CN1151921C - Nickel-coated polyimide foil and its preparing process - Google Patents
Nickel-coated polyimide foil and its preparing process Download PDFInfo
- Publication number
- CN1151921C CN1151921C CNB001146289A CN00114628A CN1151921C CN 1151921 C CN1151921 C CN 1151921C CN B001146289 A CNB001146289 A CN B001146289A CN 00114628 A CN00114628 A CN 00114628A CN 1151921 C CN1151921 C CN 1151921C
- Authority
- CN
- China
- Prior art keywords
- nickel
- foil
- coated polyimide
- polyimide foil
- kapton
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 229920001721 polyimide Polymers 0.000 title claims abstract description 34
- 239000004642 Polyimide Substances 0.000 title claims abstract description 33
- 239000011888 foil Substances 0.000 title claims abstract description 28
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title abstract description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 22
- 230000001070 adhesive effect Effects 0.000 claims abstract description 22
- -1 acrylic ester Chemical class 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000003466 welding Methods 0.000 claims abstract description 4
- 238000005187 foaming Methods 0.000 claims abstract description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 238000012360 testing method Methods 0.000 claims description 11
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 5
- 238000003490 calendering Methods 0.000 claims description 5
- 238000004132 cross linking Methods 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- 238000005868 electrolysis reaction Methods 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 3
- 150000002815 nickel Chemical class 0.000 claims description 3
- 150000002978 peroxides Chemical class 0.000 claims description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical class CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 claims description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical class CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 claims description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 2
- BONVROUPOZRCDU-UHFFFAOYSA-N 2-hydroxyprop-2-enamide Chemical compound NC(=O)C(O)=C BONVROUPOZRCDU-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 2
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 claims description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 2
- LRDFRRGEGBBSRN-UHFFFAOYSA-N isobutyronitrile Chemical compound CC(C)C#N LRDFRRGEGBBSRN-UHFFFAOYSA-N 0.000 claims description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 claims description 2
- 150000001451 organic peroxides Chemical class 0.000 claims description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 claims description 2
- 238000007788 roughening Methods 0.000 claims description 2
- 229940117958 vinyl acetate Drugs 0.000 claims description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims 1
- 125000003944 tolyl group Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229960002415 trichloroethylene Drugs 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a nickel-coated polyimide foil and a preparing method of an adhesion agent thereof. The nickel-coated polyimide foil is formed by bonding a polyimide film and a nickel foil by the particular adhesion agent, and the adhesion agent is a multielement polymerization acrylic ester adhesive. The stripping strength of the nickel-coated polyimide foil as a base material of a soft printed circuit is at least 1.70 kg/cm, and the nickel-coated polyimide foil has good tin welding resistance and has no layering phenomenon and foaming phenomenon after the tin bath of 260 DEG C for 60 seconds. The nickel-coated polyimide foil also has the folding resistance of more than 400 times without fracture, and the electric conductive performance and the combined property of the nickel-coated polyimide foil are good.
Description
The present invention relates to electronic component commercial printing circuit-board industry used base material and preparation, specially refer to a kind of new type polyimide and cover nickel foil and preparation thereof.
When making flexible print circuit (FPC) base material, modal method is bonding with Kapton and Copper Foil, as described various polyimide copper clad lamination adhesive of ZL95109152 and manufacture method thereof.Along with the fast development of FPC industry, brought into use the wiring board of nickel-coated polyimide foil processing in some field.Compare with polyimide copper clad lamination, flexibility, the electric conductivity of nickel-coated polyimide foil are better, and the nickel-coated polyimide foil of exploitation function admirable is the needs of printed circuit base material development.
Flexible print circuit base material---the nickel-coated polyimide foil that the purpose of this invention is to provide a kind of flexibility, conducts electricity very well provides a kind of this method of covering nickel foil for preparing simultaneously.
Realize the nickel-coated polyimide foil of above-mentioned purpose, form by Kapton and the nickel foil that is bonded on the film, characteristics are the testing standard built-up circuit figures according to GB/T13557-92 and IPC-TM-650, record its peel strength more than or equal to 1.70Kg/cm, anti-tin-welding is not stratified, non-foaming after 60 seconds in 260 ℃ of tin baths, folding resistance does not rupture more than 400 times, sheet resistance 1.0 * 10
5M Ω, volume resistance 1.0 * 10
6M Ω m.
Above-mentioned Kapton is a commercially available product, be aromatic series pyromellitic acid dianhydride and 4, the H type film that 4 '-diaminodiphenyl ether forms through polycondensation, film forming, stretching, cyclisation in polar solvent, BPDA and 4, the S type film that 4 '-diaminodiphenyl ether is made or compound dianhydride and 4, the X type film of 4 '-diaminodiphenyl ether.
Above-mentioned nickel foil is commercially available electrolysis or calendering nickel foil.
Preparation method's step of this nickel-coated polyimide foil is:
1. the even coated with adhesive of the one side of Kapton, the thick 0.010～0.050mm of its glue;
2. the nickel foil single face carries out roughening treatment;
3. the one side of Kapton coating adhesive is superimposed with the alligatoring face of nickel foil, places the composite pressure machine at 150 ℃～190 ℃, 20～50Kg/cm
2Following hot-press solidifying 40～120 minutes promptly makes described nickel-coated polyimide foil.
The adhesive that uses in this nickel-coated polyimide foil is a multi-component copolymer acrylate adhesive, promptly is that number of patent application is the adhesive described in 00114627.This adhesive initially contains polynary acrylic comonomers a, cross-linking modified monomer b, organic solvent c, reaction initiator d, it is formed weight ratio and is:
a. 100
b. 0.5～20
c. 50～500
d. 0.05～5
Preferable composition weight ratio is:
a. 100
b. 3～8
c. 150～300
d. 0.1～0.8
Above-mentioned acrylate co-monomers is methacrylic acid C
1～C
8Arrcostab, acrylic acid C
1～C
8The mixture of one or more in Arrcostab, styrene, acrylonitrile, the vinylacetate.
Described cross-linking modified monomer is meant methacrylic acid, acrylic acid, methacrylic acid β-C
2～C
8Hydroxy ester, propenoic acid beta-C
2～C
8In hydroxy ester, GMA, glycidyl acrylate, Methacrylamide, acrylamide, NMA, the hydroxyacrylamide two or more contains the mixture of different crosslinked groups.
Described organic solvent is one or more a mixture of toluene, dimethylbenzene, ethyl acetate, butyl acetate, dichloroethanes, trichloroethanes, chloroform, acetone, MEK, cyclohexanone.
Described reaction initiator is 2-(tert-butyl group azo) isobutyronitrile of azo-compound class, 2,2 '-ABVN, 2, the mixture of one or more of the dilauroyl peroxide of 2 '-azodiisobutyronitrile and organic peroxide class, dibenzoyl peroxide, peroxide acetic acid butyl ester, cumyl peroxide, di-tert-butyl peroxide.
The preparation method of this multi-component copolymer acrylate adhesive is: selected acrylate co-monomers, cross-linking modified monomer, reaction initiator, organic solvent are added in the reactor that has heater, agitating device, reflux and thermometer in proportion mix; Stir and heat up, feed nitrogen during the reaction beginning to shorten the reaction initiation time, the control reaction temperature was reacted 5～16 hours between 60 ℃～120 ℃; Cooling discharging is 15%～35% with solvent dilution to solid content then, promptly gets required multi-component copolymer acrylate adhesive.
Embodiments of the invention:
Embodiment 1.
Get the thick Kapton of 0.050mm, evenly coat aforementioned multi-component copolymer acrylate adhesive in its one side, the thick 0.020mm of glue, superimposed with the alligatoring electrolysis nickel foil that 0.035mm is thick, place the composite pressure machine at 170 ℃, 40kg/cm
2Hot-press solidifying was made flexible print circuit base material nickel-coated polyimide foil after 60 minutes under the condition.Testing standard by GB/T13557-92 and IPC-TM-650 is made circuitous pattern, records peel strength, soldering resistance, folding resistance and electrical property etc., the results are shown in Table 1.
Embodiment 2.
Get the thick Kapton of 0.025mm, evenly coat aforementioned multi-component copolymer acrylate adhesive in its one side, the thick 0.010mm of glue, superimposed with the alligatoring electrolysis nickel foil that 0.035mm is thick, place the composite pressure machine at 150 ℃, 50kg/cm
2Hot-press solidifying was made flexible print circuit base material nickel-coated polyimide foil after 90 minutes under the condition.With the identical method production standard specimen of embodiment 1, test result sees Table 1.
Embodiment 3.
