TW496822B - Embossed carrier tape molding and sealing apparatus - Google Patents

Embossed carrier tape molding and sealing apparatus Download PDF

Info

Publication number
TW496822B
TW496822B TW090118293A TW90118293A TW496822B TW 496822 B TW496822 B TW 496822B TW 090118293 A TW090118293 A TW 090118293A TW 90118293 A TW90118293 A TW 90118293A TW 496822 B TW496822 B TW 496822B
Authority
TW
Taiwan
Prior art keywords
tape
molding
aforementioned
thermoplastic resin
equipment
Prior art date
Application number
TW090118293A
Other languages
Chinese (zh)
Inventor
Yoshio Nakamura
Haruo Umeda
Xiao Li
Original Assignee
Tyco Electronics Amp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Amp Kk filed Critical Tyco Electronics Amp Kk
Application granted granted Critical
Publication of TW496822B publication Critical patent/TW496822B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/021Loading or unloading of containers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B9/00Enclosing successive articles, or quantities of material, e.g. liquids or semiliquids, in flat, folded, or tubular webs of flexible sheet material; Subdividing filled flexible tubes to form packages
    • B65B9/02Enclosing successive articles, or quantities of material between opposed webs
    • B65B9/04Enclosing successive articles, or quantities of material between opposed webs one or both webs being formed with pockets for the reception of the articles, or of the quantities of material
    • B65B9/045Enclosing successive articles, or quantities of material between opposed webs one or both webs being formed with pockets for the reception of the articles, or of the quantities of material for single articles, e.g. tablets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines

Abstract

The invention provides an embossed carrier tape molding and sealing apparatus which is devised so that the molding of the embossed carrier tape and the sealing of electronic parts can be efficiently performed. An embossed carrier tape molding and sealing apparatus is constructed by installing, on a continuous conveying path for a thermoplastic resin tape 10, a molding part heating means 110 which heats and softens the molding parts, a molding means 130 which positions the above-mentioned heated parts in a mold 132 and subjects these parts to embossing-molding, a hole working means 150 which forms guide holes at specified intervals in the side portions of the above-mentioned thermoplastic resin tape 10, a product insertion stage 210 which places products 20 in the recesses 12 formed by the aforementioned embossing-molding, a covering tape supply means 230 which supplies a covering tape 30 to the upper surface of the recesses 12 formed by the above-mentioned embossing-molding of the above-mentioned thermoplastic resin tape 10, and a tape thermal-bonding means 250 which thermally bonds the above-mentioned covering tape 30 to the above-mentioned thermoplastic resin tape 10 at the peripheral edges of the above-mentioned recesses 12.

Description

496822 五、發明說明(1) 【發明所屬之技 本發明係關 帶狀而供給至自 置。 【習知之技術】 壓花載體帶 帶體之長度方向 之側邊上以一定 花載體帶係將電 覆蓋帶並加以加 如此將封入電子 組裝機供給電子 以往,此種 分別使用將熱塑 成型裝置,與對 覆蓋帶之熔接裝 【發明欲解決之 惟,上述之 於捲盤上,並在 炫接覆蓋帶然後 間與作業空間須 有作業效率不佳 因此,本發 壓花載體帶之成 收容連接器 定間隔加以 成概送用之 插入前述凹 而轉以形成 带趙捲繞於 力口工。 體帶之成型 帶饜花成型 之壓花載體 分別進行。 ,係將 隔以/ 間隔形 子零件 熱密封 零件之 零件之 壓花載 性樹脂 製造出 置,係 課題】 習知技 另外的 再次捲 要較廣 之問題 明之目 型及電 術範4】 於一種対t連接器等之電子零件並捲繞成 動組裝機等用之壓花載體帶之成型密封裝 等之電子零件之凹部沿 配置,而於單側或兩侧 引導孔所構成。此種壓 部,而於凹部上覆蓋以 封入電子零件之狀態。 捲盤上而利用於對自動 與電子零件之封入,係 而製造出壓花载體帶之 帶插入電子零件並熔接 1 ’於成型出壓花載體帶後係捲繞 场所對壓花載體帶插入電子零件並 繞於捲盤上。因此,機械之設置空 大、且各作業須要個別之作業員故 的’在於提供一種可有效率地施行 子零件之封入作業的壓花載體帶之496822 V. Description of the invention (1) [Technology to which the invention belongs The present invention relates to a belt and is supplied to the home. [Known technology] The length of the embossed carrier tape body along the lengthwise side of the body is covered with a certain flower carrier tape. The electrical cover tape is added and the sealed electronic assembly machine is supplied to the electronics. , And the welding of the cover tape [the invention is to be solved, the above is on the reel, and there must be a poor working efficiency between the cover tape and the working space. Therefore, the embossed carrier tape of the present invention is contained. The connector is inserted at a predetermined interval and inserted into the aforementioned recess to form a tape. Forming of body belts and embossing carriers for embossing are performed separately. , It is made of embossed resin that is separated from the heat-sealed parts of the / part-shaped sub-parts. It is a topic.] Another skill is to re-open a wide range of problems. An electronic component such as a 対 t connector is wound along a recessed portion of an electronic component such as a molded seal of an embossed carrier tape used in a mobile assembly machine, and is formed by guiding holes on one or both sides. Such a pressing portion is covered with a recessed portion to seal the electronic component. On the reel, it is used to seal the automatic and electronic parts. The embossed carrier tape is manufactured by inserting the electronic parts and welded. 1 'After the embossed carrier tape is formed, the embossed carrier tape is inserted in the winding place. Electronic parts are wound on a reel. Therefore, the installation of the machine is large, and each operation requires an individual operator. The reason is to provide an embossed carrier tape that can efficiently perform the sealing operation of the sub-parts.

