CN1381879A - Observer for semiconductor element - Google Patents
Observer for semiconductor element Download PDFInfo
- Publication number
- CN1381879A CN1381879A CN 01116634 CN01116634A CN1381879A CN 1381879 A CN1381879 A CN 1381879A CN 01116634 CN01116634 CN 01116634 CN 01116634 A CN01116634 A CN 01116634A CN 1381879 A CN1381879 A CN 1381879A
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- Prior art keywords
- observation
- fixed mount
- semiconductor device
- multiplying power
- platform
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Microscoopes, Condenser (AREA)
Abstract
An observer for semiconductor element is composed of an observing unit whose magnifying power is less than 400 and which has a movable observing platform. Its advantages are enough magnifying power, easy regulation, and low cost.
Description
The present invention relates to a kind of device of observing semiconductor device, specifically, relate to and be applied to the device that chemical mechanical milling method (CMP) is made the observation semiconductor device in the video processing and amplifying apparatus system that the supervision of the profile of part and trickle part thereof detects.
Numerous parts of making for clean room's chemical mechanical milling method (Clean room CMP), often need part profile and fine part thereof are monitored its processing quality of detection, go up the abrasion situation of diamond on pars fibrosa flaw or diamond finishing machine (Diamond Dresser) surface as detecting back film pad (Backing-film).
In the prior art, as shown in Figure 1, generally all observe with microscope direct observing or with charge coupled device (CCD) 11 special in succession screens (Monitor) 12; Although so, in practical application, still have all inconvenience.Microscopical enlargement ratio is to do the action that multiplying power is adjusted by an eyepiece 13 and object lens 14; and adjust incident ray by Light-modulating mirror 16; but it is excessive that the multiplying power of being transferred is still disliked; so that difficult focusing; thereby can't inspecting with part profile and fine part thereof; observe the situation that there are record inconvenience, video build file and comparison difficulty in regular meeting with the special in succession screen 12 of charge coupled device 11 again; even its objective table 15 and can't moving arbitrarily, thereby often need to lean on mobile object in order to aligning.
At the unworthiness in above microscope and special in succession screen 12 observations of charge coupled device 11, as shown in Figure 2, a kind of perioscope was once arranged on the market, main as amplifications such as newspapers and periodicals maps, to assist the not good enough personage of eyesight, the books, newspapers and magazines that only needs desire is amplified is placed on the objective table 25, again according to needs, adjust its multiplying power and adjust button 19 to required size, just can know identification by special screen 18, but because of its enlargement ratio very limited, so the supervision of part profile that CMP is made and fine part thereof detects, video build file and comparison still have the difficulty of certain degree.
By above explanation, we can summarize the following shortcoming of existing in prior technology:
1. the multiplying power adjustment is difficult to control, the excessive so that difficult focusing of for example microscopical enlargement ratio, thereby can't inspecting with part profile and fine part thereof.And perioscope monitors detection to part profile and the fine part thereof that CMP makes, and still dislikes the multiplying power deficiency.
2. the situation that record inconvenience, video build file and comparison difficulty are arranged with the special in succession screen viewing of charge coupled device regular meeting.
3. be not convenient to the objective table of mobile part.
4. objective table bears weight of heavy and is restricted.
The objective of the invention is to overcome the above-mentioned shortcoming of prior art, the device that provides profile that a kind of CMP of being applicable to makes part and fine part thereof to monitor the observation halfbody part of the video processing and amplifying apparatus system that detects, it can carry out the quick searching of object part or profile target etc., can monitor enlarged image to computer screen again, and the picked-up comparison that can carry out image is filed, and can be applicable to the dust free room operational environment, and maintenance is economical convenient.
For achieving the above object, the device of observation semiconductor device according to an aspect of the present invention, it comprises: an observation device, have a multiplying power, described multiplying power is within 400; And an observation platform movably, it connects described observation device, is used for placing the semiconductor part, so as to observing described semiconductor device.
In the device of described observation semiconductor device, described multiplying power is preferably within 200 times.
The device of observation semiconductor device according to a further aspect of the invention, it comprises: an observation device has one first multiplying power adjustment and one second multiplying power adjustment; And an observation platform movably, be used for placing the semiconductor part, so as to observing described semiconductor device.
In the device of described observation semiconductor device, the described first multiplying power adjustment and the second multiplying power adjustment are respectively multiplying power fine tuning button and multiplying power coarse adjustment button.
In the device of described observation semiconductor device, described multiplying power coarse adjustment button rotates multiplying power and is about 1/10 of multiplying power fine tuning button.
The device of described observation semiconductor device is inspected a profile and a fine part thereof of making one of the part, a carrier of wafer (wafer) and a processing consumptive material with chemical mechanical milling method (CMP), with the judgement that helps life cycle (life time) and the identification of processing flaw.
In the device of described observation semiconductor device, described processing consumptive material is selected from a diamond finishing machine (Diamonddresser), a back film pad (Backing-film), a lead ring (Guide-ring), a grinding pad (Pad).
In the device of described observation semiconductor device, described observation device comprises object lens, ring lamp, a multiplying power fine tuning button and a charge coupled device (CCD).
In the device of described observation semiconductor device, the fixed mount that described charge coupled device (CCD) part is separated described observation platform alone can become hand-hold type object dimensional space (3D) surperficial processing and amplifying system.
The device of observation semiconductor device as described, wherein said fixed mount has several joints, and it can rotate and stretch contraction arbitrarily order whole group charge coupled device (CCD) and eyepiece device part, in order to object dimensional space (3D) processing and amplifying.
In the device of described observation semiconductor device, described horizontal type fixed mount is made of two supports, and the arm footpath of a support that wherein connects straight formula fixed mount is comparatively thick, so as to increasing the support force of horizontal type fixed mount.
In the device of described observation semiconductor device, described fixed mount has a multiplying power coarse adjustment button, a horizontal type fixed mount reaches formula fixed mount always, described horizontal type fixed mount is connected with described straight formula fixed mount, and described multiplying power coarse adjustment button is positioned at the junction of described horizontal type fixed mount and described straight formula fixed mount.
In the device of described observation semiconductor device, described observation device and described observation platform are connected by a fixed mount, be provided with a multiplying power coarse adjustment button on the described fixed mount in addition described horizontal type support is moved up and down along described straight cribbing, with the object lens of controlling described finder optimum distance to an article carrying platform of described observation platform.
In the device of described observation semiconductor device, described object lens to the distance between described article carrying platform face is 7 ~ 12cm.
In the device of described observation semiconductor device, described observation platform has a movably article carrying platform, described article carrying platform is of a size of 45cm * 45cm * 0.9cm, X to move+/-20cm, Y to move+/-15cm, and the described chassis size that connects described observation platform at the thing platform can be capable of carrying a load of below the 3.5Kg for 48cm * 48cm * 1.4cm.
Adopt technique scheme of the present invention, the device of described observation semiconductor device can be applied to the description of partial points in the processing profile of general meticulous or precision component and the processing, or an image reproduction of a sample, and file is set up in the comparison of described sample; And structure dismounting, maintenance and operate simple and easyly, be difficult for destroying original function because of the operation careless mistake, more be applicable to particular surroundingss such as dust free room.
For clearer understanding purpose of the present invention, characteristics and advantage, preferred embodiment of the present invention is elaborated below in conjunction with accompanying drawing.
Fig. 1 is the schematic representation of apparatus of existing microscopic structure additional charge coupling device and screen;
Fig. 2 is the schematic perspective view of existing expansion visual organ device;
Fig. 3 is the structural representation of a preferred embodiment of the present invention.
See also Fig. 3, a preferred embodiment of the present invention shown in the figure.As shown in the figure, this device is by a charge coupled device 21, one multiplying power fine tuning button 22, one object lens 23, one objective table 35, one chassis 24, one multiplying power coarse adjustment button 26, one fixed mount 27, one computer 28 and a ring lamp 29 that contains the image capture card formed, multiplying power adjusting device when wherein said multiplying power fine tuning button 22 and 26 conducts of described multiplying power coarse adjustment button are observed, wherein said multiplying power coarse adjustment button 26 is connected on the described fixed mount 27, connected by several joints between the described again fixed mount 27, can make whole group charge coupled device and eyepiece device part can rotate and stretch contraction arbitrarily, in order to object dimensional space (3D) processing and amplifying, wherein each described part can be separated fixed mount alone again, to become hand-hold type object dimensional space (3D) surperficial processing and amplifying system immediately.
Before desiring the object of observation, need to rotate earlier described multiplying power coarse adjustment button 26 to adjust the spacing of object lens 23 to objective table 35, again with multiplying power fine control button 22 inching object lens 23, wherein said objective table 35 can move freely on chassis 24, thereby can finely tune to optimum to carry out image by mobile described objective table 35, also can adjust the brightness of the described ring of light 29, to increase the definition of the described object of observation, image capture with the described object of observation stores in the computer path again, and by the described computer 28 that contains the image capture card so that the clear structure that reads the described object of observation.
