JP2002273824A - Copper foil laminate with adhesive and its manufacturing method - Google Patents
Copper foil laminate with adhesive and its manufacturing methodInfo
- Publication number
- JP2002273824A JP2002273824A JP2001075433A JP2001075433A JP2002273824A JP 2002273824 A JP2002273824 A JP 2002273824A JP 2001075433 A JP2001075433 A JP 2001075433A JP 2001075433 A JP2001075433 A JP 2001075433A JP 2002273824 A JP2002273824 A JP 2002273824A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- adhesive
- layer
- laminate
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、銅張り積層板及び
印刷回路板の作製に使用される接着剤付き銅箔積層体お
よびその作製方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper foil laminate with an adhesive used for producing a copper-clad laminate and a printed circuit board, and a method for producing the same.
【０００２】[0002]
【従来の技術】電子機器の小型化、高性能化に伴い、そ
の中に搭載される印刷回路板は、高多層化、薄型化、ス
ルーホールの小径化及び穴間隔の減少などによる高密度
化が進行している。さらに、携帯電話やモバイルコンピ
ュータ等の情報端末機器に搭載される印刷回路板には、
ＭＰＵを印刷回路板上に直接搭載するプラスチックパッ
ケージや各種モジュール用の印刷回路板を中心に、大容
量の情報を高速に処理することが求められており、信号
処理の高速化や低伝送損失化、更なるダウンサイジング
が必要となっている。そのため印刷回路板はより一層の
高密度化が進み、これまで以上の微細配線が要求されて
いる。2. Description of the Related Art With the miniaturization and high performance of electronic equipment, printed circuit boards mounted therein have been increased in density by increasing the number of layers, reducing the thickness, reducing the diameter of through-holes, and reducing the space between holes. Is progressing. Furthermore, printed circuit boards mounted on information terminal devices such as mobile phones and mobile computers include:
High-speed processing of large volumes of information is required, especially for plastic packages that mount MPUs directly on a printed circuit board and printed circuit boards for various modules, resulting in faster signal processing and lower transmission loss. Further downsizing is needed. For this reason, printed circuit boards have been further densified, and finer wiring than ever has been required.
【０００３】印刷回路板は、例えば接着剤付き銅箔を用
いて銅張り積層板を作製し、エッチングにより微細配線
回路を形成することにより作製している。この微細配線
回路をエッチングにより形成するためには、回路のアス
ペクト比を考慮すると、銅箔の厚さはできる限り薄くす
る必要がある。一方、あまりに薄い銅箔、例えば厚さ１
０μｍ以下の場合には、接着剤付き銅箔の作製に際し
て、従来の直接塗工やラミネートなどにより接着剤層を
形成する方法では、銅箔に皺や傷等が発生するという欠
点がある。他方、厚さ３μｍ程度の銅箔を厚い銅箔や他
の金属箔に担持させる方法も提案されているが、重量が
重くなり、シート状に切断加工する際に金属粉が混入す
るなど、取扱いに困難性があるため、広くは利用されて
いない。A printed circuit board is manufactured by, for example, manufacturing a copper-clad laminate using a copper foil with an adhesive, and forming a fine wiring circuit by etching. In order to form this fine wiring circuit by etching, it is necessary to reduce the thickness of the copper foil as much as possible in consideration of the aspect ratio of the circuit. On the other hand, too thin copper foil, for example, thickness 1
In the case where the thickness is 0 μm or less, the conventional method of forming an adhesive layer by direct coating or laminating when producing a copper foil with an adhesive has a disadvantage that wrinkles, scratches, and the like are generated in the copper foil. On the other hand, a method of supporting a copper foil having a thickness of about 3 μm on a thick copper foil or other metal foils has also been proposed. However, since the weight becomes heavy and metal powder is mixed in cutting into a sheet shape, handling is difficult. Are not widely used due to the difficulty of
【０００４】[0004]
【発明が解決しようとする課題】本発明は、従来の技術
における上記のような問題点を解決するためになされた
ものである。すなわち、本発明の目的は、銅箔層に皺や
傷等が発生することなく銅張り積層板及び印刷回路板を
作製することができる接着剤付き銅箔積層体およびそれ
を作製する方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems in the prior art. That is, an object of the present invention is to provide a copper foil laminate with an adhesive capable of producing a copper-clad laminate and a printed circuit board without wrinkles, scratches and the like occurring in the copper foil layer, and a method of producing the same. Is to do.