第4頁 五、發明說明(2) 成型密封裝置。 【解決課題之方式】 為達到前述目的,本發明之厣 置’其特徵為,係於熱塑性樹;;之成型密封裝 熱設備,係將成型部加熱軟化;▲型設備, ::2被::熱之部:配置於模具上而施行壓花成型;孔加 ΐ;制::前ΪΪ塑:生樹脂帶之側部以-定間隔形成引 Γ;,;: !入ΐ: 前述壓花成型之凹部中配置製 :型二:仏給9又備’係、對前述熱塑性樹脂帶之前述壓花 之上表面供給覆蓋帶;帶體溶接設備,係將前 ^後盍π於料凹部之周緣域接於前述熱塑性樹脂帶 士依本么明,將熱塑性樹脂帶沿連續之搬送路徑移動 !!,:先,、係以成型部加熱設備將成型部加熱軟化;接 二二:由成型?備將被加熱軟化之部份推入模具中而施行 ι化、型,接著,以孔加工設備於熱塑性之側 =隔形成出引導孔;接著,於製品插入載台上對壓花 帶…熱塑性樹;;上=以覆蓋帶供給設備將覆蓋 操作所得到之裝有;部之製品密封。如此 捲般上。 衣σσ之壓化載體帶,係可適當地捲繞於 依本發明之較去梯能>、+、丄、, 面視之呈c字狀收;型設備係包括:具有平 上之内框元件、、組裳於前述外框元件 、有夾持於刖述外框元件與前述内框元件 496822 的模具、將 壓於前述模 態,藉由以 使是甚複雜 可對應各種 之更佳之態 成適合前述 於前述孔加 述引導軌道 之態樣,僅 各種寬度之 之更佳態樣 脂帶之側邊 孔器作孔加 樹脂帶定位 身與前述回 設有於利用 力輥之壓接 ,於利用前 力輥之壓接 引導孔而將 孔器施行沖 可使熱塑性 前述熱 具内之 外框元 之形狀 形狀。 樣,前 熱塑性 工設備 與前述 塑性樹脂 加壓氣體 件及内框 亦可容易 述搬送路 樹脂帶寬 之力口工戶斤 回轉齒之 藉由變更 熱塑性樹 ,前述孔 以一定之 工時係插 之主導梢 轉齒之間 前述沖孔 之設備。 述沖孔器 ,於該狀 前述熱塑 孔之狀態 樹脂帶為 引導執 脂帶而 加工設 間隔配 入既已 、並設 夾持前 器與主 與主導 態下, 性樹脂 。亦即 可移動 五、發明說明(3) 間之置入元件 軟化之部份押 依此種型 形成模具,即 須更換元件即 依本發明 置於兩側之構 導轨道與嚙合 回轉齒,且前 者。 依本發明 隔’即可對應 依本發明 前述熱塑性樹 器、利用該沖 將前述熱塑性 轉齒上而於自 之張力輥、並 時解除前述張 依此樣態 係解除前述張 入既已形成之 可利用前述沖 張力輥之壓接 帶之前述被加熱 送入設備。 元件及置入元件 地加工,又’僅 徑係具備有:配 度之引導溝的引 形成之引導孔的 間隔為可變更 道與回轉齒之間 甚有利。 備係具備有:沿 置之多數之沖孔 形成之引導孔而 有壓接於前述回 述熱塑性樹脂帶 導梢施行孔加工 梢施行孔加工時 前述主導梢係插 帶定位,而成為 ,藉由解除前述 ’於該狀態下,Page 4 5. Description of the invention (2) Molded sealing device. [Method for solving the problem] In order to achieve the foregoing object, the present invention is characterized in that it is attached to a thermoplastic tree; the forming, sealing, and heating equipment is configured to heat and soften the forming part; the ▲ -type equipment, :: 2 is: : Hot part: Placed on the mold to carry out embossing; hole plus ΐ; system :: front ΪΪ plastic: the side of the raw resin tape is formed at a fixed interval Γ;,;:! Entering: the configuration of the embossing of the aforementioned embossing: Type II: 仏 9 is also prepared, and a cover tape is provided to the above embossed upper surface of the thermoplastic resin tape; the belt body welding equipment is盍 π is connected to the aforementioned thermoplastic resin tape in the peripheral area of the material recess, and the thermoplastic resin tape is moved along a continuous conveying path !!: First, the molding section is heated and softened by the molding section heating equipment; then 22: From molding? The heated and softened part is pushed into the mold to perform ι-molding and molding. Then, the hole processing equipment is used to form a guide hole on the side of the thermoplastic. Then, the product is inserted on the stage to emboss the tape ... thermoplastic Tree ;; Upper = The equipment obtained by the covering operation is supplied with the covering tape; the products of the department are sealed. So roll up. The pressurized carrier tape of the clothing σσ can be appropriately wound around the removal ladder energy according to the present invention >, +, ,,, and received in a c-shape when viewed from the side; the type equipment includes: The frame element is assembled on the outer frame element, and a mold clamped between the outer frame element and the inner frame element 496822 is pressed to the aforementioned mode, so that it can be very complicated and can correspond to a variety of better ones. It is suitable for adding the guide rails to the aforementioned holes. Only the side holes of the fat tape with better widths of various widths are used as holes and resin tape positioning body and the aforementioned back-fitting on the force roller. The shape of the inner and outer frame elements of the thermoplastic heat tool can be made by punching the hole device by using the pressure contact guide hole of the front force roller. In this way, the former thermoplastic industrial equipment and the aforementioned plastic resin pressurized gas parts and the inner frame can also easily describe the force of the resin bandwidth of the transport path. By changing the thermoplastic tree, the aforementioned holes are inserted at a certain working time. The aforementioned punching equipment between the main pinion teeth. Said puncher, in this state of the aforementioned thermoplastic hole, the resin tape is processed to guide the fat-binding tape, and the space is fitted with the existing resin, and the pre-clamping device and the main and dominant state are used as the resin. It can also be moved. 5. Description of the invention (3) The part where the component is softened is pressed according to this type to form a mold, that is, the component must be replaced, that is, the guide rails and meshing rotary teeth placed on both sides according to the present invention, and former. According to the present invention, it can correspond to the aforementioned thermoplastic tree device according to the present invention, use the punch to roll the aforementioned thermoplastic teeth onto the self-tensioning roller, and simultaneously release the aforementioned Zhang in this way is to release the aforementioned Zhang into the already formed The aforesaid heated feeding device of the crimping belt of the punching roller can be used. It is advantageous to process the component and the component to be inserted, and only the diameter is provided with: the guide hole formed by the guide of the matching guide groove can be changed between the track and the rotary tooth. The device is provided with a guide hole formed along a plurality of punching holes and crimped to the above-mentioned thermoplastic resin tape guide pin and the hole processing pin. When the hole processing is performed, the leading pin is inserted into the positioning, and is formed by Release the aforementioned 'in this state,

