CN109593501A - adhesive composition, electronic product and preparation method thereof - Google Patents
adhesive composition, electronic product and preparation method thereof Download PDFInfo
- Publication number
- CN109593501A CN109593501A CN201811407911.0A CN201811407911A CN109593501A CN 109593501 A CN109593501 A CN 109593501A CN 201811407911 A CN201811407911 A CN 201811407911A CN 109593501 A CN109593501 A CN 109593501A
- Authority
- CN
- China
- Prior art keywords
- parts
- binding compositions
- resin
- electronic product
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 227
- 238000002360 preparation method Methods 0.000 title claims abstract description 50
- 239000000853 adhesive Substances 0.000 title abstract description 10
- 230000001070 adhesive effect Effects 0.000 title abstract description 10
- 238000004519 manufacturing process Methods 0.000 title description 4
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 239000011347 resin Substances 0.000 claims abstract description 60
- 239000002994 raw material Substances 0.000 claims abstract description 54
- 239000003504 photosensitizing agent Substances 0.000 claims abstract description 28
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 23
- 239000004925 Acrylic resin Substances 0.000 claims description 48
- 239000003795 chemical substances by application Substances 0.000 claims description 40
- 238000010438 heat treatment Methods 0.000 claims description 39
- 229920000178 Acrylic resin Polymers 0.000 claims description 37
- 239000002245 particle Substances 0.000 claims description 37
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 27
- 239000003822 epoxy resin Substances 0.000 claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 27
- 239000004593 Epoxy Substances 0.000 claims description 26
- 239000004014 plasticizer Substances 0.000 claims description 23
- 238000001029 thermal curing Methods 0.000 claims description 19
- 229920000570 polyether Polymers 0.000 claims description 18
- 229920000728 polyester Polymers 0.000 claims description 16
- 150000002148 esters Chemical class 0.000 claims description 15
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 claims description 15
- 238000012545 processing Methods 0.000 claims description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 13
- -1 amide groups amine Chemical class 0.000 claims description 13
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 12
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 12
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 12
- QNJVYPYNVCLCBU-UHFFFAOYSA-N CCOP(=O)C(=O)c1c(C)cc(C)cc1C Chemical compound CCOP(=O)C(=O)c1c(C)cc(C)cc1C QNJVYPYNVCLCBU-UHFFFAOYSA-N 0.000 claims description 10
- 150000001558 benzoic acid derivatives Chemical class 0.000 claims description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 10
- 229920002554 vinyl polymer Polymers 0.000 claims description 10
- 150000001412 amines Chemical class 0.000 claims description 9
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
- 125000005375 organosiloxane group Chemical group 0.000 claims description 9
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 9
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims description 8
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 7
- 150000004985 diamines Chemical class 0.000 claims description 7
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 7
- 150000002576 ketones Chemical class 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 claims description 6
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 claims description 6
- 244000028419 Styrax benzoin Species 0.000 claims description 6
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 6
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 6
- 229920006387 Vinylite Polymers 0.000 claims description 6
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims description 6
- 229960002130 benzoin Drugs 0.000 claims description 6
- 235000019382 gum benzoic Nutrition 0.000 claims description 6
- 238000012986 modification Methods 0.000 claims description 6
- 230000004048 modification Effects 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 6
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 6
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 5
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- 229920003180 amino resin Polymers 0.000 claims description 5
- PGEAEAYLSCKCCO-UHFFFAOYSA-N benzene;n-methylmethanamine Chemical compound CNC.C1=CC=CC=C1 PGEAEAYLSCKCCO-UHFFFAOYSA-N 0.000 claims description 5
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 claims description 5
- 125000005498 phthalate group Chemical class 0.000 claims description 5
- 150000005846 sugar alcohols Chemical class 0.000 claims description 5
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 claims 4
- JNRLEMMIVRBKJE-UHFFFAOYSA-N 4,4'-Methylenebis(N,N-dimethylaniline) Chemical compound C1=CC(N(C)C)=CC=C1CC1=CC=C(N(C)C)C=C1 JNRLEMMIVRBKJE-UHFFFAOYSA-N 0.000 claims 1
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical group C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 claims 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- 239000005864 Sulphur Substances 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- MGHPNCMVUAKAIE-UHFFFAOYSA-N diphenylmethanamine Chemical compound C=1C=CC=CC=1C(N)C1=CC=CC=C1 MGHPNCMVUAKAIE-UHFFFAOYSA-N 0.000 claims 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 239000011521 glass Substances 0.000 description 20
- 238000011282 treatment Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 9
- 238000003825 pressing Methods 0.000 description 9
- 238000000016 photochemical curing Methods 0.000 description 7
- 238000007711 solidification Methods 0.000 description 7
- 230000008023 solidification Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N methyl pentane Natural products CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- MLNKXLRYCLKJSS-RMKNXTFCSA-N (2e)-2-hydroxyimino-1-phenylethanone Chemical compound O\N=C\C(=O)C1=CC=CC=C1 MLNKXLRYCLKJSS-RMKNXTFCSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- YFPJFKYCVYXDJK-UHFFFAOYSA-N Diphenylphosphine oxide Chemical compound C=1C=CC=CC=1[P+](=O)C1=CC=CC=C1 YFPJFKYCVYXDJK-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- HJOVHMDZYOCNQW-UHFFFAOYSA-N Isophorone Natural products CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 1
- NPPQSCRMBWNHMW-UHFFFAOYSA-N Meprobamate Chemical compound NC(=O)OCC(C)(CCC)COC(N)=O NPPQSCRMBWNHMW-UHFFFAOYSA-N 0.000 description 1
- IEBJZLRZRKTGFN-UHFFFAOYSA-N N=NC=NN.N=NC=NN.C1=CC=CC=C1 Chemical compound N=NC=NN.N=NC=NN.C1=CC=CC=C1 IEBJZLRZRKTGFN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- HOCOIDRZLNGZMV-UHFFFAOYSA-N ethoxy(oxido)phosphanium Chemical compound CCO[PH2]=O HOCOIDRZLNGZMV-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to an adhesive composition, an electronic product and a preparation method thereof. The raw materials of the adhesive composition comprise, by weight, 20-40 parts of thermosetting resin, 10-30 parts of photosensitive resin and 1-5 parts of photosensitizer. The adhesive composition has good adhesiveness, and the thermal expansion of the members to be bonded can be reduced by bonding with the adhesive composition.
Description
Technical field
The present invention relates to technical field of electronic encapsulation, in particular to a kind of binding compositions, electronic product and its preparation side
Method.
Background technique
Anisotropic conductive adhesive paste is a kind of adhesive for capableing of unilateal conduction.Anisotropic conductive film (Anisotropic
Conductive Film, ACF) it is the film made of anisotropic conductive adhesive paste.Since ACF has both unilateal conduction and gluing is fixed
Function, be widely used in display screen, piezo-electric crystal, crystal oscillator, resonator, solar battery, photovoltaic cell, buzzer, partly lead
The encapsulation and bonding of the various elements such as body discrete device.
The main component of traditional ACF is thermosetting resin.Such ACF is needed in use using high-temperature laminating,
So that ACF reacts and improve the adherence of ACF, complete bonding (bonding).But higher temperature leads to member to be bonded
The thermal expansion of part is larger, and then influences the normal use of element to be bonded.
Summary of the invention
Based on this, it is necessary to provide a kind of binding compositions, which has preferable adherence, and using should
Binding compositions, which carry out bonding, can reduce the thermal expansion of element to be bonded.
Further it is provided that a kind of electronic product and preparation method thereof.
A kind of binding compositions, based on parts by weight, the raw material of the binding compositions includes:
20 parts~40 parts of thermosetting resin；
10 parts~30 parts of photosensitive resin；And
1 part~5 parts of photosensitizer；
Wherein, the thermosetting resin is in epoxy resin, unsaturated polyester resin, phenolic resin and amino resins
At least one, the photosensitive resin are selected from epoxy acrylic resin, polyurethane acrylic resin, polyester acrylate resin, polyethers
At least one of acrylic resin, pure acrylic resin and vinylite, the photosensitizer are selected from 2,4,6- dipheny oxides
Change phosphine, 2,4,6- trimethylbenzoyl phosphinic acid ethyl ester, 2- methyl-1-[4- methyl mercapto phenyl]-2- morpholinyl-1- acetone, 2-
Isopropyl thioxanthone, 4- dimethylamino-benzoic acid ethyl ester, 1- hydroxyl-cyclohexyl-phenyl ketone, 2- hydroxy-2-methyl -1-
In phenyl -1- acetone, benzoin dimethylether, methyl o-benzoylbenzoate, 4- chlorobenzophenone and the stupid ketone of 4- phenyl two
It is at least one.
