CN1278405C - Clamping device holding pin, roller clamping device and clamping roller for chip - Google Patents
Clamping device holding pin, roller clamping device and clamping roller for chip Download PDFInfo
- Publication number
- CN1278405C CN1278405C CN 03121437 CN03121437A CN1278405C CN 1278405 C CN1278405 C CN 1278405C CN 03121437 CN03121437 CN 03121437 CN 03121437 A CN03121437 A CN 03121437A CN 1278405 C CN1278405 C CN 1278405C
- Authority
- CN
- China
- Prior art keywords
- clamping
- wafer
- clamping pin
- roller
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The present invention relates to a clamping device and a roller clamping device, which is suitable for bearing an ingot cylinder. The clamping device comprises a rotating seat, a clamping seat and a plurality of clamping pins, wherein the clamping seat is fixed onto the rotating seat and is provided with a plurality of supporting arms extending outwards from a center. The clamping pins are respectively arranged on the supporting arms, each clamping pin is provided with a clamping part which is provided with a withstanding surface and a bearing surface, and the withstanding surface is provided with a projection. When the ingot cylinder is positioned on the clamping pins, the edge of the ingot cylinder supports and contacts the withstanding surface of each clamping pin and is positioned between the bearing face and the projection.
Description
Technical field
The invention relates to a kind of clamping device, particularly can not break away from clamping device when rotated in clamping pin relevant for a kind of wafer that makes.
Background technology
In general, in manufacture of semiconductor, wafer is behind process cmp (CMP), all need to do processing such as cleaning and drying, that is to say, wafer can be transported to the step of carrying out cleaning in the DNS AS-2000 equipment, and DNS AS-2000 equipment mainly has a two-sided chamber (double-sided brush scrubbing chamber that scrubs, DBC), a upper brushes chamber wash (topbrush scrubbing chamber, TBC) and a hothouse (dry task chamber, DTC).
See also Figure 1A, in upper brushes chamber wash (TBC), wafer is to be positioned over the action of doing cleaning on the wafer clamping device 1.After a wafer (not shown) was positioned on the clamping pin 11 via a mechanical arm (not shown), this moment, three clamping limbs 12 just can direction as shown by arrow A outwards promote, so that wafer is positioned on the clamping pin 11 more.Then, rotating seat 13 just can rotate and make grip slipper 14 follow together counterclockwise to begin rotation.Then, see also Figure 1B, brush-washing arm 2 can move on wafer clamping device 1 and the wafer W on one, and with scrub part 21 back and forth or rotation scrub wafer W in the rotation.
Yet, please cooperate and consult Figure 1A and Fig. 1 C, because clamping limb 12 is to be connected in grip slipper 14, and must have a gap between clamping pin 11 and the clamping pin holder 15, otherwise clamping pin 11 can't rotate because of the promotion of clamping limb 12 and locate just.When rotating seat 13 rotated with high speed (1500-2500rpm), clamping limb 12 can more outwards promote because of action of centrifugal force, and the feasible clamping pin 11 that is positioned on the clamping pin holder 15 produces tilt phenomenon because of pushing of clamping limb 12.
See also Fig. 1 D and Fig. 1 E, because the contour structures of the clamping part 16 of clamping pin 11 tops, when clamping pin 11 produced, wafer W just can get loose and fly out in wafer clamping device 1 in clamping pin 11 (or clamping part 16), thereby causes the damage of wafer W.Simultaneously, because general clamping pin 11 all is made with plastics, after through long the use, the contact site B of wafer W and clamping part 16 can produce wearing and tearing, even when event clamping pin 11 did not produce, wafer W also can easily get loose in clamping pin 11 (or clamping part 16).
As in hothouse (DTC), wafer is to be positioned on another wafer clamping device equally, after the clamping via clamping pin, follows withering step.Similarly, in hothouse (DTC), clamping pin also can have above-mentioned problem in upper brushes chamber wash (TBC).
On the other hand, see also Fig. 2 A and Fig. 2 B, scrub in the chamber (DBC) two-sided, wafer W is positioned over the action of doing cleaning among the roller clamping device 3.After wafer W was via a mechanical arm (not shown) intake roller clamping device 3, two hold- down roll seats 32,33 are closing and the edge of wafer W can be positioned among a plurality of hold-down roll 31 simultaneously in opposite directions just.Then, each hold-down roll 31 all can be rotated with counter clockwise direction, thereby makes wafer W rotate in a clockwise direction, shown in Fig. 2 C and Fig. 2 D.Then, scrub part 34 and following scrub part 35 can contact lower surface on the wafer W in opposite directions on the roller clamping device 3, and also scrub lower surface on the wafer W in rotary manner simultaneously.
Still see also Fig. 2 C and Fig. 2 D; when the edge of wafer W correctly is arranged in the recess 37 of hold-down roll 31; clamping locating and detecting device 36 can present the normal state that detects; otherwise; when if the edge of wafer W correctly is not arranged in the recess 37 of hold-down roll 31; clamping locating and detecting device 36 can present the unusual state of detection, and sends a warning signal to stop 3 runnings of roller clamping device, and W is without prejudice with the protection wafer.
Yet, see also Fig. 2 E and Fig. 2 F, improper or hold-down roll 31 is excessively during abrasion when mechanical arm itself input, wafer W inputs among the roller clamping device 3 with an angle of inclination possibly, at this moment, when two hold- down roll seats 32,33 in opposite directions during closing, the edge of wafer W can be positioned on the hold-down roll 31, shown in the C part.Again because the edge of wafer W is to be positioned on the hold-down roll 31, so two hold- down roll seats 32,33 are in opposite directions during closing, wafer W can slide on the hold-down roll 31, and the edge that makes clamping locating and detecting device 36 can judge wafer W by accident has arrived location (promptly being arranged in the recess 37 of hold-down roll 31) and present the normal state that detects.At last, when last scrub part 34 and when down scrub part 35 contacts on the wafer W lower surface in opposite directions, just may crush wafer W without correct location.
In U.S. Patent application 2002/0101596A1 number, a kind of semiconductor crystal wafer position detection system is provided, this detecting system mainly has a clamping disk, a fluid pipeline, a plurality of valve, a transducer, an output device and a controller.Semiconductor crystal wafer is to be positioned on the stayed surface of clamping disk, simultaneously, also has a plurality of holes on stayed surface.Fluid circuit is to be connected between the bottom and a fluid flow device of each hole.Valve is to be positioned among the fluid circuit, and in order to flowing of control fluid, transducer also is to be positioned among the fluid circuit, in order to the state of detecting fluid.Output device then is the purposes as output signal.Controller can optionally be used one and open/close controlling signal and an output controlling signal in valve and output device, and detects the position of wafer according to the measurement signal that comes from transducer.
In U.S. Patent application 2002/0135968A1 number, a kind of wafer holding system is provided, this wafer holding system includes a base, a plurality of pore and a plurality of groove.Base has a upper surface, in order to support the semiconductor wafer.A plurality of pores are to run through base, and have and can allow the pipeline of gas stream warp.A plurality of grooves are to be positioned at surface on the base, and are connected in above-mentioned a plurality of pore.This case mainly is the wafer clamping that is applied in the plasma process chamber.
In U.S. Patent application 2002/0066475A1 number, a kind of wafer clamping device of exposure is arranged, this wafer clamping device mainly includes the barycenter of a plurality of removable jig arm, a plurality of fixed support structure and each removable jig arm.Each removable jig arm all is interval in its pivoting point with a distance, so when clamping device does not start, these a plurality of removable jig arm can be rotated to unclamp its clamp on wafer, but when clamping device starts, these a plurality of removable jig arm just can be rotated to clamp wafer, therefore reach the purpose of wafer clamping.Yet the structure of this kind wafer clamping device all can cause great inconvenience too in complexity for operation and maintenance etc.
At United States Patent (USP) the 6th, 059, in No. 889, the roller that discloses a kind of wafer clamping is arranged, the roller of this wafer clamping is to be applied to two-sided scrubbing among the chamber (DBC).When the two-sided work of scrubbing is carried out, roller can rotate with order about wafer with rotation.Roller and wafer can be in contact with one another with its outer rim, and owing to the wafer rotation is ordered about in friction to each other.Simultaneously, because the edge of wafer is the groove that is arranged in the roller outer rim, so worked as the wafer putting position not at that time, one edge of wafer also is positioned on the roller possibly, and being provided with any clamping locating and detecting device, this case do not detect the groove whether wafer is arranged in roller really, therefore, when cleaning brush up and down when closing is scrubbed in opposite directions, just wafer can be crushed.
Summary of the invention
The present invention adopts as detailed below feature with in order to solve the above problems basically.
A purpose of the present invention is that a kind of clamping device will be provided, and is applicable to carrying one wafer, and comprises a rotating seat; One grip slipper is fixed on this rotating seat, and has the therefrom outward extending a plurality of support arms of the heart; And a plurality of clamping pins, be arranged at respectively on these support arms, wherein, each clamping pin has a clamping part, this clamping part has the face of keeping out and a loading end, and this keeps out mask a protuberance, in the time of on this wafer is positioned these clamping pins, the edge of this wafer is to contact in this of each clamping pin to keep out face, and between this loading end and this protuberance.
According to above-mentioned purpose, more comprise at least one clamping limb, be arranged on this grip slipper, and be connected in center and this clamping pin of this grip slipper, be in order to promote this clamping pin so that this clamping pin rotates an angle.
According to above-mentioned purpose, each support arm has more a clamping pin holder, and each clamping pin is to be positioned on this clamping pin holder.
According to above-mentioned purpose, these clamping pins are made by plastics.
Another object of the present invention is that a kind of clamping pin will be provided, and is applicable to carrying one wafer, and comprises a clamping part; One loading end forms on this clamping part; And one keep out face, form on this clamping part, and perpendicular to this loading end, wherein, this keeps out mask a protuberance, in the time of on this wafer is positioned this clamping pin, the edge of this wafer is to contact in this of this clamping pin to keep out face, and between this loading end and this protuberance.
According to above-mentioned purpose, this clamping pin is made by plastics.
Another object of the present invention is that a kind of roller clamping device will be provided, and is applicable to carrying and scrubs a wafer, and comprise one first roller mount; One first hold-down roll, be arranged on this first roller mount, and have a first, a second portion and one first annular groove, wherein, this first annular groove is between this first and this second portion, and the height of this first and this second portion is the thickness much larger than this first annular groove; One second roller mount is with respect to this first roller mount; And one second hold-down roll, be arranged on this second roller mount, and have a third part, one the 4th part and one second annular groove, wherein, this second annular groove is between this third part and the 4th part, and this third part and this tetrameric height are the thickness much larger than this second annular groove, in the time of on this wafer is positioned this roller clamping device, this first roller mount and this second roller mount are closings in opposite directions, and the edge of this wafer is positioned among this first annular groove and this second annular groove.
According to above-mentioned purpose, more comprise on one scrub part and scrub part once, wherein, scrub part is to be positioned on the upper surface of this wafer on this, and this time scrub part is to be positioned under the lower surface of this wafer.
According to above-mentioned purpose, more comprise brush-washing arm on, be connected in scrub part on this.
According to above-mentioned purpose, more comprise brush-washing arm, be connected in this time scrub part.
According to above-mentioned purpose, more comprise a clamping locating and detecting device, be whether correctly to be positioned among this first annular groove and this second annular groove in order to the edge that detects this wafer.
According to above-mentioned purpose, this clamping locating and detecting device is to be arranged on this first roller mount.
According to above-mentioned purpose, this clamping locating and detecting device is to be arranged on this second roller mount.
According to above-mentioned purpose, this clamping locating and detecting device has more light blocking transducer and light blocking subject matter.
According to above-mentioned purpose, this first hold-down roll and this second hold-down roll are made by plastics.
According to above-mentioned purpose, this first hold-down roll and this second hold-down roll are made by synthetic resin.
According to above-mentioned purpose, this first hold-down roll and this second hold-down roll are to rotate in the same direction.
Another object of the present invention is that a kind of hold-down roll will be provided, and is applicable to carrying one wafer, and comprises a first; One annular groove forms under this first; And a second portion, form under this annular groove, wherein, the edge of this wafer is to be positioned among this annular groove, and the height of this first and this second portion is the thickness much larger than this annular groove.
According to above-mentioned purpose, this hold-down roll is made by plastics.
According to above-mentioned purpose, this hold-down roll is made by synthetic resin.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly also cooperates appended graphic elaborating.
Description of drawings
Figure 1A shows a known wafer clamping device;
Figure 1B is the situation that shows that brush-washing arm cleans a wafer on;
Fig. 1 C shows that a wafer is positioned at the schematic side view on the known clamping pin;
Fig. 1 D is the known clamping pin that shows according to Fig. 1 C;
Fig. 1 E is the part schematic top plan view that shows according to Fig. 1 C;
Fig. 2 A is the schematic perspective view that shows a known roller clamping device;
Fig. 2 B is the schematic side view that shows according to Fig. 2 A;
Fig. 2 C shows that a wafer correctly is arranged in the schematic top plan view of a known hold-down roll;
Fig. 2 D is the schematic side view that shows according to Fig. 2 C;
Fig. 2 E shows that a wafer is not properly positioned to the schematic top plan view in the known hold-down roll;
Fig. 2 F is the schematic side view that shows according to Fig. 2 E;
Fig. 3 A shows clamping device of the present invention;
Fig. 3 B shows that a wafer is positioned at the schematic side view on the clamping pin of the present invention;
Fig. 3 C is the part schematic top plan view that shows according to Fig. 3 B;
Fig. 3 D shows clamping pin of the present invention;
Fig. 4 A is the schematic perspective view that shows roller clamping device of the present invention;
Fig. 4 B is the schematic side view that shows according to Fig. 4 A;
Fig. 4 C shows hold-down roll of the present invention;
Fig. 4 D shows that a wafer is not properly positioned to the schematic top plan view in the hold-down roll of the present invention; And
Fig. 4 E is the schematic side view that shows according to Fig. 4 D.
The figure number explanation:
1-wafer clamping device
The last brush-washing arm of 2-
3-roller clamping device
The 11-clamping pin
The 12-clamping limb
The 13-rotating seat
The 14-grip slipper
15-clamping pin holder
The 16-clamping part
The 21-scrub part
The 31-hold-down roll
32,33-hold-down roll seat
The last scrub part of 34-
Scrub part under the 35-
36-clamping locating and detecting device
The 37-recess
The 100-clamping device
The 110-rotating seat
The 120-grip slipper
The 130-clamping pin
The 131-clamping part
132-keeps out face
The 133-loading end
The 134-protuberance
The 140-support arm
141-clamping pin holder
The 150-clamping limb
300-roller clamping device
310-first roller mount
320-second roller mount
The last scrub part of 330-
Scrub part under the 340-
The last brush-washing arm of 350-
Brush-washing arm under the 360-
370-clamping locating and detecting device
371-light blocking transducer
372-light blocking subject matter
The 380-hold-down roll
381-first
The 382-second portion
The 383-annular groove
B, B '-contact site
The d-diameter
The W-wafer
Embodiment
First embodiment
See also Fig. 3 A, the clamping device 100 of present embodiment mainly includes a rotating seat 110, a grip slipper 120 and six clamping pins 130.Grip slipper 120 is to be fixed on the rotating seat 110, and has therefrom outward extending six support arms 140 of the heart.In addition, clamping device 100 also includes three clamping limbs 150, and these three clamping limbs 150 are to be alternately arranged on the grip slipper 120, and is to be connected in the centre of grip slipper 120 and three clamping pins 130 wherein.
See also Fig. 3 B, six clamping pins 130 are to be arranged at respectively on six support arms 140, on each support arm 140, also has a clamping pin holder 141, and each clamping pin 130 all is to be positioned on the clamping pin holder 141, simultaneously, between clamping pin 130 and clamping pin holder 141, have the gap, clamping pin 130 is rotated on the clamping pin holder 141.
Please consult Fig. 3 D earlier, the clamping pin 130 of present embodiment has a clamping part 131.Clamping part 131 has a face of keeping out 132 and a loading end 133, and also has a protuberance 134 on the face of keeping out 132.In addition, clamping pin 130 is made by plastics, so just is unlikely to damage the wafer W of clamping.
As shown in Figure 3A, in upper brushes chamber wash (TBC), wafer W is positioned over the action of doing cleaning on the clamping device 100.After a wafer W is positioned on the clamping pin 130 via a mechanical arm (not shown), this moment, three clamping limbs 150 just can direction as shown by arrow A outwards promote, owing between clamping pin 130 and clamping pin holder 141, have the gap, so when clamping limb 150 outwards promotes, can make clamping pin 130 rotate an angle, so that wafer W is positioned on the clamping pin 130 more.Then, rotating seat 110 just can rotate and make grip slipper 120 follow together counterclockwise to begin rotation.Then, shown in Figure 1B, brush-washing arm 2 can move to the top of clamping device 100 and wafer W on one, and with scrub part 21 back and forth or rotation scrub wafer W in the rotation.
When rotating seat 110 rotated with high speed (1500-2500rpm), though clamping limb 150 can more outwards promote because of action of centrifugal force, the feasible clamping pin 130 that is positioned on the clamping pin holder 141 produced tilt phenomenon because of pushing of clamping limb 150.But owing to have a protuberance 134 on the clamping pin 130 of present embodiment, shown in Fig. 3 B and Fig. 3 C, even so clamping pin 130 produces, wafer W meeting stops because of protuberance 134, and unlikely getting loose flies out outside clamping device 100 in clamping pin 130 (or clamping part 131).
Similarly, shown in Fig. 3 B, after through long the use, the contact site B ' of wafer W and clamping part 131 is though may produce wearing and tearing (no matter clamping pin 130 has or not inclination), but can be because the stopping of protuberance 134, and can't get loose in clamping pin 130.
Especially, shown in Fig. 3 D, the diameter d of the clamping pin 130 of present embodiment can more strengthen, just so can increase the contact area of edge with 130 of the clamping pins of wafer W, and the stability raising when wafer W is held.
Second embodiment
See also Fig. 4 A and Fig. 4 B, the roller clamping device 300 of present embodiment mainly includes scrub part 330 on one first roller mount 310, one second roller mount 320,, once brush-washing arm 350 on the scrub part 340,, once a brush-washing arm 360 and a clamping locating and detecting device 370.First roller mount 310 is with respect to second roller mount 320.Last brush-washing arm 350 is to be connected in scrub part 330, and brush-washing arm 360 is to be connected in down scrub part 340 down, and last scrub part 330 is with respect to following scrub part 340.Clamping locating and detecting device 370 is to be arranged on second roller mount 320, and has light blocking transducer 371 and light blocking subject matter 372.In addition, on first roller mount 310 and second roller mount 320, be respectively arranged with a plurality of hold-down roll 380.
See also Fig. 4 C, the hold-down roll 380 of present embodiment has a first 381, a second portion 382 and an annular groove 383, and annular groove 383 is between first 381 and second portion 382.Especially, the height of first 381 and second portion 382 is the thickness much larger than annular groove 383.In addition, hold-down roll 380 is made by plastics, so just is unlikely to damage the wafer W of clamping.
Shown in Fig. 4 B, scrub in the chamber (DBC) two-sided, wafer W is positioned over the action of doing cleaning among the roller clamping device 300.After wafer W was via a mechanical arm (not shown) intake roller clamping device 300, first roller mount 310 and second roller mount 320 be closing and the edge of wafer W can be positioned among a plurality of hold-down roll 380 simultaneously in opposite directions just.Then, each hold-down roll 380 all can be rotated with counter clockwise direction, thereby makes wafer W rotate in a clockwise direction, shown in Fig. 4 D.Then, scrub part 330 and following scrub part 340 can contact lower surface on the wafer W in opposite directions on the roller clamping device 300, and also scrub the upper and lower surface of wafer W in rotary manner simultaneously.
As mentioned above; when the edge of wafer W is properly positioned in the annular groove 383 of hold-down roll 380; clamping locating and detecting device 370 can present the normal state that detects; otherwise; when if the edge of wafer W correctly is not arranged in the annular groove 383 of hold-down roll 380; clamping locating and detecting device 370 can present the unusual state of detection, and sends a warning signal to stop 300 runnings of roller clamping device, and W is without prejudice with the protection wafer.
See also Fig. 4 E, improper or hold-down roll 380 is excessively during abrasion when mechanical arm itself input, wafer W inputs among the roller clamping device 300 with an angle of inclination possibly, at this moment, when first roller mount 310 and second roller mount 320 in opposite directions during closing, the edge of wafer W just can't be properly positioned among all annular grooves 383, but also can not be positioned on the hold-down roll 380, and can contact first 381 (or second portion 382) in hold-down roll 380, shown in C ' part.At this moment, being arranged at light blocking subject matter 372 on second roller mount 320 just can't move to light and interdict 371 of transducers and can detect normal position, therefore, clamping locating and detecting device 370 can present the unusual state that detects, and send a warning signal to stop 300 runnings of roller clamping device, crush wafer W to prevent scrub part 330 and following scrub part 340 without correct location.
Claims (6)
1. a clamping device is applicable to carrying one wafer, comprising:
One rotating seat;
One grip slipper is fixed on this rotating seat, and has the therefrom outward extending a plurality of support arms of the heart; And
A plurality of clamping pins, be arranged at respectively on this support arm, wherein, each clamping pin has a clamping part, this clamping part has the face of keeping out and a loading end, and this keeps out mask a protuberance, in the time of on this wafer is positioned this clamping pin, the edge of this wafer is to contact in this of each clamping pin to keep out face, and between this loading end and this protuberance.
2. clamping device according to claim 1 more comprises at least one clamping limb, is arranged on this grip slipper, and is connected in center and this clamping pin of this grip slipper, is in order to promote this clamping pin so that this clamping pin rotates an angle.
3. clamping device according to claim 1, wherein, each support arm has more a clamping pin holder, and each clamping pin is to be positioned on this clamping pin holder.
4. clamping device according to claim 1, wherein, this clamping pin is made by plastics.
5. a clamping pin is applicable to carrying one wafer, comprising:
One clamping part;
One loading end forms on this clamping part; And
One keeps out face, form on this clamping part, and perpendicular to this loading end, wherein, this keeps out mask a protuberance, in the time of on this wafer is positioned this clamping pin, the edge of this wafer is to contact in this of this clamping pin to keep out face, and between this loading end and this protuberance.