496822496822

五、發明說明(4) 主導梢插入既已形成之引導孔而可修正位置偏移而可在正 確的位置施行使用沖孔器之沖孔加工。 【發明之實施型態】 圖一為本發明之壓花載體帶之成型密封裝置之一實施 型悲之概略構成圖。圖二為揭示同一裝置之全體之正視 圖。圖二為揭示同一裝置之成型裝置之部份放大正視圖。 圖四為同一成型裝置之左側視圖。圖五為揭示同一成型裝 置之成型部加熱設備與成型設備之部份放大斷面圖。圖$ 為使用於同一成型裝置上之模具之一例之分解立體圖。^ 七為使用於同一成型裝置上之模具之其他例之分解立體 圖。圖八為同一成型裝置上之孔加工設備之動作之斷面 圖。圖九為同一成型裝置上之帶引導之變更方法之斷面 圖。圖十為本發明之壓花載體帶之成型密封裝置之流程 圖。 如圖一及圖二所示,本發明之壓花載體帶之成型密封 裝置,係具有自第一捲盤1 〇 1拉出之熱塑性樹脂帶丨〇之連 續之搬送路徑。沿此搬送路徑係設有··成型部加熱設備 110、成型設備130與孔加工設備150所構成之成型'裝X置1〇〇 及由製品插入載台210、覆蓋帶供給設備23〇與帶體熔接設 備2 5 0所構成之密封裴置2 〇 〇。 2 ^ 請一併參照圖三及圖四,則可知前述成型裝置丨〇 〇係 具有熱塑性樹脂帶1 0之搬送路徑丨〇 2。而前述成型部加熱 設備11 0係具有配置於搬送路徑丨〇 2之上下之加熱器丨丨i \ 112,各加熱器111、112係利用第一氣壓缸113與第二氣壓V. Description of the invention (4) The leading tip is inserted into the already formed guide hole to correct the positional deviation, and the punching process using a puncher can be performed at the correct position. [Implementation Mode of the Invention] FIG. 1 is a schematic configuration diagram of an embodiment of a molding and sealing device for an embossed carrier tape of the present invention. Figure 2 is a front view showing the whole of the same device. FIG. 2 is an enlarged front view of a part of a molding device that reveals the same device. Figure 4 is a left side view of the same molding device. Fig. 5 is an enlarged cross-sectional view of a part of the heating equipment and the molding equipment of the same molding device. Figure $ is an exploded perspective view of an example of a mold used on the same molding device. ^ VII is an exploded perspective view of another example of a mold used on the same molding device. Fig. 8 is a sectional view showing the operation of the hole processing equipment on the same forming device. Fig. 9 is a sectional view of a method of changing a belt guide on the same molding apparatus. Fig. 10 is a flow chart of the forming and sealing device of the embossed carrier tape of the present invention. As shown in Figs. 1 and 2, the forming and sealing device of the embossed carrier tape of the present invention has a continuous conveying path of the thermoplastic resin tape 丨 0 drawn from the first reel 101. Along the conveying path, there are molding molding equipment 110 including molding section heating equipment 110, molding equipment 130, and hole processing equipment 150, and a product insertion stage 210, a cover tape supply equipment 23, and a belt. The body sealing device 250 is constructed by a sealing device 200. 2 ^ Please refer to FIG. 3 and FIG. 4 together, it can be seen that the aforementioned molding apparatus 丨 〇 〇 has a thermoplastic resin belt 10 conveying path 丨 〇 2. The above-mentioned molding section heating equipment 110 has heaters arranged above and below the conveying path 丨 〇 i \ 112, and each of the heaters 111 and 112 uses the first pneumatic cylinder 113 and the second pneumatic pressure.

496822 五、發明說明(5) 缸1 1 4作開閉作動以夾持熱塑性樹脂帶丨〇。 如圖五(a)及圖五(b)所示,加熱器丨丨1、1丨2係形成 於塊體11 5、11 6上,各塊體1 1 5、1 1 6則内設有發熱體 I 1 7、1 1 8。又’藉由平面視之而形成為矩形之前端部 II 9、1 20夾持熱塑性樹脂帶丨〇可將矩形之範圍加熱軟化。 成型設備1 3 0係由夾持熱塑性樹脂帶丨〇之搬送路徑1 〇 2 上方所配置之加壓氣體送入設備丨3 1與配置於下方之模具 1 32所構成。加壓氣體送入設備1 3 1係由加壓氣體供給管 1+33 &與連接前述供給管丨33之加壓喷嘴134所構成,而加壓 喷嘴134係具有矩形之開口部135。又,加壓噴嘴134係由 利用螺絲1 37支持成可調整高度狀態之托架丨36所支持。 前述模具132係具有固持於利用第三氣壓缸138作昇降 動作之塊體139上之模具本體丨43。請一併參照圖六,即可 知棋具本體1 4 3係由:具有由平面視之呈匸字狀收容部的 外框元件1 4 0、組裝於該外框元件η 〇上之内框元件η 1、 及失持於前述外框元件丨4〇與内框元件丨4 1間之置入元件 142所構成。於此例中,係藉由外框元件14〇與内框元件 1 4 1形成矩形之框體,於其底部係配置著置入元件丨4 2之上 表面,於置入元件142之上表面上形成有缺口部144。 因此’以成型部加熱設備丨丨〇加以加熱軟化之矩形範 圍為形成於模具132之上方時,則模具丨32被第三氣壓缸 1 38推上而抵接於熱塑性樹脂帶丨〇之下表面。一方面,於 熱塑性樹脂帶1 0之上表面配置有與模具丨32相對向之加壓 噴嘴1 34。在此狀態下,藉由自加壓喷嘴丨34送入加壓氣496822 V. Description of the invention (5) The cylinder 1 1 4 is opened and closed to clamp the thermoplastic resin tape. As shown in Fig. 5 (a) and Fig. 5 (b), the heaters 丨 丨 1, 1 丨 2 are formed on the blocks 11 5 and 1 16 and each block 1 1 5 and 1 1 6 are provided therein. Heating elements I 1 7 and 1 1 8. Furthermore, by forming a rectangular front end II 9 and 1 20 as viewed from a plane, the thermoplastic resin tape can be sandwiched to heat and soften the rectangular area. The molding equipment 130 is composed of a pressurized gas feeding equipment 315 arranged above the conveying path 1 02 that holds the thermoplastic resin tape 丨 〇 and a mold 131 arranged below. The pressurized gas feeding device 1 3 1 is composed of a pressurized gas supply pipe 1 + 33 & and a pressurized nozzle 134 connected to the aforementioned supply pipe 33, and the pressurized nozzle 134 has a rectangular opening 135. The pressurizing nozzle 134 is supported by a bracket 36 which is supported in a height-adjustable state by screws 137. The aforementioned mold 132 has a mold body 43 fixed to a block 139 which is moved up and down by a third pneumatic cylinder 138. Please refer to FIG. 6 together, it can be known that the chess body 1 4 3 is composed of an outer frame element 1 4 0 having a 匸 -shaped receiving portion viewed from a plane, and an inner frame element η assembled on the outer frame element η 〇 1. It is constituted by the placement element 142 which is lost between the outer frame element 丨 40 and the inner frame element 丨 4 1. In this example, a rectangular frame is formed by the outer frame element 14o and the inner frame element 1 41, and the upper surface of the placement element 4 2 is arranged at the bottom, and the upper surface of the placement element 142 is disposed A notch portion 144 is formed on the upper portion. Therefore, when the rectangular range heated and softened by the heating device of the molding section is formed above the mold 132, the mold 32 is pushed up by the third pneumatic cylinder 1 38 and abuts the lower surface of the thermoplastic resin belt. . On the one hand, a pressure nozzle 1 34 is disposed on the upper surface of the thermoplastic resin tape 10, which is opposed to the mold 32. In this state, the pressurized gas is sent from the pressurizing nozzle 34