Thermosetting resin in above-mentioned binding compositions, photosensitive resin and photosensitizer act synergistically, and enable binding compositions
Enough there is good adherence by low temperature pressing and photocuring, realize bonding, while using low temperature in use
Pressing is conducive to reduce the thermal expansion effects of element to be bonded.Experiment proves that being bonded COF using above-mentioned binding compositions
It can be pressed in 130 DEG C or less when (Chip On Film, also known as flip chip) and glass substrate, the adhesion strength after bonding
For 800N/m~1500N/m, the thermal expansion ratio for the glass substrate being bonded using above-mentioned binding compositions compares traditional
ACF, which carries out bonding, reduces 0.02%.
In one of the embodiments, based on parts by weight, the raw material of the binding compositions includes 20 parts~40 parts
Epoxy resin, 10 parts~30 parts of epoxy acrylic resin, 1 part~4 parts of 2,4,6- diphenyl phosphine oxide and 1 part~4 parts
4- dimethylamino-benzoic acid ethyl ester.
In one of the embodiments, based on parts by weight, the raw material of the binding compositions further includes 5 parts~15 parts
Thermal curing agents.
It is bicyclic to be selected from vinyl triamine, diaminocyclohexane, methylene for the thermal curing agents in one of the embodiments,
Hexane amine, isophorone diamine, tetraethylenepentamine, two amine adducts, trimethyl diamines, m-xylene diamine, diamino two
At least one of phenylmethane, benzene dimethylamine tripolymer, amide groups amine and dicyandiamide.
In one of the embodiments, based on parts by weight, the raw material of the binding compositions further includes 5 parts~10 parts
Conducting particles.
In one of the embodiments, based on parts by weight, the raw material of the binding compositions further includes 5 parts~10 parts
Helper component, the helper component are selected from least one of levelling agent and plasticizer.
In one of the embodiments, based on parts by weight, the helper component includes 1 part~10 parts of levelling agent and 1
Part~10 parts of plasticizer；And/or
The levelling agent be selected from dimethyl silicone polymer, polyether polyester azo polyether polyeste, terminal groups modification organosilicon and
At least one of alkyl-modified organosiloxane；And/or
The plasticizer in Phthalates, benzene polyacid esters, benzoates and polyalcohol esters at least
It is a kind of.
A kind of binding compositions, in terms of mass percentage, the raw material of the binding compositions includes 20%~40%
Thermosetting resin, 10%~30% photosensitive resin, 1%~5% photosensitizer, 5%~15% thermal curing agents, 5%~
10% conducting particles, 1%~10% levelling agent and 1%~10% plasticizer, the thermosetting resin be selected from asphalt mixtures modified by epoxy resin
At least one of rouge, unsaturated polyester resin, phenolic resin and amino resins, the photosensitive resin are selected from epoxy acrylic tree
At least one of rouge, polyester acrylate resin, polyoxyalkylene acrylate resin, pure acrylic resin and vinylite, the light
Quick dose is selected from 2,4,6- diphenyl phosphine oxide, 2,4,6- trimethylbenzoyl phosphinic acid ethyl ester, 2- methyl-1-[4- methylthio phenyl
Base] -2- morpholinyl -1- acetone, 2- isopropyl thioxanthone, 4- dimethylamino-benzoic acid ethyl ester, 1- hydroxyl-cyclohexyl-phenyl
Ketone, 2- hydroxy-2-methyl -1- phenyl -1- acetone, benzoin dimethylether, methyl o-benzoylbenzoate, 4- chlorobenzophenone
And at least one of stupid ketone of 4- phenyl two, the thermal curing agents are selected from vinyl triamine, diaminocyclohexane, di-2-ethylhexylphosphine oxide
Hexamethylene alkanamine, isophorone diamine, tetraethylenepentamine, two amine adducts, trimethyl diamines, m-xylene diamine, diamino
At least one of diphenyl methane, benzene dimethylamine tripolymer, amide groups amine and dicyandiamide, the levelling agent are selected from poly- diformazan
At least one in radical siloxane, polyether polyester azo polyether polyeste, terminal groups modification organosilicon and alkyl-modified organosiloxane
Kind, the plasticizer is selected from least one of Phthalates, benzene polyacid esters, benzoates and polyalcohol esters.
A kind of preparation method of electronic product, includes the following steps:
Binding compositions described above are held between first element and second element, object to be processed is obtained；
Heating pressurization and ultraviolet light processing are carried out to the object to be processed, obtain electronic product.
A kind of electronic product is prepared by the preparation method of above-mentioned electronic product.
Detailed description of the invention
Fig. 1 is the operation chart that pressurized treatments are heated in the preparation process of the electronic product of an embodiment；
Fig. 2 is the operation chart of ultraviolet light in the preparation process of electronic product shown in FIG. 1；
Fig. 3 is the operation chart of the preparation process of the electronic product of another embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
The binding compositions of one embodiment, based on parts by weight, raw material include 20 parts~40 parts thermosetting resin,
10 parts~30 parts of photosensitive resin and 1 part~5 parts of photosensitizer.
Above-mentioned binding compositions can have good adherence to realize by low temperature pressing and photocuring
Bonding is conducive to the thermal expansion effects for reducing element to be bonded.Wherein, element to be bonded includes glass plate, COF and FPC
At least one of (flexible circuit board, Flexible Printed Circuit).It should be noted that element to be bonded is unlimited
Point out element in above-mentioned, can also be other elements, such as can be COB (chip on board, Chip On Board) etc..Due to
Above-mentioned binding compositions are capable of the viscous of glass plate, COF and FPC (flexible circuit board, Flexible Printed Circuit) etc.
It connects, it is thus possible to applied to preparing electronic product.Wherein, electronic product is display screen, piezo-electric crystal, crystal oscillator, resonator, the sun
Energy battery, photovoltaic cell, buzzer or semi-conductor discrete device etc..
Thermosetting resin generates chemical change and gradually hardened forming after referring to heating, and continuing to be heated will not soften or dissolve
A kind of resin.The addition of thermosetting resin enables binding compositions to heat pressing.
Thermosetting resin is selected from epoxy resin, unsaturated polyester resin, phenolic resin and ammonia in one of the embodiments,
At least one of base resin.
In one of the embodiments, based on parts by weight, the raw material of binding compositions includes 25 parts~35 parts of thermosetting
Property resin.Further, based on parts by weight, the raw material of binding compositions includes 28 parts~32 parts of thermosetting resin.At it
In in some embodiments, based on parts by weight, the raw material of binding compositions includes 20 parts, 25 parts, 28 parts, 32 parts, 35 parts or 40
The thermosetting resin of part.
Photosensitive resin is that one kind can be by the material of photocuring rapid shaping.The addition of photosensitive resin, so that bonding
Composition can pass through illumination curing molding.
Photosensitive resin is selected from epoxy acrylic resin, polyurethane acrylic resin, polyester third in one of the embodiments,
At least one of olefin(e) acid resin, polyoxyalkylene acrylate resin, pure acrylic resin and vinylite.Further, polyurethane
Acrylic resin is that the article No. of Bayer A.G is De Shimo all polyurethane acrylic resins of D-100.Polyester acrylic tree
Rouge is the polyester acrylate resin that the article No. of Chinese Hou Ding chemical company is HD-220.
In one of the embodiments, based on parts by weight, the raw material of binding compositions includes 15 parts~25 parts photosensitive
Resin.Further, based on parts by weight, the raw material of binding compositions includes 18 parts~22 parts of photosensitive resin.Wherein one
In a little embodiments, based on parts by weight, the raw material of binding compositions includes 10 parts, 15 parts, 18 parts, 22 parts, 35 parts or 30 parts
Photosensitive resin.
The mass ratio of heat reactive resin and photosensitive resin is 2:3~4 in binding compositions in one of the embodiments:
1.Such setting can further increase the adherence of binding compositions.Further, in binding compositions heat reactive resin with
The mass ratio of photosensitive resin is 4:3~2:1.
Photosensitizer can be transferred on some pairs of insensitive reactants of visible light luminous energy to mention in photochemical reaction
Photosensitive property that is high or expanding these reactants.The addition of photosensitizer is conducive to binding compositions and carries out photocuring reaction and improve
The adherence of binding compositions.
Photosensitizer is selected from 2,4,6- diphenyl phosphine oxides, 2,4,6- trimethylbenzoyls in one of the embodiments,
Phosphinic acid ethyl ester, 2- methyl-1-[4- methyl mercapto phenyl]-2- morpholinyl-1- acetone, 2- isopropyl thioxanthone, 4- dimethylamino-
Ethyl benzoate, 1- hydroxyl-cyclohexyl-phenyl ketone, 2- hydroxy-2-methyl -1- phenyl -1- acetone, benzoin dimethylether, neighbour
At least one of methyl benzoylbenzoate, 4- chlorobenzophenone and the stupid ketone of 4- phenyl two.
In one of the embodiments, based on parts by weight, the raw material of binding compositions includes 2 parts~4 parts of photosensitizer.
Further, based on parts by weight, the raw material of binding compositions includes 2.5 parts~3.5 parts of photosensitizer.Some implementations wherein
In example, based on parts by weight, the raw material of binding compositions includes 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts
Or 5 parts of photosensitizer.
In one of the embodiments, based on parts by weight, the raw material of binding compositions includes the 2,4,6- of 1 part~4 parts
Diphenyl phosphine oxide and 1 part~4 parts of 4- dimethylamino-benzoic acid ethyl ester.The synergistic effect of above two photosensitizer, is conducive to
The pressing-in temp for reducing ACF, improves the adherence of ACF.
The mass ratio of photosensitive resin and photosensitizer is 2~30 in binding compositions in one of the embodiments,.It is such to set
It sets, the adherence of binding compositions can be further increased.Further, in binding compositions photosensitive resin and photosensitizer matter
Amount is than being 10~20.Further, the mass ratio of photosensitive resin and photosensitizer is 6~10 in binding compositions.
In one of the embodiments, based on parts by weight, the raw material of binding compositions includes 20 parts~40 parts of epoxy
Resin, 10 parts~30 parts of epoxy acrylic resin, 1 part~4 parts of 2,4,6- diphenyl phosphine oxide and 1 part~4 parts of 4- bis-
Methylamino-ethyl benzoate.Such setting, binding compositions can be pressed under lower temperature.
In one of the embodiments, based on parts by weight, the raw material of binding compositions further includes 5 parts~15 parts of thermosetting
Agent.Thermal curing agents can promote binding compositions heat cure and have good adherence.
Thermal curing agents are selected from vinyl triamine, diaminocyclohexane, di-2-ethylhexylphosphine oxide hexamethylene in one of the embodiments,
Amine, isophorone diamine, tetraethylenepentamine, two amine adducts, trimethyl diamines, m-xylene diamine, diamino-diphenyl
At least one of methane, benzene dimethylamine tripolymer, amide groups amine and dicyandiamide.Wherein, amide groups amine is U.S.'s Hexion
The 3046 amido amine curing agent of EPIKUR of Mai Tu company.
In one of the embodiments, based on parts by weight, the raw material of binding compositions includes 8 parts~12 parts of heat cure
Agent.Further, based on parts by weight, the raw material of binding compositions includes 9 parts~11 parts of thermal curing agents.Some realities wherein
It applies in example, based on parts by weight, the raw material of binding compositions includes 5 parts, 8 parts, 9 parts, 11 parts, 12 parts or 15 parts of heat cure
Agent.
The mass ratio of heat reactive resin and thermal curing agents is 1.5~8 in binding compositions in one of the embodiments,.
Such setting can further increase the adherence of binding compositions.Further, heat reactive resin and heat in binding compositions
The mass ratio of curing agent is 2~4.
In one of the embodiments, based on parts by weight, the raw material of binding compositions further includes 5 parts~10 parts of conduction
Particle.Conducting particles makes binding compositions conductive, so that binding compositions can be used as a kind of anisotropic conductive adhesive paste.
When at least two need to be electrically connected wait be bonded element, binding compositions can not only be bonded above-mentioned element to be bonded, additionally it is possible to
The electrical connection of element to be bonded is realized by conducting particles.
Further, based on parts by weight, the raw material of binding compositions includes 7 parts~8 parts of conducting particles.Wherein one
In a little embodiments, based on parts by weight, the raw material of binding compositions includes 5 parts, 6 parts, 7 parts, 7.5 parts, 8 parts, 9 parts or 10 parts
Conducting particles.
It should be noted that if two wait be bonded element do not need electrical connection when, conducting particles can be omitted.
In one of the embodiments, based on parts by weight, the raw material of binding compositions further includes 5 parts~10 parts of auxiliary
Component.Helper component is selected from least one of levelling agent and plasticizer.Levelling agent can form a film making binding compositions
During promote binding compositions to form smooth, smooth, uniform film.The addition of plasticizer can make binding compositions
Flexibility enhancing, it is easy to process.
In one of the embodiments, based on parts by weight, helper component include 1 part~10 parts levelling agent and 1 part~
10 parts of plasticizer.
Levelling agent is selected from dimethyl silicone polymer, polyether polyester azo polyether polyeste, end in one of the embodiments,
At least one of base modified organic silicon and alkyl-modified organosiloxane.
Plasticizer is selected from Phthalates, benzene polyacid esters, benzoates and polynary in one of the embodiments,
At least one of alkoxide.
In one of the embodiments, in terms of mass percentage, the raw material of binding compositions includes 20%~40%
Thermosetting resin, 10%~30% photosensitive resin, 1%~5% photosensitizer, 5%~15% thermal curing agents, 5%~
10% conducting particles, 1%~10% levelling agent and 1%~10% plasticizer, thermosetting resin is selected from epoxy resin, no
At least one of saturated polyester resin, phenolic resin and amino resins, photosensitive resin are selected from epoxy acrylic resin, polyester third
At least one of olefin(e) acid resin, polyoxyalkylene acrylate resin, pure acrylic resin and vinylite, photosensitizer are selected from 2,4,6-
Diphenyl phosphine oxide, 2,4,6- trimethylbenzoyl phosphinic acid ethyl ester, 2- methyl-1-[4- methyl mercapto phenyl]-2- morpholinyl-1-
Acetone, 2- isopropyl thioxanthone, 4- dimethylamino-benzoic acid ethyl ester, 1- hydroxyl-cyclohexyl-phenyl ketone, 2- hydroxyl -2-
Methyl-1-phenyl-1- acetone, benzoin dimethylether, methyl o-benzoylbenzoate, 4- chlorobenzophenone and the stupid first of 4- phenyl two
At least one of ketone, thermal curing agents are selected from vinyl triamine, diaminocyclohexane, di-2-ethylhexylphosphine oxide hexamethylene alkanamine, isophorone
Diamines, tetraethylenepentamine, two amine adducts, trimethyl diamines, m-xylene diamine, diaminodiphenyl-methane, benzene diformazan
At least one of amine tripolymer, amide groups amine and dicyandiamide, it is modified that levelling agent is selected from dimethyl silicone polymer, polyether polyester
At least one of organosiloxane, terminal groups modification organosilicon and alkyl-modified organosiloxane, plasticizer are selected from phthalic acid
At least one of esters, benzene polyacid esters, benzoates and polyalcohol esters.It can using this binding compositions being formulated
Pressing and photocuring under lower light energy can have good adherence and realize bonding at lower temperatures, more
Be conducive to reduce the thermal expansion effects of element to be bonded, and then be more advantageous to and improve bonding yield.
Binding compositions are paste or film-form in one of the embodiments,.
It should be noted that conducting particles is uniformly distributed in binding compositions when binding compositions include conducting particles
In.
Above-mentioned binding compositions at least have the advantages that
(1) thermosetting resin, photosensitive resin and photosensitizer act synergistically in above-mentioned binding compositions, so that binding compositions
It can be pressed by low temperature and photocuring has good adherence, realize bonding, while in use using low
Temperature and pressure close the thermal expansion effects for being conducive to reduce element to be bonded.Experiment proves that being bonded COF using above-mentioned binding compositions
It can be pressed in 130 DEG C or less when (Chip On Film, also known as flip chip) and glass substrate, the adhesion strength after bonding
For 800N/m~1500N/m, the thermal expansion ratio for the glass substrate being bonded using above-mentioned binding compositions compares traditional
ACF, which carries out bonding, reduces 0.02%.
(2) above-mentioned binding compositions by low temperature pressing plus UV solidification can have good adherence, can be avoided because
High temperature causes element thermal expansion to be bonded larger and reduces bonding yield, additionally it is possible to avoid answering for the hot processing procedure of excessive temperature
Power residual causes element to be bonded that the thermal deformations such as curling occur, and then guarantees the normal operation of element to be bonded.
(3) above-mentioned binding compositions include conducting particles, enable the binding compositions unilateal conduction, above-mentioned bonding group
A kind of anisotropic conductive adhesive paste, bonding and electrical connection for element to be bonded can be used as by closing object.
The preparation method of the binding compositions of one embodiment, including S110~S130 is operated as follows:
S110, thermosetting resin and photosensitive resin heating are melted, obtains mixture.
The temperature for heating fusing in one of the embodiments, is 150 DEG C~200 DEG C.
S120, photosensitizer is added into mixture and mixes, obtain homomixture.
It further include the operation of cooling mixture before S120 after S110 in one embodiment.Specifically, will
Mixture is cooled to 80 DEG C or less.
Binding compositions further include thermal curing agents in one of the embodiments,.When binding compositions include thermal curing agents
When, S120 specifically: photosensitizer and thermal curing agents are added into mixture and mix, obtain homomixture.
Binding compositions further include conducting particles in one of the embodiments,.When binding compositions include conducting particles
When, S120 specifically: photosensitizer and conducting particles are added into mixture and mixes, obtains homomixture.
Binding compositions further include helper component in one of the embodiments,.When binding compositions include helper component
When, S120 specifically: photosensitizer and helper component are added into mixture and mixes, obtains homomixture.
Binding compositions further include thermal curing agents, conducting particles and helper component in one of the embodiments,.Work as bonding
When composition includes helper component, S120 specifically: photosensitizer, thermal curing agents, conducting particles and auxiliary are added into mixture
Component simultaneously mixes, and obtains homomixture.
S130, homomixture is subjected to film process, obtains binding compositions.
S130 in one of the embodiments, specifically: homomixture is coated on substrate, film-forming is bonded
Composition.Further, the mode of film-forming is ultraviolet light solidification.Specifically, in solidification process, ultraviolet light wave is a length of
200nm~400nm, UV energy 500mJ~3000mJ, curing time are 1s~6s.
In one of the embodiments, binding compositions with a thickness of 10 μm~100 μm.
It should be noted that obtaining binding compositions paste if necessary, then S130 can be omitted, and S120 is obtained mixed
Even object is binding compositions paste.
The preparation method of the binding compositions of above embodiment is easy to operate, and the binding compositions that can be obtained are in low temperature
Pressing and photocuring can have good adherence.
As depicted in figs. 1 and 2, the preparation method of the electronic product 100 of an embodiment, including operate as follows S210~
S230:
S210, binding compositions 110 are held between first element 120 and second element 130, obtain object to be processed.
Binding compositions 110 are paste or film-form in one of the embodiments,.
When binding compositions 110 are film-form, S210 specifically: binding compositions 110 are set to first element 120
On one in second element 130, another in first element 120 and second element 130 is set to binding compositions
110 far from one in first element 120 and second element 130, so that binding compositions 110 are held on first element 120
Between second element 130, object to be processed is obtained.
When binding compositions 110 are paste, above-mentioned binding compositions 110 can be held on to first element 120 and the
It is cured to handle so that the solidification of binding compositions 110, obtains object to be processed between two element 130；It can also be by binding compositions
110 are held on again between first element 120 and second element 130；Binding compositions 110 can also be coated on first element
120 is upper with one in second element 130 and after solidifying, then by another setting in first element 120 and second element 130
In on binding compositions 110, so that binding compositions 110 are held between first element 120 and second element 130.
In the shown embodiment, binding compositions 110 are film.Binding compositions 110 contain conducting particles 112.It leads
Charged particle 112 is uniformly distributed in binding compositions 110.
First element 120 is glass plate, COF or FPC in one of the embodiments,.It should be noted that first element
120 be not limited to it is above-mentioned point out element, can be other elements, such as can be COB.In the shown embodiment, first element
120 be glass plate.First element 120 is equipped with first electrode 122.First electrode 122 is multiple, multiple intervals of first electrodes 122
It is set on a surface of first element 120.
Second element 130 is glass plate, COF or FPC in one of the embodiments,.It should be noted that second element
130 be not limited to it is above-mentioned point out element, can be other elements, such as can be COB.In the shown embodiment, second element
130 be COF.Second element 130 is equipped with second electrode 132.Second electrode 132 is multiple, multiple intervals of second electrode 132 setting
In second element 130 on a surface of first element 130.The position of multiple second electrodes 132 is respectively with multiple first
The position of electrode 122 is opposite, so that a second electrode 132 corresponds to a first electrode 122.
S220, it treats processed material and carries out heating pressurized treatments.
Heating temperature is less than or equal to 130 DEG C in one of the embodiments,.Pressure is 2MPa~8MPa.Heating pressurization
The time of processing is 2s~6s.Further, 100 DEG C~130 DEG C of heating temperature.Pressure is 4MPa~6MPa.It heats at pressurization
The time of reason is 3s~5s.
Further, S220 specifically: apply pressure and offer from second element 130 far from the side of first element 120
Heat carries out heating pressurized treatments to treat processed material.Such setting, to prevent first element 120 from being produced by high temperature and high pressure
The shape that changes is broken etc..
In the shown embodiment, buffer layer 140 is covered far from the side of first element 120 in second element 130, passed through
Pressurizing tool 150 presses buffer layer 140, while providing heat from second element 130 far from the side of first element 120, with right
Object to be processed carries out heating pressurized treatments.Wherein, the direction of the arrow in Fig. 1 (1-1) meaning is the direction for heating pressurization.Its
In, buffer layer 140 is silica gel buffer layer or polytetrafluoroethylene (PTFE) buffer layer.It can be avoided directly by the way that buffer layer 140 is arranged to the
Two element 130 pressurizes and causes second element 130 broken or damage, to influence the normal use of electronic product 100.
Further, during heating pressurized treatments, conducting particles 112 can be held on first electrode 122 and
Between two electrodes 132, to be electrically connected first electrode 122 and second electrode 132.
S230, the object to be processed after pressurized treatments is heated using ultraviolet light, obtain electronic product 100.
A length of 200nm~the 400nm of ultraviolet light wave in one of the embodiments,.The accumulated energy 500mJ of ultraviolet light~
3000mJ.The time of ultraviolet light is 1s~6s.
In the illustrated embodiment, ultraviolet light injects object to be processed far from the side of second element 130 from first element 120
In, so that binding compositions 110 solidify.Wherein, the direction of the arrow in Fig. 1 (1-2) meaning is the direction that ultraviolet light is injected.
Such setting is conducive to the transmitance for increasing ultraviolet light, binding compositions 110 is accelerated to solidify.It should be noted that ultraviolet light is not
It is limited to be arranged from above-mentioned direction, ultraviolet light can also be injected from second element 130 far from the side of first element 120.
The preparation method of above-mentioned electronic product 100 is bonded first element 120 and second element by binding compositions 110
The pressing of 130, Yu Caiyong low temperature and ultraviolet light solidification reduce so that first element 120 and 130 stable connection of second element are reliable
The thermal expansion effects of first element 120 and second element 130 can be avoided the stress-retained of the hot processing procedure of excessive temperature and cause
With second element 130 thermal deformations such as curling occur for one element 120, to guarantee the normal operation of electronic product 100.Above-mentioned preparation side
The electronic product 100 that method obtains has stronger tensile strength, bonding yield higher.
Ultraviolet light processing is carried out again it should be noted that being not limited to first to treat processed material and carrying out heating pressurized treatments,
Processed material progress ultraviolet light processing can also first be treated and carry out heating pressurized treatments again.
Also referring to Fig. 3, the preparation method of the electronic product 200 of another embodiment, including operate as follows S310~
S320:
S310, above-mentioned binding compositions 210 are held between first element 220 and second element 230, are obtained to be processed
Object.
Binding compositions 210 are paste or film-form in one of the embodiments,.
When binding compositions 210 are film-form, S310 specifically: binding compositions 210 are set to first element 220
On one in second element 230, another in first element 220 and second element 230 is set to binding compositions
210 far from one in first element 220 and second element 230, so that binding compositions 210 are held on first element 220
Between second element 230, object to be processed is obtained.
When binding compositions 210 are paste, above-mentioned binding compositions 210 can be held on to first element 220 and the
It is cured to handle so that the solidification of binding compositions 210, obtains object to be processed between two element 230；It can also be by binding compositions
210 are held on again between first element 220 and second element 230；Binding compositions 210 can also be coated on first element
220 is upper with one in second element 230 and after solidifying, then by another setting in first element 220 and second element 230
In on binding compositions 210, so that binding compositions 210 are held between first element 220 and second element 230.
In the shown embodiment, binding compositions 210 are film.Binding compositions 210 contain conducting particles 212.It leads
Charged particle 212 is uniformly distributed in binding compositions 210.
First element 220 is glass plate, COF or FPC in one of the embodiments,.It should be noted that first element
220 be not limited to it is above-mentioned point out element, can be other elements, such as can be COB.In the shown embodiment, first element
220 be glass plate.First element 220 is equipped with first electrode 222.First electrode 222 is multiple, multiple intervals of first electrodes 222
It is set on a surface of first element 220.
Second element 230 is glass plate, COF or FPC in one of the embodiments,.It should be noted that second element
230 be not limited to it is above-mentioned point out element, can be other elements, such as can be COB.In the shown embodiment, second element
230 be COF.Second element 230 is equipped with second electrode 232.Second electrode 232 is multiple, multiple intervals of second electrode 232 setting
In second element 230 on a surface of first element 230.The position of multiple second electrodes 232 is respectively with multiple first
The position of electrode 222 is opposite, so that the corresponding first electrode 222 of a second electrode 232.
S320, using ultraviolet light object to be processed, and treat processed material and carry out heating pressurized treatments, obtain electronics production
Product 200.
Heating temperature is less than or equal to 130 DEG C in one of the embodiments,.Pressure is 2MPa~8MPa.Heating pressurization
The time of processing is 2s~6s.A length of 200nm~the 400nm of ultraviolet light wave.Accumulated energy 500mJ~3000mJ of ultraviolet light.It is purple
The time of outer light irradiation is 2s~6s.Further, 100 DEG C~130 DEG C of heating temperature.Pressure is 4MPa~6MPa.Heating adds
The time of pressure processing is 3s~5s.A length of 230nm~the 380nm of ultraviolet light wave.Accumulated energy 1000mJ~2000mJ of ultraviolet light.
The time of ultraviolet light is 3s~5s.
Further, S320 specifically: apply pressure and offer from second element 230 far from the side of first element 220
Heat, ultraviolet light is injected in object to be processed from first element 220 far from the side of second element 230, to binding compositions 210
And then pressurized treatments and ultraviolet light are heated, so that binding compositions 210 solidify.
In the illustrated embodiment, apply pressure far from the side of first element 220 from second element 230 and heat is provided
Operation specifically: cover buffer layer 240 far from the side of first element 220 in second element 230, pressed by pressurizing tool 250
Buffer layer 240 is pressed, while providing heat from second element 230 far from the side of first element 210, is added with treating processed material
Hot pressurized treatments.The direction of arrow (2-1) meaning in Fig. 3 is the direction for heating pressurization, and the direction of arrow (2-2) meaning is
The direction injected for ultraviolet light.
By be arranged buffer layer 140 can be avoided directly cause second element 130 broken the pressurization of second element 130 or
Damage, to influence the normal use of electronic product 100.It should be noted that ultraviolet light is not limited to be arranged from above-mentioned direction, it is ultraviolet
Light can also be injected from second element 230 far from the side of first element 220.
Further, during heating pressurized treatments, conducting particles 212 can be held on first electrode 222, second
Between electrode 232, to be electrically connected first electrode 222 and second electrode 232.
The preparation method of above-mentioned electronic product 200, it is easy to operate, 220 He of first element is bonded by binding compositions 210
Second element 230, the pressing of Yu Caiyong low temperature and ultraviolet light solidification, so that first element 220 and 230 stable connection of second element can
It leans on, reduces the thermal expansion effects of first element 220 and second element 230, the stress that can be avoided the hot processing procedure of excessive temperature is residual
It stays and causes element to be bonded that the thermal deformations such as curling occur, to guarantee the normal operation of electronic product 200.Above-mentioned preparation method obtains
Electronic product 200 have stronger tensile strength, bonding yield higher.
The electronic product of one embodiment is prepared by the preparation method of above-mentioned electronic product.
In one of the embodiments, electronic product be display screen, piezo-electric crystal, crystal oscillator, resonator, solar battery,
Photovoltaic cell, buzzer or semi-conductor discrete device etc..
Above-mentioned electronic product have stronger tensile strength, bonding yield is higher, service life is long.
The following are specific embodiment parts.
In following embodiment, if not otherwise specified, " part " refers both to parts by weight.
In following embodiment, unless otherwise instructed, conducting particles is to be purchased from company, Sekisui Chemical Co., Ltd
Conductive gold spacer.Polyurethane acrylic resin is that the article No. of Bayer A.G is the polyurethane acroleic acid tree of De Shimo all D-100
Rouge.Polyester acrylate resin is the polyester acrylate resin that the article No. of Chinese Hou Ding chemical company is HD-220.
Embodiment 1
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 20 parts of epoxy resin, 10 parts of epoxy
Acrylic resin, 1 part of 2,4,6- diphenyl phosphine oxide.The binding compositions of the present embodiment are film, the thickness of binding compositions
Degree is 100 μm.
The preparation process of the electronic product of this implementation is as follows:
(1) binding compositions are held between first element and second element, obtain object to be processed；Wherein, first yuan
Part is glass plate, second element COF.
(2) apply pressure far from the side of first element from second element and heat is provided, added with treating processed material
Hot pressurized treatments；Wherein, heating temperature is 100 DEG C, pressure 2MPa, and the time for heating pressurized treatments is 2s.
(3) ultraviolet light is injected in object to be processed from first element far from the side of second element, so that binding compositions are solid
Change, obtains electronic product；Wherein, a length of 200nm of ultraviolet light wave, the accumulated energy 500mJ of ultraviolet light, the time of ultraviolet light
For 1s.
Embodiment 2
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 40 parts of epoxy resin, 30 parts of epoxy
Acrylic resin, 5 parts of 2,4,6- trimethylbenzoyl phosphinic acid ethyl ester.The binding compositions of the present embodiment are film, bonding
Composition with a thickness of 14 μm.
The preparation process of the electronic product of this implementation is as follows:
(1) binding compositions are held between first element and second element, obtain object to be processed；Wherein, first yuan
Part is glass plate, second element COF.
(2) apply pressure far from the side of first element from second element and heat is provided, added with treating processed material
Hot pressurized treatments；Wherein, heating temperature is 130 DEG C, pressure 8MPa, and the time for heating pressurized treatments is 6s.
(3) ultraviolet light is injected in object to be processed from first element far from the side of second element, so that binding compositions are solid
Change, obtains electronic product；Wherein, a length of 400nm of ultraviolet light wave, the accumulated energy 3000mJ of ultraviolet light, ultraviolet light when
Between be 6s.
Embodiment 3
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 30 parts of epoxy resin, 20 parts of epoxy
Acrylic resin and 3.5 parts of 4- dimethylamino-benzoic acid ethyl ester.The binding compositions of the present embodiment are film, bonded combination
Object with a thickness of 50 μm.
The preparation process of the electronic product of this implementation is as follows:
(1) binding compositions are held between first element and second element, obtain object to be processed；Wherein, first yuan
Part is glass plate, second element COF.
(2) apply pressure far from the side of first element from second element and heat is provided, added with treating processed material
Hot pressurized treatments；Wherein, heating temperature is 115 DEG C, pressure 5MPa, and the time for heating pressurized treatments is 3s.
(3) ultraviolet light is injected in object to be processed from first element far from the side of second element, so that binding compositions are solid
Change, obtains electronic product；Wherein, a length of 300nm of ultraviolet light wave, the accumulated energy 1500mJ of ultraviolet light, ultraviolet light when
Between be 3s.