【０００５】[0005]
【課題を解決するための手段】本発明者は、検討の結
果、剥離可能な保護層となる樹脂フィルムを銅箔の支持
体とすることにより、上記の問題を解決することができ
ることを見出し、本発明を完成するに至った。As a result of the study, the present inventor has found that the above problem can be solved by using a resin film serving as a peelable protective layer as a copper foil support. The present invention has been completed.
【０００６】すなわち、本発明の接着剤付き銅箔積層体
は、厚さ１０μｍ以下の銅箔の一面に接着剤層を設け、
他面に樹脂フィルムよりなる剥離可能な保護層を設けた
ことを特徴とする。また、本発明の接着剤付き銅箔積層
体の作製方法は、剥離可能な保護層にするための樹脂フ
ィルムの一面に、膜厚１０μｍ以下の銅箔層を形成し、
次いで形成された銅箔層の上に接着剤層を形成すること
を特徴とする。That is, the copper foil laminate with an adhesive of the present invention is provided with an adhesive layer on one surface of a copper foil having a thickness of 10 μm or less,
On the other surface, a peelable protective layer made of a resin film is provided. Further, the method for producing a copper foil laminate with an adhesive of the present invention includes forming a copper foil layer having a thickness of 10 μm or less on one surface of a resin film for forming a peelable protective layer,
Next, an adhesive layer is formed on the formed copper foil layer.
【０００７】本発明において、上記接着剤付き銅箔積層
体は、銅箔と剥離可能な保護層の間の密着力が１００ｇ
／ｃｍ以下であることが好ましい。また、接着剤層と銅
箔との間の密着力が、銅箔と剥離可能な保護層の間の密
着力より大きいことが必要である。In the present invention, the adhesive copper foil laminate has an adhesion of 100 g between the copper foil and the peelable protective layer.
/ Cm or less. In addition, it is necessary that the adhesive force between the adhesive layer and the copper foil is larger than the adhesive force between the copper foil and the peelable protective layer.
【０００８】[0008]
【発明の実施の形態】本発明において、銅箔は、接着剤
層を設ける前に、まず剥離可能な保護層にするための樹
脂フィルムの上に銅箔層として設けられる。具体的に
は、弱粘着性層を有する樹脂フィルムに銅箔を貼り合わ
せる方法、樹脂フィルム上に、スパッタ、蒸着、無電解
メッキ等の手法によって直接銅箔層を形成する方法、或
いは、樹脂フィルム上に、スパッタ、蒸着、無電解メッ
キ等の手法で直接銅箔層を形成した後、電解メッキで所
望の厚さまで成長させる方法等によって実施することが
できる。また、上記銅箔または銅箔層の厚さは微細配線
のエッチングを考えると１０μｍ以下が好ましい。DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, a copper foil is first provided as a copper foil layer on a resin film for forming a peelable protective layer before providing an adhesive layer. Specifically, a method of bonding a copper foil to a resin film having a weakly adhesive layer, a method of directly forming a copper foil layer on the resin film by a method such as sputtering, vapor deposition, or electroless plating, or a resin film After a copper foil layer is directly formed thereon by a technique such as sputtering, vapor deposition, or electroless plating, it can be carried out by a method of growing to a desired thickness by electrolytic plating. The thickness of the copper foil or the copper foil layer is preferably 10 μm or less in consideration of etching of fine wiring.
【０００９】銅箔の剥離可能な保護層となる樹脂フィル
ムとしては、ポリエチレンテレフタレート、ポリエチレ
ンナフタレート等のポリエステルフィルム、ポリフェニ
ルスルホン、ポリイミド、ポリアミド等のフィルムがあ
げられるが、これらのものに限定されるものではない。
これら樹脂フィルムの厚さは、銅箔層を担持できるだけ
の腰があれば、特に限定されるものではない。樹脂フィ
ルムの表面は、弱粘着性を付与するための処理や離型処
理等が施されてもよく、実質的には、銅箔との密着力が
９０°ピール試験で１００ｇ／ｃｍ以下であればよい。
更に、７０ｇ／ｃｍ以下であることが好ましい。Examples of the resin film serving as the protective layer capable of peeling the copper foil include polyester films such as polyethylene terephthalate and polyethylene naphthalate, and films such as polyphenylsulfone, polyimide and polyamide, but are not limited thereto. Not something.