第8頁Page 8

體,則熱塑性樹脂帶1 ο之祜如刼认Μ ;卜 $ y目j A Μ <破加熱軟化之矩形範圍係被推壓 至杈具1 3 2之凹部而施行厣允士、 Αβ19 ,,^ ^ + 仃&化成型。依此方式所形成之凹 目:成為後述之電子零件等之收容部。又,於圖六使 用模具本體143之場合,μ由署人— ^ 精由置入兀件1 42上表面上所設之 缺口 W44 ’可於凹部12之底面形成更凹下之小凹部13。 又’圖七中係揭示模具本體之其他例。此模具本體 143a與前述之例相同,伤士 θ 士 1J ^ 1J係由具有:平面視之呈匸字形收容 部的外框元件“Oa、置入於前述外框元件14〇a之内框元件 141a、與夾持於外框元件14〇a與内框元件i4u間之置入元 件142a所構成。又,藉由外框元件14〇3與内框元件141&形 成矩形之框體,於其底部係配設置入元件H2a之上表面, 於置入το件142a之上表面形成有突部145。於使用此模具 本體143a之場合,藉由置入元件142&之突部145可於熱塑 性樹脂帶1 0之凹部1 2之底面形成小突部丨4。 一如圖八所示,於機台1〇3上之寬度方向,隔以一定之 間隔形成有多數道平行之溝部丨〇 4。引導熱塑性樹脂帶工〇 之一對引導軌道1 0 5係分別由承受元件1 〇 6、推壓元件1 〇 γ 與連結前述兩者之螺栓丨〇 8所構成。又,於推壓元件丨〇 7之 下端形成有嵌入前述溝部1〇4之突條1〇7a,藉此將引導軌 返1 0 5定位。又,於承受元件丨〇 6與推壓元件丨〇 7之間,形 成有插通熱塑性樹脂帶10兩側緣之引導溝丨〇9。熱塑性樹 脂帶10係將兩側緣穿設於前述引導溝1〇9中而被搬送。 孔加工設備1 5 〇如圖二及圖三所示,係具有被第四氣 壓缸151昇降推動之塊體152,於此塊體152上以一定間隔The thermoplastic resin tape is as follows: 刼 Μ Μ Μ Μ 目 目 Μ Μ Μ 目 A j j A A A A A A A 目 A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A 破 破 The softened rectangular range is pushed to the concave portion of the branch with 1 2 3 to implement the 厣 破, Αβ19, , ^ ^ + 仃 & The recess formed in this way: It becomes a receiving part for electronic parts and the like described later. In the case where the mold body 143 is used in FIG. 6, the micro-manufacturer ^ finely inserts the notch W44 'provided on the upper surface of the element 142 to form a more concave small recess 13 on the bottom surface of the recess 12. Fig. 7 shows another example of the mold body. This mold body 143a is the same as the previous example, and the wounded θ 1 1J ^ 1J is composed of an outer frame element "Oa" having a 匸 -shaped receiving portion when viewed from a plane, and an inner frame element placed in the outer frame element 140a. 141a, and an inserting element 142a sandwiched between the outer frame element 14oa and the inner frame element i4u. In addition, a rectangular frame is formed by the outer frame element 1403 and the inner frame element 141 & The bottom part is provided with the upper surface of the insertion element H2a, and a protrusion 145 is formed on the upper surface of the insertion member 142a. When using this mold body 143a, the projection 145 of the insertion element 142 & A small protrusion 丨 4 is formed on the bottom surface of the concave portion 12 with 10. As shown in Fig. 8, a plurality of parallel grooves 丨 04 are formed at a certain interval in the width direction on the machine 10. One pair of guide rails 105 for guiding thermoplastic resin tape workers is composed of a receiving element 1 06, a pressing element 1 0γ, and a bolt connecting the two. The pressing element 1 The lower end of 7 is formed with a protrusion 107a embedded in the aforementioned groove portion 104. Return to 105 for positioning. In addition, between the receiving element 丨 〇6 and the pressing element 丨 〇7, a guide groove is inserted through both sides of the thermoplastic resin tape 10. 〇09. The thermoplastic resin tape 10 is on both sides. The edge is transported in the aforementioned guide groove 1009. The hole processing equipment 15 is provided with a block 152 pushed up and down by the fourth pneumatic cylinder 151, as shown in Figs. 2 and 3. Here, the block 152 At regular intervals

第9頁 496822Page 9 496822

,=兩列的多數根沖孔器153,並分別沿搬送方向以一 二a广垂^下二又’沖孔器15 3之前端係重疊指向於引導執 ' 之σ又置$述引導溝1 〇 9之部份,於該部份上形成透孔 口此如圖八(a)及圖八(b)所示,藉由第四氣壓缸 1 5 1使塊體1 5 2下降時,則支持於塊體丨5 2上之沖孔器丨5 3係 下降而插入引導軌道105之透孔154,於通過引導軌道1〇5 之引導溝109之熱塑性樹脂帶1〇兩側緣上,形成有一定間, = Most of the two punchers 153 in the two rows, and each of them are widened along the conveying direction by one or two a. The lower end of the puncher 15 3 is overlapped with the front end and points to the guide. The guide groove is set again. As shown in Fig. 8 (a) and Fig. 8 (b), when the block 1 5 2 is lowered by the fourth pneumatic cylinder 1 5 1, The punches 5 and 2 supported on the block 5 2 are lowered and inserted into the through holes 154 of the guide track 105 on the two edges of the thermoplastic resin tape 10 passing through the guide groove 109 of the guide track 105. There is a certain interval

隔之引導孔11。又,引導孔11可僅形成於帶體10單邊之側 邊上。 嫌 又’如圖十一所示,於沖孔器1 53鄰接於熱塑性樹脂 帶1〇之進行方向之前端處,係配置有主導梢丨58。此主導 梢158係較沖孔器153突出於下方更長,於塊體152下降 時’利用前述沖孔器153沖孔之前係插入既已形成於熱塑 性樹脂帶1 0之引導孔11中,而將熱塑性樹脂帶丨〇定位。藉 此,引導孔11之間隔可被正確地設定。隔 之 导 孔 11。 The guide hole 11. The guide hole 11 may be formed only on one side of the band body 10. As shown in FIG. 11, at the front end of the puncher 1 53 adjacent to the direction of progress of the thermoplastic resin belt 10, a leading pin 58 is disposed. This leading tip 158 protrudes longer than the puncher 153 below. When the block 152 descends, it is inserted into the guide hole 11 already formed in the thermoplastic resin tape 10 before punching with the aforementioned puncher 153, and Position the thermoplastic resin tape. Thereby, the interval of the guide holes 11 can be set correctly.