In sum, compared to prior art, the present invention has following advantage: 1. the loading of loading table top and X-Y The axial translation ability has obvious raising, and maximum can be honoured and resemble heavy 3.5Kg, and removable article carrying platform (45cm * 45cm): X-direction moves+/-20cm; Y-direction moves+/-15cm; Chassis 48cm * 48cm; General microscope may have Objective table 7cm * 7cm or 25cm * 25cm, but there is no translation functions. 2. tested special enlargement ratio model Enclose bigger, magnifying power: 1 ~ 200 times, for made by CMP 8 " part of wafer, carrier and processing consumption product as Inspecting of the profile of diamond finishing machine, lead ring, back film pad, grinding pad etc. and fine part thereof helps to use The identification of the judgement in life-span and processing flaw. 3. the processing profile that can be applied to general meticulous or precision component reaches The heavy partial points of processing is described, or the image reproduction of sample, and file is set up in the sample comparison. 4. this structure (contains figure Picture picked-up card) cost is low. 5. the dismounting of this structure, maintenance and operate simple and easyly is difficult for destroying because of the operation careless mistake Original function more is applicable to the particular surroundings such as dust free room.
The shortcoming that so the present invention's enlargement ratio in overcoming prior art is too small, adjustment is difficult for, in addition with objective table Be designed to movably structure, and increase the anti-severe of described objective table, in order to adjusting the observation bit of wanting the object of observation Put, and low cost, thereby have the practical value of industry development.
Claims (26)
1. device of observing semiconductor device is characterized in that it comprises:
One observation device has a multiplying power, and described multiplying power is within 400; And
One observation platform movably, it connects described observation device, is used for placing the semiconductor part, so as to observing described semiconductor device.
2. the device of observation semiconductor device as claimed in claim 1 is characterized in that, described multiplying power is preferably within 200 times.
3. the device of observation semiconductor device as claimed in claim 2, it is characterized in that, the device of observing semiconductor device is inspected one of part, a carrier and a processing consumptive material of a wafer made from chemical mechanical milling method profile and fine part thereof, judges and the identification of processing flaw to help life cycle.
4. the device of observation semiconductor device as claimed in claim 3 is characterized in that, described processing consumptive material is selected from one of a diamond finishing machine, a back film pad, a lead ring, a grinding pad.
5. observation semiconductor device device as claimed in claim 1 is characterized in that, an observation device comprises object lens, ring lamp, a multiplying power fine tuning button and a charge coupled device.
6. the device of observation semiconductor device as claimed in claim 1 is characterized in that, the fixed mount that described charge coupled device part is separated described observation platform alone promptly becomes hand-hold type object dimensional spatial surface processing and amplifying system.
7. the device of observation semiconductor device as claimed in claim 6 is characterized in that, described fixed mount has several joints, makes whole group charge coupled device and eyepiece device part can rotate and stretch contraction arbitrarily, in order to the processing and amplifying in object dimensional space.
8. the described a kind of device of observing semiconductor device of claim 7, it is characterized in that, described fixed mount has a multiplying power coarse adjustment button, a horizontal type fixed mount reaches formula fixed mount always, described horizontal type fixed mount is connected with described straight formula fixed mount, and described multiplying power coarse adjustment button is positioned at the junction of described horizontal type fixed mount and described straight formula fixed mount.
9. the device of observation semiconductor device as claimed in claim 8 is characterized in that, described horizontal type fixed mount is made of two supports, and the arm footpath of a support that wherein connects straight formula fixed mount is thicker, so as to increasing the support force of horizontal type fixed mount.
10. the device of observation semiconductor device as claimed in claim 1, it is characterized in that, described observation device is that described observation platform is connected by a fixed mount, be provided with a multiplying power coarse adjustment button on the fixed mount of formula always of described fixed mount in addition the horizontal type support is moved up and down along described straight cribbing, with the object lens of controlling described finder optimum distance to an article carrying platform of described observation platform.
11. the device of observation semiconductor device as claimed in claim 10 is characterized in that, described object lens to the distance between described article carrying platform face is 7 ~ 12cm.
12. the device of observation semiconductor device as claimed in claim 1, it is characterized in that, described observation platform has a movably article carrying platform, described article carrying platform is of a size of 45cm * 45cm * 0.9cm, X to move+/-20cm, Y to move+/-15cm, and the described chassis size that connects described observation platform at the thing platform is 48cm * 48cm * 1.4cm, can be capable of carrying a load of below the 3.5Kg.
13. a device of observing semiconductor device is characterized in that it comprises:
One observation device has one first multiplying power adjustment and one second multiplying power adjustment; And
One observation platform movably is used for placing the semiconductor part, so as to observing described semiconductor device.
14. the device of observation semiconductor device as claimed in claim 13 is characterized in that, one first multiplying power adjustment and one second multiplying power adjustment are respectively multiplying power fine tuning button and multiplying power coarse adjustment button.
15. the device of observation semiconductor device as claimed in claim 13 is characterized in that, multiplying power coarse adjustment button rotates multiplying power and is about 1/10 of multiplying power fine tuning button.