The thickness of these resin films is not particularly limited as long as the resin film has sufficient rigidity to support the copper foil layer. The surface of the resin film may be subjected to a treatment for imparting weak tackiness, a release treatment, or the like, and if the adhesion to the copper foil is substantially 100 g / cm or less in a 90 ° peel test. I just need.
Further, it is preferably at most 70 g / cm.
【００１０】次いで、上記のようにして樹脂フィルム上
に設けられた銅箔層の上に、接着剤層が形成される。接
着剤層を構成する樹脂としては特に限定されるものでは
なく、従来、印刷回路板作製用の接着剤付き銅箔に使用
されている公知のものであれば如何なるものでも使用可
能である。具体的には、例えば、エポキシ樹脂、エポキ
シ樹脂とフェノール樹脂の混合物、エポキシ樹脂とアミ
ン系化合物の混合物、ゴム変成エポキシ樹脂、それら樹
脂混合物にエラストマー成分を添加したもの、マレイミ
ド樹脂、マレイミドとアミンの混合物、マレイミドとメ
タリル化合物の混合物、ビスマレイミド−トリアジン樹
脂、ポリイミド樹脂、ポリフェニレンエーテル樹脂、お
よび上記の各々の混合物等が使用可能である。Next, an adhesive layer is formed on the copper foil layer provided on the resin film as described above. The resin constituting the adhesive layer is not particularly limited, and any resin can be used as long as it is a known resin conventionally used for a copper foil with an adhesive for producing a printed circuit board. Specifically, for example, an epoxy resin, a mixture of an epoxy resin and a phenol resin, a mixture of an epoxy resin and an amine compound, a rubber-modified epoxy resin, a mixture of these resins with an elastomer component added, a maleimide resin, and a mixture of a maleimide and an amine. A mixture, a mixture of a maleimide and a methallyl compound, a bismaleimide-triazine resin, a polyimide resin, a polyphenylene ether resin, a mixture of each of the above, and the like can be used.
【００１１】接着剤層は、上記の樹脂等よりなる接着剤
組成物を銅箔層の上に常法により塗布することによって
形成することができる。塗布後、形成された接着剤層は
加熱することによって半硬化状の形態にするのが好まし
い。接着剤層の膜厚は特に限定されるものではないが、
一般に８〜１００μｍの範囲に設定される。The adhesive layer can be formed by applying an adhesive composition comprising the above-mentioned resin or the like on a copper foil layer by a conventional method. After the application, the formed adhesive layer is preferably made into a semi-cured form by heating. The thickness of the adhesive layer is not particularly limited,
Generally, it is set in the range of 8 to 100 μm.
【００１２】本発明の接着剤付き銅箔積層体において、
接着剤層と銅箔との間の密着力は、銅箔と剥離可能な保
護層の間の密着力より大きいことが必要であり、実質的
には１００ｇ／ｃｍより大きいことが好ましい。もしも
接着剤層と銅箔との間の密着力が、銅箔と剥離可能な保
護層の間の密着力より小さいと、接着剤付き銅箔積層体
の接着剤層を印刷回路基板に接着した後、保護層を剥離
することができず、印刷回路板の加工が困難になる。In the copper foil laminate with an adhesive of the present invention,
The adhesion between the adhesive layer and the copper foil must be greater than the adhesion between the copper foil and the peelable protective layer, and is preferably substantially greater than 100 g / cm. If the adhesive strength between the adhesive layer and the copper foil is smaller than the adhesive strength between the copper foil and the peelable protective layer, the adhesive layer of the copper foil laminate with the adhesive was bonded to the printed circuit board. Later, the protective layer cannot be peeled off, making the processing of the printed circuit board difficult.
