TW200420707A - Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive - Google Patents

Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive

Info

Publication number
TW200420707A
TW200420707A TW093117294A TW93117294A TW200420707A TW 200420707 A TW200420707 A TW 200420707A TW 093117294 A TW093117294 A TW 093117294A TW 93117294 A TW93117294 A TW 93117294A TW 200420707 A TW200420707 A TW 200420707A
Authority
TW
Taiwan
Prior art keywords
adhesive
circuit
compound
construction
anisotropic conductivity
Prior art date
Application number
TW093117294A
Other languages
Chinese (zh)
Other versions
TWI332027B (en
Inventor
Satoyuki Nomura
Hiroshi Ono
Hoko Suto
Masami Yusa
Tohru Fujinawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000399827A external-priority patent/JP2002201440A/en
Priority claimed from JP2001261673A external-priority patent/JP4736280B2/en
Priority claimed from JP2001261675A external-priority patent/JP2003064332A/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200420707A publication Critical patent/TW200420707A/en
Application granted granted Critical
Publication of TWI332027B publication Critical patent/TWI332027B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

The present invention relates to an adhesive for connecting an anisotropic electroconductive circuits. The adhesive is interposed between two neighboring boards having opposite circuit electrodes so as to electrically connect the corresponding electrodes along the pressing direction in pressing process. Said adhesive comprises an electrode conductive particle which has been subject to a surface treatment with at least a compound selected from the group consisting of a radical polymerization compound and a basic compound or a compound having at least an epoxy group. Also disclosed are a method for connecting the circuit boards using said adhesive and a circuit connection structure.
TW093117294A 2000-12-28 2001-12-27 Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive TWI332027B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000399827A JP2002201440A (en) 2000-12-28 2000-12-28 Anisotropic conductive resin-film-forming composition, connection method of circuit boards using the same, and connection structure
JP2001261673A JP4736280B2 (en) 2001-08-30 2001-08-30 Adhesive for circuit connection and circuit connection structure using the same
JP2001261675A JP2003064332A (en) 2001-08-30 2001-08-30 Circuit-connecting adhesive and circuit-connected structural material by using the same

Publications (2)

Publication Number Publication Date
TW200420707A true TW200420707A (en) 2004-10-16
TWI332027B TWI332027B (en) 2010-10-21

Family

ID=27345597

Family Applications (3)

Application Number Title Priority Date Filing Date
TW099104101A TWI334880B (en) 2000-12-28 2001-12-27 Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive
TW093117294A TWI332027B (en) 2000-12-28 2001-12-27 Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive
TW090132486A TWI230191B (en) 2000-12-28 2001-12-27 Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW099104101A TWI334880B (en) 2000-12-28 2001-12-27 Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW090132486A TWI230191B (en) 2000-12-28 2001-12-27 Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive

Country Status (3)

Country Link
KR (1) KR100484383B1 (en)
CN (2) CN1290956C (en)
TW (3) TWI334880B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386121B (en) * 2005-08-22 2013-02-11 Hitachi Chem Dupont Microsys Circuit connection structure and method of manufacturing the same and semiconductor substrate for circuit connection structure
US8395052B2 (en) 2008-07-24 2013-03-12 Dexerials Corporation Conductive particle, anisotropic conductive film, joined structure, and joining method
TWI480297B (en) * 2007-12-07 2015-04-11 Mitsubishi Gas Chemical Co Tricyclodecane-containing naphthol compound and method for preparing the same and ester compound and method for preparing the same

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005194393A (en) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd Adhesive film for circuit connection, and circuit connection structure
JP2005320455A (en) * 2004-05-10 2005-11-17 Hitachi Chem Co Ltd Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device
KR101013260B1 (en) 2004-06-09 2011-02-09 히다치 가세고교 가부시끼가이샤 Circuit connecting material and connecting structure for circuit member
KR100622598B1 (en) * 2004-12-08 2006-09-19 엘에스전선 주식회사 Anisotropic conductive adhesive having ptc characteristic
KR100765363B1 (en) * 2005-10-31 2007-10-09 전자부품연구원 Method for fabricating conductive particle
KR100788531B1 (en) 2006-12-08 2007-12-24 엘에스전선 주식회사 Anisotropic conductive adhesive and anisotropic conductive film using the same
KR100773642B1 (en) 2006-12-13 2007-11-05 엘에스전선 주식회사 Anisotropic conductive adhesive
KR100813355B1 (en) 2006-12-13 2008-03-12 엘에스전선 주식회사 Anisotropic conductive adhesive
WO2010004793A1 (en) 2008-07-11 2010-01-14 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive film
JP5561174B2 (en) 2009-02-16 2014-07-30 株式会社村田製作所 Conductive resin composition, method of manufacturing electronic component using the same, bonding method, bonding structure, and electronic component
DE102011077927A1 (en) * 2011-06-21 2012-12-27 Tesa Se Process for the reversible covalent crosslinking of adhesives
JP6007022B2 (en) * 2012-08-06 2016-10-12 デクセリアルズ株式会社 Circuit connection material
JP6151597B2 (en) * 2013-07-29 2017-06-21 デクセリアルズ株式会社 Manufacturing method of conductive adhesive film, conductive adhesive film, and manufacturing method of connector
JP6505423B2 (en) * 2013-12-16 2019-04-24 デクセリアルズ株式会社 Method of manufacturing mounting body, and anisotropic conductive film

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044905A (en) * 1998-03-18 2000-02-15 Sumitomo Bakelite Co Ltd Anisotropic, electrically conductive adhesive and electronic equipment using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386121B (en) * 2005-08-22 2013-02-11 Hitachi Chem Dupont Microsys Circuit connection structure and method of manufacturing the same and semiconductor substrate for circuit connection structure
TWI480297B (en) * 2007-12-07 2015-04-11 Mitsubishi Gas Chemical Co Tricyclodecane-containing naphthol compound and method for preparing the same and ester compound and method for preparing the same
US8395052B2 (en) 2008-07-24 2013-03-12 Dexerials Corporation Conductive particle, anisotropic conductive film, joined structure, and joining method
TWI502608B (en) * 2008-07-24 2015-10-01 Conducting particle, anisotropic conductive film, and connected structure, and method of connecting

Also Published As

Publication number Publication date
CN1290956C (en) 2006-12-20
KR100484383B1 (en) 2005-04-20
TWI332027B (en) 2010-10-21
KR20020055403A (en) 2002-07-08
TWI230191B (en) 2005-04-01
CN1362459A (en) 2002-08-07
TWI334880B (en) 2010-12-21
CN1195035C (en) 2005-03-30
TW201030121A (en) 2010-08-16
CN1566246A (en) 2005-01-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees