CN1378270A - Self-aligning separate grid non-volatile storage unit and its producing method - Google Patents
Self-aligning separate grid non-volatile storage unit and its producing method Download PDFInfo
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- CN1378270A CN1378270A CN01110193.8A CN01110193A CN1378270A CN 1378270 A CN1378270 A CN 1378270A CN 01110193 A CN01110193 A CN 01110193A CN 1378270 A CN1378270 A CN 1378270A
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000003860 storage Methods 0.000 title claims description 41
- 229920005591 polysilicon Polymers 0.000 claims abstract description 127
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 126
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 113
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 113
- 238000005530 etching Methods 0.000 claims abstract description 57
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000002360 preparation method Methods 0.000 claims description 16
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- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
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Abstract
The present invention is a preparing method of non-volatile storing unit for self-aligning separate grid, which utilizes a silicon nitride light casing and a light resistance to etch the silicon nitride layer for forming a stepped silicon nitride layer with a high thickness area and another layer with a low thickness area. To etch the first position of the said low thickness area, the thickness of high thickness area in the first position of grid polysilicon is also decreased. To etch off the silicon nitride layer of the second position in the low thickness area at the position of the first polysilicon layer underneath the silicon nitride by using polysilicon, the thickness of silicon nitrde in rather thick zone adjacent to the second position is decreased by etching.
Description
The invention relates to improving one's methods of a kind of manufacturing separate grid non-volatile storage unit memory cell (NVM), and particularly relevant for a kind of in order to make to select grid to be self aligned in the improving one's methods of separate type Nonvolatile storage unit memory cell of suspension joint grid, therefore can get rid of problems of missing aim, and can under the situation that does not need mass upgrade etching lithographic apparatus, make that the live width of memory cell can be further reduced.
Nonvolatile storage unit or non-volatile electrical changeable semiconductor memory component have minimum size, and have become a kind of important consumptive material every day.In general, electric convertibility can be utilized and make position so-called Fowler-Nordheim between suspension joint grid (not connecting any conductive component) and silicon base wear electric charge then and reach this purpose by an extremely thin dielectric layer.Each storage element all needs a suspension joint grid and to select grid.Selecting grid is a key factor wherein of the remarkable negative effect split gate cell performance of meeting with respect to the misalignment degree of suspension joint grid.A kind of preparation method of non-self-aligned separable grid then must list the alignment tolerant degree in consideration.If the degree of misalignment surpasses the alignment tolerant degree, many undesired element characteristicss will occur.Some typical problems comprise ungratified program efficiency, asymmetric cell electric current and not good to the immunity of drain electrode upset when procedure operation.
United States Patent (USP) the 5th, 280, disclose for No. 446 a kind of cosine background information about laminated quickflashing EPROM assembly with and relevant problem.The flash memory cell circuit that is disclosed in this patent includes a plurality of positions at intrabasement memory element, comprises the semiconductor-based end, drain region, source area and suspension joint grid and control grid and selects grid.In the special arrangement of memory in the array is that drain voltage when making the sequencing of memory cell can be reduced by high efficiency ejaculation hot electron, thus can be under the LVPS supply situation complete operation.
United States Patent (USP) the 5th, 029,130 and 5,045,108 and 5,067,108 memory cell that disclose a kind of one-transistor electricity programmable and the formula of can erasing, it has one source pole, a drain electrode, and one is defined in the substrate in order to isolate the channel region of source electrode, drain.First insulating barrier then is to be used for covering source electrode, channel and drain region, and the suspension joint grid on channel region and drain region.Second insulating barrier with last abutment wall then be used for covering the suspension joint grid with and the sidewall that is close to.The first position formula of control grid is covered on first insulating barrier, and its second position then is covered in the last abutment wall and the suspension joint grid of second insulating barrier.This control grid is not self aligned in floating grid, and many problems of missing aim then still exist.
United States Patent (USP) the 5th, 674 has disclosed the method that a kind of manufacturing has the non-volatile memory element of self-aligned structure No. 767.Wherein, flash memory devices has separated grid structure, and the method is included in the step that forms a gate insulating film at semiconductor-based the end.Semiconductor layer is to be formed on the gate insulating film, is etched into floating grid then, and the semiconductor pattern between floating grid.Then, after floating grid forms, impurity is injected into the same side of substrate.Then, the film that deposits a planarization in substrate, and the time to the upper surface of floating grid, make semiconductor pattern expose out.After the semiconductor pattern removal, impurity is injected enter in the substrate, form the one source pole district.Then, planar film is removed, the floating grid surface exposure is come out, form a dielectric layer then in its surface.At last, form a control grid in substrate.Though the method that this patent disclosed can make floating grid be self aligned in the source/drain impurity range, so control then still existence of problems of missing aim between grid and floating grid.
United States Patent (USP) the 5th, 330 has disclosed a kind of method of non-volatile separable grid EPROM memory cell and method of self-aligned field insulation made for No. 938.This memory cell includes a substrate that contains source diffusion region and drain diffusion regions, and wherein source diffusion region and drain diffusion are interval and be isolated from each other with channel region.The floating grid and the control grid that are formed at first position of channel region are made of first and second polysilicons respectively, the cell gate oxide layer then be the position between first position of floating grid and channel region, interior polysilicon oxide layer then is that the position is between floating grid and control grid and a dielectric film.The suspension joint grid is self aligned in drain diffusion regions, and the control grid then is self aligned in suspension joint grid and source electrode, drain diffusion regions.Yet the method is quite complicated when implementing, so manufacturing cost is significantly promoted.In addition, when growing floating grid, the peripheral length of control grid can't implement.
The objective of the invention is to disclose a kind of self-aligned separate grid non-volatile storage unit and manufacture method thereof, it selects the misalignment degree between grid and floating grid minimum.More particularly, feature of the present invention be disclose a kind of in order to make improving one's methods of the separate type Nonvolatile storage unit of selecting grid to be self aligned in floating grid, therefore can get rid of problems of missing aim, and can under the situation of the etching lithographic apparatus that does not need extensive replacing upgrading, make that the live width of memory cell can be further reduced.
Purpose of the present invention can reach by following measure:
A kind of self-aligned separate grid non-volatile storage unit manufacture method, its step comprises:
Form a tunneling oxide layer, one first polysilicon layer and a silicon nitride layer in regular turn on a silicon base;
Utilize a silicon nitride light shield and a photoresistance to come this silicon nitride layer of etching, make it become stepped silicon nitride layer with a high caliper zones and a low caliper zones, wherein should low caliper zones containing one becomes first position in floating grid zone corresponding to preparation, and one becomes second position of drain region, unit corresponding to preparation;
Utilize one first light shield and a photoresistance etching should hang down first position of caliper zones, first polysilicon layer that preparation is become the bottom of floating grid polar region exposes out, wherein at the same time, this adjacency is somebody's turn to do the position of the high caliper zones at first position of hanging down caliper zones, and its thickness also is reduced when etching;
Make first polysilicon layer of this exposure be oxidized to a polysilicon oxide layer;
Utilize a unit drain electrode light shield and a photoresistance, this second position silicon nitride layer that will hang down caliper zones with silicon nitride etch etches away, and utilize the etching of polysilicon etching method to be positioned at the first beneath polysilicon layer of this silicon nitride layer, the wherein also etched reduction in this silicon nitride etch step of thickness of the silicon nitride layer at this thicker regional position at contiguous this second position;
Implement drain electrode and inject, then this silicon nitride layer is removed to form the drain electrode of thin unit;
Use this polysilicon oxide layer as a hard cover screen, with this first polysilicon layer of etching;
Form an abutment wall dielectric layer around this first polysilicon layer;
Deposit one second polysilicon layer and cover this substrate;
Use one second polysilicon light shield and this second polysilicon layer of a photoresistance etching; And
Using a cell source light shield and a photoresistance to implement cell source injects.
