CN1346772A - Embossed conveying belt forming and packaging device - Google Patents
Embossed conveying belt forming and packaging device Download PDFInfo
- Publication number
- CN1346772A CN1346772A CN01132850A CN01132850A CN1346772A CN 1346772 A CN1346772 A CN 1346772A CN 01132850 A CN01132850 A CN 01132850A CN 01132850 A CN01132850 A CN 01132850A CN 1346772 A CN1346772 A CN 1346772A
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- China
- Prior art keywords
- thermoplastic resin
- resin band
- mentioned
- embossed
- unit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B9/00—Enclosing successive articles, or quantities of material, e.g. liquids or semiliquids, in flat, folded, or tubular webs of flexible sheet material; Subdividing filled flexible tubes to form packages
- B65B9/02—Enclosing successive articles, or quantities of material between opposed webs
- B65B9/04—Enclosing successive articles, or quantities of material between opposed webs one or both webs being formed with pockets for the reception of the articles, or of the quantities of material
- B65B9/045—Enclosing successive articles, or quantities of material between opposed webs one or both webs being formed with pockets for the reception of the articles, or of the quantities of material for single articles, e.g. tablets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Containers And Plastic Fillers For Packaging (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention provides an embossed carrier tape molding and sealing apparatus which is devised so that the molding of the embossed carrier tape and the sealing of electronic parts can be efficiently performed. An embossed carrier tape molding and sealing apparatus is constructed by installing, on a continuous conveying path for a thermoplastic resin tape 10, a molding part heating means 110 which heats and softens the molding parts, a molding means 130 which positions the above-mentioned heated parts in a mold 132, and subjects these parts to embossing-molding, a hole working means 150 which forms guide holes at specified intervals in the side portions of the above-mentioned thermoplastic resin tape 10, a product insertion stage 210 which places products 20 in the recesses 12 formed by the aforementioned embossing-molding, a covering tape supply means 230 which supplies a covering tape 30 to the upper surface of the recesses 12 formed by the above-mentioned embossing-molding of the above-mentioned thermoplastic resin tape 10, and a tape thermal-bonding means 250 which thermally bonds the above-mentioned covering tape 30 to the above-mentioned thermoplastic resin tape 10 at the peripheral edges of the above-mentioned recesses 12.
Description
The present invention relates to a kind of being used for encloses, is wound into the banded forming and packaging device of supplying with the embossed conveying belt of automatic assembling etc. to electronic units such as adaptor unions.
The structure of embossed conveying belt is, is useful on the recess that holds electronic units such as adaptor union along the length direction of band with given being spaced, and forms to carry with given interval at the side of one-sided or bilateral and uses pilot hole.This embossed conveying belt inserts electronic unit at above-mentioned recess, with cover tape cover this recess above, by heat seal, make it be in the state of enclosing electronic unit.Then, the tape wrapping of enclosing electronic unit is become drum, electronic unit is supplied with automatic assembling etc. be used.
In the past, the shaping of this embossed conveying belt and the inclosure of electronic unit, be that the operation that utilizes building mortion and deposition apparatus to carry out separately respectively realizes, building mortion carries out embossing to the thermoplastic resin band and is shaped, produce embossed conveying belt, and deposition apparatus inserts electronic unit in the embossed conveying belt of manufacturing, then, makes cover tape deposited.
But, in above-mentioned prior art, after embossed conveying belt is shaped, in case the coiling tubular, then must insert electronic unit in the embossed conveying belt in other place, make cover tape deposited, then, coiling tubular again, thereby, need big machinery that space, working space are set, and need corresponding operating personnel, brought the problem of operating efficiency deterioration.
Therefore, the objective of the invention is, the forming and packaging device of embossed conveying belt of the inclosure operation of a kind of shaping that can carry out embossed conveying belt effectively, electronic unit is provided.
