CN1520448A - Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same - Google Patents

Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same Download PDF

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Publication number
CN1520448A
CN1520448A CNA028127722A CN02812772A CN1520448A CN 1520448 A CN1520448 A CN 1520448A CN A028127722 A CNA028127722 A CN A028127722A CN 02812772 A CN02812772 A CN 02812772A CN 1520448 A CN1520448 A CN 1520448A
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China
Prior art keywords
anisotropic
electroconductive adhesive
resin
substrate
epoxy
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Granted
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CNA028127722A
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CN1250663C (en
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黄镇相
任明镇
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Telephus Inc
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Telephus Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
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Abstract

An anisotropic conductive adhesive containing a viscosity enhancer for adjusting the fluidity of an adhesive composition, a bonding method using the anisotropic conductive adhesive, and an integrated circuit package using the method are provided. The anisotropic conductive adhesive contains: an adhesive composition including an epoxy-based base resin, a hardener, and conductive particles; and a viscosity enhancer for adjusting the fluidity of the adhesive composition. The adhesive enhancer includes an inorganic material, a radical curable resin and a radical initiator, or a UV-curable resin and a UV initiator.

Description

Have the anisotropic-electroconductive adhesive that strengthens viscosity and use its adhering method and ic package
Technical field
The present invention relates to a kind of anisotropic-electroconductive adhesive, use the adhering method of this tackiness agent and the ic package (package) of this tackiness agent of use, and more specifically, relate to a kind of can be used to make flat display module such as LCD panel (LCD), plasma display panel (PDP), electroluminescent display (ELD) etc., and the anisotropic-electroconductive adhesive that can be used for bonding microcircuit and semiconductor package part, a kind of adhering method of this anisotropic-electroconductive adhesive and ic package that uses this adhering method to obtain of using.More specifically, the present invention directly relates to the method for semi-conductive flip-chip bonding (flip-chip) and wafer-level package.
Background technology
As a kind of prior art that relates to anisotropic-electroconductive adhesive, the open 8-20629 of Japanese Patent discloses a kind of composition epoxy resin for preparing by following method: with the urea base stiffening agent of resin compound and Resins, epoxy and in 40 ℃ be stable and in 80 ℃ or lower be that the activatory catalyzer mixes mutually, this resin compound comprises and contains Resins, epoxy noncrosslinking, the thermoplastic and high-elastic component that the Resins, epoxy and the softening temperature that contain the cross-linked rubber component are 50 ℃ or higher solid epoxy.United States Patent (USP) 6,020,059 discloses a kind of anisotropic-electroconductive adhesive, and it contains film-forming resin and conductive particle, and its melt viscosity in 150 ℃ is moored greater than 100.United States Patent (USP) 5,543,486 disclose a kind of composition epoxy resin, and it contains the Resins, epoxy that has more than two epoxy group(ing) in a molecule, and the latent stiffening agent of solid-dispersion, amine add-on type and metal alkoxide are as basal component.
So far Jian Yi most conventional anisotropic-electroconductive adhesive is used the Resins, epoxy of heat-setting Resins, epoxy or modification separately, or uses various types of thermoplastic resins as polymer resin.For the conductive particle that is used for conventional anisotropic-electroconductive adhesive, mainly use nickel or gold and the compound substance that scribbles nickel.In addition, use various additives, it comprises and is used for the agent of thermal curable hardening of resin, viscosity imparting agent, antioxidant, coupling agent etc.
Figure 1A and 1B be illustrate preparation be used for that general flat pannel display uses module or at encapsulated semiconductor, use the sectional view of the bonding circuit methods of anisotropic-electroconductive adhesive.Particularly, Figure 1A is after substrate (substrate) the 60 coating anisotropic-electroconductive adhesive with surperficial thereon following circuit 50, and the cross-sectional view strength before bonding IC circuit 10 and substrate 60.Figure 1B is by heating and extruding, is connecting IC cross-sectional view strength after circuit 20 and the following circuit 50 on substrate 60 on the chip 10.
Shown in Figure 1B,, between last circuit 20 and following circuit 50, be fixed on the conductive particle 30 that contains in the anisotropic-electroconductive adhesive by heating and extruding.By conductive particle 30 electricity Connect Power road 20 and following circuit 50, and by the adhesive resin 40 mutual isolation and bonding of forming anisotropic-electroconductive adhesive.
It is a kind of 150-250 ℃ of high temperature process of carrying out using anisotropic-electroconductive adhesive to carry out bonding to last circuit 20 with following circuit 50.Therefore, the time point from the time point of heated adhesive resin 40 to completely solidified adhesive resin 40, the connection reliability of circuit 20 and following circuit 50 is gone up in the influence of adhesive resin 40 flowabilities with being changed significantly.
Fig. 2 is that adhesive resin is for the viscosity changing pattern figure of heat-up time when high temperature uses the conventional bonding circuit of anisotropic-electroconductive adhesive.In Fig. 2, the state A interval that after heating, occurs at once, viscosity increases.Because the temperature of the adhesive resin that contains in anisotropic-electroconductive adhesive raise in the bonding starting stage, the beginning curing reaction, and viscosity increases gradually along with the increase of heat-up time.In state B interval, the curing reaction of forming the adhesive resin of anisotropic-electroconductive adhesive becomes vivaciously, and viscosity with respect to heat-up time with than in the interval faster speed increase of state A.In state C interval, the curing reaction of forming the adhesive resin of anisotropic-electroconductive adhesive is accelerated, and viscosity suddenly increases with respect to tending to heat-up time.
Figure 3 shows that the light micrograph of circuit 80 states that the conventional anisotropic-electroconductive adhesive 70 of use bonds together.As shown in Figure 3, as the result who uses conventional anisotropic-electroconductive adhesive 70 bonding circuit 80, state A is as shown in Figure 2 kept for a long time, it has the bonding original state of huge flowability corresponding to the adhesive resin that contains in anisotropic-electroconductive adhesive, so between circuit to be connected 80, do not keep the adhesive resin of anisotropic-electroconductive adhesive 70, and flow down formation space 90, this is not caused by the filling of tackiness agent resin by the bubble that zone between circuit 80 exists.Because the existence of space 90 between junction circuit 80, reduced the insulation resistance between the circuit 80, connection resistance and adhesive power have reduced the reliability of equipment thus.