又,於此實施型態中,如圖九(a)及圖九(b)所示, 於變更熱塑性樹脂帶1 0寬度之場合,只要變更引導軌道 1 0 5之間隔即可對應。亦即,僅將推壓元件丨0 7下端之突條 1 0 7 a嵌入之溝部1 0 4加以變更,即可變更一對引導軌道1 〇 5 之間隔,藉此,可將引導溝1 0 9之間隔變更成適用於熱塑 性樹脂帶1 〇寬度之狀態。又,於該種場合,孔加工設備 1 5 0之沖孔器1 5 3之間隔,亦被變更成適合於引導軌道1 〇 5 之透孔154之狀態。In this embodiment, as shown in FIGS. 9 (a) and 9 (b), when the width of the thermoplastic resin tape 10 is changed, the interval between the guide rails 105 can be changed. That is, only by changing the groove portion 104 embedded in the lower end of the pressing element 丨 0 7 and the groove portion 1 0 4, the interval between a pair of guide rails 1 0 5 can be changed, thereby the guide groove 1 0 can be changed. The interval of 9 is changed to a state suitable for a width of 10 of the thermoplastic resin tape. Also, in this case, the interval between the punches 153 of the hole processing equipment 150 is also changed to a state suitable for the through holes 154 of the guide rail 105.

第10頁 496822 五、發明說明(8) 再次參照圖一及圖二,製品插入載台2丨0於此實施型 悲中’係將連接器等之電子零件2 〇 一個個以手工插入熱塑 性樹脂帶1 〇之凹部丨2之場所,但以公知之自動供給裝置施 行電子零件2 0之插入亦可。 覆盍帶供給設備230係由:捲繞覆蓋帶3〇之第二捲盤 231 '及將自前述第二捲盤“I所拉出之覆蓋帶3〇覆蓋於熱 塑性樹脂帶1 〇之上表面而將插入凹部丨2内之電子零件2 〇密 封之輕子2 3 1所構成。 於此覆蓋帶供給設備23 0前方,設置具有圖未示之驅 動機構作昇降作動之左右一對加熱器25 i的帶體熔接設備 25 0。又,夾持搬送路徑之加熱器251下方,係配置有承接 墊25 2 (參照圖二),於加熱器251與承接墊252之間,係夾 持熱塑性樹脂帶10及覆蓋帶30兩側邊而將兩者溶接。 又,如圖一及圖二所示 於π體熔接設備2 5 0之前方 於搬送路徑之下方配置有嚙合於引導孔u之一對回轉告 155,壓接於此回轉齒155之張力輥156係配置於搬送路1 之上方。張力輥156係樞接於以支軸157支持之臂部丨59 前端’藉由將臂部1 59彈壓於下方圖未示之彈筈° 壓接於回轉齒155上。 ”^射具 因此,密封有電子零件20之電子零件封入壓花 40,係藉由唾合於引導孔u之—對回轉齒155以圖未示且帶 馬達作驅動回轉而以一定之速度作間歇性之送出。 又,於臂部159之下方係配置有氣壓缸16〇,1 1 61係位於抵接臂部1 5 9之位置上。又,前汁a丄一勤杯 月』返孔加工設備 496822 五、發明說明(9) 150之塊52下降時,前述氣壓缸16〇係作動而推出桿體 161而將臂部159朝上方推上而使張力輥156離開回轉齒 L55, 月J i化載體帶40係可移動於前後方向上若干程产, 而作成不妨礙前述主導梢158之位置修正作用的狀態。又 又’於改變熱塑性樹脂帶1〇寬度 1 5 5之間隔必須蠻f成玎嘁人乂、+、& y 4 ϋ轉齒 孔11之狀離。更成了嚙a刖述熱塑性樹脂帶1〇之引導 、f回轉齒155與張力輥156之更前方處,係設 被覆盍帶30所密封之壓花截俨帶4 ’、 捲、、’九 三捲盤m係藉由圖未‘:之載 搬送速度作回轉 動機構配合壓花載體⑽之 又’於本發明中,作為埶 使用由例如聚笨乙•、聚醋與聚以:1?^帶3。係 材料所構成之物品。又,為對靜乙:寻之熱塑性樹脂 元素之樹脂帶。 f付靜電,亦可使用參雜有碳 接著參照揭示同一裝置之冷 述壓花載體帶之成型密封裳置之圖+ ’說明有關前 首先,自第一捲盤101拉出鼽 於引導軌道105之引導溝丨09。又、、塑性樹脂帶1 0 ’並插通 之一定長度之部份上,使引導?丨此呤於帶體10之前端部 形成引導孔11,而於前端部之引J ,設備150作動而預先 155(步驟S1)。 孔11上喃合回轉齒 在此狀態下使裝置作動時, 則回轉齒155間歇性地回Page 10 496822 V. Description of the invention (8) Referring again to FIG. 1 and FIG. 2, the product is inserted into the stage 2 丨 0 in this embodiment. “Electrical parts 2 such as connectors are inserted manually into the thermoplastic The location of the recessed part 2 of the resin tape 10, but it is also possible to insert the electronic part 20 with a known automatic supply device. The covering tape supply device 230 is composed of a second reel 231 ′ that winds the covering tape 30 and covers the upper surface of the thermoplastic resin tape 1 〇 with the covering tape 30 pulled out from the aforementioned second reel "I". The electronic part 2 inserted into the recessed part 2 is sealed by a lepton 2 31. A pair of left and right heaters 25 having a driving mechanism (not shown) for raising and lowering is provided in front of the cover tape supplying device 23 0. The belt welding device 250 of i. Further, a receiving pad 25 2 (see FIG. 2) is arranged below the heater 251 that holds the conveying path, and a thermoplastic resin is held between the heater 251 and the receiving pad 252. The two sides of the belt 10 and the cover belt 30 are melted together. As shown in FIG. 1 and FIG. 2, a pair of meshing guide holes u is arranged below the transport path in front of the π-body welding equipment 2 50. Turning 155, the tension roller 156 crimped to this turning tooth 155 is arranged above the conveying path 1. The tension roller 156 is pivotally connected to the arm portion supported by the support shaft 157. 59 The front end of the arm portion 1 59 It is crimped to the elastic not shown below, crimped to the rotating tooth 155. "^ Electronic parts of the electronic component 20 is sealed embossing 40, based on the guide hole engaged by saliva u - A pair of rotary teeth 155 and not shown as a motor with a rotary drive and a constant speed for the intermittent feeding of. A pneumatic cylinder 160 is arranged below the arm portion 159, and 1 1 61 is located at a position abutting the arm portion 159. In addition, before the juice a 丄 one cup of glass month "return hole processing equipment 496822 V. Description of the invention (9) When the block 52 of 150 is lowered, the aforementioned pneumatic cylinder 160 is actuated to push out the rod 161 and push the arm 159 upward. When the tension roller 156 is separated from the turning tooth L55, the carrier belt 40 can be moved in several directions in the front-rear direction, so as not to hinder the position correction effect of the leading pin 158. In addition, the interval of changing the width of the thermoplastic resin tape 10 to 15 5 must be substantially equal to 玎 嘁, +, & y 4 ϋ, and the shape of the rotary hole 11 is separated. It has become the guide of the thermoplastic resin tape 10, the front of the f-turning tooth 155 and the tension roller 156, and the embossed cutting tape 4 sealed by the cover tape 30 is provided. The three-roller m is shown in the figure by using a carrier conveying speed as a turning mechanism and an embossed carrier. In the present invention, it is used as, for example, polybenzyl, polyacetate and poly: 1? ^ Band 3. Department of materials. In addition, it is the opposite of Jing B: the resin tape of the thermoplastic resin element. fPay static electricity, you can also use carbon mixed with carbon and then refer to the figure of the cold seal embossed carrier tape of the same device to form a sealed seal. + Before explaining it, first, pull it out from the first reel 101 and guide it to the guide track 105. Of the guide ditch 09. Also, the plastic resin tape 1 0 ′ is inserted in a certain length part to guide it? The guide hole 11 is formed at the front end of the band body 10, and the lead 150 at the front end is actuated by the device 150 in advance (step S1). Rotary teeth are engaged in the hole 11 When the device is operated in this state, the rotary teeth 155 are intermittently returned.

