JPH03223380A - Anisotropic conductive adhesive - Google Patents
Anisotropic conductive adhesiveInfo
- Publication number
- JPH03223380A JPH03223380A JP2029190A JP2029190A JPH03223380A JP H03223380 A JPH03223380 A JP H03223380A JP 2029190 A JP2029190 A JP 2029190A JP 2029190 A JP2029190 A JP 2029190A JP H03223380 A JPH03223380 A JP H03223380A
- Authority
- JP
- Japan
- Prior art keywords
- conductive filler
- adhesive
- anisotropic conductive
- conductive adhesive
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 38
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 38
- 239000011231 conductive filler Substances 0.000 claims abstract description 44
- 239000004840 adhesive resin Substances 0.000 claims abstract description 20
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 20
- 239000002245 particle Substances 0.000 claims abstract description 18
- 238000010292 electrical insulation Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 abstract description 26
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 11
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、発熱量が大きい半導体素子等を実装するのに
用いる異方性導電接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an anisotropic conductive adhesive used for mounting semiconductor elements and the like that generate a large amount of heat.
〈従来の技術〉
従来の異方性導電接着剤は、電気絶縁性を有する接着樹
脂と、電気伝導性を有する金属で形成した導電フィラー
とを混合して成る。<Prior Art> Conventional anisotropic conductive adhesives are made by mixing an adhesive resin with electrical insulation properties and a conductive filler made of a metal with electrical conductivity.
次に第２図に示す実装構造の断面図により、上記従来の
異方性導電接着剤を用いて回路基板上に半導体素子を実
装した実装構造を説明する。Next, a mounting structure in which a semiconductor element is mounted on a circuit board using the conventional anisotropic conductive adhesive described above will be described with reference to a cross-sectional view of the mounting structure shown in FIG.
図に示す如く、従来の実装構造は、回路基板２１と半導
体素子２３とを前記従来の異方性導電接着剤２５を介し
て接着する。As shown in the figure, in the conventional mounting structure, a circuit board 21 and a semiconductor element 23 are bonded together via the conventional anisotropic conductive adhesive 25.
回路基板２１と半導体素子２３との電気的接続は、回路
基板２】に設けた基板電極２２と半導体素子２３の接続
端子部２３ａに設けた／＜ンプ電極２４との間に挾まれ
た前記従来の異方性導電接着剤２５中の導電フィラー２
８ａを介して成される。この導電フィラー２６ａは接着
時に押圧されて押しつぶされる。The electrical connection between the circuit board 21 and the semiconductor element 23 is made using the conventional method which is sandwiched between the board electrode 22 provided on the circuit board 2 and the /< pump electrode 24 provided on the connection terminal portion 23a of the semiconductor element 23. Conductive filler 2 in anisotropic conductive adhesive 25 of
8a. This conductive filler 26a is pressed and crushed during adhesion.
よって基板電極２２とバンプ電極２４との接続が確かな
ものになる。Therefore, the connection between the substrate electrode 22 and the bump electrode 24 becomes reliable.
更に前記従来の異方性導電接着剤２５は硬化される。Furthermore, the conventional anisotropic conductive adhesive 25 is cured.
又基板電極２２とバンプ電極２４との間以外の導電フィ
ラー２Ｅｉｂは、異方性導電接着剤２５中に浮遊した状
態で固定される。Further, the conductive filler 2Eib other than between the substrate electrode 22 and the bump electrode 24 is fixed in a floating state in the anisotropic conductive adhesive 25.
よって基板電極２２とバンプ電極２４との接続部以外で
は、電気的導通が生じない。Therefore, no electrical continuity occurs except at the connection portion between the substrate electrode 22 and the bump electrode 24.
又前記バンプ電極２４を設けないで、前記接続端子部２
３ａと前記基板電極２２とを異方性導電接着剤で上記同
様に接続してもよい。Moreover, the connection terminal portion 2 is not provided with the bump electrode 24.
3a and the substrate electrode 22 may be connected in the same manner as described above using an anisotropic conductive adhesive.