Summary of the invention
In order to solve problem recited above, first purpose of the present invention provides a kind of anisotropic-electroconductive adhesive with composition, said composition can be regulated the binder composition flowability in the bonding microcircuit starting stage, to prevent forming the space between microcircuit to be connected.
Second purpose of the present invention provides a kind of ic package that uses the anisotropic-electroconductive adhesive preparation, wherein suppressed the formation in space, so that satisfied electric conductivity and adhesive power to be provided between microcircuit.
The 3rd purpose of the present invention provide a kind of in the preparation flat pannel display module or in semi-conductive encapsulation, use anisotropic-electroconductive adhesive to come the method for bonding microcircuit, wherein suppress the formation in space, between the connection microcircuit, to provide satisfied electric conductivity and adhesive power.
In order to reach first purpose of the present invention, provide a kind of anisotropic-electroconductive adhesive, it comprises: the binder composition that comprises epoxy group(ing) base resin, stiffening agent and conductive particle; With the viscosity intensifier that is used to regulate the binder composition flowability based on the 5-95 weight % of the total amount of anisotropic-electroconductive adhesive.
Preferably, anisotropic-electroconductive adhesive comprises inorganic substance.Here, inorganic substance can be selected from aluminum oxide, silicon carbide, silicon oxide, cupric oxide, the mixture that titanium dioxide and these materials are at least two kinds.Preferably, inorganic substance are forms of particulate, and its median size is the 0.1-5 micron, and its content is based on the 5-60 weight % of the total amount of anisotropic-electroconductive adhesive.
In anisotropic-electroconductive adhesive, the preferred viscosities toughener comprises: radically curable resin and radical initiator.In the case, radically curable resin can comprise: have C 1-C 20The Acrylic Acid Monomer of main chain or methacrylic acid monomer have C 21-C 100The acrylic acid oligomer of main chain or methacrylic acid oligomer, the thermal curable resin that comprises reactive acroleic acid or methacrylic acid unit, the thermoplastic resin that comprises reactive acroleic acid or methacrylic acid unit, or the mixture of these materials, and radical initiator comprises: peroxide initiator, azo initiator, or the mixture of these materials.Preferred radical initiator comprises: peroxidation acid cumyl (cumil) ester, acetyl peroxide, peroxidized t-butyl perbenzoate, dicumyl peroxide (dicumil), azobisisobutyronitrile (azobisisobutyronitril), or the mixture of these materials.
In anisotropic-electroconductive adhesive, alternatively, viscosity intensifier can comprise: UV-curable resin and UV initiator.In the case, the UV-curable resin can comprise: the polyfunctional monomer that is selected from dipentaerythritol acrylate, diacrylate methylene glycol ester, Viscoat 295, ethylene glycol diacrylate and pentaerythritol triacrylate, be selected from the polyfunctional group oligopolymer of epoxy acrylate, urethane acrylate and polyester acrylate, reactive acrylate's polymkeric substance, or the mixture of these materials.
Preferred UV initiator is to be formed by the material to the UV wavelength sensitive of 200-400nm.For example, the UV initiator can comprise: 2, and 2-dimethoxy-2-phenyl methyl phenyl ketone, 1-hydroxyl-cyclohexyl-benzophenone, right-phenyl benzophenone, benzyldimethylketal, or the mixture of these materials.
Can comprise again according to anisotropic-electroconductive adhesive of the present invention: the conductive impurity ions of 1-100ppm.In the case, conductive impurity ions can be selected from: Na +, K +And Cl -
In anisotropic-electroconductive adhesive according to the present invention, base resin can be selected from: bisphenol-A type Resins, epoxy, bisphenol-f type Resins, epoxy, phenol phenolic varnish (nobolak) type Resins, epoxy, cresols phenolic resin varnish type epoxy resin, the Resins, epoxy of dimerization modification, the Resins, epoxy of modified rubber, polyurethane-modified Resins, epoxy, the Resins, epoxy of bromination, melamine resin, urethane resin, polyimide resin, polyamide resin, polyvinyl resin, acrylic resin, styrene resin, styrene butadiene resin, phenol resins, formaldehyde resin, silicone resin, acrylic resin, or the mixture of these resins.
Preferably, stiffening agent is selected from imdazole derivatives, sulfonamide derivatives, amide derivatives, acid anhydrides, the mixture that amphyl and these materials are at least two kinds.
Preferably, conductive particle comprises: pure nickel particle or the composite particles by obtaining with nickel and gold coating polymerization bead successively.
Preferably, binder composition also comprises: be selected from Gum Rosin, the viscosity imparting agent of terpine resin and coumarone-indene resin.Preferably, binder composition also comprises: be used to disperse and the coupling agent of stable conductive particle.In the case, coupling agent can comprise silane derivative.
In order to reach second purpose of the present invention, a kind of ic package is provided, it comprises: first substrate, realization thereon comprises first circuit of first electrode; Second substrate realizes comprising the second circuit in the face of second electrode of first electrode arrangement thereon; And anisotropic-electroconductive adhesive, it is coated between first and second substrates, and so that it is bonded together, first and second electrodes contact simultaneously connects to obtain electricity, wherein said anisotropic-electroconductive adhesive comprises: resin, stiffening agent, dispersive conductive particle in resin; With the viscosity intensifier that is used to increase resin viscosity.
Preferably, viscosity intensifier comprises a kind of silicon oxide that is selected from, silicon carbide, and the inorganic substance in the mixture that aluminum oxide and these materials are at least two kinds, and its content is based on the 5-60 weight % of the total amount of anisotropic-electroconductive adhesive.Preferably, first substrate is the component of liquid-crystal display (LCD), for example glass substrate or flexible print wiring board (FPC).
In order to reach the 3rd purpose of the present invention, a kind of bonding first substrate with first circuit is provided and has the method for second substrate of second circuit, described first circuit has first electrode, described second circuit has second electrode, and this method comprises: to first substrate coating anisotropic-electroconductive adhesive.Then, in 60-100 ℃ of anisotropic-electroconductive adhesive facing to first substrate precompressed coating.With first and second substrate orientation (align), so that first and second circuit are faced mutually.By mutually with first and second substrate bindings together, so that electricity connects first and second electrodes facing to extruding first and second substrates.
In anisotropic-electroconductive adhesive facing to first substrate precompressed coating, can apply the pressure of 0.1-1MPa, in bonding first and second substrates, can apply the pressure of 1-5MPa in 130-250 ℃ temperature, with bonding first and second substrates.
Preferably, adhering method according to the present invention also comprises: location the 3rd substrate on first substrate of crossing anisotropic-electroconductive adhesive facing to precompressed; With by applying the pressure of 0.1-1MPa in 60-100 ℃ temperature, facing to the first substrate precompressed the 3rd substrate.
Anisotropic-electroconductive adhesive according to the present invention comprises a kind of viscosity intensifier of regulating the binder composition flowability.Therefore,, also can between the microcircuit that will connect, keep anisotropic-electroconductive adhesive, prevent from thus between microcircuit, producing the space even under the high temperature bonding condition.In addition, strong adhesive power and satisfied bonding reliability, insulation resistance and connection resistance have been guaranteed.
The accompanying drawing summary
Figure 1A is in the module of the conventional flat-panel monitor of preparation with in semi-conductive encapsulation, before substrate binding IC circuit, to the cross-sectional view strength of substrate coating anisotropic-electroconductive adhesive;
Figure 1B with following circuit substrate on is connected afterwards cross-sectional view strength with being squeezed in the last circuit on the IC chip by heating;
Fig. 2 is when high temperature uses the conventional bonding circuit of anisotropic-electroconductive adhesive, and adhesive resin is at the whole mode chart that heat-up time, viscosity changed;
Figure 3 shows that the light micrograph of the circuit state that the conventional anisotropic-electroconductive adhesive of use bonds together;
Fig. 4 be illustrate anisotropic-electroconductive adhesive produced according to the present invention method first
The schema of embodiment;
Fig. 5 be illustrate anisotropic-electroconductive adhesive produced according to the present invention method second
The schema of embodiment;
Fig. 6 be illustrate anisotropic-electroconductive adhesive produced according to the present invention method the 3rd
The schema of embodiment;
Figure 7 shows that use anisotropic-electroconductive adhesive according to the present invention when the high temperature bonding microcircuit, the mode chart that the viscosity of adhesive resin and heat-up time changes;
Figure 8 shows that in coating during the light micrograph of circuit connection state according to example of anisotropic-electroconductive adhesive of the present invention;
Figure 9 shows that in coating during the light micrograph of circuit connection state according to another example of anisotropic-electroconductive adhesive of the present invention;
Figure 10 shows that in coating during the light micrograph of circuit connection state according to another example of anisotropic-electroconductive adhesive of the present invention;
Figure 11 shows that when the conventional anisotropic-electroconductive adhesive of coating and according to the present invention by the various anisotropic-electroconductive adhesive with different compositions of different methods during with bonding circuit, the comparison diagram that connection resistance changed along with the time; With
Figure 12 is the schema of preferred embodiment that illustrates the adhering method of use anisotropic-electroconductive adhesive according to the present invention.
Implement best mode of the present invention
Summarize technical spirit of the present invention with following three features.
The first, add the component of inorganic viscosity intensifier, to regulate the flowability of adhesive resin as anisotropic-electroconductive adhesive.
The second, add the viscosity intensifier formed by radically curable resin and radical initiator component, with the flowability of adjusting adhesive resin as anisotropic-electroconductive adhesive.The radical initiator that has high activity about 100-150 ℃ of low relatively temperature is used for improving curing reaction speed.
The 3rd, add the viscosity intensifier formed by UV-curable resin and UV initiator component, with the flowability of adjusting adhesive resin as anisotropic-electroconductive adhesive.In the case, the UV with appropriate wavelength is solidified in irradiation in the preparation anisotropic-electroconductive adhesive, to solidify the UV-curable resin partially or completely.Alternatively, in the UV irradiation, can heat, to induce curing reaction.
Because top three listed features, in the initial attachment stage that the relatively-high temperature degree carries out, can reduce the flowability of binder composition, thus in the final circuit of the formation that obtains, prevent the formation in space between the junction circuit, to guarantee the reliability of junction circuit.
Particularly, anisotropic-electroconductive adhesive according to the present invention comprises following basic components: the binder composition that (a) comprises epoxy group(ing) base resin, stiffening agent and conductive particle; (b) be used to regulate the viscosity intensifier of binder composition flowability.
Be used for comprising: bisphenol-A type Resins, epoxy for example, bisphenol-f type Resins, epoxy, phenol novolak type epoxy resin according to the suitable base resin of anisotropic-electroconductive adhesive of the present invention, the cresols phenolic resin varnish type epoxy resin, the Resins, epoxy of dimerization modification, the Resins, epoxy of modified rubber, polyurethane-modified Resins, epoxy, the Resins, epoxy of bromination, melamine resin, urethane resin, polyimide resin, polyamide resin, polyvinyl resin, acrylic resin, styrene resin, the styrene butadiene resin, phenol resins, formaldehyde resin, silicone resin, acrylic resin, or the mixture of these resins.
Be used for comprising: for example imdazole derivatives such as glyoxal ethyline, 2-ethyl imidazol(e) and 1-1-cyanoethyl-2-methylimidazole, amide derivatives such as dicyanamide, sulfonamide derivatives, acid anhydrides or amphyl according to the suitable stiffening agent of anisotropic-electroconductive adhesive of the present invention.In order to improve the adhesive property of anisotropic-electroconductive adhesive, can use a kind of compound that is selected from the top listed stiffening agent separately, perhaps can use at least two kinds of compounds in these stiffening agents with the blended form.In order to improve shelf characteric at room temperature, can stiffening agent be sealed with thermal curable resin or thermoplastic resin becomes microcapsule.
