CN1304179C - 从板材切割产品的方法及相关设备 - Google Patents

从板材切割产品的方法及相关设备 Download PDF

Info

Publication number
CN1304179C
CN1304179C CNB028260066A CN02826006A CN1304179C CN 1304179 C CN1304179 C CN 1304179C CN B028260066 A CNB028260066 A CN B028260066A CN 02826006 A CN02826006 A CN 02826006A CN 1304179 C CN1304179 C CN 1304179C
Authority
CN
China
Prior art keywords
sheet material
bracing
strutting arrangement
cut
described sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB028260066A
Other languages
English (en)
Chinese (zh)
Other versions
CN1607998A (zh
Inventor
迈克尔·W·加德
Original Assignee
Jetsis International Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jetsis International Pte Ltd filed Critical Jetsis International Pte Ltd
Publication of CN1607998A publication Critical patent/CN1607998A/zh
Application granted granted Critical
Publication of CN1304179C publication Critical patent/CN1304179C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02Wire-cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/10Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0461Welding tables
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K7/00Cutting, scarfing, or desurfacing by applying flames
    • B23K7/002Machines, apparatus, or equipment for cutting plane workpieces, e.g. plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10Making cuts of other than simple rectilinear form
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20Cutting beds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/04Processes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/364By fluid blast and/or suction
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/647With means to convey work relative to tool station
    • Y10T83/6476Including means to move work from one tool station to another
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/647With means to convey work relative to tool station
    • Y10T83/6584Cut made parallel to direction of and during work movement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control Of Cutting Processes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Making Paper Articles (AREA)
CNB028260066A 2001-12-28 2002-12-27 从板材切割产品的方法及相关设备 Expired - Lifetime CN1304179C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG2001081058 2001-12-28
SG200108105A SG121700A1 (en) 2001-12-28 2001-12-28 A method and related apparatus for cutting a product from a sheet material

Publications (2)

Publication Number Publication Date
CN1607998A CN1607998A (zh) 2005-04-20
CN1304179C true CN1304179C (zh) 2007-03-14

Family

ID=20430883

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028260066A Expired - Lifetime CN1304179C (zh) 2001-12-28 2002-12-27 从板材切割产品的方法及相关设备

Country Status (13)

Country Link
US (2) US7231855B2 (de)
EP (1) EP1467845B1 (de)
JP (1) JP4596780B2 (de)
KR (1) KR20040073531A (de)
CN (1) CN1304179C (de)
AT (1) ATE424979T1 (de)
AU (1) AU2002367166A1 (de)
CA (1) CA2470898C (de)
DE (1) DE60231553D1 (de)
HK (1) HK1077253A1 (de)
MY (1) MY138820A (de)
SG (1) SG121700A1 (de)
WO (1) WO2003055654A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110167270A (zh) * 2019-05-29 2019-08-23 业成科技(成都)有限公司 治具及贴装设备

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7153186B2 (en) 2002-09-13 2006-12-26 Towa Intercon Technology, Inc. Jet singulation
ATE395717T1 (de) 2002-09-13 2008-05-15 Towa Corp Strahlvereinzelung eines substrats
US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
JP2007190625A (ja) * 2006-01-17 2007-08-02 Disco Abrasive Syst Ltd ウォータージェット加工方法およびウォータージェット加工装置
SG136008A1 (en) * 2006-03-29 2007-10-29 Jetsis Int Pte Ltd Platform and method for supporting a workpiece to be cut from sheet material
KR20110095267A (ko) * 2008-11-18 2011-08-24 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 고속 레이저 블랭킹을 위한 지지 테이블 프레임
CH702452A1 (de) * 2009-12-17 2011-06-30 Micromachining Ag Bearbeitungsvorrichtung zum Bearbeiten eines Werkstücks mittels mindestens eines Flüssigkeitsstrahls.
CN103567642B (zh) * 2012-08-08 2017-07-11 赛恩倍吉科技顾问(深圳)有限公司 蓝宝石切割装置
FR2997880B1 (fr) * 2012-11-13 2015-09-04 Christophe Ribot Procede de decoupe de rectangles
US20150053058A1 (en) 2013-08-21 2015-02-26 John Bean Technologies Corporation Rotatable manifold cutter for use in portioning
IS3000B (is) * 2013-08-21 2018-07-15 John Bean Tech Corporation A Delaware State Corporation Snúanlegur margþættur skeri til þess að nota við skömmtun
CN104028864A (zh) * 2014-06-25 2014-09-10 哈尔滨工业大学 一种多线电火花切割装置
CN107073738A (zh) * 2014-10-24 2017-08-18 福伊特专利有限公司 水射流切割装置
CN110549078B (zh) * 2019-09-12 2021-06-04 山东上达稀土材料有限公司 一种钕铁硼加工方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092889A (en) * 1975-04-09 1978-06-06 The British Hydromechanics Research Association Slotted worktable
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
JPS632579A (ja) * 1986-06-19 1988-01-07 Amada Co Ltd 熱切断加工方法およびその装置
JPS63272420A (ja) * 1987-05-01 1988-11-09 Hoden Seimitsu Kako Kenkyusho Ltd ワイヤ放電加工方法
JPH08294899A (ja) * 1995-04-26 1996-11-12 Ibiden Co Ltd 回路基板切断用治具
CN1287038A (zh) * 2000-08-31 2001-03-14 华中科技大学 板材数控无模成型加工机

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3818790A (en) * 1972-11-29 1974-06-25 Armstrong Cork Co Carpet tile cutter
GB1422494A (en) * 1973-02-09 1976-01-28 Nienstedt H Apparatus for sawing up flat rectangular blocks in particular deep-frozen blocks of fish
JPS5395385A (en) * 1977-01-31 1978-08-21 Matsushita Electric Works Ltd Tile cutting apparatus
DE3437125A1 (de) * 1984-10-10 1986-04-17 Oxytechnik Gesellschaft für Systemtechnik mbH, 6236 Eschborn Verfahren zur fertigung von mehreren flaechensektionen
US4949610A (en) * 1985-04-15 1990-08-21 Flow System, Inc. Board-supporting assembly for fluid jet cutting system
JPS62282898A (ja) * 1986-05-30 1987-12-08 大成建設株式会社 ウオ−タ−ジエツト切断工法における切断溝の処理装置
US4934112A (en) * 1989-03-29 1990-06-19 Libbey-Owens-Ford Co. Multiple head abrasive cutting of glass
JPH04372400A (ja) * 1991-06-14 1992-12-25 Furukawa Electric Co Ltd:The 積層された金属薄板の切断加工方法
DE4134273C2 (de) * 1991-10-17 1994-05-26 Wolfgang Mayer Vorrichtung zum Zuschneiden und zur Kantenbearbeitung plattenförmiger Werkstücke
JP2880626B2 (ja) * 1993-06-02 1999-04-12 川崎重工業株式会社 ワークの切断加工方法
JP3281148B2 (ja) * 1993-11-11 2002-05-13 富士重工業株式会社 高圧流体噴流体による切断加工方法およびその切断加工装置
US5481083A (en) * 1993-12-23 1996-01-02 Cincinnati, Incorporated System and method for stacking and laser cutting multiple layers of flexible material
US6103049A (en) * 1994-05-31 2000-08-15 Johns Manville International, Inc. Method and apparatus for cutting, sealing and encapsulated fibrous products
JP3527371B2 (ja) * 1996-10-29 2004-05-17 三菱電機株式会社 レーザ加工機、レーザ加工機のワーク搬送装置およびワークを搬送する搬送装置
IT250346Y1 (it) * 1998-05-05 2003-09-03 Atom Spa Gruppo di taglio a getto d'acqua a teste multiple. in particolare perpelle, cuoio e materiali sintetici.
JP2000246696A (ja) * 1999-02-26 2000-09-12 Rohm Co Ltd 電子部品用基板の溝加工方法
US6155245A (en) * 1999-04-26 2000-12-05 Zanzuri; Clement Fluid jet cutting system and method
US6586955B2 (en) * 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays
US6634928B2 (en) * 2001-11-09 2003-10-21 International Business Machines Corporation Fluid jet cutting method and apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092889A (en) * 1975-04-09 1978-06-06 The British Hydromechanics Research Association Slotted worktable
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
JPS632579A (ja) * 1986-06-19 1988-01-07 Amada Co Ltd 熱切断加工方法およびその装置
JPS63272420A (ja) * 1987-05-01 1988-11-09 Hoden Seimitsu Kako Kenkyusho Ltd ワイヤ放電加工方法
JPH08294899A (ja) * 1995-04-26 1996-11-12 Ibiden Co Ltd 回路基板切断用治具
CN1287038A (zh) * 2000-08-31 2001-03-14 华中科技大学 板材数控无模成型加工机

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110167270A (zh) * 2019-05-29 2019-08-23 业成科技(成都)有限公司 治具及贴装设备

Also Published As

Publication number Publication date
CN1607998A (zh) 2005-04-20
MY138820A (en) 2009-07-31
KR20040073531A (ko) 2004-08-19
AU2002367166A1 (en) 2003-07-15
US20050235789A1 (en) 2005-10-27
SG121700A1 (en) 2006-05-26
CA2470898A1 (en) 2003-07-10
JP4596780B2 (ja) 2010-12-15
EP1467845A1 (de) 2004-10-20
CA2470898C (en) 2008-09-02
DE60231553D1 (de) 2009-04-23
JP2005512837A (ja) 2005-05-12
ATE424979T1 (de) 2009-03-15
HK1077253A1 (en) 2006-02-10
US7231855B2 (en) 2007-06-19
US20070209491A1 (en) 2007-09-13
WO2003055654A1 (en) 2003-07-10
EP1467845B1 (de) 2009-03-11

Similar Documents

Publication Publication Date Title
CN1304179C (zh) 从板材切割产品的方法及相关设备
KR102028765B1 (ko) 원형 판형상물의 분할 방법
EP2279983A2 (de) Vorrichtung und Verfahren zur Verarbeitung eines Brüchigmaterialsubstrats
US20100313868A1 (en) Concrete block splitting and pitching apparatus and method
JP2010194784A (ja) スクライブ装置及びスクライブ方法
CN102097371B (zh) 衬底划分设备
KR101737743B1 (ko) 버 제거기능을 가지는 평와셔 제조장치
CN203774265U (zh) 石墨舟片卡点更换工装桌
JP5702765B2 (ja) スクライブ装置及びスクライブ方法
CN101147241B (zh) 用于分离具有可控切割边产品的方法和设备及分离的产品
CN201201165Y (zh) 一种工件定位装置
CN104979286A (zh) 晶片的加工方法
KR20190016527A (ko) 레이저를 이용하여 취성 물질로 이루어진 원형 평면판을 복수 개의 직사각형 개별판들로 분리하기 위한 방법
TW200931510A (en) Wafer cleaver with high-precision cutting
CN105645752B (zh) 脆性材料基板的切断方法
CN105382883A (zh) 料头冲切装置
CN211101057U (zh) 一种电子雷管剪平装置
CN102601643A (zh) 多工件夹紧装置
CN210614796U (zh) 一种侧墙倒扣侧切机构
JP3170661U (ja) ガラス基板の加工装置
CN106863394A (zh) Led灯珠的分离装置及其分离方法
JP3220338U (ja) 基板の辺縁欠如部の分断装置
CN110270715B (zh) 一种全自动直角切割装置
EP2239117A1 (de) Maschine zur Bildung von Fugenlinien auf Platten und/oder zum Schneiden von Fliesen aus Platten und entsprechende Verfahren
CN204135669U (zh) 方舌全自动加工机

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1077253

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20090220

Address after: Tokyo, Japan

Patentee after: DISCO Corp.

Address before: Singapore Singapore

Patentee before: Jetsis International Pte. Ltd.

ASS Succession or assignment of patent right

Owner name: CO., LTD. DISIKE

Free format text: FORMER OWNER: JITTA SITH INTERNATIONAL CO., LTD.

Effective date: 20090220

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20070314