〈発明が解決しようとする課題〉
しかしながら、上記した従来の異方性導電接着剤を用い
た実装構造によれば、消費電力が大きい半導体素子を実
装した場合に、半導体素子内で発生した熱の放熱手段は
、熱伝導性の悪い樹脂を通した回路基板への熱伝導と、
半導体素子表面よりの熱放射とによる。よって半導体素
子の放熱が十分性われないために、半導体素子の温度が
上昇し過ぎて、回路の動作不良を生じてしまう、又半導
体素子の発熱によって樹脂が熱膨張を起こし、接続不良
を発生してしまう、これらの不良は接着樹脂が熱可塑性
樹脂の場合、特に顕著に現れる。<Problems to be Solved by the Invention> However, according to the above-mentioned conventional mounting structure using an anisotropic conductive adhesive, when a semiconductor element with large power consumption is mounted, the heat generated within the semiconductor element is Heat dissipation means include heat conduction to the circuit board through resin with poor thermal conductivity,
This is due to heat radiation from the surface of the semiconductor element. As a result, heat dissipation from the semiconductor element is not sufficient, causing the temperature of the semiconductor element to rise too much, resulting in malfunction of the circuit.Also, the heat generated by the semiconductor element causes thermal expansion of the resin, resulting in poor connection. These defects appear particularly when the adhesive resin is a thermoplastic resin.
又半導体素子の高集積化にともなって消費電力が大きく
なるので、発熱量が大きい超ＬＳＩ等の半導体素子の実
装に対して大きな障害になっていた。Furthermore, as semiconductor devices become more highly integrated, their power consumption increases, which poses a major obstacle to the mounting of semiconductor devices such as ultra-LSIs that generate a large amount of heat.
〈課題を解決するための手段〉
本発明は、上記した課題を解決する為に成されたもので
、半導体素子の放熱特性に優れた異方性導電接着剤を提
供することを目的とする。<Means for Solving the Problems> The present invention was made in order to solve the above problems, and an object of the present invention is to provide an anisotropic conductive adhesive having excellent heat dissipation properties for semiconductor devices.
即ち、接着樹脂と、電気伝導性を有するとともに略均一
な粒子径を有する導電フィラーと、電気絶縁性を有する
とともに熱伝導率が前記接着樹脂より高いものであって
、前記導電フィラーの粒子径より小さい粒子径を有する
熱伝導フィラーとを混合して成るものである。That is, an adhesive resin, a conductive filler having electrical conductivity and a substantially uniform particle size, and a material having electrical insulation properties and a thermal conductivity higher than that of the adhesive resin, which has a particle size larger than that of the conductive filler. It is made by mixing a thermally conductive filler with a small particle size.
更には前記異方性導電接着剤の熱膨張率と被接着体の熱
膨張率とが略一致する量の前記熱伝導フィラーを前記異
方性導電接着剤に混合したものである。Furthermore, the anisotropic conductive adhesive is mixed with the thermally conductive filler in an amount such that the coefficient of thermal expansion of the anisotropic conductive adhesive and the coefficient of thermal expansion of the adherend substantially match.
〈作用〉
上記構成の異方性導電接着剤は、電気絶縁性を右すると
ともに、熱伝導率が接着樹脂よりも高くかつ導電フィラ
ーの粒子径より小さい粒子径を有する熱伝導フィラーを
混合したことにより、異方性導電接着剤を用いて接着し
た半導体素子より発生した熱を伝導して、半導体素子の
温度上昇を防止する。<Function> The anisotropic conductive adhesive having the above structure has a thermally conductive filler mixed therein which not only improves electrical insulation but also has a thermal conductivity higher than that of the adhesive resin and a particle size smaller than that of the conductive filler. This conducts the heat generated by the semiconductor element bonded using the anisotropic conductive adhesive, thereby preventing the temperature of the semiconductor element from rising.
又熱伝導フィラーの混合量を調節して異方性導電接着剤
の熱膨張率を被接着体の熱膨張率に略−致させたことに
より、異方性導電接着剤と被接着体との熱膨張差により
異方性導電接着剤と被接着体との剥離を防止する。In addition, by adjusting the mixing amount of the thermally conductive filler to approximately match the thermal expansion coefficient of the anisotropic conductive adhesive to the thermal expansion coefficient of the adherend, the relationship between the anisotropic conductive adhesive and the adherend is improved. The difference in thermal expansion prevents separation between the anisotropic conductive adhesive and the object to be adhered.
更に接着樹脂が被接着体どうしを接着するとともに導電
フィラーが電極どうしを電気的に接続する。Further, the adhesive resin adheres the objects to be adhered to each other, and the conductive filler electrically connects the electrodes to each other.
〈実施例〉 本発明の実施例を以下に説明する。<Example> Examples of the present invention will be described below.
異方性導電接着剤は、接着に寄与する接着樹脂、例えば
電気絶縁性を有するエポキシ樹脂やシリコン樹脂が用い
られる。前記接着樹脂は導電フィラーと熱伝導フィラー
とが混合される。As the anisotropic conductive adhesive, an adhesive resin that contributes to adhesion, such as an epoxy resin or silicone resin having electrical insulation properties, is used. The adhesive resin is a mixture of a conductive filler and a thermally conductive filler.
前記導電フィラーは、電気伝導性を有するとともに略均
一な粒子径を有する金属粒子が用いられる。この金属に
は粒−子径が３０ＪＬｍ前後のニー２ケルや半田等が用
いられる。当然のことながらこれらに限定されることは
ない。As the conductive filler, metal particles having electrical conductivity and a substantially uniform particle size are used. As this metal, a needle, solder, or the like having a particle size of about 30 JLm is used. Naturally, it is not limited to these.
前記熱伝導フィラーは、電気絶縁性を有するとともに、
前記接着樹脂よりも熱伝導性に優れていてかつ前記導電
フィラーの粒子径より小さい粒子径を有する粒子が用い
られる。この粒子には酸化アルミニウム（Ａｌ１０３）
や窒化アルミニウム（Ａ立Ｎ）等が用いられる。The thermally conductive filler has electrical insulation properties, and
Particles are used that have better thermal conductivity than the adhesive resin and have a particle size smaller than the particle size of the conductive filler. This particle contains aluminum oxide (Al103)
or aluminum nitride (A-N).
次に第１図に示す実装構造の断面図より、異方性導電接
着剤の接着構造を説明する。Next, the bonding structure of the anisotropic conductive adhesive will be explained with reference to the cross-sectional view of the mounting structure shown in FIG.
回路基板１１には電気伝導性の銅や金等の基板電極１２
を配設する。−男手導体素子１３には接続端子部１３ａ
に金や銅等の金属よりなるバンプ電極１４を配設する。The circuit board 11 has an electrically conductive board electrode 12 made of copper, gold, etc.
Place. - The male hand conductor element 13 has a connecting terminal portion 13a.
A bump electrode 14 made of metal such as gold or copper is provided on the surface.
前記回路基板（被接着体）１１と前記半導体素子（被接
着体）１３とは上記した異方性導電接着剤１５を介して
圧着される。又圧着時には、前記パンプ゛心棒１４は所
定の前記基板電極１２に対して前記異方性導電接着剤１
５中の導電フィラーｌｅａを介して電気的に接続される
。この時、導電フィラー１６は基板電極１２とバンプ電
極１４との間に挾まれて押しつぶされる。よって基板電
極１２とバンプ電極１４との′Ｉ扛気気的接続確かなも
のになる。The circuit board (object to be bonded) 11 and the semiconductor element (object to be bonded) 13 are pressure bonded via the above-described anisotropic conductive adhesive 15. Further, during crimping, the pump shaft 14 is pressed against the anisotropic conductive adhesive 1 to the predetermined substrate electrode 12.
It is electrically connected through the conductive filler lea in 5. At this time, the conductive filler 16 is sandwiched between the substrate electrode 12 and the bump electrode 14 and crushed. Therefore, the pneumatic connection between the substrate electrode 12 and the bump electrode 14 is ensured.
又、電気的接続に関与した導電フィラーｌｅａを除く他
の導電フィラー１６ｂは、接着樹脂１８中に浮遊した状
態で固定される。よって隣接する導電フィラー１８ｂ間
の導電性はない。Further, the conductive filler 16b other than the conductive filler lea involved in electrical connection is fixed in a floating state in the adhesive resin 18. Therefore, there is no conductivity between adjacent conductive fillers 18b.
一方、前記異方性導電接着剤１５中の熱伝導フィラー１
７は、前記導電フィラーＩＥｉａ、１６ｂより小さい粒
７−径を有しているので、圧着による変形を受けること
なく、接着樹脂１８中に浮遊した状態で固定される。On the other hand, the thermally conductive filler 1 in the anisotropic conductive adhesive 15
Since the particles 7 have a smaller diameter than the conductive fillers IEia and 16b, they are fixed in a floating state in the adhesive resin 18 without being deformed by pressure bonding.
更に前記接着樹脂１８は硬化される。Further, the adhesive resin 18 is cured.
上記した接着構造では、半導体素子１３で発生した熱を
、熱伝導フィラー１７と導電フィラー１６ａ。In the adhesive structure described above, heat generated in the semiconductor element 13 is transferred to the thermally conductive filler 17 and the conductive filler 16a.
１６ｂとの双方により回路基板ｌｌに対して熱伝導によ
り放熱する。16b and radiates heat to the circuit board 11 by thermal conduction.
上記説明では、バンプ電極１４を設けて基板電極１２と
電気的に接続したが、前記接ａ１ｆｉ子部１３ａと基板
電極１２とを異方性導電接着剤１５で上記同様に接続し
てもよい。In the above description, the bump electrode 14 is provided and electrically connected to the substrate electrode 12, but the contact portion 13a and the substrate electrode 12 may be connected using the anisotropic conductive adhesive 15 in the same manner as described above.
又前記接着樹脂１８による接着力を維持するとともに、
前記導電フィラーＩＥｉａによる電気的接続性能を確保
する範囲内で、前記熱伝導フィラー１７の混合率は変え
られる。In addition, while maintaining the adhesive force due to the adhesive resin 18,
The mixing ratio of the thermally conductive filler 17 can be varied within a range that ensures electrical connection performance by the conductive filler IEia.
よって、前記熱伝導フィラー１７の混合率を変えること
によって、半導体素子１３の熱伝導率や回路基板１１の
熱伝導率に近い熱伝導率を有する異方性導電接着剤１５
を得る。Therefore, by changing the mixing ratio of the thermally conductive filler 17, an anisotropic conductive adhesive 15 having a thermal conductivity close to that of the semiconductor element 13 or the circuit board 11 can be obtained.
get.
例えば、酸化アルミニウム製の回路基板１１とシリコン
基板を用いた半導体素子１１とを、接着樹脂１８にエポ
キシ樹脂を用いた異方性導電接着剤１５で接着する場合
には、１０Ｂｍ乃至２０井■の粒子径を有する酸化アル
ミニウム粒子より成る熱伝導フィラー１７を２０％（体
積比）Ｒ合する。当然のことながら、上記数値的等の条
件はそれに限定されないこと明らかである。For example, when bonding a circuit board 11 made of aluminum oxide and a semiconductor element 11 made of a silicon substrate with an anisotropic conductive adhesive 15 using an epoxy resin as the adhesive resin 18, 20% (volume ratio) of thermally conductive filler 17 made of aluminum oxide particles having a particle size is combined. Naturally, it is clear that the above numerical conditions are not limited thereto.
従って、半導体素子−１３で温度上昇が生じても、導’
１１ｉ、フィラーｌｅａを介して接続した基板電極１２
やパップ電極１４に生じる応力が大幅に低減される。Therefore, even if the temperature rises in the semiconductor element-13, the conduction
11i, substrate electrode 12 connected via filler lea
The stress generated in the pad electrode 14 is significantly reduced.
〈発明の効果〉
以Ｌ、説明したように本発明によれば、異方性導電接着
剤に熱伝導フィラーを混入したので、異方性導電接着剤
の熱伝導率を高めることができる。よって発熱ψが大き
い半導体素子を接着によって回路基板に接続することが
できるとともに、完熟による半導体素子の動作不良を防
止できる。<Effects of the Invention> As explained below, according to the present invention, since the thermally conductive filler is mixed into the anisotropic conductive adhesive, the thermal conductivity of the anisotropic conductive adhesive can be increased. Therefore, a semiconductor element that generates a large amount of heat ψ can be connected to a circuit board by adhesion, and malfunction of the semiconductor element due to overripe can be prevented.
又熱伝導フィラーの混合率をかえて異方性導電接着剤の
熱伝導率を半導体素子等の被接着体の熱伝導率に近づけ
たので、被接着体の温度が上昇して熱膨張を起こした場
合の電極接続部の応力を小さくできる。In addition, by changing the mixing ratio of the thermally conductive filler, the thermal conductivity of the anisotropic conductive adhesive was brought close to that of the adhered object such as a semiconductor element, which caused the temperature of the adhered object to rise and cause thermal expansion. It is possible to reduce the stress at the electrode connection part when the electrode is connected.
よって電気的接続不良が防止できる。Therefore, electrical connection failures can be prevented.
第１図は、実施例の実装構造の断面図、第２図は、従来
の実装構造の断面図である。
１５・・・異方性導電接着剤。
ＩＥｉ、ｌｅａ、ＩＥｉｂ・・・導電フィラー１７・・
・熱伝導フィラー、１８・・・接着樹脂。FIG. 1 is a sectional view of a mounting structure of an embodiment, and FIG. 2 is a sectional view of a conventional mounting structure. 15...Anisotropic conductive adhesive. IEi, lea, IEib...conductive filler 17...
- Thermal conductive filler, 18...Adhesive resin.
Claims (2)
電フィラーと、 電気絶縁性を有するとともに熱伝導率が前記接着樹脂よ
り高いものであって、前記導電フィラーの粒子径より小
さい粒子径を有する熱伝導フィラーとを混合して成るこ
とを特徴とする異方性導電接着剤。(1) an adhesive resin; a conductive filler that has electrical conductivity and a substantially uniform particle shape; and a conductive filler that has electrical insulation and a higher thermal conductivity than the adhesive resin, and a particle size of the conductive filler. An anisotropic conductive adhesive characterized by being mixed with a thermally conductive filler having a smaller particle size.
膨張率とが略一致する量の前記熱伝導フィラーを前記異
方性導電接着剤に混合したことを特徴とする請求項１記
載の異方性導電接着剤。(2) A claim characterized in that the thermally conductive filler is mixed into the anisotropic conductive adhesive in an amount such that the coefficient of thermal expansion of the anisotropic conductive adhesive and the coefficient of thermal expansion of the adhered object substantially match each other. Item 1. Anisotropic conductive adhesive according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2029190A JPH03223380A (en) | 1990-01-30 | 1990-01-30 | Anisotropic conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2029190A JPH03223380A (en) | 1990-01-30 | 1990-01-30 | Anisotropic conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03223380A true JPH03223380A (en) | 1991-10-02 |
Family
ID=12023064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2029190A Pending JPH03223380A (en) | 1990-01-30 | 1990-01-30 | Anisotropic conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03223380A (en) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5410806A (en) * | 1993-09-15 | 1995-05-02 | Lsi Logic Corporation | Method for fabricating conductive epoxy grid array semiconductors packages |
| US5686703A (en) * | 1994-12-16 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Anisotropic, electrically conductive adhesive film |
| WO2000048206A1 (en) * | 1999-02-09 | 2000-08-17 | Do-Coop Technologies Ltd. | Materials and composites activable into a state of enhanced conductivity |
| KR100305750B1 (en) * | 1999-03-10 | 2001-09-24 | 윤덕용 | Manufacturing Method for Anisotropic Conductive Adhesive for Flip Chip Interconnection on an Organic Substrate |
| WO2003000816A1 (en) * | 2001-06-25 | 2003-01-03 | Telephus, Inc. | Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same |
| WO2004055126A1 (en) * | 2002-12-13 | 2004-07-01 | Ls Cable Ltd. | Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
| US6884833B2 (en) | 2001-06-29 | 2005-04-26 | 3M Innovative Properties Company | Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| KR100710957B1 (en) * | 2006-01-03 | 2007-04-24 | 엘에스전선 주식회사 | Anisotropic-electroconductive adhesive, circuit connection using the same, and circuit connection structure |
| JP2007107008A (en) * | 2006-11-13 | 2007-04-26 | Hitachi Chem Co Ltd | Film-shaped adhesive and method for producing laminate |
| JP2007113012A (en) * | 2006-11-13 | 2007-05-10 | Hitachi Chem Co Ltd | Adhesive for connecting circuit part |
| JP2007335889A (en) * | 2007-08-06 | 2007-12-27 | Hitachi Chem Co Ltd | Adhesive for circuit member connection |
| JP2008123851A (en) * | 2006-11-13 | 2008-05-29 | Kitagawa Ind Co Ltd | Contact |
| WO2009133901A1 (en) * | 2008-04-28 | 2009-11-05 | 日立化成工業株式会社 | Circuit connecting material, film-like adhesive, adhesive reel, and circuit connecting structural body |
| JP2009289729A (en) * | 2008-04-28 | 2009-12-10 | Hitachi Chem Co Ltd | Anisotropic conductive film |
| JP2010157753A (en) * | 1997-02-14 | 2010-07-15 | Hitachi Chem Co Ltd | Adhesive for connecting circuit member |
| US7879445B2 (en) | 1998-08-13 | 2011-02-01 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
| JP2012178400A (en) * | 2011-02-25 | 2012-09-13 | Toyoda Gosei Co Ltd | Led lamp |
| CN102883519A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof |
| JP2016029740A (en) * | 2010-11-08 | 2016-03-03 | 株式会社東芝 | Led-based light source using asymmetrical conductor |
-
1990
- 1990-01-30 JP JP2029190A patent/JPH03223380A/en active Pending
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5410806A (en) * | 1993-09-15 | 1995-05-02 | Lsi Logic Corporation | Method for fabricating conductive epoxy grid array semiconductors packages |
| US5686703A (en) * | 1994-12-16 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Anisotropic, electrically conductive adhesive film |
| JP2010157753A (en) * | 1997-02-14 | 2010-07-15 | Hitachi Chem Co Ltd | Adhesive for connecting circuit member |
| US8273458B2 (en) | 1997-02-14 | 2012-09-25 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
| US8273457B2 (en) | 1998-08-13 | 2012-09-25 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
| US8252419B2 (en) | 1998-08-13 | 2012-08-28 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
| US7879445B2 (en) | 1998-08-13 | 2011-02-01 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
| WO2000048206A1 (en) * | 1999-02-09 | 2000-08-17 | Do-Coop Technologies Ltd. | Materials and composites activable into a state of enhanced conductivity |
| KR100305750B1 (en) * | 1999-03-10 | 2001-09-24 | 윤덕용 | Manufacturing Method for Anisotropic Conductive Adhesive for Flip Chip Interconnection on an Organic Substrate |
| WO2003000816A1 (en) * | 2001-06-25 | 2003-01-03 | Telephus, Inc. | Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same |
| US6884833B2 (en) | 2001-06-29 | 2005-04-26 | 3M Innovative Properties Company | Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| WO2004055126A1 (en) * | 2002-12-13 | 2004-07-01 | Ls Cable Ltd. | Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
| KR100710957B1 (en) * | 2006-01-03 | 2007-04-24 | 엘에스전선 주식회사 | Anisotropic-electroconductive adhesive, circuit connection using the same, and circuit connection structure |
| JP4679492B2 (en) * | 2006-11-13 | 2011-04-27 | 北川工業株式会社 | contact |
| JP2007113012A (en) * | 2006-11-13 | 2007-05-10 | Hitachi Chem Co Ltd | Adhesive for connecting circuit part |
| JP2008123851A (en) * | 2006-11-13 | 2008-05-29 | Kitagawa Ind Co Ltd | Contact |
| JP2007107008A (en) * | 2006-11-13 | 2007-04-26 | Hitachi Chem Co Ltd | Film-shaped adhesive and method for producing laminate |
| JP2007335889A (en) * | 2007-08-06 | 2007-12-27 | Hitachi Chem Co Ltd | Adhesive for circuit member connection |
| JP2010183049A (en) * | 2008-04-28 | 2010-08-19 | Hitachi Chem Co Ltd | Circuit connecting material, film-like adhesive, adhesive reel, and circuit connection structure |
| JP2009289729A (en) * | 2008-04-28 | 2009-12-10 | Hitachi Chem Co Ltd | Anisotropic conductive film |
| WO2009133901A1 (en) * | 2008-04-28 | 2009-11-05 | 日立化成工業株式会社 | Circuit connecting material, film-like adhesive, adhesive reel, and circuit connecting structural body |
| JP2016029740A (en) * | 2010-11-08 | 2016-03-03 | 株式会社東芝 | Led-based light source using asymmetrical conductor |
| JP2012178400A (en) * | 2011-02-25 | 2012-09-13 | Toyoda Gosei Co Ltd | Led lamp |
| CN102883519A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof |
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