In order to finish above-mentioned purpose, the invention provides a kind of forming and packaging device of embossed conveying belt, this device is provided with on the continuous transport path of thermoplastic resin band: the forming section heating unit that heating makes it to soften to forming section, above-mentioned heated part is configured in the forming unit that is embossed with shape on the metal paattern, form the hole machining cell of pilot hole with given interval at the sidepiece of above-mentioned thermoplastic resin band, the goods of article configurations in the recess that above-mentioned embossing is shaped are inserted station, cover tape is supplied with the top cover tape feed unit of the recess that the above-mentioned embossing of above-mentioned thermoplastic resin band is shaped, and the periphery of above-mentioned recess above-mentioned cover tape and above-mentioned thermoplastic resin band deposited be with deposited unit.
According to the present invention, when the thermoplastic resin band moved along continuous transport path, at first, it was softening by the forming section heating unit forming section to be heated.Secondly, be pressed on the metal paattern being heated softening part, carry out embossing and be shaped by forming unit.Then, form pilot hole with given interval at the sidepiece of thermoplastic resin band by the hole machining cell.Then, semifinished piece inserts station, and goods are inserted the recess that embossing is shaped, and this is, by the cover tape feed unit cover tape supply to recess above.Thereupon, by being with deposited unit to make cover tape and thermoplastic resin band deposited, the goods of recess are inserted in encapsulation.So, the embossed conveying belt that has goods that obtains like this can be wound into suitable reel etc.
According to preferred form of the present invention, above-mentioned forming unit comprises that metal paattern and gas-pressurized send into the unit, above-mentioned metal paattern has: have the outside frame that is viewed as the receiving portion of コ word shape from the plane, be assembled into the inner frame on this outside frame and be clamped in above-mentioned outside frame and above-mentioned inner frame between lining; Above-mentioned gas-pressurized is sent into the unit and above-mentioned thermoplastic resin band above-mentioned is heated softening part is pressed in the metal paattern.
According to this form, constitute metal paattern by outside frame, inner frame and lining, thus, can not only make the processing of complicated shape become easier, and, just can be adapted to different shape only by the exchange of parts.
According to another preferred form of the present invention, above-mentioned transport path comprises; Be configured in both sides so that constitute the guide rail of the guide groove of the width that is suitable for above-mentioned thermoplastic resin band; And the pilot hole ingear swing pinion that forms with above-mentioned hole machining cell, the interval of above-mentioned guide rail and above-mentioned swing pinion can be changed.
According to this form, obtainable advantage is, only changes the interval of guide rail and swing pinion, just can be adapted to the thermoplastic resin band of various width.
According to another preferred form of the present invention, above-mentioned hole machining cell has: along the side of above-mentioned thermoplastic resin band with given spaced several drifts; And add man-hour carrying out the hole by this drift, insert in the pilot hole that has formed, the control pin that above-mentioned thermoplastic resin band is located, and above-mentioned swing pinion between, clip above-mentioned thermoplastic resin band and be provided with the tension force roller that is crimped on above-mentioned swing pinion, also be provided with carrying out the hole and add man-hour, remove the unit of the crimping of mentioned strain roller by above-mentioned drift and above-mentioned control pin.
According to this form, add man-hour carrying out the hole with above-mentioned drift and above-mentioned control pin, remove the crimping of mentioned strain roller, in this state, control pin is inserted in the pilot hole that has formed, when above-mentioned thermoplastic resin band is located, can be with above-mentioned drift perforate.That is to say,, make the mobile possibility that becomes of above-mentioned thermoplastic resin band by removing the crimping of mentioned strain roller, in this state, insert in the pilot hole that has formed by controlling pin, carry out the correction of location dislocation, can on correct position, carry out the drift perforate.
Fig. 1 is the concise and to the point pie graph of a form of implementation of the forming and packaging device of embossed conveying belt of the present invention.
Fig. 2 is all front elevations of device shown in Figure 1.
Fig. 3 is the local amplification front elevation of the building mortion of this device of expression.
Fig. 4 is the left side view of this building mortion.
Fig. 5 is the forming section heating unit of this building mortion of expression and the local amplification profile diagram of forming unit.
Fig. 6 is the decomposition diagram of an example of the expression employed metal paattern of this building mortion.
Fig. 7 is the decomposition diagram of employed another example of metal paattern of this building mortion of expression.
Fig. 8 is the cross sectional drawing of action of the hole machining cell of this building mortion of expression.
Fig. 9 is the cross sectional drawing of the tape guide variation of this building mortion of expression.
Figure 10 is the flow scheme of the forming and packaging device of embossed conveying belt of the present invention.
Figure 11 is that instruction diagram is amplified in the part of the relation of expression control pin of above-mentioned building mortion and drift.
Fig. 1 is the concise and to the point pie graph according to a form of implementation of the forming and packaging device of embossed conveying belt of the present invention.Fig. 2 is all front elevations of device shown in Figure 1.Fig. 3 is the local amplification front elevation of the building mortion of this device of expression.Fig. 4 is the left side view of this building mortion.Fig. 5 is the forming section heating unit of this building mortion of expression and the local amplification profile diagram of forming unit.Fig. 6 is the decomposition diagram of an example of the expression employed metal paattern of this building mortion.Fig. 7 is the decomposition diagram of employed another example of metal paattern of this building mortion of expression.Fig. 8 is the cross sectional drawing of action of the hole machining cell of this building mortion of expression.Fig. 9 is the cross sectional drawing of the tape guiding piece variation of this building mortion of expression.Figure 10 is the flow scheme of the forming and packaging device of embossed conveying belt of the present invention.
As shown in Figure 1, 2, the forming and packaging device of embossed conveying belt of the present invention has the continuous transport path of the thermoplastic resin band 10 of drawing from first rotating cylinder 101.Be provided with the building mortion 100 of forming section heating unit 110, forming unit 130, hole machining cell 150 compositions along this transport path; And the goods packaging system 200 that inserts station 210, cover tape feed unit 230, form with deposited unit 250.
Simultaneously, with reference to Fig. 3 and Fig. 4, building mortion 100 has the transport path 102 of thermoplastic resin band 10.Forming section heating unit 110 has and is configured in the temperature booster 111,112 of transport path about in the of 102, and each temperature booster 112 mode of thermoplastic resin band 10 and carried out on-off action by first cylinder 113 and second cylinder 114 with clamping.
Shown in Fig. 5 (a) and (b), temperature booster 111,112 is made up of piece 115,116, exothermic body 117,118 is housed in each piece 115,116.Clamp thermoplastic resin band 10 with making rectangular-shaped point 119,120, thus, make rectangular-shaped regional thermoplastic from the plane observation.
Heated air above forming unit 130 is configured in by the transport path 102 that clips thermoplastic resin band 10 is sent into unit 131 and is constituted with the metal paattern 132 that is configured in the below.Heated air is sent into unit 131 and is constituted by the feed pipe 133 of forced air with these feed pipe 133 bonded assembly pressurized nozzles 134, and pressurized nozzles 134 has rectangular-shaped opening 135.In addition, pressurized nozzles 134 is supported on the carriage 136 that is connected on the frame by the mode of screw 137 with height-adjustable.
Therefore, if pass through forming section heating unit 110 thermoplastic rectangular-shaped area configurations above metal paattern 132, metal paattern 132 is driven by the 3rd cylinder 138 and rises, and will contact with the following of thermoplastic resin band 10.On the other hand, on thermoplastic resin band 10, disposing heated nozzle 134 with metal paattern 132 with standing facing each other.In this state, by sending into forced air from pressurized nozzles 134, the thermoplastic rectangular-shaped zone of thermoplastic resin band 10 is pushed in the recess of metal paattern 132, carries out embossing and is shaped.The recess 12 that obtains like this becomes the accommodation section of aftermentioned electronic unit etc.In addition, under the situation of the metal covering body 143 that uses Fig. 6,, form more recessed little recess 13 in the bottom surface of recess 12 by means of the top set grooving portion 144 of lining 142.