第12頁 496822 五、發明說明(ίο) 轉而搬送帶體1 〇。又,帶體丨〇首先係在成型加熱設備丨i 〇 處被上下一對加熱器1丨i、;[丨2所夾持,而將應壓花加工之 矩形範圍作加熱軟化(步驟s 2 )。 接著’當上述加熱軟化範圍移動至成型設備丨3 〇時, 模具132係上昇而抵接於帶體1〇之下表面而自加壓氣體送 入設備131之加壓噴嘴134朝模具丨32方向送入加壓氣體。 其結果’帶體1 〇之加熱軟化範圍被推壓至模具1 3 2之内部 而形成凹部12(步驟S3)。 如此’經壓花成型之帶體丨〇接著被送至引導孔加工設 備150,而第四氣壓缸15ι係將塊體152與沖孔器153 一體下 降而插入引導執道1〇5之透孔154,於通過引導溝log之熱 塑性樹脂帶1 〇兩側緣形成一定間隔之引導孔1 1。又,於沖 孔之前,主導梢丨58係插入既已形成之引導孔丨丨中而將熱 ,性树脂邢1 〇定位。此引導孔丨丨係嚙合於配置於帶體熔接 設備150前方之回轉齒155而賦予拉出帶體1〇之驅 驟S4)。 如此壓花成型加工之帶體丨〇係直接被裝裝 _。於封裝裝置200上首先於製品插入載電子 零件2 0 —個個插入凹部丨2 (步驟S5 )。 接著以覆蓋帶供給裝置230將覆蓋帶3〇自上述凹部12 上方加以覆蓋。其結果,電子零件2〇係以配置於凹部12内 之狀態將其上表面以覆蓋帶30覆蓋(步驟S6)。 接著於帶體熔接設備2 5 0處,將加熱器2 5 (推壓於熱塑 对月曰π 1 〇與蓋體帶3 〇之兩側邊上,而將熱塑性樹脂帶i 〇 496822 五、發明說明(11) ~-- 與覆蓋帶3 0之兩側邊加以忮接。宜^士里 乂 ;M ;合接。其結果,電子零件20係以 配置於帶體1〇、凹部12之狀態被覆蓋帶3〇密封(步驟S7)。 如此所,=出之收容有電子零件2〇之壓花載體帶, 係被捲繞於第二捲盤270上(步驟S8)。 因此,依本裝置可連續施行熱塑性樹脂帶丨〇之成型與 電子零件20之封入,而使作業效率變得極佳。又,比起將 上述作業分別施行之場合,本發明裝置全體係小型化且裝 置之設置空間與作業空間可減小許多。 【發明之效果】 如上所述’依本發明除可將熱塑性樹脂帶沿連續之搬 送路徑移動外亦可連續施行熱塑性樹脂之壓花成型與電 子零件等之製品之封裝,因此可減縮裝置之設置空間與作 業空間,可提向作業效率而達到省力化之目的。 【主要元件符號對照說明】 10 熱 塑 性 樹 脂 帶 11 引 導 孔 12 凹 部 20 電 子 零 件 30 覆 蓋 帶 40 封 有 電 子 零 件 之壓花載體帶 100 成 型 裝 置 110 成 型 部 加 执 設 備 111 、112 加 熱 器 130 成 型 設 備Page 12 496822 V. Description of the invention (ίο) Instead of conveying the belt body 1 〇. In addition, the belt body 丨 〇 is first clamped by a pair of upper and lower heaters 1 丨 i, [丨 2 at the forming heating equipment 丨 i 〇, and the rectangular area to be embossed is heated and softened (step s 2 ). Next, when the heating and softening range moves to the molding equipment, the mold 132 rises and abuts the lower surface of the belt body 10, and the pressure nozzle 134 from the pressurized gas feeding device 131 faces the mold 32. Feed in pressurized gas. As a result, the heating and softening range of the 'band body 10' is pushed to the inside of the mold 1 32 to form the recessed portion 12 (step S3). In this way, the embossed belt body is then sent to the guide hole processing equipment 150, and the fourth pneumatic cylinder 15ι lowers the block 152 and the punch 153 integrally and inserts it into the through hole of the guideway 105. 154. Guide holes 11 are formed at a certain interval on both edges of the thermoplastic resin tape 10 passing through the guide groove log. In addition, before punching, the leading tip 58 is inserted into the already formed guide hole 丨 and the thermal resin Xing 10 is positioned. This guide hole 丨 is engaged with the turning teeth 155 disposed in front of the belt welding device 150 to give the drive S10 for pulling out the belt 10). The embossed tape body 丨 〇 is directly installed. On the packaging device 200, the electronic-carrying parts 20 are first inserted into the product—each one of the insertion recesses 2 (step S5). Then, the cover tape 30 is covered by the cover tape supply device 230 from above the recessed portion 12. As a result, the electronic component 20 is covered with the cover tape 30 in a state where it is disposed in the recessed portion 12 (step S6). Next, at the belt welding device 250, the heater 25 (pressed on both sides of the thermoplastic pair π 1 〇 and the cover tape 3 〇, and the thermoplastic resin tape i 〇496822 V. Description of the invention (11) ~-It is connected to both sides of the cover tape 30. It should be connected to M; the joint is connected. As a result, the electronic component 20 is arranged in the belt body 10 and the recess 12 The state is sealed with the cover tape 30 (step S7). As such, the embossed carrier tape containing the electronic components 20 is wound around the second reel 270 (step S8). Therefore, according to the present The device can continuously perform the molding of the thermoplastic resin tape and the sealing of the electronic component 20, so that the operation efficiency becomes extremely excellent. In addition, compared with the case where the above-mentioned operations are performed separately, the entire system of the device of the present invention is miniaturized and the device is set up. The space and working space can be reduced a lot. [Effects of the Invention] As described above, according to the present invention, in addition to moving the thermoplastic resin tape along a continuous conveying path, it is also possible to continuously perform products such as embossing of thermoplastic resin and electronic parts. Package, which can reduce the installation space and operation of the device It can improve the work efficiency and save labor. [Comparison of the main component symbols] 10 Thermoplastic resin tape 11 Guide hole 12 Recess 20 Electronic part 30 Cover tape 40 Embossed carrier tape with electronic parts sealed 100 Molding device 110 Molding section processing equipment 111, 112 Heater 130 Molding equipment

第14頁 496822 五、發明說明(12) 131 加壓氣體送入設備 132 模具 1 4 0、1 4 0 a 外框元件 1 4 1、1 4 1 a 内框元件 142 置入元件 143 模具本體 15 0 孔加工設備 152 塊體 153 沖孔器Page 14 496822 V. Description of the invention (12) 131 Pressurized gas feeding equipment 132 Mold 1 4 0, 1 4 0 a Frame element 1 4 1, 1 4 1 a Inner frame element 142 Insertion element 143 Mold body 15 0 Hole processing equipment 152 Block 153 Puncher

2 0 0 封裝裝置 23 0 覆蓋帶供給設備 2 5 0 帶體熔接設備 251 加熱器2 0 0 Packaging device 23 0 Cover tape supply equipment 2 5 0 Tape welding equipment 251 Heater

第15頁 496822 圖式簡單說明 圖一為揭示本發明之壓花載體帶之成型密封裝置之一 實施型態之概略構成圖。 圖二為揭示同一裝置之正視圖。 圖三為揭示同一裝置之成型裝置渣部份放大正視圖。 圖四為同一成型裝置之左側視圖。 圖五為揭示同一成型裝置之成型部加熱設備與成型設 備之部份放大斷面圖。 圖六為使用於同一成型裝置上之模具之一例之分解立 體圖。Page 15 496822 Brief description of the drawings Fig. 1 is a schematic structural diagram showing one embodiment of the forming and sealing device of the embossed carrier tape of the present invention. Figure 2 is a front view of the same device. FIG. 3 is an enlarged front view of a slag portion of a molding device that reveals the same device. Figure 4 is a left side view of the same molding device. Fig. 5 is an enlarged cross-sectional view of a part of the heating equipment and the molding equipment of the molding unit in the same molding device. Figure 6 is an exploded perspective view of an example of a mold used in the same molding apparatus.

圖七為使用於同一成型裝置上之模具之另一例之分解 立體圖。 圖八為揭示同一成型裝置上之孔加工設備之動作之斷 面圖。 圖九為揭示同一成型裝置上之帶引導之變更方法之斷 面圖。 圖十為本發明之壓花載體帶之成型密封裝置之流程 圖。 圖十一為前述成型裝置上之主導梢與沖孔器之關係之 部份放大說明圖。Fig. 7 is an exploded perspective view of another example of a mold used in the same molding device. Fig. 8 is a sectional view showing the operation of the hole processing equipment on the same forming device. Fig. 9 is a sectional view showing a method for changing a belt guide on the same molding apparatus. Fig. 10 is a flow chart of the forming and sealing device of the embossed carrier tape of the present invention. Fig. 11 is an enlarged explanatory view of a part of the relationship between the leading tip and the punch in the aforementioned forming device.

第16頁Page 16

Claims (1)

496822 六、申請專利範圍 1 · 一種壓花載體 性樹 將成 置於 塑性 台, 設備 上表 前述 2. 如中 其中 部之 有夾 模具 押壓 3. 如中 裝置 合前 合於 立前 4·如中 其中 邊以 孑L加 脂帶之連 型部加熱 权具上而 樹脂帶之 係於前述 ,係對前 面供給覆 凹部之周 請專利範 前述成型 外框元件 持於前述 、及將 前 於前述模 請專利範 ’其中前 述熱塑性 前述孔加 述引導軌 請專利範 前述孔加 一定之間 工時係插 帶之成型密封裝置,其特徵為,係於熱塑 續搬送路徑上設置:成型部加熱設備,係 軟化;成型設備,將前述被加熱之部份配 施行壓花成型;孔加工設備,係於前述熱 側部以一定間隔形成引導孔;製品插入載 壓花成型之凹部中配置製品;覆蓋帶供給 ,熱塑性樹脂帶之前述壓花成型之凹部之 蓋f ’帶體炼接設備,係將前述覆蓋帶於 緣上炼接於前述熱塑性樹脂帶上。 ^第員之壓花載體帶之成型密封裝置, "又備係包括··具有平面視之呈匸字狀收容 、組裝於前述外框元件上之内框元件、具 外框7L件與前述内框元件間之置入元件的 述熱塑性樹脂帶之前述被加熱軟化之部份 具内之加壓氣體送入設備。 圍11、、項或第2項之壓花載體帶之成型密封 j 2路彳至係具備有配置於兩側之構成適 貰之寬度之引導溝的引導執道,與嚙 、、,Γ ΐ之加工所形成之引導孔的回轉齒, 運1、$述回轉齒之間隔為可變更者。 圍f 3項之壓花載體帶之成型密封裝置, =二,係具備··沿前述熱塑性樹脂帶之側 南既置之多數之沖孔器、利用該沖孔器作 入已形成之引導孔而將前述熱塑性樹脂496822 VI. Scope of patent application 1 · An embossed carrier tree will be placed on a plastic table, the above table of the equipment 2. If the middle of the mold is clamped 3. If the middle device is closed before the stand 4 · For example, the middle part is attached to the heating part of the connecting part of the greased belt and the resin belt is attached to the aforementioned part. For the weekly supply of the covered recessed part, please apply for a patent for the aforementioned molded outer frame element and The aforementioned mold patent patent, wherein the aforementioned thermoplastic aforementioned hole plus the guide rail, and the patent mentioned patent plus the aforementioned hole plus a certain period of time are inserted into the sealing device, which is characterized in that it is provided on the thermoplastic continuous conveying path: the molding section Heating equipment is for softening; molding equipment is for embossing the heated part; hole processing equipment is for forming guide holes at a certain interval on the hot side; the product is inserted into the concave part of the carrier embossing to configure the product ; Cover tape supply, the cover of the aforementioned embossed molding of the thermoplastic resin tape f 'belt body smelting equipment, which smelts the cover tape on the edge to the thermoplastic The resin tape. ^ The molding and sealing device for the embossed carrier tape of the second member, "also includes: an in-frame component with a flat-shaped storage, assembled on the aforementioned outer frame element, 7L pieces with an outer frame, and the aforementioned A part of the thermoplastic resin tape in which the component is placed between the components of the inner frame is heated by a pressurized gas into the equipment. The molding seal around the embossed carrier tape around item 11, item 2, or item 2 is a guide way with a guide groove having a suitable width arranged on both sides, and it is connected with the rod, ,, and Γ ΐ. The turning teeth of the guide holes formed by machining can be changed as described above. The forming and sealing device of the embossed carrier tape around item 3 of f = 2 is provided with a plurality of punchers installed along the south side of the aforementioned thermoplastic resin tape, and using the punchers to form the formed guide holes The thermoplastic resin 第17頁 496822Page 17 496822 第18頁Page 18
TW090118293A 2000-07-27 2001-07-26 Embossed carrier tape molding and sealing apparatus TW496822B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000226524A JP2002037205A (en) 2000-07-27 2000-07-27 Apparatus for molding and sealing embossed carrier tape

