CN1290956C - Adhesive for connecting anisotropic circuit, circuit board connection method and connector - Google Patents
Adhesive for connecting anisotropic circuit, circuit board connection method and connector Download PDFInfo
- Publication number
- CN1290956C CN1290956C CNB2004100634893A CN200410063489A CN1290956C CN 1290956 C CN1290956 C CN 1290956C CN B2004100634893 A CNB2004100634893 A CN B2004100634893A CN 200410063489 A CN200410063489 A CN 200410063489A CN 1290956 C CN1290956 C CN 1290956C
- Authority
- CN
- China
- Prior art keywords
- compound
- anisotropic conductive
- adhesion agent
- epoxy
- circuit connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
The present invention relates to an adhesive for connecting an anisotropic electroconductive circuits. The adhesive is interposed between two neighboring boards having opposite circuit electrodes so as to electrically connect the corresponding electrodes along the pressing direction in pressing process. Said adhesive comprises an electrode conductive particle which has been subject to a surface treatment with at least a compound selected from the group consisting of a radical polymerization compound and a basic compound or a compound having at least an epoxy group.
Description
Technical field
The present invention relates to a kind of anisotropic conductive circuit connected adhesion agent, with the method for attachment and the circuit connecting body of the circuit card of these tackiness agent, in more detail, relate to the good and storage stability of a kind of curability at low temperatures might as well connect resistance-stable anisotropic conductive circuit connected adhesion agent simultaneously, with the method for attachment and the circuit connecting body of the circuit card of these tackiness agent.
Background technology
In recent years, for fixed electronic element or carry out circuit and connect, using has various adhesivess in fields such as semi-conductor and liquid-crystal displays.Aspect these purposes, improve constantly its densification, high precision int, and tackiness agent is also required to have high bonding force and reliability.
As circuit connection material, being connected and in being connected of FPC and printed circuit board, using to have to make conducting particles be distributed to anisotropic conductive circuit connected adhesion agent in the tackiness agent particularly at liquid-crystal display and TCP or FPC and TCP.In addition, recently, even in the occasion that semiconductor silicon chips is installed on the circuit card, the lead-in wire bonding that also need not pass by, carry out flip-chip and install but directly semiconductor silicon chips is installed to what is called on the circuit card, at this moment also begin to be suitable for anisotropic conductive circuit connected adhesion agent (spy open clear 59-120436 number, spy open clear 60-191228 number, spy open flat 1-251787 number, spy and open flat 7-90237 communique) with flip chip bonding.
In addition, in recent years,, carrying out the densification of circuit and the width of electrode and the interval of electrode and also becoming extremely narrow in the precision electronic device field.Therefore, under the condition of contact of using epoxy village fat type circuit connected adhesion agent in the past, problems such as coming off, peeling off of wiring and position deviation take place in existence.In addition, in order to enhance productivity, necessarily require the short connection time that can connect, and the low temperature rapidly-curable also becomes essential condition below 10 seconds.Thus, open the circuit connection material that discloses the free-radical polymerised material of use in the flat 10-273636 communique the spy.
But, when being placed in the air, in connection, have the so-called problem that resistance raises that connects to the tackiness agent of free-radical polymerised object that contains (methyl) acrylate, phosphate compound etc. and conducting particles.
Summary of the invention
It is excellent and storage stability is good and connect resistance-stable circuit connected adhesion agent and the anisotropic conductive circuit connected adhesion agent grown following working life in high humidity and with the method for attachment and the linker of the circuit card of this tackiness agent to the purpose of this invention is to provide a kind of low temperature voltinism of tachy steroling.
Anisotropic conductive circuit connected adhesion agent of the present invention is characterized in that being made of following compositions at least in the resin film formation thing that conducting particles is disperseed equably form:
(1) surface covers with Ag, Au, Pt, and from the transition metal of Co, Zn, Cu, the Ni conducting particles of exposing surface not;
(2) has compound by polymeric functional group of free radical institute;
(3) produce the solidifying agent of free radical by heating or light.
(4) phosphate compound.
In addition, in above-mentioned anisotropic conductive circuit connected adhesion agent, it is characterized in that described compound is selected at least a imide resin or the naphthols imide resin for contract from (methyl) acrylate resin, maleic anhydride imide resin, citraconic anhydride contract.
The method of attachment of circuit card of the present invention, be make above-mentioned anisotropic conductive circuit connected adhesion agent between have relatively to the circuit card of circuit electrode between, pressurization have relatively to the circuit card of circuit electrode, simultaneously, according to circumstances irradiates light (activation energy) the circuit card method of attachment that is electrically connected between the electrode of compression aspect.
In addition, linker of the present invention, be make above-mentioned anisotropic conductive circuit connected adhesion agent between have relatively to the circuit card of circuit electrode between, pressurization have relatively to the circuit card of circuit electrode, simultaneously the linker that is electrically connected between the electrode of compression aspect.
Anisotropic conductive circuit connected adhesion agent of the present invention, even under the situation that the room temperature high humidity is placed, also can suppress to connect the rising of resistance or the reduction of bonding strength after the various reliability tests such as connection initial stage, humidity test, cold cycling, and express good connection reliability.
The anisotropic conductive circuit connected adhesion agent be at film, by the sticky object surface on formed anisotropic conductive resin.
In addition, the present invention be between have relatively to the liner plate of circuit electrode between, pressurization have relatively to the liner plate of circuit electrode, and make the anisotropic conductive circuit connected adhesion agent that is electrically connected between the electrode of compression aspect, it is characterized in that in above-mentioned tackiness agent, containing (1) free-radical polymerised compound and (2) and use from carrying out the surface-treated conducting particles by basic cpd and at least a compound that compound constituted selects a group with at least one epoxy group(ing).Above-mentioned anisotropic conductive circuit connected adhesion agent preferably contains by light or adds the compound or the phosphate compound of thermogenesis free radical.And, anisotropic conductive circuit connected adhesion agent of the present invention preferably in surface treatment employed basic cpd be amine compound.
In addition, linker of the present invention be make the anisotropic conductive circuit connected adhesion agent between have relatively to the liner plate of circuit electrode between, pressurization have relatively to circuit electrode liner plate and make the linker that is electrically connected between the electrode of compression aspect, and this anisotropic conductive circuit connected adhesion agent is for containing (1) free-radical polymerised compound and (2) from by basic cpd with have the tackiness agent of compound constituted one group selected at least a compound the carries out surface-treated conducting particles of at least one epoxy group(ing).
In anisotropic conductive circuit connected adhesion agent of the present invention, the conducting particles that the transition metal that uses on the conducting particles surface except that Ag, Au, Pt etc. does not expose.In order to obtain sufficient moisture-proof working life and connection reliability, the most surperficial metal adopts the precious metal of Au, Ag, Pt family, and is preferably Au.
Employed conducting particles in anisotropic conductive circuit connected adhesion agent of the present invention can conduct electricity the electroconductibility that connects as long as have, and then just has no particular limits, and can enumerate the metallics of Au, Ag, Ni, Cu, Co, scolding tin etc. or graphite etc.In addition, also can use the conducting particles that covers nonconducting glass, pottery, plastics etc. by the conducting material of described metal.At this moment, the metal layer thickness that is covered is preferably more than 100 dusts in order to obtain sufficient electroconductibility.When on the transition metal of Co, Zn, Cu, Ni etc., being provided with layer of precious metal, because the layer of precious metal damaged or that produced when the conducting particles blending dispersion of layer of precious metal damaged etc. produced free radical and caused by the redoxomorphism that is produced and reduce working life, so carry out the conducting particles surface treatment.For the circuit connected adhesion agent composition, conducting particles can use in the scope of 0.1-30 volume %, and is preferably in the scope use of 0.1-20 volume %.
As the compound of handling the conducting particles surface, preferably handle with having with the reactive compound of acidic substance, by this processing, can improve the storage stability of above-mentioned anisotropic conductive circuit connected adhesion agent significantly.
In addition, as the compound of handling the conducting particles surface, preferably basic cpd or have at least 1 epoxy group(ing) compound, especially be preferably aminated compounds as basic cpd.
As aminated compounds, promptly also solid of liquid makes it to be dissolved in use in organic solvent or the water etc. for solid the time.In addition, even in the compound of liquid, preferably also make it to be dissolved in middle uses such as organic solvent.As organic solvent, then without particular limitation if do not react with aminated compounds and can dissolve aminated compounds, but this point of conducting particles is seen and is preferably methyl alcohol, ethanol, Virahol, methylethylketone, vinyl acetic monomer, toluene after the drying treatment.
As the concentration of contained aminated compounds in treatment solution, be preferably 0.05-20 weight %.When less than 0.05 weight %, can not carry out effective surface treatment, but when surpassing 20 weight %, then the quantitative change of the aminated compounds that is covered on the conducting particles surface is many, connection resistance is uprised.
As compound with at least one epoxy group(ing), promptly can be liquid and also can be solid, for solid the time, make it to be dissolved in organic solvent or the water etc. and use.In addition, even to fluid cpds, preferably also be to make it to be dissolved in the organic solvent etc. to use.As organic solvent, so long as do not have reactivity and can dissolve compound with at least one epoxy group(ing) with compound with at least one epoxy group(ing), then without particular limitation, but the conducting particles after handling from desiccated surface is seen and is preferably methyl alcohol, ethanol, Virahol, methylethylketone, vinyl acetic monomer, toluene etc.
As the compound concentrations with at least one epoxy group(ing) contained in treatment solution, ideal is 0.05-20 weight %.When less than 0.05 weight %, can not carry out surface treatment effectively, and when surpassing 20 weight %, then the quantitative change of the compound with at least one epoxy group(ing) that is covered on the conducting particles surface is many, and connection resistance uprises.
Treatment condition such as the temperature when carrying out surface treatment, time have no particular limits, but preferably treatment temp is-100 ℃ of room temperatures (25 ℃), and the treatment time is 10 seconds-1 hour.
In addition, use the dry after filtration back of handled conducting particles.Drying conditions can carry out appropriate selection according to employed organic solvent, but carries out under-150 ℃ of room temperatures (25 ℃) usually.
As employed basic cpd in surface treatment of the present invention, especially aminated compounds, can enumerate triethylamine, diethylamine, butylamine, quadrol, hexanediamine, aniline, aminopropyl trimethoxysilane, imidazoles, 2-ethyl-4-methylimidazole, 2-phenyl-1-cyanoethyl imidazoles, vinyl imidazole, vinyl pyridine etc., in amine, can enumerate primary, the second month in a season and tertiary amine, these also can mix more than 2 kinds and use.
As employed compound with at least one epoxy group(ing) in surface treatment of the present invention is phenyl glycidyl ether, glycidyl methacrylate, γ-glycidoxypropyltrime,hoxysilane, γ-glycidoxy propyl-triethoxysilicane, γ-glycidoxy propyl group methyl dimethoxysilane, γ-glycidoxy propyl group methyldiethoxysilane, β-(3,4-epoxy group(ing) cyclohexyl) ethyl trimethoxy silane, bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, phenol novolak type epoxy resin, the cresols phenolic resin varnish type epoxy resin, bisphenol-A phenolic varnish type Resins, epoxy, bisphenol F phenolic varnish type Resins, epoxy, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, glycolylurea type Resins, epoxy, isocyanuric acid ester type Resins, epoxy, aliphatics straight chain shape Resins, epoxy etc.These Resins, epoxy promptly can be by halogenation, also can hydrogenation.In addition, these epoxy compoundss also can share more than 2 kinds.
Employed free-radical polymerised compound in anisotropic conductive circuit connected adhesion agent of the present invention, for having compound by polymeric functional group of free radical institute, for (methyl) acrylate resin, maleic anhydride contract imide resin, citraconic anhydride contract imide resin, naphthols imide resin etc., also can mix use more than 2 kinds.In addition, free-radical polymerised compound also can monomer or any form of oligopolymer use, and also can monomer and oligopolymer mix and use.Here, so-called " (methyl) acrylate " is meant acrylate and its corresponding methacrylic ester.
As (methyl) acrylate is to make (methyl) acrylate carry out the resulting compound of radical polymerization, can enumerate (methyl) methyl acrylate as (methyl) acrylate, (methyl) ethyl propenoate, (methyl) isopropyl acrylate, (methyl) isobutyl acrylate, (methyl) vinylformic acid glycol ester, two (methyl) vinylformic acid binaryglycol ester, three (methyl) vinylformic acid, three propyl ester, tetramethyl glycol four (methyl) acrylate, 2-hydroxyl-1,3-propenyloxy group propane, 2,2-two [4-(propenyloxy group methoxyl group) phenyl] propane, 2,2-two [4-(propenyloxy group oxyethyl group) phenyl] propane, dicyclopentenyl (methyl) acrylate, tricyclic decenyl (methyl) acrylate, three (propenyloxy group ethyl) isocyanic ester, urethane (methyl) acrylate, cyamelide oxyethane modification diacrylates etc., above-claimed cpd can separately or mix more than 2 kinds and use.In addition, as required, under the situation that does not diminish solidified nature, also can use radical polymerization inhibitors such as quinhydrones, methyl ether quinhydrones.
In addition, when using phosphate compound, can improve bonding force as free-radical polymerised compound to inorganicss such as metals.Relative adhesive component 100 weight parts of the usage quantity of these phosphate compounds are the 0.1-10 weight part, and are preferably the 0.5-5 weight part.Phosphate compound can be obtained by the reaction of phosphoric anhydride and 2-hydroxyethyl meth acrylate.Concrete have list (2-methacryloyl hydroxyethyl) acid phosphoric acid ester, two (2-methacryloyl hydroxyethyl) acid phosphoric acid ester.