Get the thick Kapton of 0.040mm, evenly coat aforementioned multi-component copolymer acrylate adhesive in its one side, the thick 0.015mm of glue, superimposed with the thick alligatoring of 0.035mm calendering nickel foil, in the composite pressure machine in 190 ℃, 20kg/cm
2Following hot-press solidifying was made nickel-coated polyimide foil after 120 minutes.Make the standard testing sample by embodiment 1 identical method, test result sees Table 1.
Embodiment 4.
Get the thick Kapton of 0.025mm, evenly coat aforementioned multi-component copolymer acrylate adhesive in its one side, the thick 0.020mm of glue, superimposed with the alligatoring calendering nickel foil that 0.020mm is thick, place the composite pressure machine at 170 ℃, 30kg/cm
2Following hot-press solidifying was made nickel-coated polyimide foil after 60 minutes.Press the identical method production standard specimen of embodiment 1, test result sees Table 1.
Embodiment 5.
Get the thick Kapton of 0.050mm, evenly coat aforementioned multi-component copolymer acrylate adhesive in its one side, the thick 0.030mm of glue, superimposed with the calendering nickel foil that 0.020mm is thick, place the composite pressure machine at 170 ℃, 40kg/cm
2Following hot-press solidifying was made nickel-coated polyimide foil after 40 minutes.Press the identical method production standard specimen of embodiment 1, test result sees Table 1.
Comparative Examples 1.
Get methacrylic acid 5 grams, butyl acrylate 70 grams, acrylonitrile 30, peroxide acetic acid butyl ester 0.8 gram, butyl acetate: mixed solvent 300 grams of MEK=2: 1 mix, heating reflux reaction is 10 hours in having the 500ml three-necked bottle of agitator, condenser, thermometer, and cooling back adds 5 gram epoxy resin E-51 (Chinese Wuxi resin processing plant produce) and obtains adhesive.The gained adhesive is evenly coated on the thick Kapton of 0.050mm, the thick 0.020mm of glue, superimposed with the alligatoring electrolytic copper foil that 0.035mm is thick, place the composite pressure machine at 170 ℃, 40kg/cm
2Following hot-press solidifying made the coated polyimide Copper Foil after 90 minutes.Press the identical method production standard specimen of embodiment 1, test result sees Table 1.
Data from table 1 as can be seen, the nickel-coated polyimide foil of embodiment 1～5 is better than peel strength height, the electric conductivity of the coated polyimide Copper Foil of Comparative Examples 1, folding resistance is better.
Table 1
| Test event | Test condition | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Comparative Examples 1 | Method of testing |
| Peel strength (kg/cm) | Normality | 1.82 | 1.78 | 1.77 | 1.86 | 1.86 | 1.63 | The 3.1st of GB/T13557 |
| Handle after 30 minutes for 125 ℃ | 1.81 | 1.76 | 1.76 | 1.84 | 1.81 | 1.58 | The 3.2nd of GB/T13557 | |
| After 200 ℃ of thermal shocks are handled | 1.75 | 1.71 | 1.70 | 1.76 | 1.73 | 1.52 | The 3.3rd of GB/T13557 | |
| After trichloro-ethylene soaks 3 minutes | 1.75 | 1.70 | 1.68 | 1.74 | 1.70 | 1.48 | The 3.4th of GB/T13557 | |
| Anti-tin-welding (second) | In 260 ℃ of tin baths | ＞60 | ＞60 | ＞60 | ＞60 | ＞60 | ＞60 | IPC-TM-650-2.4B (method A) |
| Volume resistance (M Ω m) | After constant humid heat treatment is recovered | 2.8× 10 6 | 3.1× 10 6 | 2.6× 10 6 | 4.4× 10 6 | 2.5× 10 6 | 2.5× 10 6 | GB4722 the 5th chapter |
| Show and resistance (M Ω) | After constant humid heat treatment is recovered | 3.3× 10 5 | 2.7× 10 5 | 3.5× 10 5 | 3.2× 10 5 | 2.7× 10 5 | 1.9× 10 5 | GB4722 the 6th chapter |
| Dielectric constant (maximum) | After constant humid heat treatment is recovered | 3.5 | 3.7 | 3.3 | 3.2 | 3.4 | 3.4 | GB4722 the 9th chapter |
| Dielectric loss angle tangent (maximum) | After constant humid heat treatment is recovered | 0.035 | 0.033 | 0.032 | 0.037 | 0.035 | 0.036 | GB4722 the 9th chapter |
| Perpendicular layers is to electrical strength (KV/mm minimum of a value) | 1122 | 107 | 109 | 102 | 113 | 107 | The GB4722 Chapter 11 | |
| Chemical proofing | 2NNaOH/10 minute | No change | No change | No change | No change | No change | No change | IPC-TM-650- 2.3.2A |