Publications (1)

Publication Number Publication Date
TW496822B true TW496822B (en) 2002-08-01

Family

ID=18720128

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090118293A TW496822B (en) 2000-07-27 2001-07-26 Embossed carrier tape molding and sealing apparatus

Country Status (4)

Country Link
US (1) US20020100257A1 (en)
JP (1) JP2002037205A (en)
CN (1) CN1346772A (en)
TW (1) TW496822B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555675B (en) * 2014-11-19 2016-11-01 Ueno Seiki Co Ltd Carrying device and electronic component handling device
TWI694039B (en) * 2018-12-26 2020-05-21 萬潤科技股份有限公司 Carrier tape sealing method and device

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY144621A (en) 2003-04-01 2011-10-14 Adaptsys Ltd Plastic embossed carrier tape apparatus and process
US7987653B2 (en) * 2004-03-03 2011-08-02 Adaptsys Limited Plastic embossed carrier tape process
JP3990680B2 (en) * 2004-04-30 2007-10-17 オリヒロエンジニアリング株式会社 Vertical filling and packaging machine
AU2005237866B2 (en) 2004-04-30 2008-09-11 Orihiro Engineering Co., Ltd. Vertical filling-packaging machine and method of manufacturing packaging bag
US7012232B1 (en) 2004-08-31 2006-03-14 Mark Gruenspecht RF welding device
JP2006327634A (en) * 2005-05-27 2006-12-07 Apic Yamada Corp Sealing apparatus and method
DE102006045327A1 (en) * 2006-09-22 2008-04-03 Cfs Germany Gmbh Heating plate with a variety of heating cartridges
US20100154190A1 (en) * 2008-12-19 2010-06-24 Sanger Kurt M Method of making a composite device
KR20130033143A (en) * 2011-09-26 2013-04-03 삼성전자주식회사 Carrier tape winding unit and apparatus of packing semiconductor package
US20140331611A1 (en) * 2011-12-09 2014-11-13 Gea Food Solutions Germany Gmbh Packaging machine with a combined shaping and sealing tool
DE102012003830A1 (en) * 2012-02-29 2013-08-29 Gea Cfs Germany Gmbh Packaging machine with a replaceable tool
CN106240919A (en) * 2015-06-15 2016-12-21 戴建宇 Electronic building brick waterproof cladding external member manufacture method
US10336480B2 (en) * 2015-06-18 2019-07-02 Nexperia B.V. Air-guided tape-and-reel system and method
TWI602747B (en) * 2016-04-11 2017-10-21 All Ring Tech Co Ltd Carrier tape cutting method and device
CN109866979A (en) * 2017-01-03 2019-06-11 东莞理工学院 A kind of interface automatic detection mechanism
CN106915490A (en) * 2017-04-20 2017-07-04 东莞职业技术学院 The intelligent sorting packaging facilities and method of a kind of SMD metalworks
WO2019095252A1 (en) * 2017-11-17 2019-05-23 陈子忠 Parallel method for packaging electronic element and coating adhesive on carrier tape and structure thereof
DE102018214666A1 (en) * 2018-08-29 2020-03-05 Multivac Sepp Haggenmüller Se & Co. Kg Process for packaging products and thermoforming packaging machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555675B (en) * 2014-11-19 2016-11-01 Ueno Seiki Co Ltd Carrying device and electronic component handling device
TWI694039B (en) * 2018-12-26 2020-05-21 萬潤科技股份有限公司 Carrier tape sealing method and device

Also Published As

Publication number Publication date
CN1346772A (en) 2002-05-01
JP2002037205A (en) 2002-02-06
US20020100257A1 (en) 2002-08-01

Similar Documents

Publication Publication Date Title
TW496822B (en) Embossed carrier tape molding and sealing apparatus
RU2603661C2 (en) Device for plastic film heat sealing
KR101063990B1 (en) Envelope
US4770735A (en) Techniques for welding thermoplastic tubes
KR960704692A (en) METHOD AND APPARATUS FOR INJECTION MOLDING WHILE PUT ON A PATTERN SIMULTANEOUSLY
KR101793152B1 (en) Manufacturing apparatus for vinyl envelope of center cutting-part
ATA149594A (en) SYSTEM FOR CONTINUOUS PRODUCTION OF COMPONENTS
CN1297444C (en) Apparatus for sealing flattened tube of heat-sealable filter paper to make filter bags for infusion products
JPH0794253A (en) Automatic waterproofing device for electric wire connection part
EP3623300A1 (en) Deep-draw packaging machine
JP2942983B2 (en) Wire binding device
JP2894488B2 (en) Emboss taping device
CN213650094U (en) Hot-press plastic sealing device for packaging roll toilet paper
DK0453715T3 (en) Device for deformation of a section
PL353884A1 (en) Method and device for the manufacture of corrugated material
KR20020043774A (en) Molding and on taping apparatus for Emboss carrier tape
KR20200008748A (en) Apparatus for packaging side of textile roll
KR20010035159A (en) Mold sealing device of emboss carrier tape
KR200241533Y1 (en) Mold sealing device of emboss carrier tape
JPS58134733A (en) Method and device for manufacturing corrugated member
JP3081999U (en) Equipment for manufacturing cushioning materials in paper bags
JP2640253B2 (en) Method and apparatus for forming embossed tape for carrier tape
CN214854798U (en) Chain belt jointing machine
CN213860789U (en) U-shaped corner protector forming machine
JPH0517260Y2 (en)

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees