the flat mirror is provided with a focusing lens which can shift positions along the light path. In the process of drilling holes, the process of each hole is divided into two steps, namely, the long wavelength laser drills holes firstly, and the short wavelength laser enlarges formed holes secondly. The utility model increases working efficiency under the condition of effectively guaranteeing quality. Therefore, the utility model is good for industrial application.
Description
The utility model relates to the laser application apparatus, also relates to laser processing technology.
In the prior art, Laser Processing has become the important manufacturing process of industries such as automobile, aviation, electronics, and it not only can be used for making the micro-structure that conventional method is difficult to make, and can be used for processing the unmanageable high hardness material of conventional method.For example at microelectronic industry, laser has been used to cut silicon chip, the semiconductor p-n junction of making alloying and the encapsulation of integrated circuit etc.Laser boring is mature technique the most at present.It often is used in the perforation processing to sheet metal, pottery, composite, and it can get all adjustable through hole in a series of apertures and inclination angle quickly and easily on superhard material.For example be used for the perforation processing on the turbo blade of aircraft engine and thermoelectric generator.
Laser boring generally is to adopt high-power Pulse Nd: the YAG laser instrument is as LASER Light Source, and workpiece to be processed is placed on the light path of shoot laser.Laser drilling process is an ablation process.At first, when a branch of High Power Laser Pulses is bombarded surface of the work, workpiece surface temperature sharply raises, and the surface mass of workpiece can absorb the portion of energy of laser pulse in a short period of time vaporizes, and inferior surface mass can absorb remaining energy generation fusing.Then, after laser pulse disappears, because the cooling of surface of the work, make that inferior surface portion temperature is the highest, the fusing of inferior surface mass, evaporation can produce very high pressure, and it is external that the partial melting material is expressed to workpiece, and spray from surface of the work with the form of gasification plasma.Repeat laser pulse again and again, workpiece promptly is perforated.In the process of laser boring, because conduction of heat can form the heat affected area usually in the peripheral region in hole, and produces phenomenons such as re cast layer, micro-crack, this will directly have influence on the performance and the service life of workpiece.Therefore, the high-energy that how to make full use of laser carries out hole processing, reduces the negative effect that it brings because of high temperature as far as possible simultaneously, is the key subjects that the scientific worker faces always.
Studies show that in recent years adopts short wavelength's ultra-short pulse laser can help improving the quality of punching.For example the method that the disclosed two frequency multiplication 532nm laser that utilize Q impulse Nd:YAG punch among the US6172331 can reduce the heat affected area, re cast layer and the micro-crack phenomenon that form in the punching effectively.Workpiece for same thickness, same material, use conventional long wavelength laser, for example the Pulse Nd of uncomfortable Q: YAG fundamental frequency 1064nm laser boring, only need can bore a hole less than 1 second, its punching speed is fast, but hole quality is poor; And adopt short wavelength laser punching, for example above-mentioned long wavelength laser to transfer the 266nm laser after Q and 4 frequencys multiplication, and but needing ability perforation in 2～3 minutes, its punching speed is slow, but hole quality is good.These defectives are used to heavy industrialization and are brought adverse effect.
The purpose of this utility model is, a kind of laser drilling device that can improve drilling quality and have higher punching speed is provided.
Laser drilling device of the present utility model is characterized in that, it includes the long wavelength laser (S of director's pulse
1) and the short wavelength laser (S of a short pulse
2), two laser instruments are installed on the same base, and the laser axis of its output is at same horizontal plane and vertical mutually; Two bundle laser intersections are provided with the transmission all at 45 with a two-beam axis/plane of reflection mirror, and this level crossing is transmission S fully
1The long wavelength laser of being exported, and can reflect S fully
2The optical flat mirror of the short wavelength laser of being exported, or transmission S fully
2The short wavelength laser of being exported can reflect S simultaneously fully
1The optical flat mirror of the long wavelength laser of being exported; Be provided with a condenser lens on the light path of described level crossing output laser, this condenser lens is placed on can be along on the guide rail of optical path direction shift position.
When using this laser drilling device to carry out perforation processing, earlier this laser drilling device is placed to be processed nearby, and the laser axis is mapped on to be processed of workpiece, the punching process was divided into for two steps: (1) regulates the front and back position of condenser lens, make it focus on laser focal spot on to be processed of the workpiece less than aperture to be processed, generally get 80%～90% of aperture to be processed, open long wavelength laser S then
1Output laser pulse is closed long wavelength laser S after the workpiece perforation
1Output; (2) front and back position of regulating condenser lens makes the laser focal spot that focuses on to be processed of the workpiece equal aperture to be processed, makes short wavelength laser S
2Output laser pulse, its output is closed in the end of punching when not having tangible plasma jet phenomenon.