In addition, Fig. 7 shows another example of metal paattern body.This metal paattern body 143a and above-mentioned example are same, by outside frame 140a, be assembled into the inner frame 141a on this outside frame 140a, the lining 142a that is clamped between outside frame 140a and the inner frame 141a and constitute, wherein, outside frame 140a has the receiving portion that is viewed as コ word shape from the plane.In addition, form rectangular-shaped frame, be configured in its bottom above the lining 142a, on lining 142a, form projection 145 by outside frame 140a and inner frame 141a.Under the situation of utilizing this metal paattern body 143a,, form little projection 14 in the bottom surface of the recess 12 of thermoplastic resin band 10 by means of the projection 145 of lining 142a.
As shown in Figure 8, on bench board 103, broad ways forms several parallel grooves 104 with given interval.The pair of guide rails 105 that thermoplastic resin band 10 is led is made of the bolt 108 of accepting parts 106, push part 107, these two parts are linked together respectively.And, form the raised line 107a chimeric with above-mentioned groove 104 in the lower end of push part 107.Thus, to guide rail 105 location.In addition, accept to be formed with between parts 106 and the push part 107 guide groove 109 of the both side edges of passing thermoplastic resin band 10.Pass thermoplastic resin band 10, its both side edges is carried by above-mentioned guide groove 109.
Therefore, shown in Fig. 8 (a) and (b), when by four-cylinder 151 piece 152 being descended, the drift of being supported by this piece 152 153 descends, insert in the through hole 154 of guide rail 105, form the pilot hole 11 of certain intervals in the both side edges of the thermoplastic resin band 10 of the guide groove 109 by guide rail 105.In addition, pilot hole 11 also can only form at the folk prescription side with 10.
In addition, as shown in figure 11, dispose control pin 158 in abutting connection with ground in tip location with thermoplastic resin band 10 direct of travels of drift 153.Control pin 158 is long than drift 153, and is outstanding downwards, when piece 152 descends, before by drift 153 perforates, just be inserted in the pilot hole 11 that has formed on the thermoplastic resin band 10 earlier, thermoplastic resin band 10 is positioned, thus, can correctly set the interval of pilot hole 11.
Further, in this form of implementation, shown in Fig. 9 (a) and (b), under the situation of thermoplastic resin band 10 width change, the interval of only changing guide rail 105 just can be corresponding with it.That is to say that only change the groove 104 of the raised line 107a embedding of push part 107 lower ends, the interval that just can change pair of guide rails 105 thus, can be altered to the interval of guide groove 109 form that is consistent with thermoplastic resin band 10 width.In addition, in this occasion, the interval of the drift 153 of hole machining cell 150 also is altered to the form of the through hole 154 that is suitable for guide rail 105.
Refer again to Fig. 1, Fig. 2, in this form of implementation, goods insert station 210 become concerning electronic units 20 such as each adaptor union by hand operation be inserted into situation in the recess 12 of thermoplastic resin band 10, but, also can carry out the insertion of electronic unit 20 with known automatic supplier.Cover tape feed unit 230 is made of second reel 231 and the roller 231 of the cover tape 30 of reeling, roller 231 the cover tape 30 of drawing from second reel 231 cover thermoplastic resin band 10 above, and electronic units 20 that insert in the recess 12 are encapsulated.
In the place ahead of this cover tape feed unit 230, be provided with and be with deposited unit 250, this has the pair of right and left temperature booster 251 of being made lifting action by drive mechanism not shown in the figures with deposited unit 250.In addition, below temperature booster 251, clamping transport path and is equipped with pad 252 (with reference to Fig. 2), between temperature booster 251 and pad 252, clips the dual-side of thermoplastic resin band 10 and cover tape 30, makes both deposited.
In addition, as shown in Figure 1, 2,, below transport path, be equipped with a pair of and pilot hole 11 ingear swing pinions 155, above transport path, be equipped with tension force roller 156 with these swing pinion 155 crimping in the place ahead with deposited unit 250.Tension force roller 156 pivots prop up at the tip that is supported in arm 159 by fulcrum 157, by give the spring not shown in the figures of arm 159 application of forces towards the below, are crimped on swing pinion 155 all the time.
Therefore, enclose the embossed conveying belt that has electronic unit 40 of electronic unit 20, make rotation with a pair of swing pinion 155 of pilot hole 11 ingears, send off and on given speed by motor not shown in the figures.
In addition, be equipped with cylinder 160 below arm 159, its drive spindle 161 is in and arm 159 position contacting.When the piece 152 of above-mentioned hole machining cell 150 descends, drive cylinder 160, bar 161 is released, pushing-pressing arm 159 upward, make tension force roller 156 free with swing pinion 155.As a result, in the interstice coverage of the tooth of swing pinion 155 and pilot hole 11, allow embossed conveying belt 40 to move the position correction that does not hinder above-mentioned control pin 158 to carry out a little along front and back.
When the change of the width of thermoplastic resin band 10, the interval of above-mentioned swing pinion 155 also needs change, so as with pilot hole 11 engagements of thermoplastic resin band 10.
In more the place ahead of swing pinion 155 and tension force roller 156, be provided with the triple barrel 270 that is used to reel by the embossed conveying belt 40 of cover tape 30 encapsulation.Triple barrel 270 makes its delivery speed with embossed conveying belt 40 consistent by driver train rotation not shown in the figures.
In addition, in the present invention,, use for example thing of thermoplastic resin materials compositions such as polystyrene, polyethylene, polyvinylchloride, third rare nitrile as thermoplastic resin band 10 and cover tape 30.In addition, as the static countermeasure, also can use the band charcoal resin strip of confronting by a formidable enemy.
Below, the Figure 10 with reference to the technological process of representing the embossed conveying belt forming and packaging device illustrates the effect of this embossed conveying belt forming and packaging device.
At first, draw thermoplastic resin band 10, insert in the guide groove 109 of guide rail 105 from first reel 101.At this moment,,, be pre-formed pilot hole 11, make pilot hole 11 engagements (step S1) of swing pinion 155 and point by driving pilot hole machining cell 150 in given length part with 10 point.
In this state, actuating device makes swing pinion 155 rotate load-transfer device 10 off and on.Then, at first use forming section machining cell 110, clamp by a pair of temperature booster 111,112 up and down and be with 10, make the rectangular-shaped zone of wanting embossing to process be heated softening (step S2).
Then, when being heated softening zone and moving to forming unit 130 places, allow metal paattern 132 rise when above-mentioned, make it with 10 following the contact, send into the pressurized nozzles 134 of unit 131 from gas-pressurized and send into forced air towards the direction of metal paattern 132.As a result, with 10 the inside that softening zone is pressed to metal paattern 132 that is heated, form recess 12 (step S3).
So, give pilot hole machining cell 150 continuously with embossing forming belt 10, make and piece 152 descends for the drift 153 of one by four-cylinder, and insert in the through hole 154 of guide rail 105, form the pilot hole 11 of certain intervals in both side edges through the thermoplastic resin band 10 of guide groove 109.In addition, before offering this hole, control pin 158 is inserted in the pilot hole 11 that has formed, thermoplastic resin band 10 is positioned.This pilot hole 11 and swing pinion 155 engagements that are configured in 250 the place aheads, deposited unit apply the propulsive effort (step S4) of drawing with 10.
Then, give original packaging system 200 with embossing forming belt 10.In packaging system 200, at first, semifinished piece inserts in the station 210, and each electronic unit is inserted respectively in the recess 12 (step S5).
Then, by cover tape feedway 230, cover with the top of cover tape 30 from above-mentioned recess 12.As a result, be under the state that is configured in the recess 12, will cover (step S6) above it with cover tape 30 at electronic unit 20.
Then, in being with deposited unit 250, temperature booster 251 is pressed to the dual-side of thermoplastic resin band 10 and cover tape 30, makes the dual-side of thermoplastic resin band 10 and cover tape 30 all deposited each other.As a result, under electronic unit 20 is disposed at state with 10 recess 12, seal (step S7) by cover tape 30.
