DE60231553D1 - Verfahren und verwandte vorrichtung zum schneiden eines produkts aus einem bahnmaterial - Google Patents

Verfahren und verwandte vorrichtung zum schneiden eines produkts aus einem bahnmaterial

Info

Publication number
DE60231553D1
DE60231553D1 DE60231553T DE60231553T DE60231553D1 DE 60231553 D1 DE60231553 D1 DE 60231553D1 DE 60231553 T DE60231553 T DE 60231553T DE 60231553 T DE60231553 T DE 60231553T DE 60231553 D1 DE60231553 D1 DE 60231553D1
Authority
DE
Germany
Prior art keywords
sheet material
predetermined shape
cut
line
support means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60231553T
Other languages
English (en)
Inventor
Michael William Gadd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Application granted granted Critical
Publication of DE60231553D1 publication Critical patent/DE60231553D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0461—Welding tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K7/00—Cutting, scarfing, or desurfacing by applying flames
    • B23K7/002—Machines, apparatus, or equipment for cutting plane workpieces, e.g. plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10—Making cuts of other than simple rectilinear form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20—Cutting beds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/364—By fluid blast and/or suction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/647—With means to convey work relative to tool station
    • Y10T83/6476—Including means to move work from one tool station to another
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/647—With means to convey work relative to tool station
    • Y10T83/6584—Cut made parallel to direction of and during work movement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control Of Cutting Processes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Making Paper Articles (AREA)
DE60231553T 2001-12-28 2002-12-27 Verfahren und verwandte vorrichtung zum schneiden eines produkts aus einem bahnmaterial Expired - Lifetime DE60231553D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200108105A SG121700A1 (en) 2001-12-28 2001-12-28 A method and related apparatus for cutting a product from a sheet material
PCT/SG2002/000297 WO2003055654A1 (en) 2001-12-28 2002-12-27 A method and related apparatus for cutting a product from a sheet material

Publications (1)

Publication Number Publication Date
DE60231553D1 true DE60231553D1 (de) 2009-04-23

Family

ID=20430883

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60231553T Expired - Lifetime DE60231553D1 (de) 2001-12-28 2002-12-27 Verfahren und verwandte vorrichtung zum schneiden eines produkts aus einem bahnmaterial

Country Status (13)

Country Link
US (2) US7231855B2 (de)
EP (1) EP1467845B1 (de)
JP (1) JP4596780B2 (de)
KR (1) KR20040073531A (de)
CN (1) CN1304179C (de)
AT (1) ATE424979T1 (de)
AU (1) AU2002367166A1 (de)
CA (1) CA2470898C (de)
DE (1) DE60231553D1 (de)
HK (1) HK1077253A1 (de)
MY (1) MY138820A (de)
SG (1) SG121700A1 (de)
WO (1) WO2003055654A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7153186B2 (en) 2002-09-13 2006-12-26 Towa Intercon Technology, Inc. Jet singulation
CN1703774A (zh) 2002-09-13 2005-11-30 东和－英特康科技公司 基片的喷射分割
JP4777881B2 (ja) * 2004-05-20 2011-09-21 三星ダイヤモンド工業株式会社 マザー基板分断方法、マザー基板スクライブ装置、プログラムおよび記録媒体
JP2007190625A (ja) * 2006-01-17 2007-08-02 Disco Abrasive Syst Ltd ウォータージェット加工方法およびウォータージェット加工装置
SG136008A1 (en) * 2006-03-29 2007-10-29 Jetsis Int Pte Ltd Platform and method for supporting a workpiece to be cut from sheet material
JP2012509177A (ja) * 2008-11-18 2012-04-19 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード 高速レーザ材料取り用支持テーブル架台
CH702452A1 (de) * 2009-12-17 2011-06-30 Micromachining Ag Bearbeitungsvorrichtung zum Bearbeiten eines Werkstücks mittels mindestens eines Flüssigkeitsstrahls.
CN103567642B (zh) * 2012-08-08 2017-07-11 赛恩倍吉科技顾问（深圳）有限公司 蓝宝石切割装置
FR2997880B1 (fr) * 2012-11-13 2015-09-04 Christophe Ribot Procede de decoupe de rectangles
IS3000B (is) * 2013-08-21 2018-07-15 John Bean Tech Corporation A Delaware State Corporation Snúanlegur margþættur skeri til þess að nota við skömmtun
US20150053058A1 (en) 2013-08-21 2015-02-26 John Bean Technologies Corporation Rotatable manifold cutter for use in portioning
CN104028864A (zh) * 2014-06-25 2014-09-10 哈尔滨工业大学 一种多线电火花切割装置
CN107073738A (zh) * 2014-10-24 2017-08-18 福伊特专利有限公司 水射流切割装置
CN110167270B (zh) * 2019-05-29 2020-06-05 业成科技（成都）有限公司 治具及贴装设备
CN110549078B (zh) * 2019-09-12 2021-06-04 山东上达稀土材料有限公司 一种钕铁硼加工方法

