CN102700188A - Heat conducting resin coated copper foil, manufacturing method of heat conducting resin coated copper foil and application of heat conducting resin coated copper foil to aluminum substrate manufacturing process - Google Patents
Heat conducting resin coated copper foil, manufacturing method of heat conducting resin coated copper foil and application of heat conducting resin coated copper foil to aluminum substrate manufacturing process Download PDFInfo
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- CN102700188A CN102700188A CN2012101683302A CN201210168330A CN102700188A CN 102700188 A CN102700188 A CN 102700188A CN 2012101683302 A CN2012101683302 A CN 2012101683302A CN 201210168330 A CN201210168330 A CN 201210168330A CN 102700188 A CN102700188 A CN 102700188A
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- copper foil
- heat conducting
- heat conduction
- resin coated
- coated copper
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Abstract
The invention provides heat conducting resin coated copper foil, a manufacturing method of the heat conducting resin coated copper foil and an application of the heat conducting resin coated copper foil to an aluminum substrate manufacturing process. The heat conducting resin coated copper foil comprises a copper foil layer (1), a heat conducting adhesive film layer (2) and a parting film layer (3), wherein the copper foil layer (1), the heat conducting adhesive film layer (2) and the parting film layer (3) are overlapped in sequence; in the process of manufacturing the heat conducting resin coated copper foil, a copper foil roll is unrolled, a heat conducting adhesive film is coated on one surface of the copper foil and then dried, and finally, a parting film is laminated on the heat conducting adhesive film so as to obtain the heat conducting resin coated copper foil; and during manufacturing an aluminum substrate with the heat conducting resin coated copper foil, an aluminum plate is cut and treated, the heat conducting resin coated copper foil is unrolled, the parting film layer on the heat conducting resin coated copper foil is removed, the aluminum plate is pressed on the heat conducting resin coated copper foil, then a protective film is laminated on the external side of the aluminum plate, and the heat conducting resin coated copper foil and the protective film are cut according to the size of the aluminum plate, and finally, an aluminum substrate finished product is obtained. The heat conducting resin coated copper foil provided by the invention can be used in the making field of the aluminum substrates.
Description
Technical field
The present invention relates to production method and this application of heat conduction gum Copper Foil in the aluminium base production technology of a kind of heat conduction gum Copper Foil and this heat conduction gum Copper Foil.
Background technology
The development of LED technology is more and more faster.Aluminium base has good thermal conductivity, electrical insulation properties and machining property, and aluminium base is compared with traditional FR-4, adopts identical thickness; Identical live width; Aluminium base can carry higher electric current, and aluminium base is withstand voltage to reach 4500V, and thermal conductivity factor is greater than 2.0.So in the LED technology, aluminium base is a main bearing plate of making the LED product.Aluminium base is divided into tow sides, and the one side of white is a welding LED pin, and another side presents the aluminium true qualities, contacts with thermal conduction portions after generally can smearing the heat conduction sizing material.In existing aluminium base manufacturing process, often the heat-conducting glue bed of material and aluminium base produced by separation, press together producing good heat conduction sizing material and aluminium base again, again at arranged outside one deck Copper Foil of heat conduction sizing material.As shown in Figure 1, in the process of production heat conduction sizing material, need on one deck mould release membrance A, be coated with and be covered with heat-conducting glue material B after one deck mould release membrance C is sticked in oven dry again, get the raw materials ready.In follow-up production process, need before the two-layer mould release membrance that sticks remove respectively, could finally form the aluminium base finished product to the heat conduction sizing material respectively at the pressing of aluminum plate foundation Copper Foil.This shows, in existing production process, need stick two-layer mould release membrance again and remove; Such way had both increased the input cost of mould release membrance; Also increase the process in aluminium base manufacturing process, increased the complexity of operation, also strengthened staff's labour intensity.If can design a kind of technological process that can simplify the production stage of aluminium base, then can solve the problems referred to above.
Summary of the invention
Technical problem to be solved by this invention is the deficiency that overcomes prior art; A kind of heat conduction gum Copper Foil simple in structure is provided, and the production method of this heat conduction gum Copper Foil, the production method of this heat conduction gum Copper Foil only needs one deck mould release membrance; Simplify technology, saved production cost.