At last, the embossed conveying belt 40 with the charged subassembly 20 of manufacturing is wound into reel 270 (step S8).
Therefore,, can carry out the shaping of thermoplastic resin band 10 and the inclosure of electronic unit 20 continuously, greatly improve operating efficiency according to this device.In addition, compare with the situation that above-mentioned operation is carried out separately, the device compact overall structure, and reduced device space and working space be set.
As indicated above, according to the present invention, the thermoplastic resin band is moved along continuous transport path, carry out on one side the encapsulation of goods such as the embossing shaping of thermoplastic resin band and electronic unit continuously, thus, but reduction means space and working space etc. are set, improved operating efficiency, realized laborsavingization.
Claims (4)
1, a kind of forming and packaging device of embossed conveying belt, it is characterized in that the continuous transport path of thermoplastic resin band is provided with: the forming section heating unit that heating makes it to soften to forming section, described heated part is configured in the forming unit that is embossed with shape on the metal paattern, form the hole machining cell of pilot hole with given interval at the sidepiece of described thermoplastic resin band, the goods of article configurations in the recess that described embossing is shaped are inserted station, cover tape is supplied with the top cover tape feed unit of the recess that the described embossing of described thermoplastic resin band is shaped, and the periphery of described recess described cover tape and described thermoplastic resin band deposited be with deposited unit.
2, the forming and packaging device of the embossed conveying belt of putting down in writing according to claim 1 is characterized in that, described forming unit comprises that metal paattern and gas-pressurized send into the unit, and described metal paattern has: have the outside frame that is viewed as the receiving portion of コ word shape from the plane; Be assembled into the inner frame on this outside frame and be clamped in described outside frame and described inner frame between lining, described gas-pressurized is sent into the unit and described thermoplastic resin band described is heated softening part is pressed in the metal paattern.
According to the forming and packaging device of claim 1 or 2 embossed conveying belts of being put down in writing, it is characterized in that 3, described transport path comprises; Be configured in both sides so that constitute the guide rail of the guide groove of the width that is suitable for described thermoplastic resin band; And the pilot hole ingear swing pinion that forms with described hole machining cell, the interval of described guide rail and described swing pinion can be changed.
4, the forming and packaging device of the embossed conveying belt of putting down in writing according to claim 3 is characterized in that described hole machining cell has: along the side of described thermoplastic resin band with given spaced several drifts; And add man-hour carrying out the hole by this drift, insert in the pilot hole that has formed, the control pin that described thermoplastic resin band is located, and described swing pinion between, clip described thermoplastic resin band and be provided with the tension force roller that is crimped on described swing pinion, also be provided with carrying out the hole and add man-hour, remove the unit of the crimping of described tension force roller by described drift and described control pin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000226524A JP2002037205A (en) | 2000-07-27 | 2000-07-27 | Apparatus for molding and sealing embossed carrier tape |
| JP226524/00 | 2000-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1346772A true CN1346772A (en) | 2002-05-01 |
Family