【００１３】[0013]
【実施例】以下に、実施例に基づき本発明を説明する。 実施例１ 厚さ３８μｍのポリエステルフィルムの片面に、厚さ３
μｍの銅箔層を蒸着によって形成した。次いで、エポキ
シ樹脂（商品名：ＥＰＯＭＩＣ Ｒ−３０１、三井石油
化学社製）４０重量部、ゴム変成エポキシ樹脂（商品
名：ＥＰＯＴＯＨＴＯ ＹＲ−１０２、東都化成社製）
２０重量部、ポリビニルアセタール樹脂（商品名：デン
カブチラール＃５０００Ａ、電気化学工業社製）３０重
量部、メラミン樹脂（商品名：ユーバン２０ＳＢ、三井
東圧化学社製）１０重量部（固形分として）、潜在性エ
ポキシ樹脂硬化剤（ジシアンジアミド）２重量部（固形
分２５重量％のジメチルホルムアミド溶液として添
加）、硬化促進剤（商品名：キュアゾール２Ｅ４ＭＺ、
四国化成社製）０．５重量部を、トルエン−メタノール
１：１の混合溶剤に溶解して固形分２５重量％の接着剤
組成物を調製した。この接着剤組成物を、上記ポリエス
テルフィルム上に形成した銅箔層の上に塗布し、風乾し
た後、１５０℃にて７分間加熱して、膜厚３０μｍの接
着剤層を形成した。得られた接着剤付き銅箔積層体にお
いて、外観上の問題点は何ら認められなかった。９０°
ピール試験にて測定した銅箔−ポリエステルフィルム
（保護層）および接着剤−銅箔間の密着力は、各々４０
ｇ／ｃｍ、および１０００ｇ／ｃｍであった。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments. Example 1 A polyester film having a thickness of 38 μm and a thickness of 3
A μm copper foil layer was formed by evaporation. Next, 40 parts by weight of an epoxy resin (trade name: EPOMIC R-301, manufactured by Mitsui Petrochemical Co., Ltd.) and a rubber-modified epoxy resin (trade name: EPOTOTOTO YR-102, manufactured by Toto Kasei Co., Ltd.)
20 parts by weight, 30 parts by weight of polyvinyl acetal resin (trade name: Denka Butyral # 5000A, manufactured by Denki Kagaku Kogyo), 10 parts by weight of melamine resin (trade name: Uban 20SB, manufactured by Mitsui Toatsu Chemicals) (as solid content) 2 parts by weight of a latent epoxy resin curing agent (dicyandiamide) (added as a dimethylformamide solution having a solid content of 25% by weight), a curing accelerator (trade name: Curesol 2E4MZ,
0.5 part by weight of Shikoku Chemicals Co., Ltd.) was dissolved in a mixed solvent of toluene-methanol 1: 1 to prepare an adhesive composition having a solid content of 25% by weight. The adhesive composition was applied on a copper foil layer formed on the polyester film, air-dried, and heated at 150 ° C. for 7 minutes to form an adhesive layer having a thickness of 30 μm. No problem in appearance was observed in the obtained copper foil laminate with the adhesive. 90 °
The adhesion between the copper foil-polyester film (protective layer) and the adhesive-copper foil measured by the peel test was 40 for each.
g / cm, and 1000 g / cm.
【００１４】実施例２ 厚さ３８μｍのポリエステルフィルムの片面に、スパッ
タで銅の薄層を形成した後、電解メッキにて厚さ５μｍ
の銅箔層を形成した。次いで、２，２−ビス［４−（ア
ミノフェノキシ）フェニル］プロパン、３，３′−ジカ
ルボキシ−４，４′−ジアミノジフェニルメタン、アミ
ノプロピル末端ジメチルシロキサン８量体、および２，
３′，３，４′−ビフェニルテトラカルボン酸二無水物
からなる分子量２５，０００のシロキサン変性ポリイミ
ド（シロキサン変性率８％）１００重量部、４，４′−
ビスマレイミドジフェニルメタン６９重量部、およびジ
メタリルビスフェノールＡ２４重量部を、テトラヒドロ
フラン中に添加して充分に混合、溶解し、固形分３０重
量％の接着剤組成物を得た。この接着剤組成物を、上記
ポリエステルフィルム上に形成した銅箔層の上に塗布
し、１４０℃にて５分間加熱して、厚さは６０μｍの接
着剤層を形成した。得られた接着剤付き銅箔積層体にお
いて、外観上の問題点は何ら認められなかった。９０°
ピール試験にて測定した銅箔−ポリエステルフィルム
（保護層）および接着剤−銅箔間の密着力は、各々２０
ｇ／ｃｍ、および６００ｇ／ｃｍであった。Example 2 A thin layer of copper was formed on one side of a 38 μm-thick polyester film by sputtering, and then 5 μm in thickness by electrolytic plating.