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* Cited by examiner, † Cited by third party
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US3818790A (en) * 1972-11-29 1974-06-25 Armstrong Cork Co Carpet tile cutter
GB1422494A (en) * 1973-02-09 1976-01-28 Nienstedt H Apparatus for sawing up flat rectangular blocks in particular deep-frozen blocks of fish
US4092889A (en) * 1975-04-09 1978-06-06 The British Hydromechanics Research Association Slotted worktable
JPS5395385A (en) * 1977-01-31 1978-08-21 Matsushita Electric Works Ltd Tile cutting apparatus
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
DE3437125A1 (de) * 1984-10-10 1986-04-17 Oxytechnik Gesellschaft für Systemtechnik mbH, 6236 Eschborn Verfahren zur fertigung von mehreren flaechensektionen
US4949610A (en) * 1985-04-15 1990-08-21 Flow System, Inc. Board-supporting assembly for fluid jet cutting system
JPS62282898A (ja) * 1986-05-30 1987-12-08 大成建設株式会社 ウオ−タ−ジエツト切断工法における切断溝の処理装置
JPS632579A (ja) * 1986-06-19 1988-01-07 Amada Co Ltd 熱切断加工方法およびその装置
JPS63272420A (ja) * 1987-05-01 1988-11-09 Hoden Seimitsu Kako Kenkyusho Ltd ワイヤ放電加工方法
US4934112A (en) * 1989-03-29 1990-06-19 Libbey-Owens-Ford Co. Multiple head abrasive cutting of glass
JPH04372400A (ja) * 1991-06-14 1992-12-25 Furukawa Electric Co Ltd:The 積層された金属薄板の切断加工方法
DE4134273C2 (de) * 1991-10-17 1994-05-26 Wolfgang Mayer Vorrichtung zum Zuschneiden und zur Kantenbearbeitung plattenförmiger Werkstücke
JP2880626B2 (ja) * 1993-06-02 1999-04-12 川崎重工業株式会社 ワークの切断加工方法
JP3281148B2 (ja) * 1993-11-11 2002-05-13 富士重工業株式会社 高圧流体噴流体による切断加工方法およびその切断加工装置
US5481083A (en) * 1993-12-23 1996-01-02 Cincinnati, Incorporated System and method for stacking and laser cutting multiple layers of flexible material
US6103049A (en) * 1994-05-31 2000-08-15 Johns Manville International, Inc. Method and apparatus for cutting, sealing and encapsulated fibrous products
JPH08294899A (ja) * 1995-04-26 1996-11-12 Ibiden Co Ltd 回路基板切断用治具
JP3527371B2 (ja) * 1996-10-29 2004-05-17 三菱電機株式会社 レーザ加工機、レーザ加工機のワーク搬送装置およびワークを搬送する搬送装置
IT250346Y1 (it) * 1998-05-05 2003-09-03 Atom Spa Gruppo di taglio a getto d'acqua a teste multiple. in particolare perpelle, cuoio e materiali sintetici.
JP2000246696A (ja) * 1999-02-26 2000-09-12 Rohm Co Ltd 電子部品用基板の溝加工方法
US6155245A (en) * 1999-04-26 2000-12-05 Zanzuri; Clement Fluid jet cutting system and method
US6586955B2 (en) * 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays
CN1111465C (zh) * 2000-08-31 2003-06-18 华中科技大学 板材数控无模成型加工机
US6634928B2 (en) * 2001-11-09 2003-10-21 International Business Machines Corporation Fluid jet cutting method and apparatus

Also Published As

Publication number Publication date
CN1304179C (zh) 2007-03-14
CA2470898C (en) 2008-09-02
CN1607998A (zh) 2005-04-20
ATE424979T1 (de) 2009-03-15
WO2003055654A1 (en) 2003-07-10
JP2005512837A (ja) 2005-05-12
US20050235789A1 (en) 2005-10-27
SG121700A1 (en) 2006-05-26
JP4596780B2 (ja) 2010-12-15
MY138820A (en) 2009-07-31
HK1077253A1 (en) 2006-02-10
EP1467845B1 (de) 2009-03-11
EP1467845A1 (de) 2004-10-20
AU2002367166A1 (en) 2003-07-15
US7231855B2 (en) 2007-06-19
KR20040073531A (ko) 2004-08-19
US20070209491A1 (en) 2007-09-13
CA2470898A1 (en) 2003-07-10

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Legal Events

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8364 No opposition during term of opposition