The present invention also provides the technique for applying of above-mentioned heat conduction gum Copper Foil in the aluminium base manufacture craft, and this technology is simple, cost of manufacture is low.
The technical scheme that heat conduction gum Copper Foil of the present invention is adopted is: heat conduction gum Copper Foil of the present invention comprises copper foil layer, heat-conducting glue rete and release rete, and said copper foil layer, said heat-conducting glue rete and said release rete stack gradually.
The technical scheme that production method adopted of heat conduction gum Copper Foil of the present invention is that the production method of said heat conduction gum Copper Foil may further comprise the steps:
(1) to copper foil layer uncoiling material;
(2) evenly apply the above conductive adhesive film to said copper foil layer through coating area and on the one side of said copper foil layer;
(3) copper foil layer of handling through said step (2) is dried, said conductive adhesive film forms the heat-conducting glue rete;
(4) to release rete uncoiling material, be combined in said mould release membrance lamination on the one side of the heat-conducting glue rete of handling through step (3), it is range upon range of to form release rete, heat-conducting glue rete and copper foil layer, obtains heat conduction gum Copper Foil at last.
In the application of heat conduction gum Copper Foil of the present invention in the aluminium base production technology, said heat conduction gum Copper Foil is used as raw material in the aluminium base production technology, and the production technology of this aluminium base may further comprise the steps:
(a) aluminium sheet is cut out and opened: the anode to aluminium sheet is handled, and cuts aluminium sheet on request, cleans carrying out polish-brush through the aluminium sheet that cuts, and is subsequent use;
(b) to said heat conduction gum Copper Foil uncoiling material;
(c) remove release rete on the said heat conduction gum Copper Foil;
(d) the heat conduction gum Copper Foil of handling aluminium sheet of handling through said step (a) and the said step of process (c) presses together and forms the aluminium base semi-finished product, and the one side of removing release rete on the wherein said heat conduction gum Copper Foil fits with said aluminium sheet;
(e) on the half-finished two sides of aluminium base of handling, stick diaphragm through said step (d);
(f) size according to said aluminium sheet cuts the said heat conduction gum Copper Foil that removes release rete, obtains aluminium base at last.
The invention has the beneficial effects as follows: since heat conduction gum Copper Foil of the present invention the heat conduction gum be coated on the Copper Foil through oven dry again with the mould release membrance pressing; So; The present invention compares with traditional heat conduction gum Copper Foil, and the present invention has reduced the release rete of one deck, has both reduced the input of material; Also make and simplified process flow, practiced thrift production cost greatly for follow-up aluminium base.
Because the production method of heat conduction gum Copper Foil of the present invention directly is coated in conductive adhesive film on the Copper Foil, through oven dry, pressing mould release membrance on a side of heat-conducting glue rete again; So the present invention compares with traditional making heat conduction gum rete, has reduced the input of one deck mould release membrance; Reduced production cost; Directly be coated in the heat-conducting glue rete on the Copper Foil simultaneously, saved technological process, provide cost savings expenditure widely for the technology of follow-up production aluminium base.
Because in the application of heat conduction gum Copper Foil of the present invention in the production technology of aluminium base, in heat conduction gum Copper Foil and the process that aluminium sheet combines, need remove one deck mould release membrance; Press together heat conduction gum Copper Foil mutually with aluminium sheet then, promptly form aluminium base, so; Processing step of the present invention is compared with traditional technological process; Can save mould release membrance " the false subsides " action, shortened process has reduced staff's labour intensity.
Description of drawings
Fig. 1 is the structural representation of traditional conductive adhesive film;
Fig. 2 is the structural representation of heat conduction gum Copper Foil of the present invention;
Fig. 3 is the making FB(flow block) of heat conduction gum Copper Foil of the present invention;
Fig. 4 is that heat conduction gum Copper Foil of the present invention is applied to the FB(flow block) in the aluminium base manufacturing process.
The specific embodiment
As shown in Figure 2, heat conduction gum Copper Foil of the present invention comprises copper foil layer 1, heat-conducting glue rete 2 and release rete 3, and said copper foil layer 1, said heat-conducting glue rete 2 and said release rete 3 stack gradually.
As shown in Figure 3, the making step of said heat conduction gum Copper Foil is following:
(1) to copper foil layer uncoiling material;
(2) evenly apply the above conductive adhesive film to said copper foil layer through coating area and on the one side of said copper foil layer;
(3) copper foil layer of handling through said step (2) is dried, said conductive adhesive film forms the heat-conducting glue rete;
(4) to release rete uncoiling material, be combined in said mould release membrance lamination on the one side of the heat-conducting glue rete of handling through step (3), it is range upon range of to form release rete, heat-conducting glue rete and copper foil layer, obtains heat conduction gum Copper Foil at last.
Through above-mentioned steps, can directly be coated on the Copper Foil and oven dry, through on the heat-conducting glue rete side of oven dry, sticking release rete said conductive adhesive film; Reduced the production and the pad pasting of the release rete of one deck, compared with traditional production process, the present invention can reduce the input of mould release membrance material; Reduce cost and reduced the use of mould release membrance; Realize environmental protection, combined with aluminium sheet when making aluminium base, can reduce " the false subsides " action; Shorten technological process, and guaranteed the higher rate of pass and production efficiency.
As shown in Figure 4, in the application of said heat conduction gum Copper Foil in the aluminium base production technology, said heat conduction gum Copper Foil is used as raw material in the aluminium base production technology, may further comprise the steps:
(a) aluminium sheet is cut out and opened: the anode to aluminium sheet is handled, and cuts aluminium sheet on request, cleans carrying out polish-brush through the aluminium sheet that cuts, and is subsequent use;
(b) to said heat conduction gum Copper Foil uncoiling material;
(c) remove release rete on the said heat conduction gum Copper Foil;
(d) the heat conduction gum Copper Foil of handling aluminium sheet of handling through said step (a) and the said step of process (c) presses together and forms the aluminium base semi-finished product, and the one side of removing release rete on the wherein said heat conduction gum Copper Foil fits with said aluminium sheet;
(e) on the half-finished two sides of aluminium base of handling, stick diaphragm through said step (d);
(f) size according to said aluminium sheet cuts the said heat conduction gum Copper Foil that removes release rete, obtains aluminium base at last.
In the production technology of aluminium base, reduce one deck mould release membrance among the present invention, saved the input of mould release membrance material; And reduced " the false subsides " action in the traditional handicraft, so the technological process of production of aluminium base of the present invention shortens; Reduced the expenditure of cost; Through the roll extrusion of high temperature roller, said heat conduction gum Copper Foil can be attached on the aluminium sheet securely, has guaranteed the service life of aluminium base finished product simultaneously.
The present invention can be applicable to the making field of aluminium base.
Claims (3)
1. heat conduction gum Copper Foil; It is characterized in that: said heat conduction gum Copper Foil comprises copper foil layer (1), heat-conducting glue rete (2) and release rete (3), and said copper foil layer (1), said heat-conducting glue rete (2) and said release rete (3) stack gradually.
2. the production method of a heat conduction gum Copper Foil as claimed in claim 1 is characterized in that, this method may further comprise the steps:
(1) to copper foil layer uncoiling material;
(2) evenly apply the above conductive adhesive film to said copper foil layer through coating area and on the one side of said copper foil layer;
(3) copper foil layer of handling through said step (2) is dried, said conductive adhesive film forms the heat-conducting glue rete;
(4) to release rete uncoiling material, be combined in said mould release membrance lamination on the one side of the heat-conducting glue rete of handling through step (3), it is range upon range of to form release rete, heat-conducting glue rete and copper foil layer, obtains heat conduction gum Copper Foil at last.
3. one kind like claim 1 or the application of the described heat conduction gum of claim 2 Copper Foil in the aluminium base production technology; Said heat conduction gum Copper Foil is used as raw material in the aluminium base production technology; It is characterized in that the production technology of said aluminium base may further comprise the steps:
(a) aluminium sheet is cut out and opened: the anode to aluminium sheet is handled, and cuts aluminium sheet on request, cleans carrying out polish-brush through the aluminium sheet that cuts, and is subsequent use;
(b) to said heat conduction gum Copper Foil uncoiling material;
(c) remove release rete on the said heat conduction gum Copper Foil;
(d) the heat conduction gum Copper Foil of handling aluminium sheet of handling through said step (a) and the said step of process (c) presses together and forms the aluminium base semi-finished product, and the one side of removing release rete on the wherein said heat conduction gum Copper Foil fits with said aluminium sheet;
(e) on the half-finished two sides of aluminium base of handling, stick diaphragm through said step (d);
(f) size according to said aluminium sheet cuts the said heat conduction gum Copper Foil that removes release rete, obtains aluminium base at last.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101683302A CN102700188A (en) | 2012-05-28 | 2012-05-28 | Heat conducting resin coated copper foil, manufacturing method of heat conducting resin coated copper foil and application of heat conducting resin coated copper foil to aluminum substrate manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101683302A CN102700188A (en) | 2012-05-28 | 2012-05-28 | Heat conducting resin coated copper foil, manufacturing method of heat conducting resin coated copper foil and application of heat conducting resin coated copper foil to aluminum substrate manufacturing process |
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| CN102700188A true CN102700188A (en) | 2012-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012101683302A Pending CN102700188A (en) | 2012-05-28 | 2012-05-28 | Heat conducting resin coated copper foil, manufacturing method of heat conducting resin coated copper foil and application of heat conducting resin coated copper foil to aluminum substrate manufacturing process |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102329A (en) * | 2016-08-22 | 2016-11-09 | 景旺电子科技(龙川)有限公司 | A kind of embedding potsherd metal base printed circuit board manufacture method |
| CN110356014A (en) * | 2019-07-10 | 2019-10-22 | 深圳市金企电子有限公司 | A kind of copper foil overlay film production technology |
| CN112118688A (en) * | 2019-06-21 | 2020-12-22 | 李家铭 | Process for increasing layer of back-adhesive copper foil |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002273824A (en) * | 2001-03-16 | 2002-09-25 | Tomoegawa Paper Co Ltd | Copper foil laminate with adhesive and its manufacturing method |
| US7217464B2 (en) * | 2002-05-14 | 2007-05-15 | Mitsui Mining & Smelting Co., Ltd. | Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method |
| CN102029745A (en) * | 2010-08-31 | 2011-04-27 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
| CN102250556A (en) * | 2010-05-20 | 2011-11-23 | 松扬电子材料(昆山)有限公司 | Lightproof polyimide back glue film |
-
2012
- 2012-05-28 CN CN2012101683302A patent/CN102700188A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002273824A (en) * | 2001-03-16 | 2002-09-25 | Tomoegawa Paper Co Ltd | Copper foil laminate with adhesive and its manufacturing method |
| US7217464B2 (en) * | 2002-05-14 | 2007-05-15 | Mitsui Mining & Smelting Co., Ltd. | Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method |
| CN102250556A (en) * | 2010-05-20 | 2011-11-23 | 松扬电子材料(昆山)有限公司 | Lightproof polyimide back glue film |
| CN102029745A (en) * | 2010-08-31 | 2011-04-27 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102329A (en) * | 2016-08-22 | 2016-11-09 | 景旺电子科技(龙川)有限公司 | A kind of embedding potsherd metal base printed circuit board manufacture method |
| CN106102329B (en) * | 2016-08-22 | 2019-07-26 | 景旺电子科技(龙川)有限公司 | A kind of embedding potsherd metal base printed circuit board production method |
| CN112118688A (en) * | 2019-06-21 | 2020-12-22 | 李家铭 | Process for increasing layer of back-adhesive copper foil |
| CN110356014A (en) * | 2019-07-10 | 2019-10-22 | 深圳市金企电子有限公司 | A kind of copper foil overlay film production technology |
| CN110356014B (en) * | 2019-07-10 | 2024-02-02 | 深圳市金企电子有限公司 | Copper foil laminating production process |
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Application publication date: 20121003 |