ID=18720128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN01132850A Pending CN1346772A (en) | 2000-07-27 | 2001-07-27 | Embossed conveying belt forming and packaging device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20020100257A1 (en) |
| JP (1) | JP2002037205A (en) |
| CN (1) | CN1346772A (en) |
| TW (1) | TW496822B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106628414A (en) * | 2017-01-03 | 2017-05-10 | 东莞理工学院 | Automatic interface detecting packaging machine |
| CN107285093A (en) * | 2016-04-11 | 2017-10-24 | 万润科技股份有限公司 | Carrier tape cutting method and device |
| CN110871915A (en) * | 2018-08-29 | 2020-03-10 | 莫迪维克西普哈根牧勒股份及两合公司 | Method for packaging products and thermoforming packaging machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7771187B2 (en) | 2003-04-01 | 2010-08-10 | Adaptsys Limited | Plastic embossed carrier tape apparatus and process |
| US7987653B2 (en) * | 2004-03-03 | 2011-08-02 | Adaptsys Limited | Plastic embossed carrier tape process |
| JP3990680B2 (en) * | 2004-04-30 | 2007-10-17 | オリヒロエンジニアリング株式会社 | Vertical filling and packaging machine |
| AU2005237866B2 (en) | 2004-04-30 | 2008-09-11 | Orihiro Engineering Co., Ltd. | Vertical filling-packaging machine and method of manufacturing packaging bag |
| US7012232B1 (en) | 2004-08-31 | 2006-03-14 | Mark Gruenspecht | RF welding device |
| JP2006327634A (en) * | 2005-05-27 | 2006-12-07 | Apic Yamada Corp | Sealing apparatus and method |
| DE102006045327A1 (en) * | 2006-09-22 | 2008-04-03 | Cfs Germany Gmbh | Heating plate with a variety of heating cartridges |
| US20100154190A1 (en) * | 2008-12-19 | 2010-06-24 | Sanger Kurt M | Method of making a composite device |
| KR20130033143A (en) * | 2011-09-26 | 2013-04-03 | 삼성전자주식회사 | Carrier tape winding unit and apparatus of packing semiconductor package |
| EP2788259B1 (en) * | 2011-12-09 | 2016-08-24 | GEA Food Solutions Germany GmbH | Packaging machine with a combined shaping and sealing tool |
| DE102012003830A1 (en) * | 2012-02-29 | 2013-08-29 | Gea Cfs Germany Gmbh | Packaging machine with a replaceable tool |
| JP5835825B1 (en) * | 2014-11-19 | 2015-12-24 | 上野精機株式会社 | Carrier tape traveling device and electronic component conveying device |
| CN106240919A (en) * | 2015-06-15 | 2016-12-21 | 戴建宇 | Electronic building brick waterproof cladding external member manufacture method |
| US10336480B2 (en) * | 2015-06-18 | 2019-07-02 | Nexperia B.V. | Air-guided tape-and-reel system and method |
| CN106915490A (en) * | 2017-04-20 | 2017-07-04 | 东莞职业技术学院 | The intelligent sorting packaging facilities and method of a kind of SMD metalworks |
| EP3712077B1 (en) * | 2017-11-17 | 2022-03-30 | Tzu-Chung Chen | Parallel method and mechanism for packaging electronic element and coating adhesive on carrier tape and structure thereof |
| TWI694039B (en) * | 2018-12-26 | 2020-05-21 | 萬潤科技股份有限公司 | Carrier tape sealing method and device |
-
2000
- 2000-07-27 JP JP2000226524A patent/JP2002037205A/en active Pending
-
2001
- 2001-07-20 US US09/910,393 patent/US20020100257A1/en not_active Abandoned
- 2001-07-26 TW TW090118293A patent/TW496822B/en not_active IP Right Cessation
- 2001-07-27 CN CN01132850A patent/CN1346772A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107285093A (en) * | 2016-04-11 | 2017-10-24 | 万润科技股份有限公司 | Carrier tape cutting method and device |
| CN107285093B (en) * | 2016-04-11 | 2019-04-05 | 万润科技股份有限公司 | Carrier tape cutting method and device |
| CN106628414A (en) * | 2017-01-03 | 2017-05-10 | 东莞理工学院 | Automatic interface detecting packaging machine |
| CN106628414B (en) * | 2017-01-03 | 2019-06-07 | 浙江冒个泡电子商务有限公司 | A kind of interface Automated detection packaging machine |
| CN110871915A (en) * | 2018-08-29 | 2020-03-10 | 莫迪维克西普哈根牧勒股份及两合公司 | Method for packaging products and thermoforming packaging machine |
| CN110871915B (en) * | 2018-08-29 | 2021-08-10 | 莫迪维克西普哈根牧勒股份及两合公司 | Method for packaging products and thermoforming packaging machine |
Also Published As
| Publication number | Publication date |
|---|---|
| US20020100257A1 (en) | 2002-08-01 |
| TW496822B (en) | 2002-08-01 |
| JP2002037205A (en) | 2002-02-06 |
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