CN1328930C - 一种加热元件的绝缘层 - Google Patents
一种加热元件的绝缘层 Download PDFInfo
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Abstract
公开了一种加热元件，至少包括基体、电绝缘层和电阻层。所述元件的电绝缘层包括通过溶胶-凝胶工艺得到的层，另外还公开了一种至少包括这种加热元件的家用电器产品，以及制造这种加热元件的方法。
Description
技术领域
本发明涉及一种加热元件，其至少包括基体、电绝缘层、和电阻层。此外，本发明还设计一种包括这种加热元件的家用电器产品，以及制造这种加热元件的方法。
背景技术
前面提到的加热元件，例如，可通过美国专利US-A-5,822,675进行了解。所述专利公开了一种加热元件，其包括基体，基体的表面上设有硅基电绝缘材料第一层；所述层最好还是可导热的，可从电阻层传导大量的热量。为了实现电绝缘和热传导，第一层最好包括填料，如铝、碳化硅或二氧化锆，以及硅树脂。在第一层的表面是第二层，第二层包括硅基导电材料。至少两个分开的硅基导电材料区域连接到第二层。这两个分开的区域都可以连接到电源。
上面提到的加热元件的缺点是用于电绝缘层的硅当吸收水分时出现漏电，因而超过国际电工委员会标准IEC335-1规定的0.75mA最大允许漏电电流。
可注意的是，US5973298描述一种电绝缘层设置在基体与电阻膜之间，电绝缘层优选为诸如SiO2/AlN的溶胶-凝胶施加的陶瓷。
发明内容
本发明的目的是提供一种根据前言所述的加热元件，其具有相对高的击穿电压。具体地，本发明的目的是提供一种加热元件，其基体包括铝或阳极氧化铝。应当清楚术语铝包括了铝和铝合金。另外，本发明的目的是提供一种包括这种加热元件的家用电器产品，还包括制造这种加热元件的方法。
本发明的这些目的和其他目的的实现是通过一种至少包括基体、电绝缘层和电阻层的加热元件，其特征在于，电绝缘层包括一种通过溶胶-凝胶工艺得到的第一层和一种包括热塑树脂的第二层，第二层位于在第一层和电阻层之间。
设置包括所谓溶胶-凝胶层的电绝缘层显示出许多优点。首先，溶胶-凝胶层具有优良的电绝缘性能。溶胶-凝胶材料的碳含量非常低，在加热元件出现故障的情况下可防止碳化的导电踪迹形成。因此，提供了安全的加热元件。而且，溶胶-凝胶材料具有高导热性能，其量级为0.5-2W/m/°K。另外溶胶-凝胶材料可在低于400℃的温度下进行加工，使得这种材料可直接应用于铝基体。
尽管溶胶-凝胶电绝缘层非常适合应用于铝基体，也可以应用于其他的传统上用于加热元件的基体和能够与最终效用兼容的基体。所述基体还可包括，比如，不锈钢、涂瓷釉钢或铜。基体可以具有与最终效用兼容的平板、管状或其他的结构形式。
具体地，溶胶-凝胶工艺至少包括有机硅烷化合物和水混合到一起的步骤。
所述有机硅烷化合物最好包括至少两个水解缩合取代基。
所述溶胶-凝胶工艺最好包括混合有机硅烷化合物和硅石颗粒的步骤，特别是与胶体氧化硅颗粒混合。
尽管多种有机硅烷可以用于高温应用的场合，耐热硅烷为优选。这种硅烷的优选示例是甲基三甲氧基硅烷(MTMS)或四乙氧基硅烷(TEOS)。增加这种层的厚度可以通过增加填料来实现，比如胶体氧化硅。
