CN1293794C - 用于在基底上装配元件的装配系统和方法 - Google Patents
用于在基底上装配元件的装配系统和方法 Download PDFInfo
- Publication number
- CN1293794C CN1293794C CNB028145909A CN02814590A CN1293794C CN 1293794 C CN1293794 C CN 1293794C CN B028145909 A CNB028145909 A CN B028145909A CN 02814590 A CN02814590 A CN 02814590A CN 1293794 C CN1293794 C CN 1293794C
- Authority
- CN
- China
- Prior art keywords
- substrate
- substrate holder
- transportation route
- along
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2001125392 DE10125392A1 (de) | 2001-05-23 | 2001-05-23 | Bestücksystem und Verfahren zum Bestücken von Substraten mit Bauelementen |
DE10125391A DE10125391B4 (de) | 2001-05-23 | 2001-05-23 | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
DE10125391.5 | 2001-05-23 | ||
DE10125392.3 | 2001-05-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1606903A CN1606903A (zh) | 2005-04-13 |
CN1293794C true CN1293794C (zh) | 2007-01-03 |
Family
ID=26009381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028145909A Expired - Fee Related CN1293794C (zh) | 2001-05-23 | 2002-05-17 | 用于在基底上装配元件的装配系统和方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20040143963A1 (zh) |
EP (1) | EP1389344B1 (zh) |
CN (1) | CN1293794C (zh) |
WO (1) | WO2002095793A2 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7761977B2 (en) * | 2003-07-03 | 2010-07-27 | Assembleon N.V. | Component placement device |
DE102007046346A1 (de) * | 2007-09-27 | 2009-04-23 | Siemens Ag | Instandhaltung einer auswechselbaren Komponente einer Bestückvorrichtung |
DE102008019102A1 (de) * | 2008-04-16 | 2009-10-29 | Siemens Aktiengesellschaft | Anordnung zum Transport von Substraten, Anordnung zum Handhaben von Substraten, Anordnung zum Herstellen elektronischer Baugruppen sowie Verfahren zum Handhaben von Substraten |
DE102009015769B4 (de) * | 2009-03-31 | 2016-01-21 | Asm Assembly Systems Gmbh & Co. Kg | Fertigungslinie und Fertigungsverfahren |
EP2842402B1 (de) * | 2012-07-06 | 2018-09-05 | Siemens Aktiengesellschaft | Zuordnung von leiterplatten auf bestückungslinien |
JP2015531159A (ja) | 2012-07-06 | 2015-10-29 | シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft | 複数のプリント基板を各実装ラインへと割り当てるための方法 |
JP6606668B2 (ja) * | 2016-10-27 | 2019-11-20 | パナソニックIpマネジメント株式会社 | 部品実装方法 |
DE112018007673T5 (de) * | 2018-05-30 | 2021-03-11 | Yamaha Hatsudoki Kabushiki Kaisha | Bauteilwiederauffüllungs- verwaltungssystem und bauteilmontage-system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0302542A1 (en) * | 1987-07-14 | 1989-02-08 | Koninklijke Philips Electronics N.V. | Apparatus for the transport of carriers from and to a positioning device, and selection device for use in such an apparatus |
CN1237085A (zh) * | 1998-05-25 | 1999-12-01 | 索尼公司 | 装配装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1234924A (en) * | 1984-01-21 | 1988-04-05 | Hideo Sakamoto | Printed circuit board load-unload system with bypass route |
US5271139A (en) * | 1989-04-04 | 1993-12-21 | Walter Sticht | Production installation |
JPH0715171A (ja) * | 1993-06-28 | 1995-01-17 | Matsushita Electric Ind Co Ltd | 部品装着装置 |
SE9400077D0 (sv) * | 1994-01-10 | 1994-01-14 | Mytronic Ab | Maskinkoncept |
US5517748A (en) * | 1994-10-07 | 1996-05-21 | Samsung Electronics Co., Ltd. | Apparatus for conveying circuit boards through a component-mounting station |
DE29513799U1 (de) * | 1995-08-28 | 1995-10-19 | Siemens AG, 80333 München | Bestückautomat |
IL120071A (en) * | 1997-01-24 | 2002-03-10 | Orbotech Ltd | Method and system for continuously processing workpieces along a production line |
JP4523217B2 (ja) * | 1999-05-21 | 2010-08-11 | パナソニック株式会社 | 板状部材の搬送保持装置及びその方法、並びに部品実装装置 |
US6643917B1 (en) * | 2000-01-19 | 2003-11-11 | Delaware Capital Formation | Redundant system for assembly of electronic components to substrates |
-
2002
- 2002-05-17 EP EP02737846.2A patent/EP1389344B1/de not_active Expired - Lifetime
- 2002-05-17 US US10/478,374 patent/US20040143963A1/en not_active Abandoned
- 2002-05-17 CN CNB028145909A patent/CN1293794C/zh not_active Expired - Fee Related
- 2002-05-17 WO PCT/DE2002/001787 patent/WO2002095793A2/de not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0302542A1 (en) * | 1987-07-14 | 1989-02-08 | Koninklijke Philips Electronics N.V. | Apparatus for the transport of carriers from and to a positioning device, and selection device for use in such an apparatus |
CN1237085A (zh) * | 1998-05-25 | 1999-12-01 | 索尼公司 | 装配装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2002095793A3 (de) | 2003-02-20 |
WO2002095793A2 (de) | 2002-11-28 |
EP1389344A2 (de) | 2004-02-18 |
US20040143963A1 (en) | 2004-07-29 |
CN1606903A (zh) | 2005-04-13 |
EP1389344B1 (de) | 2014-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS LIMITED PARTN Free format text: FORMER OWNER: SIEMENS AG Effective date: 20090925 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090925 Address after: Munich, Germany Patentee after: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG Address before: Munich, Germany Patentee before: Siemens AG |
|
C56 | Change in the name or address of the patentee |
Owner name: ADVANCED ASSEMBLY SYSTEMS GMBH + CO. KG Free format text: FORMER NAME: SIEMENS AG (DE) |
|
CP01 | Change in the name or title of a patent holder |
Address after: Munich, Germany Patentee after: ASM Assembly Systems GmbH & Co. KG Address before: Munich, Germany Patentee before: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070103 Termination date: 20150517 |
|
EXPY | Termination of patent right or utility model |