HK1040826A1 - 用於將半導體芯片安裝到基片上的設備 - Google Patents

用於將半導體芯片安裝到基片上的設備

Info

Publication number
HK1040826A1
HK1040826A1 HK02102519.6A HK02102519A HK1040826A1 HK 1040826 A1 HK1040826 A1 HK 1040826A1 HK 02102519 A HK02102519 A HK 02102519A HK 1040826 A1 HK1040826 A1 HK 1040826A1
Authority
HK
Hong Kong
Prior art keywords
substrate
semiconductor chips
mounting semiconductor
mounting
chips
Prior art date
Application number
HK02102519.6A
Other languages
English (en)
Inventor
尤金‧曼哈特
奧古斯特‧恩兹樂
安德烈‧奧德馬特
Original Assignee
Esec貿易公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec貿易公司 filed Critical Esec貿易公司
Publication of HK1040826A1 publication Critical patent/HK1040826A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/342—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells the sensed object being the obturating part
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
HK02102519.6A 2000-03-17 2002-04-04 用於將半導體芯片安裝到基片上的設備 HK1040826A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH5112000 2000-03-17

Publications (1)

Publication Number Publication Date
HK1040826A1 true HK1040826A1 (zh) 2002-06-21

Family

ID=4517443

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102519.6A HK1040826A1 (zh) 2000-03-17 2002-04-04 用於將半導體芯片安裝到基片上的設備

Country Status (8)

Country Link
US (1) US6481614B2 (zh)
KR (1) KR20010090460A (zh)
CN (1) CN1171297C (zh)
CH (1) CH694931A5 (zh)
DE (1) DE10110955A1 (zh)
HK (1) HK1040826A1 (zh)
MY (1) MY133998A (zh)
SG (1) SG96203A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6776327B2 (en) * 2002-11-05 2004-08-17 Palomar Technologies, Inc. High-accuracy placement method utilizing double pick and place
JP4151658B2 (ja) * 2005-02-18 2008-09-17 ヤマハ株式会社 物理量センサ、およびこれに使用するリードフレーム
US7416104B2 (en) * 2006-04-21 2008-08-26 International Business Machines Corporation Rotational fill techniques for injection molding of solder
US7694869B2 (en) * 2006-04-21 2010-04-13 International Business Machines Corporation Universal mold for injection molding of solder
US7410092B2 (en) * 2006-04-21 2008-08-12 International Business Machines Corporation Fill head for injection molding of solder
US9314864B2 (en) * 2007-07-09 2016-04-19 International Business Machines Corporation C4NP compliant solder fill head seals
US8324602B2 (en) * 2009-04-14 2012-12-04 Intersil Americas Inc. Optical sensors that reduce specular reflections
US8232541B2 (en) * 2009-04-14 2012-07-31 Intersil Americas Inc. Optical sensors that reduce specular reflections
CN112344855B (zh) * 2020-10-27 2022-08-26 阿波罗智联(北京)科技有限公司 障碍物的检测方法、装置、存储介质和路测设备
JP2024523149A (ja) * 2021-06-01 2024-06-28 クリック アンド ソッファ インダストリーズ、インク． 電子部品ボンディング装置およびそのような装置上の距離を測定する方法
CN114279331B (zh) * 2021-12-27 2024-04-05 长三角哈特机器人产业技术研究院 一种导叶片外形尺寸视觉测量装置及其测量方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3738560A (en) * 1970-12-08 1973-06-12 Kulicke & Soffa Ind Inc Semiconductor die bonder
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
DE2803653C3 (de) * 1978-01-27 1986-05-28 Texas Instruments Deutschland Gmbh, 8050 Freising Ausrichtvorrichtung
US4520102A (en) 1981-10-20 1985-05-28 Kuraray Co., Ltd. Microbial process for producing 12α-hydroxypregna-1,4-dien-3-one-20α-carboxylic acid
DE58909457D1 (de) 1988-02-26 1995-11-09 Esec Sa Verfahren und Einrichtung zum Bestücken von metallenen Systemträgern mit elektronischen Komponenten.
US5238174A (en) * 1991-11-15 1993-08-24 Kulicke And Soffa Investments, Inc. Smart indexing head for universal lead frame work station
EP0901155B1 (de) 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
JPH11136214A (ja) * 1997-10-28 1999-05-21 Matsushita Electric Ind Co Ltd 波長多重光伝送システム
US5944281A (en) * 1998-03-09 1999-08-31 The United States Of America As Represented By The Secretary Of The Army Dual band millimeter-infrared fiber optics guidance data link
CH689188A5 (de) 1998-03-26 1998-11-30 Esec Sa Verfahren zum Transport eines Folienstreifens und Transportanlage fuer Folienstreifen.

Also Published As

Publication number Publication date
CN1325133A (zh) 2001-12-05
US20010035450A1 (en) 2001-11-01
MY133998A (en) 2007-11-30
DE10110955A1 (de) 2001-10-04
CN1171297C (zh) 2004-10-13
KR20010090460A (ko) 2001-10-18
CH694931A5 (de) 2005-09-15
US6481614B2 (en) 2002-11-19
SG96203A1 (en) 2003-05-23

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