CN1281883A - Multi-component copolymer acrylate adhesive, its preparation method and application for covering aluminium plate with polyimide - Google Patents
Multi-component copolymer acrylate adhesive, its preparation method and application for covering aluminium plate with polyimide Download PDFInfo
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- CN1281883A CN1281883A CN 00114627 CN00114627A CN1281883A CN 1281883 A CN1281883 A CN 1281883A CN 00114627 CN00114627 CN 00114627 CN 00114627 A CN00114627 A CN 00114627A CN 1281883 A CN1281883 A CN 1281883A
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- Prior art keywords
- tackiness agent
- organic solvent
- cross
- peroxide
- polyimide
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- Granted
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 27
- 239000004642 Polyimide Substances 0.000 title claims abstract description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 24
- 239000000853 adhesive Substances 0.000 title claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 title claims abstract description 10
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 229920001577 copolymer Polymers 0.000 title claims description 7
- 239000004411 aluminium Substances 0.000 title abstract 2
- 238000006243 chemical reaction Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000000178 monomer Substances 0.000 claims abstract description 16
- 238000004132 cross linking Methods 0.000 claims abstract description 12
- 239000003960 organic solvent Substances 0.000 claims abstract description 12
- 239000005030 aluminium foil Substances 0.000 claims abstract description 11
- 239000003999 initiator Substances 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 35
- 239000000203 mixture Substances 0.000 claims description 17
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 15
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 11
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000010992 reflux Methods 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- -1 Hydroxy ester Chemical class 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 229940043232 butyl acetate Drugs 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 4
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 4
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 claims description 3
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 claims description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 3
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 claims description 3
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 3
- LRDFRRGEGBBSRN-UHFFFAOYSA-N isobutyronitrile Chemical compound CC(C)C#N LRDFRRGEGBBSRN-UHFFFAOYSA-N 0.000 claims description 3
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 claims description 3
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 claims description 3
- 150000002978 peroxides Chemical class 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 2
- BONVROUPOZRCDU-UHFFFAOYSA-N 2-hydroxyprop-2-enamide Chemical compound NC(=O)C(O)=C BONVROUPOZRCDU-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 125000005907 alkyl ester group Chemical group 0.000 claims description 2
- 229960001701 chloroform Drugs 0.000 claims description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 238000007788 roughening Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 230000035484 reaction time Effects 0.000 claims 2
- 238000012512 characterization method Methods 0.000 claims 1
- 238000007865 diluting Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000007334 copolymerization reaction Methods 0.000 abstract 2
- 239000002131 composite material Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000012046 mixed solvent Substances 0.000 description 5
- 238000005868 electrolysis reaction Methods 0.000 description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical class C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- 239000012295 chemical reaction liquid Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical class CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- VVWRJUBEIPHGQF-UHFFFAOYSA-N propan-2-yl n-propan-2-yloxycarbonyliminocarbamate Chemical compound CC(C)OC(=O)N=NC(=O)OC(C)C VVWRJUBEIPHGQF-UHFFFAOYSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The present invention relates to a multicomponent copolyacrylate adhesive, its preparation and application on aluminium plate covered with polyimide. Said adhesive contains the components of multicomponent acrylate copolymerization monomer, cross-linking modifying monomer, organic solvent and reaction initiator, in its formula two or more than two kinds of cross-linking monomers are used to participate in copolymerization. The above-mentioned materials are proportioned, placed in reactor, mixed, heated, stirred to make reaction and polymerized to obtain said invented adhesive which can be used for sticking polyimide film and aluminium foil to make flexible printed circuit board base material with high peeling strength, good resistance to soldering and good comprehensive performance, etc..
Description
The present invention relates to a kind of multi-component copolymer acrylate adhesive and preparation and its application on flexible print circuit base material polyimide covering aluminum plate.