As the maleic anhydride imide resin that contracts is the compound that has a maleic anhydride imido grpup in molecule at least, the phenyl maleic anhydride imines that contracts is for example arranged, 1-methyl-2, the 4-span comes the acid anhydrides imines benzene that contracts, N, a N '-benzene two maleic anhydrides imines that contracts, N, N '-to the benzene two maleic anhydrides imines that contracts, N, N '-4, the 4-biphenyl two maleic anhydrides imines that contracts, N, N '-4,4-(3, the 3-dimethyl diphenyl) the two maleic anhydrides imines that contracts, N, N '-4,4-(3, the 3-dimethyl diphenyl methane) the two maleic anhydrides imines that contracts, N, N '-4,4-(3,3-diethylbenzene ditane) the two maleic anhydrides imines that contracts, N, N '-4, the 4-ditane two maleic anhydrides imines that contracts, N, N '-4, the 4-diphenyl propane two maleic anhydrides imines that contracts, N, N '-4, the 4-phenyl ether two maleic anhydrides imines that contracts, N, N '-4, the 4-sulfobenzide two maleic anhydrides imines that contracts, 2,2-two [4-(4-maleic anhydride contract imines phenoxy group) phenyl] propane, 2, two [the 3-S-butyl-3 of 2-, 4-(4-maleic anhydride phenoxy group) phenyl] propane, 1,1-two [4-(4-maleic anhydride contract imines phenoxy group) phenyl] decane, 4,4 '-cyclohexylene-two [1-(4-maleic anhydride contract imines phenoxy group) phenoxy group]-2-phenylcyclohexane, 2,2-two [4-(4-maleic anhydride contract imines phenoxy group) phenyl] HFC-236fa etc., these compounds can also can mix use separately more than 2 kinds.
As the citraconic anhydride imide resin that contracts is to make to have the citraconic anhydride citraconic anhydride of the imido grpup group with imine moiety polymeric compounds that contracts that contracts at least, as the citraconic anhydride group with imine moiety that contracts, the phenyl citraconic anhydride imines that contracts is for example arranged, 1-methyl-2, the two lemon health of the 4-imines benzene that contracts, N, a N '-benzene two citraconic anhydrides imines that contracts, N, N '-to the benzene two citraconic anhydrides imines that contracts, N, N '-4, the 4-biphenyl two citraconic anhydrides imines that contracts, N, N '-4,4-(3, the 3-dimethyl diphenyl) the two citraconic anhydrides imines that contracts, N, N '-4,4-(3, the 3-dimethyl diphenyl methane) the two citraconic anhydrides imines that contracts, N, N '-4,4-(3,3-diethylbenzene ditane) the two citraconic anhydrides imines that contracts, N, N '-4, the 4-ditane two citraconic anhydrides imines that contracts, N, N '-4, the 4-diphenyl propane two citraconic anhydrides imines that contracts, N, N '-4, the 4-phenyl ether two citraconic anhydrides imines that contracts, N, N '-4, the 4-sulfobenzide two citraconic anhydrides imines that contracts, 2,2-two [4-(4-citraconic anhydride contract imines phenoxy group) phenyl] propane, 2, two [3-S-butyl-3,4-(the 4-citraconic anhydride phenoxy group) phenyl] propane of 2-, 1,1-two [4-(4-citraconic anhydride contract imines phenoxy group) phenyl] decane, 4,4 '-cyclohexylene-two [1-(4-citraconic anhydride contract imines phenoxy group) phenoxy group]-2-phenylcyclohexane, 2,2-two [4-(4-citraconic anhydride contract imines phenoxy group) phenyl] HFC-236fa etc., above-claimed cpd can also can mix use separately more than 2 kinds.
As the naphthols imide resin is to be aggregated in the naphthols group with imine moiety that has a naphthols imido grpup in the molecule at least.For example have as the naphthols group with imine moiety: phenyl naphthols imines, 1-methyl-2,4-bisnaphthol imines benzene, N, a N '-benzene bisnaphthol imines, N, N '-to benzene bisnaphthol imines, N, N '-4,4-biphenyl bisnaphthol imines, N, N '-4,4-(3, the 3-dimethyl diphenyl) bisnaphthol imines, N, N '-4,4-(3, the 3-dimethyl diphenyl methane) bisnaphthol imines, N, N '-4,4-(3,3-diethylbenzene ditane) bisnaphthol imines, N, N '-4,4-ditane bisnaphthol imines, N, N '-4,4-diphenyl propane bisnaphthol imines, N, N '-4,4-phenyl ether bisnaphthol imines, N, N '-4,4-sulfobenzide bisnaphthol imines, 2, two [4-(the 4-naphthols imines phenoxy group) phenyl] propane of 2-, 2, two [3-S-butyl-3,4-(the 4-naphthols imines phenoxy group) phenyl] propane of 2-, 1, two [4-(the 4-naphthols imines phenoxy group) phenyl] decane of 1-, 4,4 '-cyclohexylene-two [1-(4-naphthols imines phenoxy group) phenoxy group]-2-phenylcyclohexane, 2,2 '-two [4-(4-naphthols imines phenoxy group) phenyl] HFC-236fa etc., these compounds can also can mix use separately more than 2 kinds.
When stating free-radical polymerised compound in the use, use polymerization starter as the solidifying agent that produces free radical by heating or light.If can or add the compound of thermogenesis free radical by light as polymerization starter, then not have especially and limit, can be superoxide or azo-compound etc.Though connection temperature, tie-time, storage stability of being considered as purpose etc. can suitably be selected, but from hyperergy and stability, using the temperature of 10 hours transformation period is more than 40 ℃, and the temperature of 1 minute transformation period is that the organo-peroxide below 180 ℃ is an ideal, and the temperature that is preferably 10 hours transformation period is more than 50 ℃, and the temperature of 1 minute transformation period is the organo-peroxide below 170 ℃.When be 10 seconds continuous time, for the total amount of the relative tackiness agent of use level of the polymerization starter that obtains abundant reactivity is that 1-20 weight % is preferably 2-15 weight %.Concrete compound as used organo-peroxide can be selected from diacyl peroxide, mistake two carbonic ethers, peroxy esters, peroxy ketal, dialkyl peroxide, hydroperoxide, silicomethane superoxide etc.; but peroxy esters, dialkyl peroxide, hydroperoxide, silicomethane superoxide; chlorion in initiator or organic acid are that 5000ppm is when following; decompose the corrosion that the back organic acid that is produced is few, can suppress the splicing ear of circuit block, so desirable especially.And preferably select the ester from obtaining crossing of hyperergy, these compounds also can suitably mix use.
Can enumerate isobutyryl superoxide, 2 as diacyl peroxide; 4-dichloro-benzoyl superoxide, 3; 5,5-trimethyl acetyl superoxide, decoyl superoxide, dodecanoyl superoxide, stearyl superoxide, succinyl superoxide, benzoyl are crossed toluene, benzoyl superoxide etc.
Can enumerate di and cross two carbonic ethers, di-isopropyl and cross that two carbonic ethers, two (4-tert-butylcyclohexyl peroxide), two carbonic ethers, two-2-oxyethyl group methoxy base are crossed two carbonic ethers, two (2-ethylhexyl peroxide), two carbonic ethers, the dimethoxy butyl is crossed two carbonic ethers, two (3-methyl-3-methoxy butyl peroxy), two carbonic ethers as crossing two carbonates.
Can enumerate cumenyl peroxide neodecanoic acid ester as the peroxy esters class, 1,1,3,3-tetramethylbutyl peroxide neodecanoic acid ester, 1-cyclohexyl-1-first and second basic peroxide neodecanoic acid esters, uncle's hexyl peroxide neodecanoic acid ester, t-butyl peroxy trimethylacetic acid ester, 1,1,3,3-tetramethyl butyl peroxide-2-ethylhexanoate, 2,5-dimethyl-2,5-two (2-ethyl hexanoyl peroxide) hexane, 1-cyclohexyl-1-first and second basic peroxide-2-ethylhexanoate, uncle's hexyl peroxide-2-ethylhexanoate, t-butyl peroxy-2-ethylhexanoate, the t-butyl peroxy isobutyrate, 1,1-two (t-butyl peroxy) hexanaphthene, uncle's hexyl peroxy isopropyl base monocarbonate, t-butyl peroxy-3,5,5-tri-methyl hexanoic acid ester, the t-butyl peroxy laurate, 2, the 5-dimethyl-, 25-two (toluoyl peroxide) hexane, t-butyl peroxy sec.-propyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, uncle's hexyl peroxy benzoate, t-butyl peroxy acetic ester etc.
Can enumerate 1 as the peroxy ketal class, 1-two (uncle's hexyl peroxide)-3,3,5-trimethyl-cyclohexane, 1,1-two (uncle's hexyl peroxide) hexanaphthene, 1,1-two (t-butyl peroxy)-3,3,5-trimethyl-cyclohexane, 1,1-(t-butyl peroxy) cyclododecane, 2,2-two (t-butyl peroxy) decane etc.
Can enumerate α as the dialkyl peroxide class, α '-two (t-butyl peroxy) diisopropyl benzene, two cumenyl superoxide, 2,5-dimethyl-2,5-two (t-butyl peroxy) hexane, tertiary butyl cumenyl superoxide etc.
Can enumerate diisopropylbenzyl hydroperoxide, cumene hydroperoxide etc. as hydroperoxide type.
Can enumerate tertiary butyl trimethyl silyl superoxide, two (tertiary butyl) dimethylsilane superoxide, tertiary butyl trivinyl silicomethane superoxide, two (tertiary butyl) divinyl silicomethane superoxide, three (tertiary butyl) vinyl silicomethane superoxide, tertiary butyl triolefin propylene silicomethane superoxide, two (tertiary butyl) diallyl silicomethane superoxide, three (tertiary butyl) allyl group silicomethane superoxide etc. as the silicomethane peroxide.
In addition, for the corrosion of the splicing ear that suppresses circuit block, being preferably in chlorion contained in the radical initiator (solidifying agent) or organic acid is below the 5000ppm, and few better of the organic acid that is produced after the thermal degradation.In addition, for the stability of the circuit connection material that improves made, be preferably in the weight conservation rate that after placing 24 hours, has under room temperature (25 ℃), the normal pressure more than the 20 weight %.And these compounds also can suitably mix use.
These radical initiators can be used alone or as a mixture, and also can mix and use decomposition accelerating agent, inhibitor etc.
In addition, these radical initiators of coverings such as polymer substance that are with polyurethane series, polyester carry out micro encapsulation, and can extend working time is ideal.
Except that free-radical polymerised compound, also can cooperate Resins, epoxy as thermosetting resin.As Resins, epoxy bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, phenol novolak type epoxy resin, cresol-novolak varnish type Resins, epoxy, bisphenol-A phenolic varnish type Resins, epoxy, bisphenol F phenolic varnish type Resins, epoxy, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, glycolylurea type Resins, epoxy, isocyanuric acid ester type Resins, epoxy, aliphatics chain Resins, epoxy etc. are arranged, these Resins, epoxy can carry out halogenation, also can add hydrogen, and also can share more than 2 kinds.
In addition, can enumerate the curing agent for epoxy resin of using amine, phenols, anhydrides, imidazoles, Dyhard RU 100 etc. commonly used as above-mentioned curing agent for epoxy resin.And, also can suitably use normally used tertiary amines, organophosphorus based compound as curing catalyst.
In addition, as the method that makes the Resins, epoxy reaction, except that using described solidifying agent, can use sulfonium salt, salt compounded of iodine etc., and also can make it to carry out cationoid polymerisation.
In addition, form thing at circuit connected adhesion agent of the present invention or anisotropic conductive resin film, because the stress retentivity when giving with film forming, cementability, curing is so can use polymer compositions such as polyvinylbutyral resin, polyethylene methylal, vibrin, polyamide resin, polyimide resin, xylene resin, phenoxy resin, urethane resin, Precondensed UreaFormaldehyde Resin.The molecular weight of these macromolecule components is preferably 10,000-10,000,000.In addition, the also available free radical polyalcohol functional group modification of these resins, and raising thermotolerance at this moment.And, also available free-radical polymerised functional group or modifications such as epoxy group(ing), carboxyl, raising thermotolerance at this moment.The use level of macromolecule component is 2-80 weight %, and % is better for 5-70 weight, and is preferably 10-60 weight %.When less than 2 weight %, stress mitigation and bonding force are insufficient, surpass 80 weight % and work as, the time, then mobile decline.
In anisotropic conductive circuit connected adhesion agent of the present invention, also can add suitable weighting agent, tenderizer, promotor, antiaging agent, tinting material, fire retardant, coupler.
When containing packing material, be ideal owing to can improve connection reliability.If the maximum particle diameter of packing material just can be used less than the particle diameter of conducting particles, and is preferably 5-60 volume %.When surpassing 60 volume %, the then reliable effect that improves reaches capacity.See the compound that preferably contains vinyl, propenyl, amino, epoxy group(ing), change nitrogen base and isocyanate group as couplant from improving this point of cementability.
Tg (second-order transition temperature) when in addition, anisotropic conductive circuit connected adhesion agent of the present invention being made cured article also can be by 2 kinds of different multilayered structures that constitute with the upper strata.
As use anisotropic conductive circuit connected adhesion agent of the present invention bonding liner plate, if can form the electrode that must be electrically connected, then there is not restriction especially, glass or plastics lining board at formation electrodes such as the ITO that is used for liquid-crystal display are arranged, the chip part of the image-displaying sheet of PDP plate, EL plate etc., printed wiring running board, ceramic wiring plate, flexible printed circuit board, running board, semi-conductor chip, resistance chip, electric capacity chip etc., the circuit block semiconductor silicon chips of tape carrier assembly, COF etc. etc. can be used in combination as required.
Restriction especially of condition when connecting connects temperature and is 90-250 ℃, tie-time and is 1 second-10 minutes, and can suitably selects according to the purposes of using, tackiness agent, liner plate etc.Also can carry out after fixing as required.In addition, also can be undertaken during connection, and also can use heat energy in addition, for example light, ultrasonic wave, hertzian wave etc. as required by heating and pressurizing.
Embodiment
Below, with embodiment the present invention is specifically described, but the invention is not restricted to the scope of embodiment.
Embodiment 1
50g is dissolved among the MEK (ethyl methyl ketone, 79.6 ℃ of boiling points) phenoxy resin (associating carbide Co., Ltd. system, trade(brand)name PKHC, molecular-weight average 45,000), makes the solution that solid part is 50 weight %.
Use the diacrylate (Toagosei Co., Ltd's system, trade(brand)name M-215) and the phosphate type acrylate (grease Co., Ltd. of common prosperity society system, goods name P-2M) of the modification of cyamelide oxyethane as free-radical polymerised material.
Solidifying agent as produced free radical by heating or light uses 2,5-dimethyl-2, the hydrocarbon solution (NOF Corp's system, commodity Pahesa250) of 50 weight % of 5-two (2-ethyl hexanoyl peroxide) hexane.
Use in that (elasticity of compression compares 480kg/mm for the particle of nuclear polystyrene as conducting particles
2) the surface median size that is provided with thickness 0.09 μ m Ag layer be the conducting particles of 5 μ m.
By solidifying diacrylate 50g, the phosphate type acrylate 2g, 2 that weight ratio cooperates phenoxy resin 50g, the modification of cyamelide oxyethane, 5-dimethyl-2,5-two (2-ethyl hexanoyl peroxide) hexane 5g, and conducting particles is added and dispersion by 3 volume %, use apparatus for coating on surface treated PET (polyethylene terephthalate) film, to be coated with single face then and become thick 80 μ m, by 70 ℃, 10 minutes warm air drying, the thickness that obtains adhesive layer was the anisotropic conductive circuit connected adhesion agent of 35 μ m.
Embodiment 2
Use at the particle (elasticity of compression rate 366kg/mm that polystyrene is made nuclear as conducting particles
2) the surface median size that is provided with the Ag layer of thickness 0.1 μ m be the conducting particles of 6.15 μ m, obtain the anisotropic conductive circuit connected adhesion agent similarly to Example 1.
Embodiment 3
Use at the particle (elasticity of compression rate 480kg/mm that polystyrene is made nuclear as conducting particles
2) the surface be provided with the Ag layer of thickness 0.1 μ m, and the median size that is provided with the Au layer of thickness 0.04 μ m in the outside of this Ag layer is the conducting particles of 5 μ m, obtains the anisotropic conductive circuit connected adhesion agent similarly to Example 1.
Embodiment 4
Use at the particle (elasticity of compression rate 480kg/mm that polystyrene is made nuclear as conducting particles
2) the surface be provided with the Ni layer of thickness 0.1 μ m, and the median size that is provided with the Au layer of thickness 0.05 μ m in the outside of this Ni layer is the conducting particles of 5 μ m, obtains the anisotropic conductive circuit connected adhesion agent similarly to Example 1.
Comparative example 1
Use at the particle (elasticity of compression rate 480kg/mm that polystyrene is made nuclear as conducting particles
2) the surface median size that is provided with the Ni layer of thickness 0.2 μ m be the conducting particles of 5 μ m, obtain the anisotropic conductive circuit connected adhesion agent similarly to Example 1.
Comparative example 2
Use at the particle (elasticity of compression rate 480kg/mm that polystyrene is made nuclear as conducting particles
2) the surface be provided with the Ni layer of thickness 0.2 μ m, and the median size that is provided with the Au layer of thickness 0.04 μ m in the outside of this Ni layer is the conducting particles of 5 μ m, obtains the anisotropic conductive circuit connected adhesion agent similarly to Example 1.
The connection of circuit
Use above-mentioned anisotropic conductive resin film to form thing, and heating and pressurizing had the tape carrier assembly (TCP) of copper circuit of 150 live widths, 30 μ m, spacing 30 μ m, thickness 18 μ m and ito glass (Geomateek strain formula society system, surface resistivity 20-30 Ω, thickness 1.1mm) 15 seconds under 140 ℃, 3MPa, obtained the linker that width 2mm is connected.At this moment, be selected in the bonding plane that sticks the anisotropic conductive circuit connected adhesion agent on the ito glass in advance after, heating and pressurizing connected in 3 seconds temporarily under 80 ℃, 0.5MPa, peeled off the PET film then and was connected on the TCP.
The mensuration that connects resistance
Made anisotropic conductive circuit connected adhesion agent is kept at respectively in the constant temperature and humidity cabinet of-20 ℃ and 30 ℃, 85%RH after 100 hours, carry out the connection of foregoing circuit, comprise with multitester measuring above-mentioned connection section TCP in abutting connection with the connection resistance value between circuit.Mean value with 150 of the resistance of adjacency circuit represents to connect resistance value.Its measurement result is shown in table 1.
Table 1
| Connect resistance (Ω) | ||
| -20 ℃, preserved 100 hours | 30 ℃, 85%RH preserved 100 hours | |
| Embodiment 1 | 2.1 | 2.3 |
| Embodiment 2 | 1.9 | 2.1 |
| Embodiment 3 | 2.2 | 2.4 |
| Embodiment 4 | 2.3 | 2.1 |
| Comparative example 1 | 2.2 | 35.5 |
| Comparative example 2 | 2.5 | 28.4 |
At the linker of embodiment 1 gained, all be illustrated in good connection reliability below 2.5 Ω-20 ℃ of any one of preserving or in 30 ℃, the constant temperature and humidity cabinet of 85%RH, being preserved.In addition, to the linker of embodiment 2,3 too, to-20 ℃ preserve or 30 ℃, the constant temperature and humidity cabinet of 85%RH in preserved any one can both obtain connection reliability good below 2.5 Ω.
In contrast to this, though comparative example 1 and 2 linkers-20 ℃ of preservations obtain good connection reliability, the resistance of the linker of being preserved in 30 ℃, the constant temperature and humidity cabinet of 85%RH rises to more than 10 Ω.
The mensuration of bonding strength
In embodiment 1-3, any one of being preserved in the constant temperature and humidity cabinet of-20 ℃ or 30 ℃, 85%RH can both obtain the good bonding strength of 1000N/m.In addition, comparative example 1 and 2 is for bonding strength, and any one of preserving in the constant temperature and humidity cabinet of-20 ℃ or 30 ℃, 85%RH also can obtain the good bonding strength of 1000N/m degree.
The evaluation of insulativity
Use resulting anisotropic conductive circuit connected adhesion agent, at 140 ℃, under the 3MPa heating and pressurizing have 250 cross-over configuration live widths, 50 μ m, spacing 100 μ m, thickness 18 μ m copper circuit comb shape circuit printed circuit board (PCB) and have 15 seconds of tape carrier joint (TCP) of the copper circuit of 500 live widths, 50 μ m, spacing 100 μ m, thickness 18 μ m, connect along width 2mm.On the comb shape circuit of this linker, add 100V voltage, be determined at 85 ℃, the insulating resistance value of high temperature and humidity test after 500 hours of 85%RH.In either case, can both obtain 10
9The above good insulation performance of Ω is not observed insulativity and is reduced.
Mobile evaluation
The anisotropic conductive circuit connected adhesion agent of used thickness 35 μ m, 5mm * 5mm is clipped in it in the sheet glass of thick 0.7mm, 15mm * 15mm, and under 140 ℃, 3MPa 15 seconds of heating and pressurizing.With the value that the area (A) and the area (B) after the heating and pressurizing at initial stage are obtained flowability (B)/(A), embodiment 1-3 is the scope of 1.9-2.0.Comparative example 1 and 2 also is 1.8 and 1.9.
Solidify the back spring rate
The back 40 ℃ spring rate of curing of measuring the anisotropic conductive circuit connected adhesion agent of embodiment 1 is 1.5CPa.
Spring rate after above-mentioned bonding strength, insulativity, flowability, the curing, though the value of embodiments of the invention nearly all has identical value with the value of comparative example, connection resistance value difference as shown in table 1 is big.Represent equal characteristic from bonding strength, insulativity, flowability etc. at embodiment, comparative example, this coating that is considered to the conducting particles surface as thin as a wafer, but to connecting resistance remarkable influence is arranged.By the present invention, be used in the conducting particles that the transition metal of surface except that Ag, Au, Pt do not expose, do not promote the polymerization of free-radical polymerised material on the conducting particles surface, it is low to connect resistance, represents good value.By embodiment 4, even when using the such transition metal of Ni, at its Ag, Au more than outer side covers 500 dusts, Pt etc., by inboard transition metal is not exposed, handle even carry out temperature and humiture, storage stability is also excellent, and does not also increase connection resistance.
The making of surface treated particles A
In the methanol solution of triethylamine 1 weight %, be added in the Ni layer that is provided with thickness 0.2 μ m on the particle surface that polystyrene is done to examine, and be provided with the conducting particles of median size 4 μ m of the gold layer of thickness 0.04 μ m in the outside of this Ni layer, stirred 10 minutes at 25 ℃.After filtering conducting particles,, obtain surface treated particles A 50 ℃ of dryings 15 minutes.
The making of surface treated particles B
In the methanol solution of aminopropyl trimethyl silane 3 weight %, be added in the Ni layer that is provided with thickness 0.2 μ m on the surface of the particle of vinylbenzene work nuclear, and be provided with the conducting particles of median size 5 μ m of the gold layer of thickness 0.04 μ m in the outside of this Ni layer, stirred 5 minutes at 50 ℃.After filtering conducting particles,, obtain surface treated particles B 80 ℃ of dryings 5 minutes.
The making of surface treated particles C
In the methanol solution of γ-epoxypropyl methyl dimethoxysilane 1 weight %, be added in the Ni layer that the particle surface that polystyrene is done to examine is provided with thickness 0.2 μ m, and be provided with the conducting particles of median size 4 μ m of the gold layer of thickness 0.04 μ m in the outside of this Ni layer, stirred 10 minutes at 25 ℃.After filtering conducting particles,, obtain surface treated particles C 50 ℃ of dryings 15 minutes.
Surface treated particles D making
In the methanol solution of bisphenol A type epoxy resin 3 weight %, be added in the Ni layer that is provided with thickness 0.2 μ m on the particle surface that polystyrene is done to examine, and be provided with the conducting particles of median size 5 μ m of the gold layer of thickness 0.04 μ m in the outside of this Ni layer, stirred 5 minutes at 50 ℃.After filtering conducting particles,, obtain surface treated particles D 80 ℃ of dryings 5 minutes.
With these conducting particless A, B, C and D, cooperation shown below cooperates respectively, with simple coating machine (Tesuta Industry Co., Ltd system), making coating single face thickness 50 μ m on surface-treated (polyethylene terephthalate) film, by 70 ℃ of warm air dryings of 10 minutes, made circuit connected adhesion agent.
Embodiment 5
Ethyl methyl ketone is made dissolution with solvents cooperate phenoxy resin (PKHC, associating carbide Co., Ltd. system, molecular-weight average 45,000) 50g, as free-radical polymerised compound dicyclohexyl methacrylic ester 48g and phosphoester acrylic ester 2g, 2,5-dimethyl-2,5-two (2-ethyl hexanoyl peroxide) hexane 3g, and cooperate dispersion surface treated particles A3 volume %.With simple and easy coating machine in surface treatment pet film on coating single face thick 50 μ m, 70 ℃ of dryings 10 minutes, obtain the anisotropic conductive circuit connected adhesion agent of thickness 30 μ m.
Embodiment 6
Ethyl methyl ketone is made dissolution with solvents cooperate phenoxy resin (PKHC, associating carbide Co., Ltd. system, molecular-weight average 45,000) diacrylate 46g, the phosphoester acrylic ester 4g, 2 of 50g, the modification of cyamelide oxyethane, 5-dimethyl-2,5-two (2-ethyl hexanoyl peroxide) hexane 3g, and cooperate dispersion surface treated particles B 3 volume %.With simple and easy coating machine in surface treatment pet film on coating single face thick 50 μ m, 70 ℃ of dryings 10 minutes, obtain the anisotropic conductive circuit connected adhesion agent of thickness 30 μ m.
Embodiment 7
Ethyl methyl ketone is made dissolution with solvents cooperate phenoxy resin (PKHC, associating carbide Co., Ltd. system, molecular-weight average 45,000) 25g, urethane resin 25g, dicyclohexyl methacrylic ester 48g, phosphoester acrylic ester 2g, 2,5-dimethyl-2,5-two (2-ethyl hexanoyl peroxide) hexane 3g, and cooperate dispersion surface treated particles B 3 volume %.With simple and easy coating machine in surface treatment pet film on coating single face thick 50 μ m, 70 ℃ of dryings 10 minutes, obtain the anisotropic conductive circuit connected adhesion agent of thickness 30 μ m.
Embodiment 8
Ethyl methyl ketone is made dissolution with solvents cooperate phenoxy resin (PKHC, associating carbide Co., Ltd. system, molecular-weight average 45,000) 50g, as free-radical polymerised compound dicyclohexyl methacrylic ester 48g, as phosphoester acrylic ester 2g, 2,5-dimethyl-2,5-two (2-ethyl hexanoyl peroxide) hexane 3g, and cooperate dispersion surface treated particles C3 volume %.With simple and easy coating machine in surface treatment pet film on coating single face thick 50 μ m, 70 ℃ of dryings 10 minutes, obtain the anisotropic conductive circuit connected adhesion agent of thickness 30 μ m.
Embodiment 9
Ethyl methyl ketone is made dissolution with solvents cooperate phenoxy resin (PKHC, associating carbide Co., Ltd. system, molecular-weight average 45,000) 50g, the diacrylate 46g as the modification of cyclic isocyanate oxidative ethane, phosphoester acrylic ester 4g, 2,5-dimethyl-2,5-two (2-ethyl hexanoyl peroxide) hexane 3g, and cooperate dispersion surface treated particles D 3 volume %.With simple and easy coating machine in surface treatment pet film on coating single face thick 50 μ m, 70 ℃ of dryings 10 minutes, obtain the anisotropic conductive circuit connected adhesion agent of thickness 30 μ m.
Embodiment 10
Ethyl methyl ketone is made dissolution with solvents cooperate phenoxy resin (PKHC, associating carbide Co., Ltd. system, molecular-weight average 45,000) 25g, urethane resin 25g, dicyclohexyl acrylate 48g, phosphoester acrylic ester 2g, 2,5-dimethyl-2,5-two (2-ethyl hexanoyl peroxide) hexane 3g, and cooperate dispersion surface treated particles D3 volume %.With simple coating machine in surface treatment pet film on coating single face thick 50 μ m, 70 ℃ of dryings 10 minutes, obtain the anisotropic conductive circuit connected adhesion agent of thickness 30 μ m.
Comparative example 3
Except that the surface treated particles A of embodiment 5 is changed into the particle that is untreated, make the anisotropic conductive circuit connected adhesion agent similarly to Example 5.
The making of circuit connecting body
It is wide and as electrode that above-mentioned anisotropic conductive circuit connected adhesion agent is cut into 1.5mm, and with 80 ℃, 5 seconds, the condition of 1MPa connected temporarily on the glass backing-plate that forms ITO.Peel off PET and support lining material, the wide 50 μ m of overlapping electrode, the electrode of the TCP of 50 μ mr at interval on this material connect 150 ℃, 20 seconds, the condition of 40MPa, make circuit connecting body.
Evaluating characteristics
Connect resistance: use the Adopan teseto of Co., Ltd. system volt ohm-milliammeter TR 6848, measure in abutting connection with the resistance between circuit with the rated current of 1mA.Initial stage after measure connecting and at 30 ℃, 60%RH, the value of placement after 100 hours.It the results are shown in table 2.
Table 2
| Project | Connect resistance (Ω) | |
| Initial stage | 30 ℃, 60%RH is after the placement in 100 hours | |
| Embodiment 5 | 2.1 | 2.4 |
| Embodiment 6 | 2.8 | 2.5 |
| Embodiment 7 | 3.2 | 3.1 |
| Embodiment 8 | 2.2 | 2.5 |
| Embodiment 9 | 2.4 | 2.4 |
| Embodiment 10 | 2.8 | 3.1 |
| Comparative example 3 | 2.4 | 34.7 |
In embodiments of the invention 5-10,, but do not use the comparative example 3 of surface treated particles after placement, to connect resistance rising change greatly even it is also low and good to connect resistance after the placement.In addition, make behind the anisotropic conductive circuit connected adhesion agent 25 ℃ place 30 after, the result who makes circuit connecting body with embodiment equally represents, contain basic cpd or epoxy group(ing) the compound surface treatment the anisotropic conductive circuit connected adhesion agent of conducting particles, cooperate by embodiment 5-10, connecting resistance (initial stage) is 2.1-3.8 Ω, has good storage stability.But being to use the connection resistance of the linker of the comparative example 3 that the compound of basic cpd or epoxy group(ing) surface-treated conducting particles need not be arranged is 20-200, and its storage stability is poor.
By the present invention, after making the anisotropic conductive circuit connected adhesion agent, also can obtain the good anisotropic conductive circuit connected adhesion agent of storage stability (storage life) even place, and for 170 ℃ of the connection temperature of the anisotropic conductive circuit connected adhesion agent of Thermocurable, at the also good less linker of deviation of the more cryogenic 150 ℃ connection resistance after connecting and can obtain the preservation of tackiness agent.
Claims (4)
1. anisotropic conductive circuit connected adhesion agent, be be placed on have relatively to the liner plate of circuit electrode between, pressurization have relatively to the liner plate of circuit electrode, the anisotropic conductive circuit connected adhesion agent that is electrically connected between the electrode of compression aspect, it is characterized in that in described tackiness agent, containing (1) and have compound by polymeric functional group of free radical institute, (2) from by aminated compounds and have that selected at least a compound carries out the surface-treated conducting particles one group that the compound of an epoxy group(ing) constitutes at least, (3) by light or add the compound of thermogenesis free radical, (4) phosphate compound, wherein (1) has by the compound of polymeric functional group of free radical institute for from (methyl) acrylate resin, the maleic anhydride imide resin that contracts, citraconic anhydride contracts selected at least a in imide resin or the naphthols imide resin.
2. anisotropic conductive circuit connected adhesion agent according to claim 1, the compound that wherein has an epoxy group(ing) at least is for being selected from phenyl glycidyl ether, glycidyl methacrylate, γ-glycidoxypropyltrime,hoxysilane, γ-glycidoxy propyl-triethoxysilicane, γ-glycidoxy propyl group methyl dimethoxysilane, γ-glycidoxy propyl group methyldiethoxysilane, β-(3,4-epoxy group(ing) cyclohexyl) ethyl trimethoxy silane, bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, phenol novolak type epoxy resin, the cresols phenolic resin varnish type epoxy resin, bisphenol-A phenolic varnish type Resins, epoxy, bisphenol F phenolic varnish type Resins, epoxy, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, glycolylurea type Resins, epoxy, isocyanuric acid ester type Resins, epoxy, at least a kind of aliphatics straight chain shape Resins, epoxy.
3. anisotropic conductive circuit connected adhesion agent according to claim 1, wherein said conducting particles be the surface by Ag, Au or/and the particle that Pt covers.