Embodiment 4
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 30 parts of epoxy resin, 20 parts of epoxy
Acrylic resin, 1.5 parts of 2,4,6- diphenyl phosphine oxide and 2 parts of 4- dimethylamino-benzoic acid ethyl ester.The present embodiment glues
Polymeric composition is film, binding compositions with a thickness of 50 μm.
The preparation process of the electronic product of this implementation is identical as the preparation process of embodiment 3.
Embodiment 5
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 30 parts of epoxy resin, 20 parts of epoxy
Acrylic resin, 1.5 parts of 2,4,6- diphenyl phosphine oxide and 2 parts of 4- dimethylamino-benzoic acid ethyl ester.The present embodiment glues
Polymeric composition is film, binding compositions with a thickness of 50 μm.
The preparation process of the electronic product of this implementation is as follows:
(1) binding compositions are held between first element and second element, obtain object to be processed；Wherein, first yuan
Part is glass plate, second element COF.
(2) side from second element far from first element applies pressure to object to be processed and provides heat, while ultraviolet
Light is injected in object to be processed from first element far from the side of second element, to treat processed material while carry out heating pressurization and purple
Outer light irradiation, obtains electronic product；Wherein, heating temperature is 115 DEG C, pressure 5MPa, ultraviolet light wave a length of 300nm, ultraviolet
The accumulated energy 1500mJ of light, the time of processing are 3s.
Embodiment 6
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 20 parts of epoxy resin, 10 parts of epoxy
Acrylic resin, 1 part of 2,4,6- diphenyl phosphine oxide, 5 parts of vinyl triamine, 5 parts of conducting particles, 2 parts of polyethers are poly-
Ester modified organosiloxane and 3 parts of phthalic easter plastizer.The binding compositions of the present embodiment are film, bonded combination
Object with a thickness of 100 μm.
The preparation process of the electronic product of this implementation is as follows:
(1) binding compositions are held between first element and second element, obtain object to be processed；Wherein, first yuan
Part is glass plate, second element COF.
(2) side from second element far from first element applies pressure to object to be processed and provides heat, while ultraviolet
Light is injected in object to be processed from first element far from the side of second element, to treat processed material while carry out heating pressurization and purple
Outer light irradiation, obtains electronic product；Wherein, heating temperature is 100 DEG C, pressure 2MPa, ultraviolet light wave a length of 200nm, ultraviolet
The accumulated energy 500mJ of light, the time of processing are 1s.
Embodiment 7
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 40 parts of epoxy resin, 30 parts of epoxy
Acrylic resin, 5 parts of 2,4,6- trimethylbenzoyl phosphinic acid ethyl ester, 15 parts of di-2-ethylhexylphosphine oxide hexamethylene alkanamine, 10 parts lead
Charged particle, 5 parts of dimethyl silicone polymer and 5 parts of benzoates plasticizer.The binding compositions of the present embodiment are film,
Binding compositions with a thickness of 14 μm.
The preparation process of the electronic product of this implementation is as follows:
(1) binding compositions are held between first element and second element, obtain object to be processed；Wherein, first yuan
Part is glass plate, second element COF.
(2) side from second element far from first element applies pressure to object to be processed and provides heat, while ultraviolet
Light is injected in object to be processed from first element far from the side of second element, to treat processed material while carry out heating pressurization and purple
Outer light irradiation, obtains electronic product；Wherein, heating temperature is 130 DEG C, pressure 6MPa, ultraviolet light wave a length of 380nm, ultraviolet
The accumulated energy 2000mJ of light, the time of processing are 5s.
Embodiment 8
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 30 parts of epoxy resin, 20 parts of epoxy
Acrylic resin, 1.5 parts of 2,4,6- diphenyl phosphine oxide, 2 parts of 4- dimethylamino-benzoic acid ethyl ester, 10 parts of trimethyl
Diamines, 7.5 parts of conducting particles, 3 parts of alkyl-modified organosiloxane and 3.5 parts of benzene polyacid ester plasticizer.This reality
Apply example binding compositions be film, binding compositions with a thickness of 50 μm.
The preparation process of the electronic product of this implementation is as follows:
(1) binding compositions are held between first element and second element, obtain object to be processed；Wherein, first yuan
Part is glass plate, second element COF.
(2) side from second element far from first element applies pressure to object to be processed and provides heat, while ultraviolet
Light is injected in object to be processed from first element far from the side of second element, to treat processed material while carry out heating pressurization and purple
Outer light irradiation, obtains electronic product；Wherein, heating temperature is 115 DEG C, pressure 5MPa, ultraviolet light wave a length of 300nm, ultraviolet
The accumulated energy 1500mJ of light, the time of processing are 3s.
Embodiment 9
In the present embodiment, in terms of mass percentage, the raw material of binding compositions include 35% epoxy resin, 25%
Epoxy acrylic resin, 2% 2,4,6- diphenyl phosphine oxide, 2% 4- dimethylamino-benzoic acid ethyl ester, 9% trimethyl
Diamines, 9% conducting particles, 4% alkyl-modified organosiloxane and 4% benzene polyacid ester plasticizer.The present embodiment
Binding compositions be film, binding compositions with a thickness of 50 μm.The preparation process and embodiment 8 of the electronic product of this implementation
It is identical.
Embodiment 10
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 30 parts of epoxy resin, 10 parts of epoxy
Acrylic resin, 1 part of 2,4,6- diphenyl phosphine oxide, 5 parts of vinyl triamine, 5 parts of conducting particles, 2 parts of polyethers are poly-
Ester modified organosiloxane and 3 parts of phthalic easter plastizer.The binding compositions of the present embodiment are film, bonded combination
Object with a thickness of 100 μm.
The preparation process of the electronic product of this implementation is identical as the preparation process of the electronic product of embodiment 6.
Embodiment 11
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 20 parts of epoxy resin, 30 parts of epoxy
Acrylic resin, 5 parts of 2,4,6- trimethylbenzoyl phosphinic acid ethyl ester, 15 parts of di-2-ethylhexylphosphine oxide hexamethylene alkanamine, 10 parts lead
Charged particle, 5 parts of dimethyl silicone polymer and 5 parts of benzoates plasticizer.The binding compositions of the present embodiment are film,
Binding compositions with a thickness of 14 μm.
The preparation process of the electronic product of this implementation is identical as the preparation process of the electronic product of embodiment 7.
Embodiment 12
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 20 parts of epoxy resin, 12 parts of epoxy
Acrylic resin, 1 part of 2,4,6- diphenyl phosphine oxide, 5 parts of vinyl triamine, 5 parts of conducting particles, 2 parts of polyethers are poly-
Ester modified organosiloxane and 3 parts of phthalic easter plastizer.The binding compositions of the present embodiment are film, bonded combination
Object with a thickness of 100 μm.
The preparation process of the electronic product of this implementation is identical as the preparation process of the electronic product of embodiment 6.
Embodiment 13
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 40 parts of epoxy resin, 25 parts of epoxy
Acrylic resin, 5 parts of 2,4,6- trimethylbenzoyl phosphinic acid ethyl ester, 15 parts of di-2-ethylhexylphosphine oxide hexamethylene alkanamine, 10 parts lead
Charged particle, 5 parts of dimethyl silicone polymer and 5 parts of benzoates plasticizer.The binding compositions of the present embodiment are film,
Binding compositions with a thickness of 14 μm.
The preparation process of the electronic product of this implementation is identical as the preparation process of the electronic product of embodiment 7.
Embodiment 14
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 20 parts of epoxy resin, 10 parts of epoxy
Acrylic resin, 1 part of 2,4,6- diphenyl phosphine oxide, 4 parts of vinyl triamine, 5 parts of conducting particles, 2 parts of polyethers are poly-
Ester modified organosiloxane and 3 parts of phthalic easter plastizer.The binding compositions of the present embodiment are film, bonded combination
Object with a thickness of 100 μm.
The preparation process of the electronic product of this implementation is identical as the preparation process of the electronic product of embodiment 6.
Embodiment 15
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 35 parts of epoxy resin, 30 parts of epoxy
Acrylic resin, 5 parts of 2,4,6- trimethylbenzoyl phosphinic acid ethyl ester, 15 parts of di-2-ethylhexylphosphine oxide hexamethylene alkanamine, 10 parts lead
Charged particle, 5 parts of dimethyl silicone polymer and 5 parts of benzoates plasticizer.The binding compositions of the present embodiment are film,
Binding compositions with a thickness of 14 μm.
The preparation process of the electronic product of this implementation is identical as the preparation process of the electronic product of embodiment 7.
Embodiment 16
In the present embodiment, based on parts by weight, the raw material of binding compositions include 30 parts unsaturated polyester resin, 20 parts
Epoxy acrylic resin and 3.5 parts of 4- dimethylamino-benzoic acid ethyl ester.The binding compositions of the present embodiment are film, are glued
Polymeric composition with a thickness of 50 μm.The preparation process of the electronic product of this implementation is identical as embodiment 3.
Embodiment 17
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 30 parts of epoxy resin, 20 parts of pure C
Olefin(e) acid resin and 3.5 parts of 4- dimethylamino-benzoic acid ethyl ester.The binding compositions of the present embodiment are film, binding compositions
With a thickness of 50 μm.The preparation process of the electronic product of this implementation is identical as embodiment 3.
Embodiment 18
In the present embodiment, based on parts by weight, the raw material of binding compositions includes 30 parts of epoxy resin, 20 parts of epoxy
Acrylic resin and 3.5 parts of 1- hydroxyl-cyclohexyl-phenyl ketone.The binding compositions of the present embodiment are film, bonded combination
Object with a thickness of 50 μm.The preparation process of the electronic product of this implementation is identical as embodiment 3.
Embodiment 19
In the present embodiment, based on parts by weight, the raw material of binding compositions include 30 parts epoxy resin, 7.5 parts lead
Charged particle, 3 parts of alkyl-modified organosiloxane and 3.5 parts of benzene polyacid ester plasticizer.The binding compositions of the present embodiment
For film, binding compositions with a thickness of 50 μm.
The preparation process of the electronic product of this implementation is as follows:
(1) binding compositions are held between first element and second element, obtain object to be processed；Wherein, first yuan
Part is glass plate, second element COF.
(2) side from second element far from first element applies pressure to object to be processed and provides heat, while ultraviolet
Light is injected in object to be processed from first element far from the side of second element, to treat processed material while carry out heating pressurization and purple
Outer light irradiation, obtains electronic product；Wherein, heating temperature is 115 DEG C, pressure 5MPa, and the time of processing is 3s.
Embodiment 20
Binding compositions in the present embodiment are identical as embodiment 19.
The preparation process of the electronic product of this implementation is roughly the same with embodiment 19, the difference is that, heating temperature
It is 140 DEG C.
Embodiment 21
In the present embodiment, in terms of mass percentage, the raw material of binding compositions includes 4.5% ethoxylated bisphenol A diformazan
Base acrylate, 23.5% tetraphenolic ethane tetraglycidel ether epoxy resin, 6% polypropylene glycol glycidol ether, 4%
Conductive gold spacer, 3% epoxy benzoylformaldoxime, 16% cyanoguanidine derivative and 0.5% dimethyl silicone polymer.
The preparation process of the electronic product of this implementation is same as Example 8.
Embodiment 22
Binding compositions in the present embodiment are the ACF glue for 1800 series that Hitachi is melted into (Hitachi) company.
The preparation process of the electronic product of this implementation is identical as embodiment 19.
Test:
Measure the adhesion strength of electronic product, the thermal expansion ratio of the first element of electronic product and the electricity of Examples 1 to 22
The flatness of sub- product.See Table 1 for details for measurement result.What table 1 indicated is adhesion strength, the electronics of the electronic product of Examples 1 to 22
The thermal expansion ratio of the first element of product and the flatness of electronic product.
Wherein, using the adhesion of tensile testing machine test electronic product；
By measuring the thickness change of first element, to embody the thermal expansion ratio of first element；Specifically, first is measured
Element before preparing electronic product thickness be prepared into electronic product after thickness, difference using the two is divided by preparing
Thickness before electronic product and multiplied by 100%, obtains thermal expansion ratio；
The problem on deformation such as whether occur crimping by the first element and second element of observing electronic product, to test electronics
The flatness of product；Judgment criteria are as follows: one in first element and second element deforms as out-of-flatness (as no), and first
Element and second element are undeformed, are smooth (being as).
Table 1
As it can be seen from table 1 the adhesion strength of the electronic product of Examples 1 to 9 be 750N/m~1200N/m, at least with reality
The adhesion strength for applying the commercially available ACF glue of example 22 is suitable, and the thermal expansion ratio of the first element of the electronic product of Examples 1 to 9 is
0.044%~0.052%, the thermal expansion ratio than the commercially available ACF glue of embodiment 22 reduces at least 0.02%, illustrates above-mentioned bonding
Composition has preferable adherence, and carries out being bonded the thermal expansion that can reduce element to be bonded using the binding compositions.
The thermal expansion ratio and embodiment 19 of the electronic product of embodiment 8 are suitable, but the adhesion strength of the electronic product of embodiment 8 is higher than in fact
Example 19 is applied, illustrates that the binding compositions of embodiment 8 are more advantageous to the adhesion strength for increasing electronic product.The electronic product of embodiment 20
Adhesion strength be slightly better than embodiment 8, the thermal expansion ratio of the electronic product of embodiment 20 is higher than embodiment 8, although illustrating to mention
The adhesion strength of the electronic product of embodiment 20 can be increased for stabilization, but also will increase the thermal expansion of electronic product, and then say
The binding compositions of bright embodiment 8 are more advantageous to the adhesion strength for increasing electronic product and reduce the thermal expansion ratio of electronic product.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of binding compositions, which is characterized in that based on parts by weight, the raw material of the binding compositions includes:
20 parts~40 parts of thermosetting resin；
10 parts~30 parts of photosensitive resin；And
1 part~5 parts of photosensitizer；
Wherein, the thermosetting resin in epoxy resin, unsaturated polyester resin, phenolic resin and amino resins at least
One kind, the photosensitive resin are selected from epoxy acrylic resin, polyurethane acrylic resin, polyester acrylate resin, polyethers propylene
At least one of acid resin, pure acrylic resin and vinylite, the photosensitizer be selected from 2,4,6- diphenyl phosphine oxides,
2,4,6- trimethylbenzoyl phosphinic acid ethyl ester, 2- methyl-1-[4- methyl mercapto phenyl]-2- morpholinyl-1- acetone, 2- isopropyl
Thioxanthone, 4- dimethylamino-benzoic acid ethyl ester, 1- hydroxyl-cyclohexyl-phenyl ketone, 2- hydroxy-2-methyl -1- phenyl -1-
At least one in acetone, benzoin dimethylether, methyl o-benzoylbenzoate, 4- chlorobenzophenone and the stupid ketone of 4- phenyl two
Kind.
2. binding compositions according to claim 1, which is characterized in that based on parts by weight, the binding compositions
Raw material includes 20 parts~40 parts of epoxy resin, 10 parts~30 parts of epoxy acrylic resin, 1 part~4 parts of 2,4,6- hexichol
Base phosphine oxide and 1 part~4 parts of 4- dimethylamino-benzoic acid ethyl ester.
3. binding compositions according to claim 1, which is characterized in that based on parts by weight, the binding compositions
Raw material further includes 5 parts~15 parts of thermal curing agents.
4. binding compositions according to claim 3, which is characterized in that the thermal curing agents are selected from vinyl triamine, two
Aminocyclohexane, di-2-ethylhexylphosphine oxide hexamethylene alkanamine, isophorone diamine, tetraethylenepentamine, two amine adducts, trimethyl two
At least one of amine, m-xylene diamine, diaminodiphenyl-methane, benzene dimethylamine tripolymer, amide groups amine and dicyandiamide.
5. binding compositions according to claim 1, which is characterized in that based on parts by weight, the binding compositions
Raw material further includes 5 parts~10 parts of conducting particles.
6. binding compositions according to claim 1, which is characterized in that based on parts by weight, the binding compositions
Raw material further includes 5 parts~10 parts of helper component, and the helper component is selected from least one of levelling agent and plasticizer.
7. binding compositions according to claim 6, which is characterized in that based on parts by weight, the helper component includes 1
Part~10 parts of levelling agent and 1 part~10 parts of plasticizer；And/or
The levelling agent is selected from dimethyl silicone polymer, polyether polyester azo polyether polyeste, terminal groups modification organosilicon and alkyl
At least one of azo polyether polyeste；And/or
The plasticizer is selected from least one of Phthalates, benzene polyacid esters, benzoates and polyalcohol esters.