6. clamping pin according to claim 5, wherein, this clamping pin is made by plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03121437 CN1278405C (en) | 2003-03-27 | 2003-03-27 | Clamping device holding pin, roller clamping device and clamping roller for chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03121437 CN1278405C (en) | 2003-03-27 | 2003-03-27 | Clamping device holding pin, roller clamping device and clamping roller for chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1534755A CN1534755A (en) | 2004-10-06 |
| CN1278405C true CN1278405C (en) | 2006-10-04 |
Family
ID=34285703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03121437 Expired - Lifetime CN1278405C (en) | 2003-03-27 | 2003-03-27 | Clamping device holding pin, roller clamping device and clamping roller for chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1278405C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI731940B (en) * | 2016-03-07 | 2021-07-01 | 奧地利商蘭姆研究股份公司 | Apparatus for liquid treatment of wafer shaped articles |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1796966B (en) * | 2004-12-22 | 2010-09-01 | 中芯国际集成电路制造(上海)有限公司 | Clamp for preparing detection sample in use for electron microscope |
| KR100809594B1 (en) * | 2006-09-12 | 2008-03-04 | 세메스 주식회사 | Chucking member and spin head, method for chucking a substrate using the chucking member |
| CN101716585B (en) * | 2009-12-14 | 2012-11-14 | 中国电子科技集团公司第四十五研究所 | Silicon chip cleaning device of chemical and mechanical polishing equipment |
| CN102059225A (en) * | 2010-11-23 | 2011-05-18 | 南通富士通微电子股份有限公司 | Wafer protecting device of cleaning machine |
| CN105529291A (en) * | 2014-09-29 | 2016-04-27 | 盛美半导体设备（上海）有限公司 | Wafer supporting device |
| CN204792711U (en) * | 2015-01-27 | 2015-11-18 | 精材科技股份有限公司 | stripping device |
| CN107591351B (en) * | 2016-07-06 | 2020-02-14 | 北京北方华创微电子装备有限公司 | Robot and semiconductor processing apparatus |
| CN109571782A (en) * | 2018-10-26 | 2019-04-05 | 广州市昊志机电股份有限公司 | A kind of rotatable quick-clamping module of high-precision |
| CN110034062A (en) * | 2019-04-19 | 2019-07-19 | 德淮半导体有限公司 | Wafer clamping device and chuck |
| CN111112186B (en) * | 2019-12-27 | 2022-08-09 | 上海至纯洁净系统科技股份有限公司 | Wafer cleaning equipment |
| CN112768392A (en) * | 2021-01-07 | 2021-05-07 | 北京北方华创微电子装备有限公司 | Wafer transmission device |
| CN115863227A (en) * | 2023-03-02 | 2023-03-28 | 拓思精工科技(苏州)有限公司 | Wafer fine cleaning tool and using method thereof |
| CN116864424B (en) * | 2023-09-05 | 2023-11-14 | 上海图双精密装备有限公司 | Tab self-correction system and method for silicon wafer cassette and lithography machine |
-
2003
- 2003-03-27 CN CN 03121437 patent/CN1278405C/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI731940B (en) * | 2016-03-07 | 2021-07-01 | 奧地利商蘭姆研究股份公司 | Apparatus for liquid treatment of wafer shaped articles |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1534755A (en) | 2004-10-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1278405C (en) | Clamping device holding pin, roller clamping device and clamping roller for chip | |
| CN1137503C (en) | Cutting device | |
| JP4502260B2 (en) | Spinner cleaning device and dicing device | |
| KR102058754B1 (en) | Cleaning apparatus | |
| JP2014033178A (en) | Liquid processing apparatus, cleaning jig and cleaning method | |
| TW202107552A (en) | Rotary drying device characterized by efficiently executing a drying process of little residual water | |
| WO2020189039A1 (en) | Cleaning head, center brush, outer peripheral brush, substrate cleaning device, and substrate cleaning method | |
| CN1097490C (en) | Spinning device and spinning method | |
| TWI379351B (en) | Apparatus and method of cleaning substrate | |
| US8915771B2 (en) | Method and apparatus for cleaning grinding work chuck using a vacuum | |
| CN1541151A (en) | Polishing method | |
| JP2010177602A (en) | Spinner cleaning device | |
| TWI384542B (en) | Treatment device and surface treatment jig | |
| CN1792475A (en) | Dry cleaning apparatus used to manufacture semiconductor devices | |
| JP2003092278A (en) | Apparatus and method for treatment of substrate | |
| JPH10261605A (en) | Semiconductor processor | |
| CN1153271C (en) | Jig | |
| CN1251301C (en) | Method for removnig polymer and apparatus for removing polymer | |
| JP7045867B2 (en) | Board processing method | |
| JP2009218249A (en) | Wafer cleaning equipment and production process of semiconductor device | |
| JP6403564B2 (en) | Cleaning device | |
| JP7104580B2 (en) | Substrate cleaning equipment and substrate cleaning method | |
| US20070256632A1 (en) | Systems and methods for clamping semiconductor wafers | |
| JP5471777B2 (en) | Wafer processing method and wafer processing apparatus | |
| JP6043060B2 (en) | Holding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20061004 |
|
| CX01 | Expiry of patent term |