16. the device of observation semiconductor device as claimed in claim 13 is characterized in that, multiplying power is the highest can be to 400 times, as only being used as the device of observing semiconductor device, then with 200 multiplying power best results.
17. the device of observation semiconductor device as claimed in claim 16, it is characterized in that, the device of observing semiconductor device is selected from the part of a wafer made from chemical mechanical milling method, inspecting of one of one carrier and processing consumptive material profile and fine part thereof helps life cycle to judge and process the identification of flaw.
18. the device of observation semiconductor device as claimed in claim 17 is characterized in that, described processing consumptive material is selected from a diamond finishing machine, a back film pad, a lead ring and a grinding pad.
19. the device of observation semiconductor device as claimed in claim 13 is characterized in that, an observation device comprises object lens, ring lamp, a multiplying power fine tuning button and a charge coupled device.
20. the device of observation semiconductor device as claimed in claim 13 is characterized in that, whole group charge coupled device part is separated fixed mount alone can promptly become hand-hold type object dimensional spatial surface processing and amplifying system.
21. the device of observation semiconductor device as claimed in claim 13 is characterized in that, adds several joints between fixed mount, so that contraction can be rotated and stretch to whole group device and eyepiece device part arbitrarily, in order to the processing and amplifying in object dimensional space.
22. the device of the described observation halfbody of claim 21 part, it is characterized in that, described fixed mount has a multiplying power coarse adjustment button, a horizontal type fixed mount reaches formula fixed mount always, described horizontal type fixed mount is connected with described straight formula fixed mount, and described multiplying power coarse adjustment button is positioned at the junction of described horizontal type fixed mount and described straight formula fixed mount.
23. the device of observation halfbody part as claimed in claim 22 is characterized in that, described horizontal type fixed mount is made of two stands, and the arm footpath of one section support that wherein connects straight formula fixed mount is thicker, to increase the support force of support.
24. observation semiconductor device device as claimed in claim 13, it is characterized in that, described observation device and described observation platform are connected by a fixed mount, be provided with a multiplying power coarse adjustment button on the fixed mount of formula always of described fixed mount in addition and can make the horizontal type support prolong described straight cribbing to move up and down, with the object lens of controlling described finder optimum distance to an article carrying platform of described observation platform.
25. as described in claim 24, it is characterized in that described object lens to the distance between described article carrying platform face is 7 ~ 12cm.
26. observation semiconductor device device as claimed in claim 13, it is characterized in that, described observation platform has removable article carrying platform, described article carrying platform is of a size of 45cm * 45cm * 0.9cm, X to move+/-20cm, Y to move+/-15cm, and the described chassis size that described article carrying platform connects described observation platform is 48cm * 48cm * 1.4cm, can be capable of carrying a load of below the 3.5Kg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01116634 CN1282235C (en) | 2001-04-17 | 2001-04-17 | Observer for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01116634 CN1282235C (en) | 2001-04-17 | 2001-04-17 | Observer for semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1381879A true CN1381879A (en) | 2002-11-27 |
| CN1282235C CN1282235C (en) | 2006-10-25 |
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ID=4662539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01116634 Expired - Lifetime CN1282235C (en) | 2001-04-17 | 2001-04-17 | Observer for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1282235C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102509710A (en) * | 2011-10-18 | 2012-06-20 | 南通富士通微电子股份有限公司 | Semiconductor product inspection bench |
| CN104470681A (en) * | 2012-06-21 | 2015-03-25 | 国立大学法人鹿儿岛大学 | Observation and photography apparatus |
| CN107748428A (en) * | 2017-10-18 | 2018-03-02 | 歌尔股份有限公司 | Screen detects Atomatic focusing method and device |
| CN109445042A (en) * | 2018-12-05 | 2019-03-08 | 深圳市埃尔法光电科技有限公司 | A kind of low cost imaging and passive imaging formula high speed light path coupling system |
-
2001
- 2001-04-17 CN CN 01116634 patent/CN1282235C/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102509710A (en) * | 2011-10-18 | 2012-06-20 | 南通富士通微电子股份有限公司 | Semiconductor product inspection bench |
| CN104470681A (en) * | 2012-06-21 | 2015-03-25 | 国立大学法人鹿儿岛大学 | Observation and photography apparatus |
| CN107748428A (en) * | 2017-10-18 | 2018-03-02 | 歌尔股份有限公司 | Screen detects Atomatic focusing method and device |
| CN109445042A (en) * | 2018-12-05 | 2019-03-08 | 深圳市埃尔法光电科技有限公司 | A kind of low cost imaging and passive imaging formula high speed light path coupling system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1282235C (en) | 2006-10-25 |
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Granted publication date: 20061025 |