在某些情况下，有必要使电绝缘层具有最小的厚度，例如，当考虑到该层的电容性功能时。为了得到这样小的厚度，电绝缘层还要包括树脂。
特别是在溶胶-凝胶材料不能得到所要厚度时，这是很有利的。
为了得到丝网印刷的电绝缘层，所述层可有利地包括带有绝缘填料的树脂。
所述绝缘填料包括二氧化钛，氧化硅，氧化铝、云母或氧化铁。
树脂最好包括聚酰亚胺。
所述聚酰亚胺最好用绝缘填料来充填。
聚酰亚胺是一种具有耐高温性能和很好的电绝缘性能的材料。此材料在350℃以下不会出现漏电。绝缘填料材料可包括上面所提到的任何绝缘填料。
然而，在载荷很高或在寿命末期的情况下，加热元件可能出现故障。在出现问题的过程中，聚酰亚胺绝缘层可能出现碳化，因此形成了导电踪迹。应当清楚，这可能导致非常危险的后果。
为了避免这种危险情况的出现，加热元件的电绝缘层最好至少包括第一层，第一层是通过溶胶-凝胶工艺得到的；还有第二层，第二层包括热塑树脂，最好是聚酰亚胺。
在出现聚酰亚胺层击穿电压的情况下，溶胶-凝胶层将保持绝缘并保证加热元件安全。
本发明还涉及一种家用电器产品，其至少包括根据本发明的加热元件。
根据本发明的加热元件特别适合用于高温用途。这些应用包括，比如，(蒸汽)熨斗、开水壶、咖啡机、深煎锅、烤架、小暖炉、对开式铁心、烤面包片器、炉子、流水加热器、和类似的器具。
最后，本发明涉及一种制造加热元件的方法，至少包括步骤：
提供基体；
施加电绝缘层到所述基体；和
施加电阻层到电绝缘层的顶面。
所述方法的特征在于，电绝缘层包括一种通过溶胶-凝胶工艺形成的第一层和一种包括热塑树脂的第二层，第二层位于在第一层和电阻层之间。
本发明通过参考下的实施例、下面的制造示例和所附的附图来进一步说明。其中：
附图说明
图1显示了根据本发明的的加热元件的实施例的部分视图；
具体实施方式
应当注意到，各个元件是示意性的，没有按照比例绘制。
图1所示的加热元件1是基体2、绝缘层3和电阻层6的组合件。
在所示的实施例中，基体2包括用作熨斗底板的铝合金。所述基板覆盖了一电绝缘材料层3。在这种情况下，电绝缘层由通过溶胶-凝胶工艺得到第一层4，以及包括热塑树脂的第二层5组成。在这种情况下，热塑树脂包括聚酰亚胺。
溶胶-凝胶材料可以在低于400℃的温度下进行固化，固化可使溶胶-凝胶材料直接连接到铝合金基体上。由于溶胶-凝胶材料层4具有较低的碳含量，避免了形成导电踪迹，即使在加热元件出现故障的情况下。因此，溶胶-凝胶材料层4的绝缘性能仍保持完整。即使在极端的情形下。此外，溶胶-凝胶材料层4的导热性能非常高，具有0.5-2W/m/°K的量级。
出自对加热元件的一些要求，电绝缘层的厚度必须在大约30到60微米的范围。由于通过溶胶-凝胶技术难以组合这样厚的绝缘层，故将聚酰亚胺层5施加到溶胶-凝胶层的顶部，以便得到要求的厚度。但是，此溶胶-凝胶层尽可能地厚，以便利用上面所述的全部优点。示例
根据本发明的制造加热元件的方法
根据本发明的制造加热元件的方法至少包括下面的步骤：
提供基体；
施加电绝缘层到所述基体上；和
施加电阻层到所述电绝缘层顶面。
下面将进一步介绍本制造方法的各个步骤。
基体
制造方法的第一步是提供基体。在这种情况下，可参考上述实施例和附图，基体包括可以用作熨斗底板的阳极氧化铝板。为了保证所有各层之间的适当粘结，铝基体必须进行全面清洗。在这种情况下，基体根据下列程序进行清洗：
基体在含5％的中性皂溶液的去离子水中进行超声波清洗(大约1分钟)，使用的清洗机是Unitech Ultrasonic Cleaner；
然后将基体放在水槽中用流动的自来水进行清洗以及用软化水清洗。
最后基体在80℃进行干燥。
施加电绝缘层到基体上：
制备溶胶-凝胶绝缘材料
用于本示例性实施例的溶胶-凝胶层是基于甲基三甲氧基硅烷(MTMS)、硅溶胶AS40(40％重量的胶体氧化硅的水悬浮液)、乙醇和顺丁烯二酸的混合物。SiO2溶胶通过一步酸催化合成法进行制备。甲基三甲氧基硅烷(MTMS)(美国，Aldrich公司生产)、乙醇(Merck公司生产)、顺丁烯二酸和H2O(Ludox生产)以摩尔比例1∶1.37∶0.0166∶4.5进行混合。MTMS、EtOH和顺丁烯二酸在室温下混合2分钟。添加硅溶胶AS40(DuPont产品)，将溶液混合60分钟。在混合后，溶胶溶液通过5和2微米的过滤器进行过滤。硅溶胶和MTMS的重量比是0.99。溶胶-凝胶系统所用的配方和制备程序在下面给出。
溶胶-凝胶配方：
第一步MTMS(40g)加乙醇(18.5g)加顺丁烯二酸(0.568g)搅拌1到2分钟(顺丁烯二酸必须溶解)
第二步添加硅溶胶(AS-40)(39.6g)搅拌60分钟
制备完成后，在使用前，硅溶胶溶液通过5和2微米孔径的过滤器(美国，新泽西州，Whatman公司产品)，清除可能存在的颗粒。
施加第一溶胶-凝胶层到基体上
在将铝基体清洗干净后的两个小时内将溶胶-凝胶层施加到铝基体表面。
溶胶-凝胶层通过旋涂施加到铝基体上。或者溶胶-凝胶层也可以通过喷涂来施加。在本示例所使用的程序是以400rpm低转速旋涂5秒钟，接着以800rpm高转速旋涂10秒钟，一次运作产生的最终溶胶-凝胶层厚度为大约3-4微米。带有涂层的基体在100℃的温度下进行热处理(干燥)，持续10分钟以清除溶剂，这是在绝对无尘室内的扁平烤盘上进行的。干燥步骤之后，带有溶胶-凝胶材料涂层的基体在马弗炉中在大气气氛中在375℃的温度下进行固化大约20分钟。
施加下一个溶胶-凝胶层
产生的溶胶-凝胶层是不易被水沾湿的，防碍了后面的溶胶-凝胶层和/或聚酰亚胺层的适当粘结。因此有必要对所产生的层用“火焰”或紫外线/臭氧进行预处理使表面亲水。要求的溶胶-凝胶绝缘材料最后层厚因此可以通过多次旋涂-固化-火焰处理的循环来得到。聚酰亚胺层的适当粘结不仅要求火焰处理溶胶-凝胶层，还要求使用粘结促进剂，如γ-氨丙基三甲氧基硅烷(APS)，其以去离子水稀释溶液的形式应用。
施加聚酰亚胺绝缘层
制备聚酰亚胺层是通过在N-甲基吡咯烷酮(NMP)的聚酰胺酸(PAA)溶液的缩合反应。在示例中使用的材料是Pyre-M.L的RC-5019。该溶液的高粘度使其可旋涂出比较厚的这种材料层。通过在400rpm低转速下旋涂处理5秒钟，然后接着以800rpm高转速旋涂10秒钟可以得到高达20微米的干层厚度。
在旋涂后，所形成的涂层在150℃干燥10分钟。在冷却后，可以相同的方式施加第二层，并不需进一步的处理。最后元件在375℃保持30分钟进行固化。
施加电阻层到电绝缘层的顶面
电阻或发热层通过丝网印刷技术来施加。在这种情况下，电阻层包括发热迹线。发热迹线是碳和PAA(Pyre-M.L.的RC-5019)的混合物，这个混合物可按照丝网印刷工艺的要求成为糊状物。得到的层需要在80℃进行干燥10分钟以急剧蒸发NMP.
用银充填PAA制成的如接触迹线这样的其他层和顶层材料可以通过与电阻层相同的方式使用丝网印刷进行印刷，其后进行干燥。
最后整个组合层需要在375℃进行固化30分钟以便使PAA亚氨基化成为聚酰亚胺。
Claims (8)
1.一种加热元件，至少包括基体、电绝缘层和电阻层；其特征在于，所述电绝缘层包括：一种通过溶胶-凝胶工艺得到的第一层和一种包括热塑树脂的第二层，第二层位于在第一层和电阻层之间。
2.根据权利要求1所述的加热元件，其特征在于，所述溶胶-凝胶工艺至少包括将有机硅烷化合物和水混合到一起的步骤。
3.根据权利要求1所述的加热元件，其特征在于，所述溶胶-凝胶工艺至少包括将有机硅烷化合物和硅石颗粒混合到一起的步骤。
4.根据权利要求2或3所述的加热元件，其特征在于，所述有机硅烷化合物包括甲基三甲氧基硅烷或四乙氧基硅烷。
5.根据权利要求1所述的加热元件，其特征在于，所述树脂包括聚酰亚胺。
6.根据权利要求5所述的加热元件，其特征在于，所述聚酰亚胺中填充了绝缘填料。
7.一种家用电器产品，至少包括权利要求1到6中任一项所述的加热元件。
8.一种制造权利要求1到6中任一项所述的加热元件的方法，其包括步骤：
提供基体；
施加电绝缘层到所述基体上；和
施加电阻层到所述电绝缘层顶面；
其特征在于，所述电绝缘层包括一种通过溶胶-凝胶工艺得到的第一层和一种包括热塑树脂的第二层，第二层位于在第一层和电阻层之间。
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| ATE384413T1 (de) * | 2003-11-20 | 2008-02-15 | Koninkl Philips Electronics Nv | Dünnschichtheizelement |
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| US7126092B2 (en) * | 2005-01-13 | 2006-10-24 | Watlow Electric Manufacturing Company | Heater for wafer processing and methods of operating and manufacturing the same |
| US8197757B2 (en) * | 2006-07-07 | 2012-06-12 | Drexel University | Electrical insulation of devices with thin layers |
| US7572480B2 (en) * | 2006-10-19 | 2009-08-11 | Federal-Mogul World Wide, Inc. | Method of fabricating a multilayer ceramic heating element |
| US8481335B2 (en) * | 2006-11-27 | 2013-07-09 | Drexel University | Specificity and sensitivity enhancement in cantilever sensing |
| US7992431B2 (en) * | 2006-11-28 | 2011-08-09 | Drexel University | Piezoelectric microcantilevers and uses in atomic force microscopy |
| US8927259B2 (en) * | 2006-11-28 | 2015-01-06 | Drexel University | Piezoelectric microcantilever sensors for biosensing |
| US8456150B2 (en) | 2007-02-01 | 2013-06-04 | Drexel University | Hand-held phase-shift detector for sensor applications |
| WO2009046755A1 (en) * | 2007-10-08 | 2009-04-16 | Abb Research Ltd | Surface modified electrical insulation system with improved tracking and erosion resistance |
| WO2009079154A2 (en) | 2007-11-23 | 2009-06-25 | Drexel University | Lead-free piezoelectric ceramic films and a method for making thereof |
| WO2009126378A2 (en) | 2008-03-11 | 2009-10-15 | Drexel University | Enhanced detection sensitivity with piezoelectric microcantilever sensors |
| ES2698073T3 (es) * | 2008-04-22 | 2019-01-30 | Datec Coating Corp | Elemento calefactor de película gruesa, aislada, termoplástica a altas temperaturas |
| WO2009140660A2 (en) | 2008-05-16 | 2009-11-19 | Drexel University | System and method for evaluating tissue |
| KR100963224B1 (ko) * | 2009-02-03 | 2010-06-10 | (주) 더몰론코리아 | 물 또는 공기 중에서 겸용 사용이 가능한 세라믹 코팅 히터 |
| US20110086368A1 (en) * | 2009-10-08 | 2011-04-14 | Drexel University | Method for immune response detection |
| US8722427B2 (en) * | 2009-10-08 | 2014-05-13 | Drexel University | Determination of dissociation constants using piezoelectric microcantilevers |
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| US20020155303A1 (en) | 2002-10-24 |
| ATE311084T1 (de) | 2005-12-15 |
| EP1382226A1 (en) | 2004-01-21 |
| US6828032B2 (en) | 2004-12-07 |
| EP1382226B1 (en) | 2005-11-23 |
| JP2004519832A (ja) | 2004-07-02 |
| DE60207540T2 (de) | 2006-08-10 |
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| DE60207540D1 (de) | 2005-12-29 |
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