8. a kind of binding compositions, which is characterized in that in terms of mass percentage, the raw material of the binding compositions includes 20%
~40% thermosetting resin, 10%~30% photosensitive resin, 1%~5% photosensitizer, 5%~15% thermal curing agents,
5%~10% conducting particles, 1%~10% levelling agent and 1%~10% plasticizer, the thermosetting resin be selected from ring
At least one of oxygen resin, unsaturated polyester resin, phenolic resin and amino resins, the photosensitive resin are selected from propylene oxide
At least one of acid resin, polyester acrylate resin, polyoxyalkylene acrylate resin, pure acrylic resin and vinylite, institute
It states photosensitizer and is selected from 2,4,6- diphenyl phosphine oxide, 2,4,6- trimethylbenzoyl phosphinic acid ethyl ester, 2- methyl-1-[4- first sulphur
Base phenyl] -2- morpholinyl -1- acetone, 2- isopropyl thioxanthone, 4- dimethylamino-benzoic acid ethyl ester, 1- hydroxyl-cyclohexyl -
Phenyl ketone, 2- hydroxy-2-methyl -1- phenyl -1- acetone, benzoin dimethylether, methyl o-benzoylbenzoate, 4- chlorodiphenyl
At least one of ketone and the stupid ketone of 4- phenyl two, the thermal curing agents are selected from vinyl triamine, diaminocyclohexane, methylene
Base bis cyclohexane amine, isophorone diamine, tetraethylenepentamine, two amine adducts, trimethyl diamines, m-xylene diamine, two
At least one of aminodiphenylmethane, benzene dimethylamine tripolymer, amide groups amine and dicyandiamide, the levelling agent are selected from poly-
In dimethyl siloxane, polyether polyester azo polyether polyeste, terminal groups modification organosilicon and alkyl-modified organosiloxane extremely
Few one kind, the plasticizer in Phthalates, benzene polyacid esters, benzoates and polyalcohol esters at least one
Kind.
9. a kind of preparation method of electronic product, which comprises the steps of:
Binding compositions according to any one of claims 1 to 8 are held between first element and second element, are obtained wait locate
Manage object；
Heating pressurization and ultraviolet light processing are carried out to the object to be processed, obtain electronic product.
10. a kind of electronic product, which is characterized in that be prepared by the preparation method of electronic product as claimed in claim 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811407911.0A CN109593501A (en) | 2018-11-23 | 2018-11-23 | adhesive composition, electronic product and preparation method thereof |
| PCT/CN2018/120784 WO2020103228A1 (en) | 2018-11-23 | 2018-12-13 | Adhesive composition, and electronic product and preparation method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811407911.0A CN109593501A (en) | 2018-11-23 | 2018-11-23 | adhesive composition, electronic product and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109593501A true CN109593501A (en) | 2019-04-09 |
Family
ID=65959537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811407911.0A Pending CN109593501A (en) | 2018-11-23 | 2018-11-23 | adhesive composition, electronic product and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109593501A (en) |
| WO (1) | WO2020103228A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110387183A (en) * | 2019-08-22 | 2019-10-29 | 李金娣 | A kind of aeroge multifunctional material and preparation method thereof |
| CN110591633A (en) * | 2019-09-09 | 2019-12-20 | 深圳日高胶带新材料有限公司 | Polyurethane modified acrylate UV (ultraviolet) curing pressure-sensitive adhesive |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1520448A (en) * | 2001-06-25 | 2004-08-11 | 泰勒弗氏股份有限公司 | Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same |
| CN102127386A (en) * | 2010-12-29 | 2011-07-20 | 东莞市新懿电子材料技术有限公司 | Photocuring and thermocuring conductive adhesive and preparation method |
| CN102634286A (en) * | 2012-05-17 | 2012-08-15 | 深圳市飞世尔实业有限公司 | Photo-thermal dual curable type anisotropic conductive resin and conductive film as well as preparation method of conductive resin and conductive film |
| CN104673113A (en) * | 2015-03-05 | 2015-06-03 | 东华大学 | Photo-thermal dual-curing anisotropic conductive adhesive film and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002285135A (en) * | 2001-03-27 | 2002-10-03 | Shin Etsu Polymer Co Ltd | Anisotropic electroconductive adhesive and connecting structure using the same |
| KR100922658B1 (en) * | 2006-09-12 | 2009-10-19 | 히다치 가세고교 가부시끼가이샤 | Anisotropic conductive film and circuit board using the same |
| CN101724361B (en) * | 2008-12-30 | 2011-12-07 | 四川虹欧显示器件有限公司 | Aeolotropic conductive adhesive and conductive film and electric connection method thereof |
| KR101332436B1 (en) * | 2010-12-06 | 2013-11-22 | 제일모직주식회사 | Anisotropic conductive film |
| CN104559878B (en) * | 2013-10-11 | 2018-06-22 | 威海联浪新材料科技有限公司 | A kind of heat resistance modified ODF techniques LCD sealants of nanometer technology and its preparation |
-
2018
- 2018-11-23 CN CN201811407911.0A patent/CN109593501A/en active Pending
- 2018-12-13 WO PCT/CN2018/120784 patent/WO2020103228A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1520448A (en) * | 2001-06-25 | 2004-08-11 | 泰勒弗氏股份有限公司 | Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same |
| CN102127386A (en) * | 2010-12-29 | 2011-07-20 | 东莞市新懿电子材料技术有限公司 | Photocuring and thermocuring conductive adhesive and preparation method |
| CN102634286A (en) * | 2012-05-17 | 2012-08-15 | 深圳市飞世尔实业有限公司 | Photo-thermal dual curable type anisotropic conductive resin and conductive film as well as preparation method of conductive resin and conductive film |
| CN104673113A (en) * | 2015-03-05 | 2015-06-03 | 东华大学 | Photo-thermal dual-curing anisotropic conductive adhesive film and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110387183A (en) * | 2019-08-22 | 2019-10-29 | 李金娣 | A kind of aeroge multifunctional material and preparation method thereof |
| CN110591633A (en) * | 2019-09-09 | 2019-12-20 | 深圳日高胶带新材料有限公司 | Polyurethane modified acrylate UV (ultraviolet) curing pressure-sensitive adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020103228A1 (en) | 2020-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101642521B1 (en) | Conductive adhesive precursor, method of using the same, and article | |
| US8613623B2 (en) | Acrylic insulating adhesive | |
| CN102753640B (en) | Adhesive tape for manufacturing electric components | |
| CN109593501A (en) | adhesive composition, electronic product and preparation method thereof | |
| CN108702845B (en) | Method for manufacturing connection structure | |
| CN102439705B (en) | Method for connecting electrodes, and connection composition for use in the method | |
| WO2017122624A1 (en) | Curable adhesive sheet | |
| CN102559091A (en) | Anisotropic conductive adhesive, conductive film and preparation method for conductive film | |
| KR101944125B1 (en) | Circuit connection material, connection method using same, and connection structure | |
| JP4081839B2 (en) | Electrode connecting adhesive and connection structure of fine electrode using the same | |
| CN102585722A (en) | Adhesive tape for manufacturing electronic component | |
| KR101872562B1 (en) | Circuitry connecting material and connecting method and connecting structure using same | |
| CN206486463U (en) | Adhesive tape | |
| KR101080033B1 (en) | Heat curable adhesive | |
| JP2007009201A (en) | Electrode-connecting adhesive and connecting structure of fine electrode given by using the same | |
| JP4635287B2 (en) | Anisotropic conductive film | |
| CN106700965A (en) | Anisotropic conductive adhesive and method for producing same, circuit connecting structure body and application | |
| CN206432264U (en) | Display base plate and its display panel, crimping apparatus | |
| JP6536152B2 (en) | Manufacturing method of resin-sealed parts | |
| US20170077056A1 (en) | Anisotropic conductive film and production method of the same | |
| JPH01254786A (en) | Adhesive for sealing liquid crystal element and liquid crystal display device | |
| JP4665280B2 (en) | Anisotropic conductive film | |
| KR20120078080A (en) | Anisotropic conductive film | |
| KR20120032189A (en) | Ultraviolet-thermal dual curable type anisotropic conductive film and mounting method using the same | |
| CN108690548A (en) | Non-solvent adhesive composition, adhesive and bonding sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190409 |