| 2NHCl solution/10 minute | No change | No change | No change | No change | No change | No change | ||
| Folding resistance | 413 | 448 | 531 | 548 | 524 | 115 | GB4722 the 4th chapter |
Claims (4)
1, a kind of nickel-coated polyimide foil, form by Kapton and the nickel foil that is bonded on this film, adhesive between Kapton and nickel foil is a multi-component copolymer acrylate adhesive, this adhesive initially contains polynary acrylic comonomers a, cross-linking modified monomer b, organic solvent c, reaction initiator d, it forms weight ratio: a.100 b.0.5～20 c.50～500 d.0.05～5, described acrylic comonomers is methacrylic acid C
1～C
8Arrcostab, acrylic acid C
1～C
8The mixture of one or more in Arrcostab, styrene, acrylonitrile, the vinylacetate, described cross-linking modified monomer is meant methacrylic acid, acrylic acid, methacrylic acid β-C
2～C
8Hydroxy ester, propenoic acid beta-C
2～C
8Hydroxy ester, GMA, glycidyl acrylate, Methacrylamide, acrylamide, NMA, in the hydroxyacrylamide two or more contains the mixture of different crosslinked groups, described organic solvent is a toluene, dimethylbenzene, ethyl acetate, butyl acetate, dichloroethanes, trichloroethanes, chloroform, acetone, MEK, the mixture of one or more of cyclohexanone, described reaction initiator is 2-(tert-butyl group azo) isobutyronitrile of azo-compound class, 2,2 '-ABVN, 2, the dilauroyl peroxide of 2 '-azodiisobutyronitrile and organic peroxide class, dibenzoyl peroxide, peroxide acetic acid butyl ester, cumyl peroxide, the mixture of one or more of di-tert-butyl peroxide is characterized in that this nickel-coated polyimide foil makes circuitous pattern according to the testing standard of GB/13557-92 and IPC-TM-650 and record peel strength more than or equal to 1.70Kg/cm; Anti-tin-welding is not stratified, non-foaming in 260 ℃ of tin baths, after 60 seconds; Folding resistance does not rupture more than 400 times; Sheet resistance 1.0 * 10
5M Ω; Volume resistance 1.0 * 10
6M Ω m.
2, nickel-coated polyimide foil as claimed in claim 1, it is characterized in that Kapton is aromatic series pyromellitic acid dianhydride and 4, H type film, BPDA and 4 that 4 '-diaminodiphenyl ether is made, the X type film that make the S type film that 4 '-diaminodiphenyl ether is made or compound dianhydride and 4,4 '-diaminodiphenyl ether.
3, nickel-coated polyimide foil as claimed in claim 1 is characterized in that nickel foil is electrolysis or calendering nickel foil.
4, the preparation method of the described nickel-coated polyimide foil of claim 1 is characterized in that step is:
1. at the even coated with adhesive of one side of Kapton, the thick 0.010～0.050mm of its glue;
2. the nickel foil single face carries out roughening treatment;
3. the one side of Kapton coating adhesive is superimposed with the one side of nickel foil alligatoring, places the composite pressure machine at 150 ℃～190 ℃, 20～50Kg/cm
2Following hot-press solidifying 40～120 minutes promptly makes described nickel-coated polyimide foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001146289A CN1151921C (en) | 2000-06-13 | 2000-06-13 | Nickel-coated polyimide foil and its preparing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001146289A CN1151921C (en) | 2000-06-13 | 2000-06-13 | Nickel-coated polyimide foil and its preparing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1283548A CN1283548A (en) | 2001-02-14 |
| CN1151921C true CN1151921C (en) | 2004-06-02 |
Family
ID=4584279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001146289A Expired - Lifetime CN1151921C (en) | 2000-06-13 | 2000-06-13 | Nickel-coated polyimide foil and its preparing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1151921C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112778563A (en) * | 2021-01-25 | 2021-05-11 | 深圳和力纳米科技有限公司 | Polyimide film and preparation method thereof |
-
2000
- 2000-06-13 CN CNB001146289A patent/CN1151921C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1283548A (en) | 2001-02-14 |
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