Be used for comprising according to the suitable conductive particle of anisotropic-electroconductive adhesive of the present invention: pure nickel particle or the composite particles by obtaining with nickel and gold coating polymerization bead successively, its thickness separately is about 500 .
The proportion of composite particles is 1-3.The proportion of this level is similar to the proportion according to the binder composition of anisotropic-electroconductive adhesive of the present invention, and therefore its dispersion stabilization than using the pure nickel particle for good.In addition advantageously, because their almost uniform particle sizes, electric conductivity does not have deviation between interconnective single circuit.
For the viscosity intensifier that anisotropic-electroconductive adhesive according to the present invention is used, it is used for regulating the binder composition flowability, can use inorganic substance, radically curable resin and radical initiator, or UV-curable resin and UV initiator.Preferably, based on the total amount of anisotropic-electroconductive adhesive, contain viscosity intensifier with the amount of 5-95 weight %.
Can will have the inorganic substance of thixotropic behaviour as viscosity intensifier.Be used for comprising: aluminum oxide (Al for example according to the suitable inorganic substance of anisotropic-electroconductive adhesive of the present invention 2O 3), silicon carbide (SiC), silicon oxide (SiO 2), cupric oxide (CuO) or titanium dioxide (TiO 2).Can use a kind of material that is selected from the listed material separately.Alternatively, can use in these materials at least two kinds with the blended form.Preferably, inorganic substance are that average particle size particle size is the granular form of 0.1-5 micron.Preferably, for inorganic substance,, use silicon oxide with the amount of 5-60 weight % based on the total amount of anisotropic-electroconductive adhesive.In the case, the characteristic aspect of expection increase anisotropic-electroconductive adhesive viscosity and thermal expansivity and second-order transition temperature improves.
When with radically curable resin and radical initiator during as viscosity intensifier, suitable radically curable resin comprises: for example have C 1-C 20The Acrylic Acid Monomer of main chain or methacrylic acid monomer have C 21-C 100The acrylic acid oligomer of main chain or methacrylic acid oligomer comprise the thermal curable resin of reactive acroleic acid or methacrylic acid unit, comprise the thermoplastic resin of reactive acroleic acid or methacrylic acid unit, or the mixture of these materials.Can be with any organic compound of free radical that can produce as radical initiator.Suitable radical initiator comprises: peroxide initiator, and azo initiator, or the mixture of these materials, and more specifically, peroxidation acid cumyl ester, acetyl peroxide, peroxidized t-butyl perbenzoate, dicumyl peroxide, azobisisobutyronitrile, or the mixture of these materials.
When UV-curable resin and UV initiator are used as viscosity intensifier, suitable UV-curable resin comprises: the polyfunctional monomer that is selected from dipentaerythritol acrylate, diacrylate methylene glycol ester, Viscoat 295, ethylene glycol diacrylate and pentaerythritol triacrylate, be selected from the polyfunctional group oligopolymer of epoxy acrylate, urethane acrylate and polyester acrylate, reactive acrylate's polymkeric substance, or the mixture of these materials.Can use and use the UV wavelength, the UV wavelength of preferred 200-400nm can be induced any UV initiator of photoresponse.Suitable UV initiator comprises: for example 2, and 2-dimethoxy-2-phenyl methyl phenyl ketone, 1-hydroxyl-cyclohexyl-benzophenone, right-phenyl benzophenone, benzyldimethylketal, or the mixture of these materials.When use has the mixture of reactive at least two kinds of light triggers for different wavelength, can be reduced in the deviation of the anisotropic-electroconductive adhesive characteristic aspect that depends on different preparation conditions.In order to improve the characteristic of UV-curable resin, can additionally use the benzophenone photosensitizers, or anti-polymerizing agent such as quinhydrones list ether.
If desired, can comprise conductive impurity ions again according to anisotropic-electroconductive adhesive of the present invention.Add conductive impurity ions and can prevent that junction circuit from being corroded.For conductive impurity ions, can use positively charged ion or negatively charged ion, for example Na +, K +And Cl -Preferably with 1-100ppm and more preferably contain conductive impurity ions with the amount that is less than 10ppm.Consider the amount of conductive impurity ions, adjust the component and the composition of anisotropic-electroconductive adhesive.
If desired, can comprise the viscosity imparting agent again according to anisotropic-electroconductive adhesive of the present invention, as Gum Rosin, terpine resin and or coumarone-indene resin.Be used for the second-order transition temperature that the suitable resin of viscosity imparting agent has the room temperature of being less than or equal to.
Anisotropic-electroconductive adhesive according to the present invention may further include and is used to disperse and the coupling agent of stable conductive particle.Suitable coupling agent comprises various silane derivatives, for example 3-glycidyl oxygen base propyl trimethoxy silicane, or 3-glycidyl oxygen base propyl group methyl-diethoxy silane.
In order to improve physicals, can use the various additives except that component recited above according to anisotropic-electroconductive adhesive of the present invention.For example, can use vinylformic acid or silica-based dispersion agent, silica-based antifoams, antioxidant etc.When will anisotropic-electroconductive adhesive according to the present invention being processed into film,, can use smoothing agent for film is shaped easily.
Anisotropic-electroconductive adhesive preparation according to the present invention can be become film or paste.
Fig. 4 is the schema of first embodiment that illustrates the method for anisotropic-electroconductive adhesive produced according to the present invention.With reference to figure 4, first embodiment for preparing the method for anisotropic-electroconductive adhesive comprises: preparation contains the binder composition (step S10) of base resin.As mentioned above, binder composition comprises: contain the base resin of Resins, epoxy as basic substance, stiffening agent and conductive particle.In order to prepare binder composition in step S10, preparation contains the thermal curable resin separately or is added with the base resin (step S12) of the thermal curable resin of thermoplastic resin.Then, conductive particle is mixed (step S14) and in mixture, add stiffening agent (step S16) with base resin.Then, in the binder composition that in step S10, prepares, add viscosity intensifier, to regulate the flowability (step S20) of binder composition.As mentioned above, viscosity intensifier can comprise the inorganic substance with thixotropic behaviour.Then, if desired, additive such as coupling agent can be mixed (step S30) with mixture.Preparing in the anisotropic-electroconductive adhesive according to first embodiment of the invention, can change the order of step and do not exceed technical scope of the present invention.
Fig. 5 is the schema of second embodiment that illustrates the method for anisotropic-electroconductive adhesive produced according to the present invention.The method for preparing anisotropic-electroconductive adhesive according to second embodiment of the invention comprises: with as identical mode as described in reference to figure 4, preparation contains the binder composition (step S110) of base resin.Prepare binder composition by preparation base resin (step S112), hybrid conductive particle (step S114) and adding stiffening agent (step S116).Then, adding is used to regulate the viscosity intensifier (step S120) of binder composition flowability in the binder composition for preparing in step S110.Can form viscosity intensifier by radically curable resin and radical initiator.To omit the detailed description that these are used for the material of viscosity intensifier at this, because described in the above.If desired, can further add additive such as coupling agent (step S130).Regulate the flowability (step S140) of binder composition by heated mixt.In the step S140 that flowability is regulated, with the temperature of mixture heating up to 100-150 ℃.By having added the initial viscosity of anisotropic-electroconductive adhesive heat gain.Here, heat, up to small part, when the radically curable resin of preferred 1-70% is cured till.Preparing in the anisotropic-electroconductive adhesive according to second embodiment of the invention, can change the order of step and do not exceed technical scope of the present invention.
Fig. 6 is the schema of the 3rd embodiment that illustrates the method for anisotropic-electroconductive adhesive produced according to the present invention.The method for preparing anisotropic-electroconductive adhesive according to third embodiment of the invention comprises: to prepare the binder composition (step S210) that contains base resin as identical mode as described in reference to figure 4.Prepare binder composition by preparation base resin (step S212), hybrid conductive particle (step S214) and adding stiffening agent (step S216).Then, adding is used to regulate the viscosity intensifier (step S220) of binder composition flowability in the binder composition for preparing in step S210.Can form viscosity intensifier by UV-curable resin and UV initiator.To omit the detailed description that these are used for the material of viscosity intensifier at this, because described in the above.If desired, can further add additive such as coupling agent (step S230).UV by mixture shines the flowability (step S240) of regulating adhesive resin.In the step S240 that flowability is regulated, the detailed conditions of UV irradiation is with recited above identical.Increased the initial viscosity of anisotropic-electroconductive adhesive by the UV irradiation.Here, continue irradiation up to small part, when the UV-curable resin of preferred 1-70% is cured till.In the anisotropic-electroconductive adhesive of preparation, can change the order of step and do not exceed technical scope of the present invention according to second embodiment of the invention.
Figure 7 shows that use anisotropic-electroconductive adhesive according to the present invention when the high temperature bonding microcircuit, the viscosity changing pattern figure of adhesive resin and heat-up time.As shown in Figure 7, because anisotropic-electroconductive adhesive according to the present invention comprises the viscosity intensifier that is used to increase viscosity and reduces the binder composition flowability, can not experience as shown in Figure 2 state A interval so be used for the anisotropic-electroconductive adhesive of bonding microcircuit.Therefore, in using the bonding microcircuit of anisotropic-electroconductive adhesive according to the present invention, reduced time loss, and appeared at the bonding starting stage in the viscosity changing pattern in state B interval by state A interval.In other words, when using according to the bonding microcircuit of anisotropic-electroconductive adhesive of the present invention, at bonding initial, hot stage, the flowability of adhesive resin is reduced to a kind of like this degree, promptly between microcircuit to be connected, adhesive resin is remained into for solidifying sufficiently long for some time.Therefore, between microcircuit, do not have to cause the generation in space owing to lacking enough adhesive resins.
Come bonding circuit, bonding temp to be set to 100-300 ℃ and apply pressure 5-60 second of about 0.5-5MPa in order to use according to anisotropic-electroconductive adhesive of the present invention.This method causes between circuit bonding reliably.Preferably, apply the pressure 10-30 second of 2-5MPa at 150-250 ℃ bonding temp.When bonding circuit under these conditions, the most excellent adhesive power and connection resistance and insulation resistance property have been guaranteed.
By the reference the following examples, will describe in more detail according to the preparation of anisotropic-electroconductive adhesive of the present invention and the various characteristics of measuring for the anisotropic-electroconductive adhesive that obtains.
Embodiment 1
Form preparation with film has the anisotropic-electroconductive adhesive that table 1 is formed, and measures the characteristic of anisotropic-electroconductive adhesive.
Table 1
Component Amount (weight %)
The thermal curable resin Bisphenol A type epoxy resin (200g/ equivalent) ????15
Thermoplastic resin Urethane resin (Mw=20,000) ????15
Solvent Toluene ????20
Tetrahydrofuran (THF) (THF) ????20
Conductive particle Nickel (average particulate size=5 micron) ????4
Stiffening agent The glyoxal ethyline derivative ????5
Coupling agent 3-glycidyl oxygen base propyl group methyldiethoxysilane ????1
Viscosity intensifier (inorganic substance) Silicon oxide (SiO 2, average particulate size=1 micron) ????20
Amount to ????100
By the circuit that applies the little spacing of the bonding 80-of pressure of 3MPa in 180 ℃, and use the observation by light microscope circuit connection state.
Figure 8 shows that when coating has the anisotropic-electroconductive adhesive 170 of table 1 composition according to the present invention the light micrograph of circuit 180 connection state.Can clearly be seen that as photo from Fig. 8, for the situation of the conventional anisotropic-electroconductive adhesive 70 of use shown in Figure 3, for the anisotropic-electroconductive adhesive 170 that contains inorganic viscosity intensifier according to the present invention, reduced the not number in the space 190 of filling adhesive resin significantly.
For by have the circuit that anisotropic-electroconductive adhesive that table 1 forms bonds together according to the present invention, use the 4-detecting probe method to measure connection resistances in 25 ℃, and measure 90 ° of delamination power the speed of 50mm/min and 25 ℃.As a result of, the bounding force between circuit is 850g/cm, and connection resistance is 0.8 Ω.For reliability testing, under 85 ℃ and 85%-humidity, in warm and humid constant device (thermohydrostat), observe the change 2000 hours of junction circuit connection resistance.The results are shown among Figure 11.For the conventional anisotropic-electroconductive adhesive that does not contain viscosity intensifier, the anisotropic-electroconductive adhesive of embodiment 1 preparation shows excellent characteristic.
Embodiment 2
Form preparation with film has the anisotropic-electroconductive adhesive that table 2 is formed, and measures the characteristic of anisotropic-electroconductive adhesive.
Table 2
Component Amount (weight %)
The thermal curable resin Bisphenol A type epoxy resin (200g/ equivalent) ????15
Viscosity intensifier Radically curable resin EHA ????5
Radical initiator Dicumyl peroxide ????2
Thermoplastic resin Urethane resin (Mw=20,000) ????20
Solvent Toluene ????25
Tetrahydrofuran (THF) (THF) ????25
Conductive particle Nickel (average particulate size=5 micron) ????4
Stiffening agent The glyoxal ethyline derivative ????3
Coupling agent 3-glycidyl oxygen base oxypropyl trimethyl diethoxy silane ????1
Amount to ????100
Under the condition of not heat-treating in addition, the anisotropic-electroconductive adhesive that will have top described composition is processed into film, circuit connection is coated with, and the characteristic of definite anisotropic-electroconductive adhesive.
Figure 9 shows that when coating has the anisotropic-electroconductive adhesive 270 of table 2 composition according to the present invention the light micrograph of circuit 280 connection state.Can clearly be seen that as photo,, almost do not produce the space because the anisotropic-electroconductive adhesive 270 of preparation contains radically curable resin and radical initiator as according to viscosity intensifier of the present invention in this embodiment from Fig. 9.
For by having the circuit that anisotropic-electroconductive adhesive that table 2 forms bonds together according to the present invention, with embodiment 1 in used same procedure measure bounding force and connection resistance.As a result of, the bounding force between circuit is 910g/cm, and connection resistance is 0.7 Ω.Under the same terms that is adopted with embodiment 1, in warm and humid constant device, observe the change of connection resistance for the time.The results are shown among Figure 11.For the conventional anisotropic-electroconductive adhesive that does not contain viscosity intensifier, the anisotropic-electroconductive adhesive of embodiment 2 preparations shows excellent characteristic.
Embodiment 3
Composition with table 2 prepares anisotropic-electroconductive adhesive.In the preparation anisotropic-electroconductive adhesive, consider the kick off temperature of radical initiator, carry out other thermal treatment in 120 ℃, and anisotropic-electroconductive adhesive is processed into film.
With with embodiment 1 in used identical method measure bounding force and connection resistance.As a result of, the bounding force between circuit is 1023g/cm, and connection resistance is 0.8 Ω.Under the same terms that is adopted with embodiment 1, in warm and humid constant device, observe the change of connection resistance for the time.The results are shown among Figure 11.For the conventional anisotropic-electroconductive adhesive that does not contain viscosity intensifier, the anisotropic-electroconductive adhesive of embodiment 3 preparations shows excellent characteristic.
Embodiment 4
Have the anisotropic-electroconductive adhesive that table 3 is formed with film preparation, and measure the characteristic of anisotropic-electroconductive adhesive.
Table 3
Component Amount (weight %)
The thermal curable resin Bisphenol A type epoxy resin (200g/ equivalent) ????15
Viscosity intensifier The UV-curable resin EHA ????5
The UV initiator 2,2-dimethoxy-2-phenyl methyl phenyl ketone ????2
Thermoplastic resin Urethane resin (Mw=20,000) ????20
Solvent Toluene ????25
Tetrahydrofuran (THF) (THF) ????25
Conductive particle Nickel (average particulate size=5 micron) ????4
Stiffening agent The glyoxal ethyline derivative ????3
Coupling agent 3-glycidyl oxygen base oxypropyl trimethyl diethoxy silane ????1
Amount to ????100
Have in the anisotropic-electroconductive adhesive of table 3 composition in preparation, the UV light of the appropriate wavelength in the irradiation 200-400nm scope is processed into film with anisotropic-electroconductive adhesive then.Here, the absorbing wavelength scope of considering the UV initiator determines to solidify the UV of the appropriate wavelength of usefulness.
Figure 10 shows that when coating has the anisotropic-electroconductive adhesive 370 of table 3 composition according to the present invention the light micrograph of circuit 380 connection state.Can clearly be seen that, do not have the space to produce because the anisotropic-electroconductive adhesive 370 of preparation contains UV-curable resin and UV initiator as according to viscosity intensifier of the present invention in this embodiment as photo from Figure 10.
For by having the circuit that anisotropic-electroconductive adhesive that table 3 forms bonds together according to the present invention, with embodiment 1 in used identical method measure bounding force and connection resistance.As a result of, the bounding force between circuit is 955g/cm, and connection resistance is 0.7 Ω.Under the same terms that is adopted with embodiment 1, in warm and humid constant device, observe the change of connection resistance for the time.The results are shown among Figure 11.For the conventional anisotropic-electroconductive adhesive that does not contain viscosity intensifier, the anisotropic-electroconductive adhesive of embodiment 2 preparations shows excellent characteristic.
Embodiment 5
Preparation has the anisotropic-electroconductive adhesive that table 4 is formed, and measures the characteristic of anisotropic-electroconductive adhesive.
Table 4
Component Amount (weight %)
Liquid thermal curable resin Bisphenol A type epoxy resin (180g/ equivalent) ????40
Conductive particle Nickel (average particulate size=5 micron) ????8
Stiffening agent The glyoxal ethyline derivative ????10
Coupling agent 3-glycidyl oxygen base oxypropyl trimethyl diethoxy silane ????2
Viscosity intensifier (inorganic substance) Silicon oxide (SiO 2, average particulate size=1 micron) ????40
Amount to ????100
Have in the anisotropic-electroconductive adhesive of table 4 composition in preparation, with the form processing anisotropic-electroconductive adhesive of thickener.For the circuit that bonds together by the anisotropic-electroconductive adhesive that obtains, with embodiment 1 in used identical method measure bounding force and connection resistance.As a result of, the bounding force between circuit is 972g/cm, and connection resistance is 0.9 Ω.Under the same terms that is adopted with embodiment 1, in warm and humid constant device, observe the change of connection resistance for the time.The results are shown among Figure 11.For the conventional anisotropic-electroconductive adhesive that does not contain viscosity intensifier, the anisotropic-electroconductive adhesive of embodiment 5 preparations shows excellent characteristic.
Figure 12 is the schema of preferred embodiment that illustrates the adhering method of use anisotropic-electroconductive adhesive according to the present invention.With reference to Figure 12, preparation: will be bonded in together substrate with first circuit and chip with second circuit, and anisotropic-electroconductive adhesive, this first circuit has first electrode, and second circuit has second electrode.As anisotropic-electroconductive adhesive, preparation is aforesaid any anisotropic-electroconductive adhesive (step 510) with different compositions according to the present invention.
Substrate coating anisotropic-electroconductive adhesive (step 520) to preparation.Here, can use anisotropic-electroconductive adhesive with the form of film or thickener.When using the film-type anisotropic-electroconductive adhesive, on substrate, be coated with anisotropic-electroconductive adhesive, this anisotropic-electroconductive adhesive has the non-tackiness agent antiadhesion barrier as being made by polyethylene terephthalate on surface attached thereto.When using thickener type anisotropic-electroconductive adhesive, directly be coated with anisotropic-electroconductive adhesive to the position of substrate coideal.
Then, the anisotropic-electroconductive adhesive (step 530) that is coated with facing to the substrate precompressed.When the coating be the film-type anisotropic-electroconductive adhesive time, this precompressed step is more effective.Particularly, under the pressure of about 60-100 ℃ temperature and about 0.1-1MPa, use source heat pump heat to having the about 0.5-5 of coating anisotropic-electroconductive adhesive second on the surperficial substrate of antiadhesion barrier thereon.Then, remove the antiadhesion barrier that is attached to the anisotropic-electroconductive adhesive surface.
Then, position substrate and chip like this are so that first circuit and second circuit are mutually in the face of (step 540).Then, substrate and die bonding are in the same place, so that electricity connects first and second electrodes (step 550) by exerting pressure.In this main adhering method, under the pressure of about 130-250 ℃ temperature and about 1-5MPa, use source heat pump heat to push substrate and the about 10-120 of chip second.Here, consider mutual independence, can regulate aptly and be used for main bonding temperature and pressure.
In adhering method according to the present invention, can use element such as the glass substrate and flexible print wiring board (FPC) the realization substrate of printed circuit board (PCB) (PCB) or LCD panel.
In preparation TFT-LCD, bonding some FPCs on a glass substrate.In the case, as institute in the schema of Figure 12 is illustrational, after the step 530 of the anisotropic-electroconductive adhesive that is coated with facing to the substrate precompressed, can also comprise: on the substrate of precompressed, locate new FPC and the step of this new FPC of precompressed.Can adopt the condition identical with Figure 12 step 530.But, if desired, can reduce the time length of precompressed.
Though with reference to the preferred embodiment of the invention, described according to anisotropic-electroconductive adhesive of the present invention and preparation method thereof,, can make the change of various forms and content therein and do not leave the spirit and scope of the present invention.Preferred embodiment recited above and accompanying drawing are presented for purposes of illustration and and are not intended to limit the scope of the invention.Those skilled in the art should be understood that: change the present invention recited above with various by the mode that substitutes and revise, do not leave as the defined the spirit and scope of the present invention of appended claim or in the scope that it is equal to.
Industrial usability
Anisotropic-electroconductive adhesive according to the present invention comprises the viscosity intensifier for the flowability of regulating adhesive composition. Therefore, when using according to the bonding microcircuit of anisotropic-electroconductive adhesive of the present invention, in the starting stage of heating and extrusion process, reduced the flowability of anisotropic-electroconductive adhesive. As a result of, even under the high temperature bonding condition, also can between microcircuit, keep anisotropic-electroconductive adhesive, prevent from thus between microcircuit, producing the space. In addition, strong bonding force and satisfied bonding reliability, insulaion resistance and connection resistance have been guaranteed.

Claims (25)

1. anisotropic-electroconductive adhesive, it comprises:
Binder composition, it comprises epoxy group(ing) base resin, stiffening agent and conductive particle; With
The viscosity intensifier that is used to regulate the binder composition flowability based on the 5-95 weight % of the total amount of anisotropic-electroconductive adhesive.
2. anisotropic-electroconductive adhesive according to claim 1, wherein said viscosity intensifier comprises: be selected from aluminum oxide, silicon carbide, silicon oxide, cupric oxide, the inorganic substance in the mixture that titanium dioxide and these materials are at least two kinds.
3. anisotropic-electroconductive adhesive according to claim 2, wherein said inorganic substance are that median size is the form of the particulate of 0.1-5 micron, and its content is based on the 5-60 weight % of the total amount of anisotropic-electroconductive adhesive.
4. anisotropic-electroconductive adhesive according to claim 1, wherein said viscosity intensifier comprises: radically curable resin and radical initiator.
5. anisotropic-electroconductive adhesive according to claim 4, wherein said radically curable resin comprises: have C 1-C 20The Acrylic Acid Monomer of main chain or methacrylic acid monomer have C 21-C 100The acrylic acid oligomer of main chain or methacrylic acid oligomer, the thermal curable resin that comprises reactive acroleic acid or methacrylic acid unit, the thermoplastic resin that comprises reactive acroleic acid or methacrylic acid unit, or the mixture of these materials, and described radical initiator comprises: peroxide initiator, azo initiator, or the mixture of these materials.
6. anisotropic-electroconductive adhesive according to claim 4, wherein said radical initiator comprises: peroxidation acid cumyl ester, acetyl peroxide, peroxidized t-butyl perbenzoate, dicumyl peroxide, azobisisobutyronitrile, or the mixture of these materials.
7. anisotropic-electroconductive adhesive according to claim 1, wherein said viscosity intensifier comprises: UV-curable resin and UV initiator.
8. anisotropic-electroconductive adhesive according to claim 7, wherein said UV-curable resin comprises: the polyfunctional monomer that is selected from dipentaerythritol acrylate, diacrylate methylene glycol ester, Viscoat 295, ethylene glycol diacrylate and pentaerythritol triacrylate, be selected from the polyfunctional group oligopolymer of epoxy acrylate, urethane acrylate and polyester acrylate, reactive acrylate's polymkeric substance, or the mixture of these materials.
9. anisotropic-electroconductive adhesive according to claim 7, wherein said UV initiator comprises: 2,2-dimethoxy-2-phenyl methyl phenyl ketone, 1-hydroxyl-cyclohexyl-benzophenone, right-phenyl benzophenone, benzyldimethylketal, or the mixture of these materials.
10. anisotropic-electroconductive adhesive according to claim 1, it also comprises the conductive impurity ions of 1-100ppm.
11. anisotropic-electroconductive adhesive according to claim 10, wherein said conductive impurity ions is selected from: Na +, K +And Cl -
12. anisotropic-electroconductive adhesive according to claim 1, wherein said base resin is selected from: bisphenol-A type Resins, epoxy, bisphenol-f type Resins, epoxy, phenol novolak type epoxy resin, cresols phenolic resin varnish type epoxy resin, the Resins, epoxy of dimerization modification, the Resins, epoxy of modified rubber, polyurethane-modified Resins, epoxy, the Resins, epoxy of bromination, melamine resin, urethane resin, polyimide resin, polyamide resin, polyvinyl resin, acrylic resin, styrene resin, styrene butadiene resin, phenol resins, formaldehyde resin, silicone resin, acrylic resin, or the mixture of these resins.
13. anisotropic-electroconductive adhesive according to claim 1, wherein said stiffening agent is selected from: imdazole derivatives, sulfonamide derivatives, amide derivatives, acid anhydrides, the mixture that amphyl and these materials are at least two kinds.
14. anisotropic-electroconductive adhesive according to claim 1, wherein said conductive particle comprises: pure nickel particle or the composite particles by obtaining with nickel and gold coating polymerization bead successively.
15. anisotropic-electroconductive adhesive according to claim 1, wherein said binder composition also comprise a kind of Gum Rosin that is selected from, the viscosity imparting agent of terpine resin and coumarone-indene resin.
16. anisotropic-electroconductive adhesive according to claim 1, wherein said binder composition also comprise and a kind ofly are used to disperse and the coupling agent of stable conductive particle.
17. anisotropic-electroconductive adhesive according to claim 16, wherein said coupling agent comprises silane derivative.
18. an ic package, it comprises:
First substrate, realization thereon comprises first circuit of first electrode;
Second substrate realizes comprising the second circuit in the face of second electrode of first electrode arrangement thereon; With
Anisotropic-electroconductive adhesive, it is coated between first and second substrates so that it is bonded together, and first and second electrodes contact simultaneously connects to obtain electricity,
Wherein said anisotropic-electroconductive adhesive comprises: resin, stiffening agent, dispersive conductive particle in resin; With the viscosity intensifier that is used to increase resin viscosity.
19. ic package according to claim 18, wherein said resin is a kind of epoxy group(ing) thermal curable resin, and viscosity intensifier comprises: be selected from silicon oxide, silicon carbide, the inorganic substance of the mixture that aluminum oxide and these materials are at least two kinds, and its content is based on the 5-60 weight % of the total amount of anisotropic-electroconductive adhesive.
20. ic package according to claim 18, wherein said first substrate are glass substrate or flexible print wiring board (FPC).
First substrate that 21. a kind bonding has first circuit with have the method for second substrate of second circuit, described first circuit has first electrode, described second circuit has second electrode, this method comprises:
To first substrate coating anisotropic-electroconductive adhesive;
Anisotropic-electroconductive adhesive facing to first substrate precompressed coating;
With first and second substrate orientation, so that first and second circuit are faced mutually;
By mutually with first and second substrate bindings together, so that electricity connects first and second electrodes facing to extruding first and second substrates.
22. method according to claim 21, wherein said anisotropic-electroconductive adhesive comprise epoxy group(ing) thermal curable resin, stiffening agent and are dispersed in conductive particle in the resin; With the viscosity intensifier that is used to improve resin viscosity based on the 5-60 weight % of the total amount of anisotropic-electroconductive adhesive, described viscosity intensifier is selected from silicon oxide, silicon carbide, the mixture that aluminum oxide and these materials are at least two kinds.
23. method according to claim 21, wherein, in the described anisotropic-electroconductive adhesive that faces toward first substrate precompressed coating, apply the pressure of 0.1-1Mpa, and in bonding first and second substrates, in 130-250 ℃ of pressure that applies 1-5Mpa with bonding first and second substrates.
24. method according to claim 21, wherein said first substrate are glass substrate or flexible print wiring board (FPC).
25. method according to claim 21, this method also comprises: location the 3rd substrate on first substrate of crossing anisotropic-electroconductive adhesive facing to precompressed; With
By the pressure that applies 0.1-1MPa in 60-100 ℃, facing to the first substrate precompressed the 3rd substrate.
CNB028127722A 2001-06-25 2002-06-24 Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same Expired - Lifetime CN1250663C (en)

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