A kind of tool self-aligned separate grid non-volatile storage unit comprises that one selects grid, a floating grid and a dielectric capacitor, and this self-aligned separate grid non-volatile storage unit can be manufactured according to following step, comprising:
Form a tunneling oxide layer, one first polysilicon layer and a silicon nitride layer in regular turn on a silicon base;
Utilize a silicon nitride light shield and a photoresistance to come this silicon nitride layer of etching, make it become stepped silicon nitride layer with a high caliper zones and a low caliper zones, wherein should low caliper zones containing one becomes first position in floating grid zone corresponding to preparation, and one becomes second position of drain region, unit corresponding to preparation;
Utilize one first light shield and a photoresistance etching should hang down first position of caliper zones, first polysilicon layer that preparation is become the bottom of floating grid polar region exposes out, wherein at the same time, this adjacency is somebody's turn to do the position of the high caliper zones at first position of hanging down caliper zones, and its thickness also is reduced when etching;
Make first polysilicon layer of this exposure be oxidized to a polysilicon oxide layer;
Utilize a unit drain electrode light shield and a photoresistance, this second position silicon nitride layer that will hang down caliper zones with silicon nitride etch etches away, and utilize first polysilicon layer of polysilicon etching method etching position under this silicon nitride layer, wherein the also etched reduction in this silicon nitride etch step of thickness of the silicon nitride layer at this thicker regional position at contiguous this second position;
Implement drain and inject, then this silicon nitride layer is removed to form the unit drain electrode;
Use this polysilicon oxide layer as a hard cover screen, with this first polysilicon layer of etching;
Form an abutment wall dielectric layer around this first polysilicon layer;
Deposit one second polysilicon layer and cover this substrate;
Use one second polysilicon light shield and this second polysilicon layer of a photoresistance etching;
Using a cell source light shield and a photoresistance to implement cell source injects; And
First polysilicon layer forms this floating grid, and this second polysilicon layer then forms the selection grid of this self-aligned Nonvolatile storage unit.
The present invention has following advantage compared to existing technology:
Disclosed method comprises the following steps:
Form a tunneling oxide layer in a substrate;
Deposit one first polysilicon layer on this tunneling oxide layer, and then mix it;
Deposit a silicon nitride layer on this first polysilicon layer;
Utilize one to expose the silicon nitride light shield deposition of floating grid and drain region, unit and the silicon nitride photoresistance that develops;
Implement first silicon nitride etch, fall silicon nitride layer, remove the silicon nitride photoresistance then with partially-etched;
Utilize first polysilicon light shield deposition and develop to expose previous etched silicon nitride layer with and first photoresistance of the presumptive area of contiguous not etches both silicon nitride layer;
Implement silicon nitride etch for the second time, further the previous etched silicon nitride layer of etching with and the presumptive area of contiguous not etches both silicon nitride layer,, till first polysilicon layer under the silicon nitride layer exposes, then photoresistance is removed until the position;
Use silicon nitride layer as mask, make first polysilicon layer that exposes produce oxidation reaction, and form a polysilicon oxide layer.But, be noted that because stepped silicon nitride layer of the present invention, thus use whole silicon nitride layer as mask when carrying out the oxidation reaction of first polysilicon layer, the position that drains, unit is labeled, perhaps self-aligned;
Use unit drain electrode light shield deposition and the unit drain electrode photoresistance that develops, and then continue the etching of the 3rd silicon nitride, etching, drain injection and the removal photoresistance of first polysilicon;
Perhaps, can before removing, execute photoresistance a drain electrode oxidation step earlier, to increase the oxidated layer thickness of position in drain electrode;
Utilize hot phosphoric acid or wet etching to remove silicon nitride layer;
Utilize polysilicon oxide layer as hard mask, etching first polysilicon layer;
Utilize the deposition or the growth of dielectric material, around first polysilicon layer of remnants, form a sidewall dielectric layer;
Deposit one second polysilicon layer on wafer, and then carry out ion and inject;
Use one second polysilicon light shield deposition and the second polysilicon photoresistance that is covered on second polysilicon layer for preparing conduct selection grid that develops, and then etching second polysilicon layer, and then remove photoresistance; And
Use the cell source light shield deposition and the cell source photoresistance that develops, and then carry out source electrode and inject, and remove photoresistance.
Disclosed the method uses the first silicon nitride light shield to make that the silicon nitride layer of half is etched, and then utilization has the etching end point of the silicon nitride layer of step-thickness configuration as first polysilicon layer of position under it.In other words, stepped silicon nitride layer is to be used for defining floating grid and unit drain electrode.Therefore, select the length of grid to be determined by the silicon nitride light shield in advance.This separate grid non-volatile storage unit according to the present invention has the feature of self-aligned, so can have preferable symmetry and performance.In addition, the feature of this self-aligned also allows the size of separable grid memory cell structure to dwindle further, and does not need huge cost in order to upgrading photoetching process and equipment.
For making advantages and features of the invention more clearly visible, now will be with preferred embodiment according to the present invention, and cooperate relevant drawings, be described in detail as follows:
Description of drawings
That Fig. 1 shows is the wafer cross figure that is formed with silicon nitride layer, first polysilicon layer and tunneling oxide layer in the substrate.
Fig. 2 is a profile, its demonstration be that wafer is applied photoetching, and make the silicon nitride layer of a half thickness etched, form a stepped silicon nitride layer, it includes the etched position of part, outstanding position and not etched position.
Fig. 3 is a profile, its demonstration be on stepped silicon nitride layer, to form a photoresistance, as the first polysilicon light shield.
Fig. 4 is a profile, its demonstration be etching not by the outstanding position that photoresistance covered, and first polysilicon layer of position under it expose, and then be oxidized to polysilicon oxide layer.
Fig. 5 shows the profile that is to use unit drain electrode light shield to form a photoresistance on this silicon nitride layer.
Fig. 6 shows is that drain electrode is injected and removed profile behind photoresistance and the silicon nitride layer.
What Fig. 7 showed is to use polysilicon oxide layer as hard mask, with the profile of first polysilicon layer removal.
What Fig. 8 showed is the profile of deposition second polysilicon layer on wafer.
What Fig. 9 showed is the profile that the second polysilicon photoetching technique forms the selectivity grid of second polysilicon layer formation.
Figure 10 shows be form a light shield on wafer as the cell source light shield, and then implement the profile that source electrode impurity injects.
What Figure 11 showed is the profile of separate grid non-volatile storage unit structure of the present invention.
What Figure 12 showed is to form a plurality of profiles according to separate grid non-volatile storage unit structure of the present invention on same wafer.
The present invention discloses a kind of method of making the Nonvolatile storage unit of separable grid type, wherein The grid of selecting is self aligned in the floating grid in alignment with the drain electrode of unit, so can get rid of misalignment Problem, and then in the situation that does not need huge cost and upgrading photoetch instrument, the permission memory cell Size can reduce further. The one main key of the method is that optical lithography can be at first polysilicon Form a stepped silicon nitride layer on the layer. This stepped silicon nitride layer comprises a depressed area, and it will be follow-up Etch process is etched, to expose the first polysilicon layer surface of position under it, becomes then floating grid The utmost point. Same stepped silicon nitride layer will further be used for forming the unit drain electrode.
Therefore, in the method for the invention, same silicon nitride light shield will can be used to define floating grid and Therefore unit drain electrode selects the length of grid can utilize this silicon nitride light shield and be predetermined. Because this The feature of self-aligned, the Nonvolatile storage unit of separable grid of the present invention will have better right Title property, and the performance of improving. In addition, the characteristic of this self-aligned also allows separable grid memory knot The size of structure can be in the situation that does not need huge cost with upgrading light etching process and equipment, further by Reduction.
Disclosed method mainly comprises the following steps:
(1) form in regular turn a tunneling oxide layer, one first polysilicon layer and a silicon nitride layer on a silicon base:
(2) utilize a silicon nitride light shield and a photoresistance to come this silicon nitride layer of etching, it is become have a height The stepped silicon nitride layer of caliper zones and a low caliper zones wherein should low caliper zones contain one corresponding to preparation Become first position in floating grid zone, and one becomes second of drain region, unit corresponding to preparation The position;
(3) utilize one first light shield and a photoresistance etching should hang down first position of caliper zones, preparation is become First polysilicon layer of the bottom of floating grid polar region exposes out, and wherein at the same time, this adjacency should be low thick The position of the high caliper zones at first position in degree district, its thickness also is reduced when etching;
(4) make first polysilicon layer of this exposure be oxidized to a polysilicon oxide layer;
(5) utilize unit drain electrode light shield and a photoresistance, will hang down being somebody's turn to do of caliper zones with silicon nitride etch The second position silicon nitride layer etches away, and utilizes polysilicon etching method etching position under this silicon nitride layer First polysilicon layer, the thickness of the silicon nitride layer at this thicker regional position at contiguous this second position wherein Also etched reduction in this silicon nitride etch step;
(6) implementing drain electrode injects;
(7) remove this silicon nitride layer;
(8) use this polysilicon oxide layer as a hard mask, with this first polysilicon layer of etching;
(9) form an abutment wall dielectric layer around this first polysilicon layer;
(10) deposition one second polysilicon layer covers this substrate;
(11) use one second polysilicon light shield and this second polysilicon layer of a photoresistance etching; And
(12) using a cell source light shield and a photoresistance to implement cell source injects.
In order to improve definition, many obvious and general steps are by being omitted in the aforesaid explanation Fall. These steps comprise at the beginning the doping that well forms, field oxide is grown up, polysilicon becomes and Finish removal of the photoresistance behind the etching step etc. These steps are the step well-known to those skilled in the art Suddenly, so do not repeat them here. Yet of the present invention one main key is to be to form stepped silicon nitride, Wherein thicker position is the etching end point as subsequent silicon nitride etch step, and this will allow the suspension joint grid Formation, and can utilize identical silicon nitride light shield to finish unit drain electrode, but make select gate alignment in Suspension joint grid and the peripheral length of selecting grid.
Below will content of the present invention be discussed, but be noted that these embodiment are not in order to limit the present invention in order to convenient explanation advantages and features of the invention only so that embodiment is more detailed.
Embodiment:
The 1st～11 figure shows is with the profile of the key step of making the self-aligned separate grid non-volatile storage unit according to the present invention.These accompanying drawings will be in following detailed description.
Fig. 1 shows a wafer, also wraps in its substrate 1 to be formed with a silicon nitride layer 4, first polysilicon layer 3 and a tunneling oxide layer 2.Be preferably, this tunneling oxide layer is to utilize to wear then to be oxidized to regular way formation, and its thickness is about 50～150 .In addition, the thickness of first polysilicon layer and silicon nitride layer is preferably and is respectively 500～3000 and 300～3000 .
What Fig. 2 showed is wafer to be executed an etching lithography process, etches away in order to the silicon nitride layer with a half thickness, forms a stepped silicon nitride layer, and it includes, and a part is etched, part projection and not etched position.Fig. 2 shows that also silicon nitride layer 4 has become stepped silicon nitride layer, and the thick regional 4a of wherein high thickness is covered by silicon nitride photoresistance 5, and low thickness area 4b is not then covered by photoresistance.
What Fig. 3 showed is to form one first polysilicon photoresistance 6 on stepped silicon nitride layer, with as the first polysilicon light shield.
Fig. 4 shows and cooperates the first polysilicon light shield, and the low thickness position of silicon nitride layer is etched to first polysilicon layer under exposing, and the thickness at the high thickness position of silicon nitride layer also reduces in this etching process simultaneously.The thicker position of silicon nitride layer is as etching end point when the silicon nitride layer position of the low thickness of etching.Then, after photoresistance is removed, will expose first polysilicon layer zone oxide layer polysilicon oxide layer.
What Fig. 5 showed is the engagement unit light shield, forms unit drain electrode light shield 8, makes that not the low thickness silicon nitride layer that is covered by unit drain electrode light shield 8 is etched, and the thickness of high thickness silicon nitride layer also reduces in this etching process simultaneously.After the etching of silicon nitride layer finishes, the etching step of first polysilicon layer under beginning to carry out.
What Fig. 6 showed is to utilize drain electrode impurity to inject formed drain region, and then removes silicon nitride layer (hot phosphoric acid solution or wet etching) and unit drain electrode photoresistance 8.Fig. 6 also shows the carrying out of removing the thick drain electrode oxidation step of photoresistance, is be used for increasing the thickness of position in the oxide layer 11 on surface, drain region.If need, side wall oxide 13 also can utilize wet infusion process to remove.
What Fig. 7 showed is the profile that utilizes polysilicon-oxide layer as hard cover screen first polysilicon layer to be removed, and makes the polysilicon layer of winning finally become the floating grid of Nonvolatile storage unit.
What Fig. 8 showed is deposition one second polysilicon layer on wafer, and what Fig. 9 showed then is to utilize the 2nd polysilicon light shield that second polysilicon layer is defined as the selection grid.This second polysilicon layer preferably is made of the pure silicon polycrystal or the multi-crystal silicification metal level of thickness 1000～4000 dusts.
What Figure 10 showed is that photoresistance 15 removals are thick, forms a cell source photoresistance 16 in wafer surface.
What at last, Figure 11 showed is with the profile after the removal of cell source photoresistance.