Laser drilling device of the present utility model, two different wavelength of laser devices are assembled on the same base, and will be placed on energy in order to the convex lens that focus on the guide rail that base is done to move, thereby its position is adjusted in front and back easily, be adjusted in the size of the laser focal spot of surface of the work, shorten the adjustment time effectively, help realizing within a short period of time the punching of two steps.When using the utility model to carry out perforation processing, its processing to each hole was divided equally for two steps and is carried out, and promptly bored a hole fast with long wavelength laser earlier, and then adopted short wavelength laser to expand shaped hole.In the ream forming process, laser can be repaired the defective that quick perforation procedure forms simultaneously, promptly removes re cast layer, micro-crack and the heat affected area etc. of this hole periphery of inner wall, thereby has finally realized using the hole of getting better quality than the short time.Its reason is that optical maser wavelength is short more, and photon energy is high more, and is big more to the energy of metal function, and simultaneously material is to the absorptivity height of short wavelength laser, so the coupling efficiency height of its laser energy, the ratio of the energy of the workpiece material that really is used for vaporizing is also high.If melt substance reaches the degree of vaporization fully, then will in the hole, spray fully, can not condense upon and form re cast layer and micro-crack etc. in the hole wall.Use the perforation fast of separate unit long wavelength laser compared to existing technology, the utility model can improve the quality of machining hole effectively; The situation that adopts the separate unit short wavelength laser to punch compared to existing technology, the utility model can improve operating efficiency greatly.Therefore this laser drilling device helps industrial applications more.
Be described further below by embodiment and accompanying drawing thereof.
Fig. 1 is the structural representation of a kind of embodiment of laser drilling device of the present utility model.
Fig. 2 is a structural representation of placing the guide rail mechanism that focuses on convex lens described in the laser drilling device of the present utility model.
Among Fig. 1, (1) is long wavelength laser S
1, (2) are short wavelength laser S
2, (3) are level crossing M
1, it is transmission S fully
1The laser of being exported, and can reflect S fully
2The transmission of the laser of being exported/anacamptics level crossing, (4) are for focusing on convex lens M
2, (5) are base plate, S
1, S
2, M
1, M
2Be installed on this base plate long wavelength laser S
1With short wavelength laser S
2The laser axis of output is in same horizontal plane and vertical mutually, transmission/anacamptics level crossing M
1Place the intersections with two bundle laser axis, and respectively with two axial lines angle at 45.(6) focus on convex lens M for placing
2Guide rail mechanism.(7) be workpiece to be processed.For easy to adjust and make laser focal spot reach maximum power density, make laser instrument S in the present embodiment
1Distance L with the level crossing center
1Equal laser instrument S
2Distance L with the level crossing center
2, and the distance L between level crossing center and the condenser lens
3About desirable 10cm.
Among Fig. 2, (8) are and focus on convex lens M
2The moving slider that is connected, (9) are guiderail base, and its both sides are provided with the locating hole that is used for fixing.Moving slider is provided with the V-type groove that cooperates, the guide rail mechanism that formation can be slided relatively with the contact-making surface of guiderail base.(10) be screw rod, the internal thread in it and the moving slider hole matches, and constitutes screw rod, nut body, and the screw rod two supports is on guiderail base, and its right-hand member extends the guiderail base outside, and is connected with the main shaft of stepper motor (11).When starting stepper motor,, play to regulate focusing on convex lens M because the effect of screw rod, nut body then makes moving slider drive thus and to focus on the convex lens displacement relative to moving as guiderail base
2The effect of position.
Claims (3)
1. a laser drilling device is characterized in that, it includes the long wavelength laser (S of director's pulse
1) and the short wavelength laser (S of a short pulse
2), two laser instruments are installed on the same base, and the laser axis of its output is at same horizontal plane and vertical mutually; Two bundle laser intersections are provided with the transmission all at 45 with a two-beam axis/plane of reflection mirror; Be provided with a condenser lens on the light path of described level crossing output laser, this condenser lens is placed on can be along on the guide rail of optical path direction shift position.
2. laser drilling device as claimed in claim 1 is characterized in that, described transmission/plane of reflection mirror is transmission S fully
1The long wavelength laser of being exported, and can reflect S fully
2The optical flat mirror of the short wavelength laser of being exported.
3. laser drilling device as claimed in claim 1 is characterized in that, described transmission/plane of reflection mirror is transmission S fully
2The short wavelength laser of being exported, and can reflect S fully
1The optical flat mirror of the long wavelength laser of being exported.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01237763 CN2474263Y (en) | 2001-05-10 | 2001-05-10 | Laser boring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01237763 CN2474263Y (en) | 2001-05-10 | 2001-05-10 | Laser boring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2474263Y true CN2474263Y (en) | 2002-01-30 |
Family
ID=33650503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01237763 Expired - Lifetime CN2474263Y (en) | 2001-05-10 | 2001-05-10 | Laser boring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2474263Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107052587A (en) * | 2017-06-09 | 2017-08-18 | 广东顺德墨勒智能装备有限公司 | Laser marking machine |
-
2001
- 2001-05-10 CN CN 01237763 patent/CN2474263Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107052587A (en) * | 2017-06-09 | 2017-08-18 | 广东顺德墨勒智能装备有限公司 | Laser marking machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |