CN1284526A - 用于电子封装的薄膜粘合剂组合物 - Google Patents

用于电子封装的薄膜粘合剂组合物 Download PDF

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CN1284526A
CN1284526A CN00126285A CN00126285A CN1284526A CN 1284526 A CN1284526 A CN 1284526A CN 00126285 A CN00126285 A CN 00126285A CN 00126285 A CN00126285 A CN 00126285A CN 1284526 A CN1284526 A CN 1284526A
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film
carrier
pen
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X·何
B·吴
C·J·多米尼克
D·申非尔德
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National Starch and Chemical Investment Holding Corp
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Abstract

一种薄膜粘合剂使用疏水的聚合物载体来代替常规的聚酰亚胺载体,用以实现高防潮性,同时保持其它的粘着特性。用于电子封装。

Description

用于电子封装的薄膜粘合剂组合物
本发明涉及用于电子封装的粘着膜和使用该膜制备的电子器件。该薄膜粘合剂使用疏水的聚合物载体来代替常规的聚酰亚胺载体，用以实现高防潮性，同时保持其它的粘着特性。
半导体器件形成于被切割成单芯片的硅晶片上。芯片被安装在基片上，基片作为机械支撑和用于芯片与外部电路互连。将芯片附着于基片的一项技术是需要使用由载体，常规的是聚酰亚胺薄膜、涂敷在两侧的热塑或热固的粘合剂组成的薄膜粘合剂。对于内存储器器件的封装是特别常用的。它涉及一个预装带过程，该过程由将薄膜粘合剂冲压成预定的形状和将该粘合剂附着于基片上组成。预装带的基片将被运送到半导体封装生产商手中，在那里会将半导体芯片附着基片、内引线键合，并密封该包装。
半导体封工业的趋势是采用用于内存储器件的预装带。在预装带过程之后，由粘合带组成的基片在运输和贮藏期间会与水分接触。最常用的聚酰亚胺载体会吸收水分。在接下来的用于将芯片附着在基片上的生产操作中会蒸发水分，结果，在结合面上产生孔隙，并对最终的电子器件造成潜在的隐患。目前，在芯片附着之前，通常使用预烘烤方法来减少水分蒸发产生的孔隙。这样的预烘烤方法显著地降低了生产率。
对这些生产操作提供一种低水分吸收的粘着膜是有好处的，它可以省略预烘烤方法，同时保持基它所需的物理性质，这些性质包括足够的附着强度、柔性、耐高温性和将半导体附着于基片上所需的形稳性。
已经发现当粘着膜包括聚酯载体层，且特别是聚乙烯萘亚甲基酯时，粘着膜比包括聚酰亚胺载体的膜具有较低的吸水性，因此，省略了预烘烤方法，同时保持了商业可接受的模具剪切强度、模量和形稳性。
用于粘着膜的载体可以是任何柔性的具有超过700000psi杨氏模量、熔点高于260℃，且玻璃化温度大于100℃的聚酯膜。在一个具体的实施方案中，载体是杜邦的商标为KALADEX2030的聚乙烯萘亚甲基酯膜。
该粘着膜可以通过本领域任何公知的方法制备。一般，这样的膜通过用热塑聚合物或可聚合的热固单体组合物的溶液涂敷到载体上而制备，所述的组合物可以被热固化。
适合于涂敷在载体膜上的热塑聚合物的代表是聚酰亚胺、聚酰胺、聚酯、聚碳酸酯、聚砜、聚缩醛、聚卤乙烯、聚烯烃、卤化聚烯烃、丙烯酸聚合物、乙烯基聚合物、聚(硫化亚苯基)、聚(醚砜)，双马来酰亚胺和乙烯基化合物的共聚物和热塑环氧树脂。
适合于涂敷在载体膜上的热固聚合物的代表是环氧树脂、橡胶改性环氧树脂、酚氧树脂和马来酰亚胺树脂。
该粘合剂组合物也可以含无机填料和颜料。填料的代表包括硅石、二氧化钛、矾土和金属填料。该填料可以提供高温强度、热导性和所需的表面胶粘性。
下述实施例将对本发明进行更全面的描述，但不能视为对本发明的限制。
实施例1
用如表1所示的同样配方制备两个薄膜粘合带，一个使用本发明的聚乙烯萘亚甲基酯(PEN)载体，而另一个使用聚酰亚胺(PI)载体。专用的橡胶环氧加合物和专用的尿素催化剂由National Starch and Chemical Company制造。HM091是Dainippon制造的固体双A环氧树脂。PEN膜具有50微米(1微米=1×106米)的厚度，购买的是杜邦的商标为KALADEX2030，而PI膜具有50微米的厚度，购买的是Ube的商标为UPILEX SGA。这两个载体的物理性质如表2所示。
        表1：制造带1-PI和1-PEN的配方
          配方    在100％固体中的％wt．
    专用的橡胶环氧加合物硅石填料双氰胺专用的尿素催化剂HM091          83.634.881.180.599.72
        表2：PI和PEN载体的物理性质
PI(Upilex SGA)  PEN(Kaladex2030)
   拉伸强度(Mpa)      390         200
   杨氏模量(Mpa)     8，820        5，000
     熔点(℃)      无         262
  玻璃化温度(℃)     ＞500         120
水分吸收(85℃/85％RH)     1.2％        0.28％
粘合带1-PI和1-PEN是通过将粘合剂分别以溶液形式涂敷到PI和PEN载体而制备的。粘合剂总厚度是25微米，或者载体的每一侧上是12.5微米。模具剪切强度在室温下使用Daye 2400PC模具剪切测试器进行测试。80mil×80mil的模具使用一个粘合剂涂敷带粘附到陶瓷基片上。在固化之后测试模具剪切强度，将固化的测试样品暴露于85℃和85％相对湿度的BLUEM潮湿室中90小时之后再次测试。在室温下使用United E.V.60搭接剪切测试器进行搭接剪切强度的测试。杨氏模量使用动态机械热分析仪MRⅢ测试。热膨胀系数使用Perkin-Elmer TMA7热机械分析仪测试。水分吸收使用WTC Binder DVS-2000水分测试器在85℃/85％RH下进行测量。用于样品制备的标准的固化条件是165℃/60分钟。起泡测试通过将干燥的1.9mm宽带附着于载玻片上进行，预调节在25℃/50％RH下两天，模具在170℃下附着。用光学显微镜进行目测用来探测水分引起的气泡。结果示于表3。
        表3：PI和PEN粘合带的性能
             性能     1-PI     1-PEN
     搭接剪功强度(psi)     1900     1400
 固化后的模具剪切强度(psi)     4100     4400
 85/85之后的模具剪切强度(psi)     1050     1050
  在25℃的杨氏模量(psi)    336，000    336，000
   热膨胀系数(CTE)(ppm)低于Tg/高于Tg    101/295    166/320
   水分吸收(85℃/85％RH)     ＞2％     1．2％
   起泡测试(25℃/50％RH)     失败     通过
实施例2
用如表4所示的同样配方制备两个薄膜粘合带，一个使用本发明的聚乙烯萘亚甲基酯(PEN)载体，而另一个使用聚酰亚胺(PI)载体。专用的橡胶环氧加合物(2)和专用的尿素催化剂由National Starch and Chrmical Company制造。
        表4：制造带2-PI和2-PEN的配方
         配方     在100％固体中的％wt．
专用的橡胶环氧加合物(2)硅石填料双氰胺专用的尿素催化剂           95.42.71.30.6
粘合带2-PI和2-PEN是通过将粘合剂分别以溶液形式涂敷到PI和PEN载体上而制备的。粘合剂的总厚度是100微米，或者载体的每一侧上是50微米。两个带的物理性质示于表5。
        表5：PI和PEN粘合带的性能
         性能     2-PI     2-PEN
   搭接剪切强度(psi)     1400     1300
固化后的模具剪切强度(psi)     1900     1700
  在25℃的杨氏模量(psi)    53，000    53，000
 CIE(ppm)低于Tg/高于Tg    75/442    49/476
  水分吸收(85℃/85％RH)     1.4％     1.2％
  起泡测试(25℃/50％RH)     失败     通过

Claims (2)

1．一种薄膜粘合剂，所述薄膜粘合剂包括热固、热塑或β-阶段聚合物和柔性的聚酯膜载体，其杨氏模量超过700000psi，熔点高于260℃，且玻璃化温度大于100℃。
2．根据权利要求1的薄膜粘合剂，其中的柔性聚酯膜是聚乙烯萘亚甲基酯。
CN00126285A 1999-08-16 2000-08-15 用于电子封装的薄膜粘合剂组合物 Pending CN1284526A (zh)

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