What the 1st～11 figure showed only is a unit, and what Figure 12 showed then is to form a plurality of profiles according to separate grid non-volatile memory structures of the present invention on same wafer.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; allly know art technology person; without departing from the spirit and scope of the present invention; the various changes of being done all fall within the scope of the invention with retouching, and therefore scope of patent protection of the present invention is when looking appended claim and being as the criterion in conjunction with specification and accompanying drawing scope.
Claims (20)
1. self-aligned separate grid non-volatile storage unit manufacture method is characterized in that said method comprising the steps of:
Form a tunneling oxide layer, one first polysilicon layer and a silicon nitride layer in regular turn on a silicon base;
Utilize a silicon nitride light shield and a photoresistance to come this silicon nitride layer of etching, make it become stepped silicon nitride layer with a high caliper zones and a low caliper zones, wherein should low caliper zones containing one becomes first position in floating grid zone corresponding to preparation, and one becomes second position of drain region, unit corresponding to preparation;
Utilize one first light shield and a photoresistance etching should hang down first position of caliper zones, first polysilicon layer that preparation is become the bottom of floating grid polar region exposes out, wherein at the same time, this adjacency is somebody's turn to do the position of the high caliper zones at first position of hanging down caliper zones, and its thickness also is reduced when etching;
Make first polysilicon layer of this exposure be oxidized to a polysilicon oxide layer;
Utilize a unit drain electrode light shield and a photoresistance, this second position silicon nitride layer that will hang down caliper zones with silicon nitride etch etches away, and utilize first polysilicon layer of polysilicon etching method etching position under this silicon nitride layer, wherein the also etched reduction in this silicon nitride etch step of thickness of the silicon nitride layer at this thicker regional position at contiguous this second position;
Implement drain and inject, then this silicon nitride layer is removed to form the unit drain electrode;
Use this polysilicon oxide layer as a hard mask, with this first polysilicon layer of etching;
Form an abutment wall dielectric layer around this first polysilicon layer;
Deposit one second polysilicon layer and cover this substrate;
Use one second polysilicon light shield and this second polysilicon layer of a photoresistance etching; And
Using a cell source light shield and a photoresistance to implement cell source injects.
2. self-aligned separate grid non-volatile storage unit manufacture method as claimed in claim 1 is characterized in that: wherein include silicon nitride in this silicon nitride layer.
3. self-aligned separate grid non-volatile storage unit manufacture method as claimed in claim 1 is characterized in that: the thickness that wherein should low thickness nitrogenize silicon area be had is half of this high thickness nitrogenize silicon area.
4. self-aligned separate grid non-volatile storage unit manufacture method as claimed in claim 1 is characterized in that: wherein the thickness of this tunneling oxide layer is 50～150 .
5. self-aligned separate grid non-volatile storage unit manufacture method as claimed in claim 1 is characterized in that: wherein the thickness of this silicon nitride layer is 300～3000 .
6. self-aligned separate grid non-volatile storage unit manufacture method as claimed in claim 1 is characterized in that: wherein the thickness of this first polysilicon layer is 300～3000 .
7. self-aligned separate grid non-volatile storage unit manufacture method as claimed in claim 1 is characterized in that: wherein the thickness of this second polysilicon layer is 1000～3000 .
8. self-aligned separate grid non-volatile storage unit manufacture method as claimed in claim 1 is characterized in that: wherein this second polysilicon layer includes pure silicon polycrystal or multi-crystal silicification metal.
9. self-aligned separate grid non-volatile storage unit manufacture method as claimed in claim 1 is characterized in that: wherein after this drain electrode is injected, more comprise a drain electrode oxidation step, be covered in this unit with increase and leak oxidated layer thickness on drain.
10. self-aligned separate grid non-volatile storage unit manufacture method as claimed in claim 1, it is characterized in that: wherein using this polysilicon oxide layer as a hard mask, before the step with this first polysilicon layer of etching, the removal step that more comprises an abutment wall polysilicon oxide is in order to etch away this first polysilicon layer.
11. tool self-aligned separate grid non-volatile storage unit, it is characterized in that: comprise that one selects grid, a floating grid and a dielectric capacitor, this self-aligned separate grid non-volatile storage unit can be manufactured according to following step, comprising:
Form a tunneling oxide layer, one first polysilicon layer and a silicon nitride layer in regular turn on a silicon base;
Utilize a silicon nitride light shield and a photoresistance to come this silicon nitride layer of etching, make it become stepped silicon nitride layer with a high caliper zones and a low caliper zones, wherein should low caliper zones containing one becomes first position in floating grid zone corresponding to preparation, and one becomes second position in drain zone, unit corresponding to preparation;
Utilize one first light shield and a photoresistance etching should hang down first position of caliper zones, first polysilicon layer that preparation is become the bottom of suspension joint gate regions exposes out, wherein at the same time, this adjacency is somebody's turn to do the position of the high caliper zones at first position of hanging down caliper zones, and its thickness also is reduced when etching;
Make first polysilicon layer of this exposure be oxidized to a polysilicon oxide layer;
Utilize a unit drain light shield and a photoresistance, this second position silicon nitride layer that will hang down caliper zones with silicon nitride etch etches away, and utilize first polysilicon layer of polysilicon etching method etching position under this silicon nitride layer, wherein the also etched reduction in this silicon nitride etch step of thickness of the silicon nitride layer at this thicker regional position at contiguous this second position;
Implement drain electrode and inject, then this silicon nitride layer is removed to form the unit drain electrode;
Use this polysilicon oxide layer as a hard mask, with this first polysilicon layer of etching;
Form an abutment wall dielectric layer around this first polysilicon layer;
Deposit one second polysilicon layer and cover this substrate;
Use one second polysilicon light shield and this second polysilicon layer of a photoresistance etching;
Using a cell source light shield and a photoresistance to implement cell source injects; And
First polysilicon layer forms this floating grid, and this second polysilicon layer then forms the selection grid of this self-aligned Nonvolatile storage unit.
12. tool self-aligned separate grid non-volatile storage unit as claimed in claim 11 is characterized in that: wherein include silicon nitride in this silicon nitride layer.
13. tool self-aligned separate grid non-volatile storage unit as claimed in claim 11 is characterized in that: the thickness that wherein should low thickness nitrogenize silicon area be had is half of this high thickness nitrogenize silicon area.
14. tool self-aligned separate grid non-volatile storage unit as claimed in claim 11 is characterized in that: wherein the thickness of this tunneling oxide layer is 50～150 .
15. tool self-aligned separate grid non-volatile storage unit as claimed in claim 11 is characterized in that: wherein the thickness of this silicon nitride layer is 300～3000 .
16. tool self-aligned separate grid non-volatile storage unit as claimed in claim 11 is characterized in that: wherein the thickness of this first polysilicon layer is 300～3000 .
17. tool self-aligned separate grid non-volatile storage unit as claimed in claim 11 is characterized in that: wherein the thickness of this second polysilicon layer is 1000～3000 .
18. tool self-aligned separate grid non-volatile storage unit as claimed in claim 11 is characterized in that: wherein this second polysilicon layer includes pure silicon polycrystal or multi-crystal silicification metal.
19. tool self-aligned separate grid non-volatile storage unit as claimed in claim 11 is characterized in that: wherein after this drain electrode is injected, more comprise a drain electrode oxidation step, be covered in oxidated layer thickness in this unit drain electrode with increase.
20. tool self-aligned separate grid non-volatile storage unit as claimed in claim 11, it is characterized in that: wherein using this polysilicon oxide layer as a hard mask, before the step with this first polysilicon layer of etching, the removal step that more comprises an abutment wall polysilicon oxide is in order to etch away this first polysilicon layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011101938A CN1153279C (en) | 2001-03-29 | 2001-03-29 | Self-aligning separate grid non-volatile storage unit and its producing method |
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| CNB011101938A CN1153279C (en) | 2001-03-29 | 2001-03-29 | Self-aligning separate grid non-volatile storage unit and its producing method |
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| CN1378270A true CN1378270A (en) | 2002-11-06 |
| CN1153279C CN1153279C (en) | 2004-06-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101923296B (en) * | 2009-06-17 | 2011-12-14 | 上海华虹Nec电子有限公司 | Making method of photoetching fiducial mark in process of making NVM (Non-Volatile Memory) device |
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2001
- 2001-03-29 CN CNB011101938A patent/CN1153279C/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101923296B (en) * | 2009-06-17 | 2011-12-14 | 上海华虹Nec电子有限公司 | Making method of photoetching fiducial mark in process of making NVM (Non-Volatile Memory) device |
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| Publication number | Publication date |
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| CN1153279C (en) | 2004-06-09 |
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