CN1325133A - 用于将半导体芯片安装到基片上的设备 - Google Patents

用于将半导体芯片安装到基片上的设备 Download PDF

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CN1325133A
CN1325133A CN01111601A CN01111601A CN1325133A CN 1325133 A CN1325133 A CN 1325133A CN 01111601 A CN01111601 A CN 01111601A CN 01111601 A CN01111601 A CN 01111601A CN 1325133 A CN1325133 A CN 1325133A
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尤金·曼哈特
奥古斯特·恩兹乐
安德烈·奥德马特
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Besi Switzerland AG
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Abstract

本发明涉及用于将半导体芯片安装到基片(1)上的安装设备,用该设备把基片(1)沿第1方面x步进地送到表示下一个基片位置(2)的粘接站,使弯曲基片或其它的基片按垂直于基片输送方向的方向在它的位置中稍稍移动,而使基片在粘接站正确定位。可以在粘接站处按垂直于输送方向的y方向测试基片(1)的纵向边缘(4)的位置,对基片(1)进行校正移动。传感器(12)可采用带有相邻设置的2个光障的光传感器。

Description

用于将半导体芯片安装到基片上的设备
本发明涉及将半导体芯片安装到基片上特别是引线框架(1)上的设备。
自动组装机械如通常所知的“Die Bonders”。半导体芯片安装时，输送装置把基片顺序送到施加粘接剂的分送站，之后，送到放有下一个半导体芯片的粘接站。输送设备已在欧洲专利EP-330831和瑞士专利CH-689188公开，用该装置把基片按垂直于输送方向的方向对准，用机械牵引基片，使它们抵住停止器。这种方法的缺点是，当牵引基片使它们抵住停止器时，某些基片变弯曲。另一方面，市售的动组装机要求在放置下一个半导体芯片之前用摄象或电子图像处理方式来及时确定和校正基片的位置。这种方法已在欧洲专利申请877544得知。该方法有两个显著缺点：由于要花循环时间因而费时而且价格贵。所以，要求自动组装机有高的放置精度和短的时间周期。
用于输送引线框架的带有可移动指示(indexing)头的引线框架工作站已由欧洲专利申请EP-542465公开。而且，还知道引线框架有弯曲边缘。指示头包括传感器，在获取和输送引线框架之前用它检测弯曲边缘的位置。按传感器光障所测到的情况，能部分补偿由引线框架的边缘曲率造成的位置误差。但是，获取引线框架之后，要使它机械对准指示头。指示头把引线框架送到工作站，在对引线框架加工时用降落夹紧系统夹住引线框架。得到的最好位置放置精度是25μm。为了得到布线必需的精度，用降落夹紧系统夹紧引线框架之后要用摄象方式测试半导体芯片引线框架。
本发明的目的是提高在短的时间周期安装的半导体芯片位置的精度。
权利要求1所述的特征构成了本发明。由从属权利要求得到了优选实施例。
发明建议在粘接站的高度上在垂直于输送方向的方向测试引线框架纵向边缘的位置，之后，使基片校正移动，以使基片处于位置正确的粘接位置上。为了进行该测试，建议使用带两个并排光障的光学传感器。
根据附图更详细地说明发明的实施例，附图所示只是示意性的，对具体尺寸没限制。
图1是半导体芯片和引线框架安装设备的部分示意图；
图2是另一引线框架；
图3是传感器；
图4是电子电路；
图5是校准板；和
图6是有两个传感器的设备。
图1示出了为了解本发明把半导体芯片安装到基片上的安装设备所必需的那些零件。基片是一个有许多芯片岛2的细长金属引线框架1，要放置的半导体芯片一个接一个的依次设置在上面。设备包括：输送系统，用于输送引线框架1；分送站，用于给引线框架1加粘接剂；和粘接站，在此处拾取和放置系统把半导体芯片一个接一个的放到引线框架1上。
引线框架总是位于水平输送平面xy中并按输送方向x移动。引线框架1留在构成引线框架1的水平滑道的可加热的支承板上，并处于输送平面xy上，用固定系统和可移动夹按输送方向x把引线框架依次送到分送站和粘接站。这种输送系统已在欧洲专利EP-330831中公开。因此，这里不详述。也可以用只有单个可移动夹紧装置的输送系统来输送引线框架1。用夹紧装置移动引线框架1，如果只有一个夹紧装置时用一个夹紧装置，使引线框架横向移动，即，沿负y方向牵引引线框架1，抵住与输送方向x平行设置的轨道3，轨道3用作停止器，并使它与此对准。引线框架1有沿其纵向边缘4和5设置的孔6，由未示出的光传感器扫描，孔6用于使引线框架1按输送方向准确定位。
图1中所示引线框架1是弯曲的。它的曲率被大大地放大了。由此，只有引线框架1的纵向边缘4的前后边缘区域7和8接触在轨道3上。引线框架1的纵向边缘4与轨道3之间的距离D随所处的位置而变化。D可达到80μm。而且，芯片岛2与轨道3之间的距离会有一定变化。如图2所示，若引线框架1的另一边弯曲，之后，只有一个边缘区域9接触在轨道3上。
在图1中，只要没有采取校正步骤，拾取和放置系统就将下一个半导体芯片放置在打有第一个“x”10的安装位置上。由于引线框架1的曲率使安装的位置与实际位置不符，实际位置打有第2个“x”11。这就造成引线框架1上的半导体芯片的实际位置相对于设置位置偏移一个距离，它代表在粘接站的位置处的引线框架1的纵向边缘4与轨道3的当前偏移距离。为了在放置下一个半导体芯片之前使实际的位置与设定位置一致，总是要用传感器12预先测出偏移距离，之后，按垂直于输送方向x的方向，也就是负y方向，使轨道3和夹紧装置移动测得距离a。通过夹紧装置牵引而抵着轨道3的引线框架1也就移动了，消除了实际位置与设定位置之间的偏差。
图3是适合于测试距离a的传感器12的沿y方向的剖视图。传感器12固定到轨道3(图1)上。轨道3在传感器12的区域处有一个凹部。传感器12有按y方向设置的光源13和两个光接收器14和15(图1)。一个接一个地构成两个光障。透镜16最好设置在光源与两个光接收器14和15之间的光束路径中，光源位于透镜16的聚光点。透镜16把光源13发射的光聚集成平行光束，光束按几乎垂直于纵向边缘4的区域照射引线框架1。用点划线表示图1中引线框架1的边缘区7和8所接触的轨道3的平面。通常，两个光接收器14和15中每个尺寸是1mm×1mm。传感器12和轨道13相互对准，使引线框架1只阻断从透镜16射到第1光接收器14的光束，而不阻断从透镜16射到第2光接收器15的光束。这就是说被光源13照射的引线框架1的阴影总是落在第1光接收器14上，而第2光接受器15没有阴影。
沿引线架1的纵向边缘4、5的插孔6距边缘只有0.4mm。最好在透镜16与光接收器14之间的光束中设置有一个以上的小孔板18，大多数情况下，无论有无以光源13发射的光穿过孔6，穿过孔6的光不会落到光接收器14上。光束(通路)中可以选择设置其它任何光学元件。
以第2光接收器15作参考基准，可以补偿光源13的亮度偏差和光接收器14的灵敏度偏差。同一个半导体芯片上最好放两上光接收器14和15。以使它们表现出相同的光灵敏度和温度灵敏度。用同步技术操作两个光障，由此，例如用200kHz调制供给光源13的电流幅度。最好用发光二极管作光源13，可对发光二极管的幅度进行100％的调制，而激光二极管的幅度调制可能只有较小的百分比。而且，如图4所示，两个光接收器14和15的信号最好馈给多路调制器19，然后由公用放大器20放大，再由多路解调器21分离，最后馈给A/D转换器22，这样放大器电路中的波动对两个信号有相同的影响。因此，第1光接收器14的输出连接第2光接收器15的输出连接到多路调制器19的第2输入。用标号23表示多路调制器19和多路解调器21的控制线。第1光接收器14的信号与作为参考的第2光接收器的信号之比构成传感器12的输出信号UA，它的数值表示引线框架1覆盖第1光接收器14的程度。
特性曲线UA(a)，表示图1所示传感器12的输出信号UA与引线框架1离开轨道3的距离之间的关系，例如是通过利用与图1所示引线框架1类似的校准板24时所产生的。如图5所示，校正板24有直的纵向边缘25，直纵向边缘25有凹进预定量的直边缘部分26。在寄存校正特性曲线UA(a)时校准板24贴放在轨道3上，至少对两个不同的边缘部分26测得输出信号UA并存储。
在正常操作下，用插入法从测得的输出信号UA与存储的特性曲线UA(a)算出当前距离，使轨道3、夹紧装置和引线框架1按预定的距离a沿y方向移动。校正移动一完成，半导体芯片就能放在引线框架1上的正确位置中。
图6示出把半导体芯片安装到引线框架1上用的安装设备，它有两个牢固设置的传感器12.1和12.2，用于测试引线框架1的纵向边缘与面对的轨道3之间的距离。该设备具有：分送站，它有在水平面中被引导的可移动写出头27，用于按预定图形给芯片岛2加粘接剂；和粘接站。这种分送站已在欧洲专利申请EP 901155中公开，在此引作参考。传感器12.1位于分送站处，在这里用于测量引线框架1的纵向边缘4到轨道3的距离。如上所述，传感器12.2用于测试在粘接站的引线框架1的纵向边缘4到轨道3的距离。
如果在粘接周期中测得距离9，之后，轨道按垂直于引线框架1的输送方向x的y方向移动，同时，相对于芯片岛2，分送站的书写头27的相对位置改变。在给芯片岛2加粘接剂时，考虑到传感器12.1测得的芯片岛2到轨道3的距离c，书写头27沿y方向受控制移动，同时轨道3沿y方向校正移动补偿距离a。
由于本发明，用输送夹的打开和闭合使在粘接处的弯曲的引线框架在其位置上稍稍移动，就可使引线框架在短的时间周期中位置精度达到微米级。

Claims (6)

1．一种用于将半导体芯片安装到基片的安装设备，特别是安装到金属引线框架(1)，用该设备把基片按第1方向(x)步进地送到粘接站，以呈现下一基片位置(2)，包括：传感器(12)，用于确定相对于垂直第1方向(x)的第2方向(y)的基片(1)的纵向边缘(4)位置，其特征是，传感器(12)具有由光源(13)和第1光接收器(14)构成的第1光障，和由光源(13)和第2光接收器(15)构成的用作参考的第2光障，传感器(12)设置成在工作中基片部分覆盖第1光障但不覆盖第2光障。
2．按权利要求1的设备，其特征是，第1和第2光接收器(14、15)集成在同一半导体芯片上。
3．按权利要求1或2的设备，其特征是，设有透镜(16)，使光源(13)位于透镜(16)的聚焦点。
4．按权利要求1至3之一的设备，其特征是，第1和第2光接收器(14和15)的信号馈入多路调制器(19)，并有公用放大器(20)串联连接到多路调制器(19)。
5．按权利要求1至4之一的设备，其特征是，光源(13)是发光二极管。
6．按权利要求1至5之一的设备，其特征是，在正常工作，用传感器(12)获得基片(1)的纵向边缘(4)相对于第2方向(y)的位置，随后，按第2方向(y)进行基片的校正移动，以使基片位于正确的下一个基片位置(2)中。
CNB011116013A 2000-03-17 2001-03-16 用于将半导体芯片安装到基片上的设备 Expired - Fee Related CN1171297C (zh)

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SG96203A1 (en) 2003-05-23
HK1040826A1 (zh) 2002-06-21
US20010035450A1 (en) 2001-11-01
KR20010090460A (ko) 2001-10-18
CH694931A5 (de) 2005-09-15
MY133998A (en) 2007-11-30
US6481614B2 (en) 2002-11-19
CN1171297C (zh) 2004-10-13

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