4. circuit connecting body, be the anisotropic conductive circuit connected adhesion agent is placed on have relatively to the liner plate of circuit electrode between, add be pressed with relatively to the liner plate of circuit electrode, the linker that is electrically connected between the electrode of compression aspect, it is characterized in that described anisotropic conductive circuit connected adhesion agent is any described anisotropic conductive circuit connected adhesion agent among the claim 1-3.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000399827A JP2002201440A (en) | 2000-12-28 | 2000-12-28 | Anisotropic conductive resin-film-forming composition, connection method of circuit boards using the same, and connection structure |
| JP2000399827 | 2000-12-28 | ||
| JP2001261675A JP2003064332A (en) | 2001-08-30 | 2001-08-30 | Circuit-connecting adhesive and circuit-connected structural material by using the same |
| JP2001261675 | 2001-08-30 | ||
| JP2001261673 | 2001-08-30 | ||
| JP2001261673A JP4736280B2 (en) | 2001-08-30 | 2001-08-30 | Adhesive for circuit connection and circuit connection structure using the same |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011448873A Division CN1195035C (en) | 2000-12-28 | 2001-12-28 | Adhesive for connecting anisotropic circuit, circuit board connection method and connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1566246A CN1566246A (en) | 2005-01-19 |
| CN1290956C true CN1290956C (en) | 2006-12-20 |
Family
ID=27345597
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100634893A Expired - Fee Related CN1290956C (en) | 2000-12-28 | 2001-12-28 | Adhesive for connecting anisotropic circuit, circuit board connection method and connector |
| CNB011448873A Expired - Fee Related CN1195035C (en) | 2000-12-28 | 2001-12-28 | Adhesive for connecting anisotropic circuit, circuit board connection method and connector |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011448873A Expired - Fee Related CN1195035C (en) | 2000-12-28 | 2001-12-28 | Adhesive for connecting anisotropic circuit, circuit board connection method and connector |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100484383B1 (en) |
| CN (2) | CN1290956C (en) |
| TW (3) | TWI334880B (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005194393A (en) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | Adhesive film for circuit connection, and circuit connection structure |
| JP2005320455A (en) * | 2004-05-10 | 2005-11-17 | Hitachi Chem Co Ltd | Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device |
| JP4466650B2 (en) | 2004-06-09 | 2010-05-26 | 日立化成工業株式会社 | Film adhesive, film circuit connecting material, circuit member connecting method, and semiconductor device |
| KR100622598B1 (en) * | 2004-12-08 | 2006-09-19 | 엘에스전선 주식회사 | Anisotropic conductive adhesive having ptc characteristic |
| JP4691417B2 (en) * | 2005-08-22 | 2011-06-01 | 日立化成デュポンマイクロシステムズ株式会社 | CIRCUIT CONNECTION STRUCTURE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR SUBSTRATE FOR CIRCUIT CONNECTION STRUCTURE |
| KR100765363B1 (en) * | 2005-10-31 | 2007-10-09 | 전자부품연구원 | Method for fabricating conductive particle |
| KR100788531B1 (en) | 2006-12-08 | 2007-12-24 | 엘에스전선 주식회사 | Anisotropic conductive adhesive and anisotropic conductive film using the same |
| KR100813355B1 (en) | 2006-12-13 | 2008-03-12 | 엘에스전선 주식회사 | Anisotropic conductive adhesive |
| KR100773642B1 (en) | 2006-12-13 | 2007-11-05 | 엘에스전선 주식회사 | Anisotropic conductive adhesive |
| CN101889037B (en) * | 2007-12-07 | 2013-02-13 | 三菱瓦斯化学株式会社 | Modified naphthalene formaldehyde resin, tricyclodecane skeleton-containing naphthol compound and ester compound |
| JP5549103B2 (en) | 2008-07-11 | 2014-07-16 | デクセリアルズ株式会社 | Anisotropic conductive film |
| JP5430093B2 (en) | 2008-07-24 | 2014-02-26 | デクセリアルズ株式会社 | Conductive particles, anisotropic conductive film, joined body, and connection method |
| JP5561174B2 (en) | 2009-02-16 | 2014-07-30 | 株式会社村田製作所 | Conductive resin composition, method of manufacturing electronic component using the same, bonding method, bonding structure, and electronic component |
| DE102011077927A1 (en) * | 2011-06-21 | 2012-12-27 | Tesa Se | Process for the reversible covalent crosslinking of adhesives |
| JP6007022B2 (en) * | 2012-08-06 | 2016-10-12 | デクセリアルズ株式会社 | Circuit connection material |
| JP6151597B2 (en) * | 2013-07-29 | 2017-06-21 | デクセリアルズ株式会社 | Manufacturing method of conductive adhesive film, conductive adhesive film, and manufacturing method of connector |
| JP6505423B2 (en) * | 2013-12-16 | 2019-04-24 | デクセリアルズ株式会社 | Method of manufacturing mounting body, and anisotropic conductive film |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000044905A (en) * | 1998-03-18 | 2000-02-15 | Sumitomo Bakelite Co Ltd | Anisotropic, electrically conductive adhesive and electronic equipment using the same |
-
2001
- 2001-12-27 KR KR10-2001-0085782A patent/KR100484383B1/en not_active IP Right Cessation
- 2001-12-27 TW TW099104101A patent/TWI334880B/en not_active IP Right Cessation
- 2001-12-27 TW TW093117294A patent/TWI332027B/en not_active IP Right Cessation
- 2001-12-27 TW TW090132486A patent/TWI230191B/en not_active IP Right Cessation
- 2001-12-28 CN CNB2004100634893A patent/CN1290956C/en not_active Expired - Fee Related
- 2001-12-28 CN CNB011448873A patent/CN1195035C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020055403A (en) | 2002-07-08 |
| TWI334880B (en) | 2010-12-21 |
| CN1195035C (en) | 2005-03-30 |
| TW201030121A (en) | 2010-08-16 |
| CN1362459A (en) | 2002-08-07 |
| TWI230191B (en) | 2005-04-01 |
| TWI332027B (en) | 2010-10-21 |
| TW200420707A (en) | 2004-10-16 |
| CN1566246A (en) | 2005-01-19 |
| KR100484383B1 (en) | 2005-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1290956C (en) | Adhesive for connecting anisotropic circuit, circuit board connection method and connector | |
| CN1214455C (en) | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure | |
| CN1146647C (en) | Anisotropic conductive adhesive and method for preparation thereof and electronic apapratus using said adhesive | |
| CN1288219C (en) | Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices | |
| CN100416921C (en) | Adhesive film for circuit connection, and circuit connection structure | |
| CN1339055A (en) | Adhesive, electrode-connecting structure, and method of connecting electrodes | |
| CN1375179A (en) | Wiring-connecting material and process for producing circuit board with the same | |
| KR20020042649A (en) | Adhesive agent, method for connecting wiring terminals and wiring structure | |
| CN1373170A (en) | Adhesive and electrical device | |
| JP4735229B2 (en) | Anisotropic conductive film | |
| WO2005090510A1 (en) | Resin composition and semiconductor devices made by using the same | |
| CN1796453A (en) | Anisotropic conductive film forming composition | |
| CN1520448A (en) | Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same | |
| JP2010242101A (en) | Anisotropic conductive film, connection structure and production method thereof | |
| KR20210134875A (en) | Adhesive composition and connected structure | |
| CN1233739C (en) | Resin compsn. adhesives prepared therewith for bonding circuit members, and circuit boards | |
| CN103871544A (en) | Composition for use of an anisotropic conductive film and an anisotropic conductive film thereof | |
| JP5556488B2 (en) | Adhesive for connecting counter electrode | |
| CN102206480A (en) | Application of circuit-connecting material as circuit-connecting material | |
| JP2005054140A (en) | Adhesive composition, adhesive composition for connecting circuit, connected body and semiconductor device | |
| JP7000857B2 (en) | Adhesive composition and structure | |
| JP2003198119A (en) | Circuit connection material and method of manufacturing circuit connection body using the same | |
| JP2006127956A (en) | Anisotropic conductive film, manufacturing method of anisotropic conductive film, and connection body and semi-conductor device using this | |
| JP4604577B2 (en) | Adhesive composition, film-like adhesive and circuit connecting material using the same, circuit member connecting structure, and manufacturing method thereof | |
| JP2003277694A (en) | Adhesive composition for circuit connection and connected circuit structure produced by using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061220 Termination date: 20171228 |