When making flexible print circuit (FPC) base material, modal method is bonding with Kapton and Copper Foil, as described various polyimide copper clad lamination tackiness agent of ZL95109152 and manufacture method thereof.Along with the fast development of FPC industry, brought into use the wiring board of polyimide covering aluminum plate processing in some field, its consumption also increases year by year.Compare with polyimide copper clad lamination, the flexibility of polyimide covering aluminum plate is better, material cost is lower.
At present, the development and production of polyimide covering aluminum plate just begin, and its used Study on making adhesives work is not also had special report.Once the fire resistant polyimide copper-clad plate tackiness agent of mentioning in ZL95109152 with the preparation of bimaleimide resin modified butadiene acrylonitrile rubber can be used for the polyimide covering aluminum plate simultaneously.But this tackiness agent is after passing through pyroprocessing, and the base material color is understood blackening, has had a strong impact on the outward appearance of wiring board.
Purpose one of the present invention is the shortcoming that overcomes above-mentioned modification butadiene-acrylonitrile rubber, provide a kind of to Kapton and aluminium foil have preferably bonding force, anti-tin-welding good, do not influence the base material color and storage period long tackiness agent; Another object of the present invention provides a kind of method and the application of this tackiness agent on the polyimide covering aluminum plate for preparing this tackiness agent.
Realize that the technical scheme of the object of the invention one provides a kind of multi-component copolymer acrylate adhesive of good combination property, this tackiness agent contains multicomponent methacrylate comonomer, cross-linking modified monomer, organic solvent, reaction initiator, and its composition weight ratio is:
Multicomponent methacrylate comonomer 100
Cross-linking modified monomer 0.5～20
Organic solvent 50～500
Reaction initiator 0.05～5
Better composition weight ratio is:
Multicomponent methacrylate comonomer 100
Cross-linking modified monomer 3～10
Organic solvent 150～300
Reaction initiator 0.3～1.2
The acrylate co-monomers of using in this tackiness agent is methacrylic acid C
1～C
8Alkyl ester, vinylformic acid C
1～C
8The mixture of one or more in alkyl ester, vinylbenzene, vinyl cyanide, the vinyl acetate;
The cross-linking modified monomer that uses in this tackiness agent is methacrylic acid, vinylformic acid, methacrylic acid β-C
2～C
8Hydroxy ester, propenoic acid beta-C
2～C
8In hydroxy ester, glycidyl methacrylate, glycidyl acrylate, Methacrylamide, acrylamide, n-methylolacrylamide, the hydroxyacrylamide two or more contains the mixture of different crosslinked groups;
The organic solvent that uses in this tackiness agent is one or more mixture of toluene, dimethylbenzene, ethyl acetate, butylacetate, ethylene dichloride, trichloroethane, trichloromethane, acetone, methylethylketone, pimelinketone;
The reaction initiator that uses in this tackiness agent is 2-(tertiary butyl azo) isopropyl cyanide of azo-compound class, 2,2 '-2,2'-Azobis(2,4-dimethylvaleronitrile), 2, the mixture of one or more of the dilauroyl peroxide of 2 '-Diisopropyl azodicarboxylate and organo-peroxide class, dibenzoyl peroxide, peroxide acetic acid butyl ester, dicumyl peroxide, ditertiary butyl peroxide.
The synthetic method and the synthesis step of this multi-component copolymer acrylate adhesive are:
1. selected multicomponent methacrylate comonomer, cross-linking modified monomer, reaction initiator, organic solvent are added in the reactor that has heating unit, whipping appts, reflux and thermometer in proportion and mix;
2. stir and heat up, feed nitrogen during the reaction beginning to shorten the reaction initiation time, control reaction temperature was reacted 3～24 hours between 50 ℃～150 ℃, and preferably control reaction temperature was reacted 8～15 hours between 70 ℃～110 ℃.
3. cooling discharging is 15～35% promptly to get described multi-component copolymer acrylate adhesive with solvent cut to solid content.