Was formed. Then, 2,2-bis [4- (aminophenoxy) phenyl] propane, 3,3′-dicarboxy-4,4′-diaminodiphenylmethane, aminopropyl-terminated dimethylsiloxane octamer, and
100 parts by weight of a siloxane-modified polyimide composed of 3 ', 3,4'-biphenyltetracarboxylic dianhydride and having a molecular weight of 25,000 (siloxane modification rate 8%), 4,4'-
69 parts by weight of bismaleimidodiphenylmethane and 24 parts by weight of dimethallyl bisphenol A were added to tetrahydrofuran, mixed and dissolved sufficiently to obtain an adhesive composition having a solid content of 30% by weight. This adhesive composition was applied on the copper foil layer formed on the polyester film, and heated at 140 ° C. for 5 minutes to form an adhesive layer having a thickness of 60 μm. No problem in appearance was observed in the obtained copper foil laminate with the adhesive. 90 °
The adhesion between the copper foil-polyester film (protective layer) and the adhesive-copper foil measured by the peel test was 20 for each.
g / cm, and 600 g / cm.
【００１５】実施例３ 厚さ３８μｍのポリエステルフィルムの片面に無電解メ
ッキにて厚さ５μｍの銅箔層を形成した。次いで、ジシ
クロ型エポキシ樹脂（商品名：ＨＰ−７２００、大日本
インキ社製）２６．４重量部、レゾールフェノ−ル樹脂
（商品名：ショウノールＣＫＭ２４００、昭和高分子社
製）１２．３重量部、ジアミノジシロキサン（商品名：
ＴＳＬ９３０６、東芝シリコ−ン社製）１．３重量部、
エポフレンドＡ１０２０（ダイセル化学社製）５６．３
重量部をテトラヒドロフラン２１６．９重量部に溶解し
て固形分３０．８重量％の接着剤組成物を調製した。こ
の接着剤組成物を、上記ポリエステルフィルム上に形成
された銅箔層の上に塗布し、風乾した後、１５０℃にて
５分間加熱して、厚さ３０μｍの接着剤層を形成した。
得られた接着剤付き銅箔積層体において、外観上の問題
点は何ら認められなかった。９０°ピール試験にて測定
した銅箔−ポリエステルフィルム（保護層）および接着
剤−銅箔間の密着力は、各々１５ｇ／ｃｍ、および１１
００ｇ／ｃｍであった。Example 3 A copper foil layer having a thickness of 5 μm was formed on one surface of a polyester film having a thickness of 38 μm by electroless plating. Then, 26.4 parts by weight of a dicyclo epoxy resin (trade name: HP-7200, manufactured by Dainippon Ink) and 12.3 parts by weight of resolephenol resin (trade name: Shaunol CKM2400, manufactured by Showa Polymer Co., Ltd.) , Diaminodisiloxane (trade name:
TSL9306, manufactured by Toshiba Silicone Corp.) 1.3 parts by weight,
Epo Friend A1020 (manufactured by Daicel Chemical) 56.3
Part by weight was dissolved in 216.9 parts by weight of tetrahydrofuran to prepare an adhesive composition having a solid content of 30.8% by weight. This adhesive composition was applied on a copper foil layer formed on the polyester film, air-dried, and then heated at 150 ° C. for 5 minutes to form an adhesive layer having a thickness of 30 μm.
No problem in appearance was observed in the obtained copper foil laminate with the adhesive. The adhesion between the copper foil-polyester film (protective layer) and the adhesive-copper foil measured by the 90 ° peel test was 15 g / cm, and 11 respectively.
It was 00 g / cm.
【００１６】比較例 実施例１で作製したポリエステルフィルム上に銅箔層が
形成されたものから、ポリエステルフィルムを引き剥が
して厚さ３μｍ銅箔を得た。この銅箔上に、実施例１で
使用した接着剤組成物を塗布し、風乾した後、１５０℃
にて７分間加熱して、厚さ３０μｍの接着剤層を有する
接着剤付き銅箔を作製した。その際、接着剤乾燥の過程
で銅箔に皺が寄り、良品部分の歩留まりは５０％程度で
あった。９０°ピール試験にて測定した接着剤−銅箔間
の密着力は１０００ｇ／ｃｍであった。Comparative Example A polyester film was peeled off from the copper foil layer formed on the polyester film produced in Example 1 to obtain a copper foil having a thickness of 3 μm. The adhesive composition used in Example 1 was applied on this copper foil, and air-dried.
For 7 minutes to produce a copper foil with an adhesive having an adhesive layer having a thickness of 30 μm. At that time, the copper foil was wrinkled in the process of drying the adhesive, and the yield of the non-defective part was about 50%. The adhesive strength between the adhesive and the copper foil measured by the 90 ° peel test was 1000 g / cm.
【００１７】実施例１〜３の接着剤付き銅箔積層体の接
着剤層に、市販の０．２ｍｍガラスエポキシプリプレグ
を重ねて、１４０℃で仮圧着した後、保護層を剥離し、
更に圧力３０ｋｇ／ｃｍ2 、温度１７０℃にて６０分間
プレスして積層板を作製した。本発明の実施例の場合、
銅箔層に皺の発生はなく、良好な積層板が作製された。
同様に比較例の接着剤付き銅箔を用いて積層板を作製し
たところ、仮圧着時の皺が残り、良品は得られなかっ
た。また、これらの積層板をエッチングして１５μｍピ
ッチの櫛形電極を形成したところ、本発明の実施例のも
のでは問題なく櫛形電極を形成することができたが、比
較例の場合は仮圧着時の皺が残り、良品は得られなかっ
た。A commercially available 0.2 mm glass epoxy prepreg was superimposed on the adhesive layer of the copper foil laminate with an adhesive of Examples 1 to 3, and after being temporarily pressed at 140 ° C., the protective layer was peeled off.
Further, the laminate was pressed at a pressure of 30 kg / cm 2 and a temperature of 170 ° C. for 60 minutes to produce a laminate. In the case of the embodiment of the present invention,
There was no wrinkle in the copper foil layer, and a good laminate was produced.
Similarly, when a laminated board was prepared using the copper foil with an adhesive of the comparative example, wrinkles at the time of temporary press-bonding remained, and no good product was obtained. Further, when these laminated plates were etched to form a comb-shaped electrode having a pitch of 15 μm, a comb-shaped electrode could be formed without any problem in the example of the present invention. Wrinkles remained, and good products were not obtained.
【００１８】[0018]
【発明の効果】本発明の接着剤付き銅箔積層体は、上記
の構成を有するから、それを用いて銅張り積層板及び印
刷回路板を作製する場合、銅箔層に皺や傷が発生するこ
とがない。また、本発明の方法によれば、銅箔層に皺の
発生のない接着剤付き銅箔積層体を製造することが可能
になる。The copper foil laminate with the adhesive of the present invention has the above-mentioned structure, and therefore when producing a copper-clad laminate and a printed circuit board using the same, wrinkles and scratches occur on the copper foil layer. Never do. Further, according to the method of the present invention, it becomes possible to produce a copper foil laminate with an adhesive which does not cause wrinkles in the copper foil layer.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 吉井 康弘 静岡県静岡市用宗巴町３番１号 株式会社 巴川製紙所電子材料事業部内 Ｆターム(参考） 4E351 BB01 BB24 BB30 CC18 CC40 DD04 DD54 DD60 GG01 4F100 AB17A AB33A AK23G AK36G AK41C AK53G AR00B AR00C BA02 BA03 BA07 CA02G CB00B GB43 JL04 JL11B JL14C ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Yasuhiro Yoshii 3-1 Yomune-cho, Shizuoka-shi, Shizuoka Prefecture F-term Co., Ltd. Electronic Materials Division, Hamakawa Paper Works 4E351 BB01 BB24 BB30 CC18 CC40 DD04 DD54 DD60 GG01 4F100 AB17A AB33A AK23G AK36G AK41C AK53G AR00B AR00C BA02 BA03 BA07 CA02G CB00B GB43 JL04 JL11B JL14C
Claims (6)
脂フィルムよりなる剥離可能な保護層を設けたことを特
徴とする接着剤付き銅箔積層体。1. A copper foil laminate with an adhesive, wherein an adhesive layer is provided on one surface of a copper foil and a peelable protective layer made of a resin film is provided on the other surface.
１に記載の接着剤付き銅箔積層体。2. The copper foil laminate with an adhesive according to claim 1, wherein the thickness of the copper foil is 10 μm or less.
１００ｇ／ｃｍ以下であることを特徴とする請求項１に
記載の接着剤付き銅箔積層体。3. The copper foil laminate with an adhesive according to claim 1, wherein the adhesion between the copper foil and the peelable protective layer is 100 g / cm or less.
と剥離可能な保護層の間の密着力より大きいことを特徴
とする請求項１に記載の接着剤付き銅箔積層体。4. The copper foil with an adhesive according to claim 1, wherein the adhesive strength between the adhesive layer and the copper foil is larger than the adhesive strength between the copper foil and the peelable protective layer. Laminate.
ルムの一面に、銅箔層を形成し、次いで形成された銅箔
層の上に接着剤層を形成することを特徴とする請求項１
記載の接着剤付き銅箔積層体の作製方法。5. A method according to claim 1, wherein a copper foil layer is formed on one surface of the resin film for forming a peelable protective layer, and then an adhesive layer is formed on the formed copper foil layer. 1
The method for producing a copper foil laminate with an adhesive according to the above.
５に記載の接着剤付き銅箔積層体の作製方法。6. The method for producing a copper foil laminate with an adhesive according to claim 5, wherein the thickness of the copper foil is 10 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001075433A JP2002273824A (en) | 2001-03-16 | 2001-03-16 | Copper foil laminate with adhesive and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001075433A JP2002273824A (en) | 2001-03-16 | 2001-03-16 | Copper foil laminate with adhesive and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002273824A true JP2002273824A (en) | 2002-09-25 |
Family
ID=18932514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001075433A Pending JP2002273824A (en) | 2001-03-16 | 2001-03-16 | Copper foil laminate with adhesive and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002273824A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004053981A1 (en) * | 2002-12-11 | 2004-06-24 | Matsushita Electric Industrial Co., Ltd. | Method of cutting semiconductor wafer and protective sheet used in the cutting method |
| JP2009246200A (en) * | 2008-03-31 | 2009-10-22 | Nippon Steel Chem Co Ltd | Multilayer wiring circuit board and method of manufacturing same |
| CN102700188A (en) * | 2012-05-28 | 2012-10-03 | 珠海亚泰电子科技有限公司 | Heat conducting resin coated copper foil, manufacturing method of heat conducting resin coated copper foil and application of heat conducting resin coated copper foil to aluminum substrate manufacturing process |
| JP2013006278A (en) * | 2011-06-22 | 2013-01-10 | Hitachi Chemical Co Ltd | Metal thin film with adhesive, method for producing the same, copper-clad laminate, and method for producing the copper-clad laminate |
-
2001
- 2001-03-16 JP JP2001075433A patent/JP2002273824A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004053981A1 (en) * | 2002-12-11 | 2004-06-24 | Matsushita Electric Industrial Co., Ltd. | Method of cutting semiconductor wafer and protective sheet used in the cutting method |
| CN100356549C (en) * | 2002-12-11 | 2007-12-19 | 松下电器产业株式会社 | Method of cutting semiconductor wafer and protective sheet used in the cutting method |
| JP2009246200A (en) * | 2008-03-31 | 2009-10-22 | Nippon Steel Chem Co Ltd | Multilayer wiring circuit board and method of manufacturing same |
| JP2013006278A (en) * | 2011-06-22 | 2013-01-10 | Hitachi Chemical Co Ltd | Metal thin film with adhesive, method for producing the same, copper-clad laminate, and method for producing the copper-clad laminate |
| CN102700188A (en) * | 2012-05-28 | 2012-10-03 | 珠海亚泰电子科技有限公司 | Heat conducting resin coated copper foil, manufacturing method of heat conducting resin coated copper foil and application of heat conducting resin coated copper foil to aluminum substrate manufacturing process |
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