The tackiness agent of gained is at the flexible print circuit base material--and the application method in the polyimide covering aluminum plate is:
Above-mentioned glue is evenly coated in the one side of Kapton, the thick 0.010～0.030mm of glue; The aluminium foil single face carries out after the roughening treatment compound with the gluing Kapton, in the composite pressure machine in 130 ℃～210 ℃, 10～60Kg/cm
2Under the pressure, pressurize 20～200 minutes promptly gets described polyimide covering aluminum plate.
Better combined temp is 160 ℃～180 ℃, and composite pressure is 25～45Kg/cm
2, the heat-insulation pressure keeping time is 40～120 minutes.
Prepared polyimide covering aluminum plate is made circuitous pattern according to the testing standard of GB/T13557-92 and IPC-TM-650 and is recorded stripping strength 〉=1.60Kg/cm, soldering resistance is not stratified after 260 ℃, 60 seconds, non-foaming in tin bath, folding resistance does not rupture more than 200 times, surface resistivity 1.0 * 10
5M Ω, volume resistance 1.0 * 10
6M Ω .m.
Used Kapton is aromatic series pyromellitic acid dianhydride and 4, the H type film that 4 '-diaminodiphenyl oxide forms through polycondensation, film forming, stretching, cyclisation in polar solvent, BPDA and 4, the S type film that 4 '-diaminodiphenyl oxide is made or compound dianhydride and 4, the X type film of 4 '-diaminodiphenyl oxide;
Aluminium foil is calendering or electrolysis aluminium foil;
Above-mentioned material all is commercially available products.
Advantage of the present invention is;
1. tackiness agent is a liquid single-component packing, storage period long, 12 months unchangeability;
2. lack the solidification value of tackiness agent low (150 ℃～190 ℃), set time (40～120 minutes), and
Do not need post curing treatment;
3. use the crosslinked group more than two kinds and two kinds in the tackiness agent, do not needed secondary composite during use,
Can be used for bonding mutually between the multiple material;
4. the bonding compound polyimide covering aluminum plate that provides of Kapton and aluminium foil and aforementioned is provided
Polyimide copper clad lamination to compare folding resistance better, flexibility is bigger, material cost is low.
Embodiments of the invention:
Embodiment 1.
Get methacrylic acid 5 grams, glycidyl methacrylate 5 grams, butyl acrylate 80 grams, methyl methacrylate 22 grams, vinyl cyanide 13 grams, 2-(tertiary butyl azo) isopropyl cyanide 0.8 gram, toluene: ethyl acetate=mixed solvent 250 of 1: 2 restrains the mixing liquid of composition, heating reflux reaction is 8 hours in 500 milliliters of three-necked bottles that have agitator, condenser, thermometer, promptly gets tackiness agent of the present invention.
This tackiness agent is evenly coated on the thick Kapton of 0.050mm, the thick 0.015mm of glue, superimposed with the alligatoring electrolysis aluminium foil that 0.035mm is thick, in the composite pressure machine in 170 ℃, 40kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide covering aluminum plate after 60 minutes.Make circuitous pattern by the testing standard of GB/T13557-92 and IPC-TM-650 and record stripping strength, soldering resistance, folding resistance and electrical property etc., the results are shown in Table 1.
Embodiment 2.
Get vinylformic acid 200 grams, propenoic acid beta-hydroxy ethyl ester 100 grams, butyl methacrylate 4000 grams, vinylbenzene 200 grams, methyl methacrylate 650 grams, benzoyl peroxide 60 grams, dimethylbenzene: acetone: mixed solvent 15000 grams of butylacetate=2: 1: 1, heating reflux reaction is 12 hours in the 50 liter reactors that have agitator, condenser, thermometer, and the cold filtration discharging promptly gets tackiness agent of the present invention.
This tackiness agent is evenly coated on the thick Kapton of 0.025mm, the thick 0.020mm of glue, superimposed with the alligatoring electrolysis aluminium foil that 0.035mm is thick, in the composite pressure machine in 165 ℃, 45kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide covering aluminum plate after 90 minutes.Press embodiment 1 preparation standard specimen, test result sees Table 1.
Embodiment 3.
Get 1 kilogram of Methacrylamide, 1 kilogram of propenoic acid beta-hydroxy propyl ester, 15 kilograms of ethyl acrylates, 1 kilogram of vinyl acetate, 2.5 kilograms of vinyl cyanide, 0.080 kilogram of dilauroyl peroxide, the mixing liquid of 40 kilograms of compositions of toluene, heating reflux reaction is 10 hours in the 100 liter reactors that have agitator, condenser, thermometer, and the cold filtration discharging promptly gets tackiness agent of the present invention.
This tackiness agent is evenly coated on the thick Kapton of 0.040mm, the thick 0.030mm of glue, superimposed with the alligatoring electrolysis aluminium foil that 0.020mm is thick, in the composite pressure machine in 130 ℃, 60kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide covering aluminum plate after 200 minutes.Make the standard testing sample with the method identical with embodiment 1, test result sees Table 1.
Embodiment 4.
Get 0.5 kilogram of methacrylic acid, 1 kilogram of n-methylolacrylamide, 18 kilograms of Isooctyl acrylate monomers, 5 kilograms of vinyl cyanide, 2,0.15 kilogram of 2 '-2,2'-Azobis(2,4-dimethylvaleronitrile), trichloroethane: pimelinketone: the reaction liquid of 75 kilograms of compositions of mixed solvent of ethyl acetate=1: 2: 1, heating reflux reaction is 15 hours in the reactor of 200 liters that have agitator, condenser, thermometer, promptly gets tackiness agent of the present invention.
This tackiness agent is evenly coated on the thick Kapton of 0.025mm, the thick 0.010mm of glue, superimposed with the rolling aluminum foil that 0.020mm is thick, in the composite pressure machine in 210 ℃, 10kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide covering aluminum plate after 20 minutes.Method with embodiment 1 makes specimen, and test result sees Table 1.
Embodiment 5.
Get propenoic acid beta-hydroxy propyl ester 20 grams, glycidyl acrylate 30 grams, butyl acrylate 650 grams, vinylbenzene 150 grams, Diisopropyl azodicarboxylate 8 grams, ethylene dichloride: methylethylketone=mixed solvent 2000 of 1: 1 restrains the reaction liquid of composition, and heating reflux reaction is 24 hours in 10 liters of three-necked bottles that have agitator, condenser, thermometer, promptly obtains tackiness agent of the present invention.
This tackiness agent is evenly coated on the thick Kapton of 0.050mm, the thick 0.020mm of glue glue, superimposed with the rolling aluminum foil that 0.040mm is thick, in the composite pressure machine in 170 ℃, 25kg/cm
2Following hot-press solidifying was made the polyimide covering aluminum plate after 120 minutes.
Method with embodiment 1 makes the standard testing sample, and test result sees Table 1.
Comparative Examples 1.
Get methacrylic acid 5 grams, butyl acrylate 70 grams, vinyl cyanide 30, peroxide acetic acid butyl ester 0.8 gram, butylacetate: mixed solvent 300 grams of methylethylketone=2: 1 mix, heating reflux reaction is 12 hours in having the 500ml three-necked bottle of agitator, condenser, thermometer, and the cooling back adds 5 gram Resins, epoxy (E-51 China Wuxi resin processing plant produces), must contrast tackiness agent.
The gained tackiness agent is evenly coated on the thick Kapton of 0.050mm, the thick 0.020mm of glue, with the thick alligatoring electrolytic copper foil poststack of 0.035mm, in the composite pressure machine in 165 ℃, 40kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide covering aluminum plate after 90 minutes.
Make specimen with embodiment 1 identical method, test result sees Table 1.Table 1
Claims (6)
1. a multi-component copolymer acrylate adhesive contains multicomponent methacrylate comonomer, cross-linking modified monomer, organic solvent, reaction initiator.It is characterized in that the multicomponent methacrylate comonomer is methacrylic acid C
1～C
8Alkyl ester, vinylformic acid C
1～C
8The mixture of one or more in alkyl ester, vinylbenzene, vinyl cyanide, the vinyl acetate; Cross-linking modified monomer is methacrylic acid, vinylformic acid, methacrylic acid β-C
2～C
8Hydroxy ester, propenoic acid beta-C
2～C
8In hydroxy ester, glycidyl methacrylate, glycidyl acrylate, Methacrylamide, acrylamide, n-methylolacrylamide, the hydroxyacrylamide two or more contains the mixture of different crosslinked groups; Organic solvent is one or more a mixture of toluene, dimethylbenzene, ethyl acetate, butylacetate, ethylene dichloride, trichloroethane, trichloromethane, acetone, methylethylketone, pimelinketone; Reaction initiator is 2-(tertiary butyl azo) isopropyl cyanide of azo-compound class, 2,2 '-2,2'-Azobis(2,4-dimethylvaleronitrile), 2, the mixture of one or more of the dilauroyl peroxide of 2 '-Diisopropyl azodicarboxylate and organo-peroxide class, dibenzoyl peroxide, peroxide acetic acid butyl ester, dicumyl peroxide, ditertiary butyl peroxide;
It forms weight ratio:
Multicomponent methacrylate comonomer 100
Cross-linking modified monomer 0.5～20
Organic solvent 50～500
Initiator 0.05～5
2. tackiness agent as claimed in claim 1 is characterized in that the weight ratio of forming is:
Multicomponent methacrylate comonomer 100
Cross-linking modified monomer 3～10
Organic solvent 150～300
Initiator 0.3～1.2
3. as the preparation method of claim 1,2 described tackiness agent, its characterization step is:
1. selected acrylate monomer, cross-linking monomer, initiator, organic solvent are added in the reactor with heating, stirring, reflux and thermo detector in proportion and mix;
2. stir and heat up and feeding nitrogen;
3. control reaction temperature is between 50 ℃～150 ℃, and the reaction times is 3～24 hours, then cooling discharging;
4. be 15～35% promptly to get described tackiness agent with organic solvent diluting to solid content.
4. the preparation method of tackiness agent as claimed in claim 3 is characterized in that control reaction temperature between 70 ℃～110 ℃, and the reaction times is 8～15 hours.
5. as claim 1, the application of 2 described tackiness agent in flexible print circuit base material polyimide covering aluminum plate, it is characterized in that described tackiness agent is evenly coated in the one side of Kapton, thick 0.010～the 0.030mm of glue, the aluminium foil single face carries out after the roughening treatment compound with the gluing Kapton, in pressing machine in 130 ℃～210 ℃, 10～60Kg/cm
2Pressurize is 20～200 minutes under the pressure, makes the polyimide covering aluminum plate.
6. tackiness agent as claimed in claim 5 is used in the polyimide covering aluminum plate, it is characterized in that aluminium foil and the Kapton compound temperature that scribbles tackiness agent are that 160 ℃～180 ℃, pressure are 25～45Kg/cm
2, the time is 40～120 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN00114627A CN1109085C (en) | 2000-06-13 | 2000-06-13 | Multi-component copolymer acrylate adhesive, its preparation method and application for covering aluminium plate with polyimide |
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| Application Number | Priority Date | Filing Date | Title |
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| CN00114627A CN1109085C (en) | 2000-06-13 | 2000-06-13 | Multi-component copolymer acrylate adhesive, its preparation method and application for covering aluminium plate with polyimide |
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| CN1281883A true CN1281883A (en) | 2001-01-31 |
| CN1109085C CN1109085C (en) | 2003-05-21 |
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