CN1251364C - 用于连接导体的方法和装置 - Google Patents

用于连接导体的方法和装置 Download PDF

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CN1251364C
CN1251364C CNB028059549A CN02805954A CN1251364C CN 1251364 C CN1251364 C CN 1251364C CN B028059549 A CNB028059549 A CN B028059549A CN 02805954 A CN02805954 A CN 02805954A CN 1251364 C CN1251364 C CN 1251364C
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sonotrode
flat conductor
conductor
weld
counter electrode
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CN1494753A (zh
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E·施泰纳
D·施特罗
H·迪特尔勒
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Schunk Ultraschalltechnik GmbH
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Abstract

本发明涉及一种借助于超声焊接、将呈外绝缘包围的电导体形式的扁导体连接和焊接的方法和装置,其中该装置具有一个产生超声波振动的超声焊极及一个焊接时支承所述扁导体并与所述超声焊极相配置的对应电极,其中该待焊接的扁导体位于一个支架的一个平面上,该用于焊接扁导体的超声焊极可沿所述支架平面相对移动,且该支架至少部分区域设计成所述对应电极或者具有通孔,在具有通孔的情况下该对应电极可伸入其中。

Description

用于连接导体的方法和装置
技术领域
本发明涉及一种用产生超声波振动的超声焊极以及配置于该超声焊极的对应电极来实施要搭接的扁导体的包有外绝缘的电导体象焊接那样的连接方法,其中,在超声焊极和对应电极之间延伸的支架表面上放置要连接的导体。此外,本发明涉及一种用产生超声波振动的超声焊极以及配置于该超声焊极的对应电极来实施要搭接的扁导体的包有外绝缘的电导体象焊接那样的连接装置。其中,要焊接的导体可放置在支架的一个介于超声焊极和对应电极之间延伸的表面上。
背景技术
特别是汽车电网布线要求大范围使用扁导体(柔性印制电缆;柔性层压电缆;柔性扁电缆)。这种扁导体也叫做导体箔,具有高的韧性和小的占地面积以及节省重量的特点。在扁导体相互连接时,必须确保接触部位能够经受机械负荷以便保证所需的电力线或信号线的安全。有时往往需要在极窄的空间将搭接的扁导体的电导体进行导电连接。此外,由于扁导体在不断增加的范围内代替电缆束,所以必须提供把许多扁导体进行电连接的可能性。为此,必须把这些扁导体事先在一个平面内相互对准。
文献EP1014515A1和EP0191175B1提出了用超声波焊接来互相连接扁导体。
发明内容
本发明的任务是改进一种开始所述类型的方法和装置,来把搭接的、在一个平面内相互对准的许多扁导体的电导体在要求的范围内极精确连接起来。
根据本发明,通过一种借助于超声焊接、将呈外绝缘包围的电导体形式的扁导体连接和焊接的方法,其中,在一个超声焊极和对应电极之间放置所述的扁导体,所述超声焊极产生超声波振动,通过调整该超声焊极相对所述对应电极的位置而将一个力引导到所述的扁导体上,其特征为所述方法包括:
将所述扁导体以下述方式布置在一个支架上,即使得扁导体在不同的区域叠置;
使所述超声焊极和该叠置的并要焊接的区域逐步相互对准,通过该超声焊极与一个区域对准而实施对所述扁导体的焊接,其中所述支架可在相应的区域作为所述的对应电极构成,或该支架在每一个所述的区域具有一个通孔,此时的焊接让该对应的电极对准所述的通孔,或让所述的通孔对准该对应电极。
本发明还进一步提供一种借助于超声焊接、将呈外绝缘包围的电导体形式的扁导体连接和焊接的装置,该装置具有一个产生超声波振动的超声焊极及一个焊接时支承所述扁导体并与所述超声焊极相配置的对应电极,其中该待焊接的扁导体位于一个支架的一个平面上,其特征为:
该用于焊接扁导体的超声焊极可沿所述支架平面相对移动,且该支架至少部分区域设计成所述对应电极或者具有通孔,在具有通孔的情况下该对应电极可伸入其中。
其中,超声焊极可对于该支架移动。该支架可对超声焊极进行调节,或双方相互调节同样是可能的。
作为超声焊极可单独使用这样的超声焊极,它被设计成扭转振荡器,作为摇杆被支承的纵向振荡器、平行导向的纵向振荡器或弯曲振荡器。
但本发明的特征是,超声焊极在扭转振动中用于产生使导体象焊接那样的连接所需的超声波能量,且超声焊极以其纵轴垂直或倾斜于支架的表面而延伸,在该表面上放置要象焊接那样要连接的扁导体。
根据本发明,超声波焊接装置特别适用于一个扭转振荡器、一个设计成摇杆的纵向振荡器、一个平行导向的纵向振荡器、一个弯曲振荡器或公知的一种其它的超声焊极结构的超声波焊接装置,以便产生超声波能量。然后,超声焊极或其焊接面对准要焊接的导体。作为对应电极可用支架本身,在该支架上,扁导体相互精确定位地对准放置。但该支架也可设置通孔,以便在进行焊接时,对应电极在需要的范围内对准通孔并支撑要连接的导体。
此外,在用扭转振荡器作为发生超声波能量的超声焊极时,既可通过纯碎的机械连接也可通过焊接实现导体的连接。前者是这样实现的,超声焊极头的端面侧做成逐渐变尖的顶尖,借助该顶尖可刺穿要连接的导体,从而使这些导体在相同方向产生变形并相互实现机械的形状配合的连接。这样被刺穿的导体的焊接可附加地通过超声焊极的焊接面与导体及其在对应电极上的支撑的接触来实现。为此,对应电极可根据机械连接的导体的通过刺穿产生的几何形状来设置一个漏斗形的凹槽,被刺穿的导体沿着该凹槽的界面延伸。
为了在规定的区域实施导体的精确的焊接,本发明的其它方案建议用一个光学系统在目视控制下使超声焊极对准焊接的导体。这时目视控制可通过图像处理来进行。这样,超声焊极就可自动移动到要进行焊接的导体区域内。
但也存在或补充存在这样的可能性,即要焊接的区域用光例如用激光束标出,以便超声焊极自动或用手动移动。
本发明还有这样的特点,用超声焊极不但可以进行导体即金属的焊接,而且也可用超声波通过塑料焊接使搭接的外绝缘相互连接。为此,超声焊极设计成可在一个区域上进行金属焊接并在垂直于超声焊极的实际的或假定的振动方向的另一个区域上进行塑料焊接。
而开始所述类型的装置则具有这样的特点,用于焊接导体的超声焊极可在不同的区域内沿着支架的表面相对移动,且该支架或者具有对应电极可以对准的通孔或者至少部分区域地设计为对应电极。在这种情况下,该超声焊极可以是一个扭转振荡器、一个设计成摇杆的纵向振荡器、一个平行导向的纵向振荡器或一个弯曲振荡器。
特别是,超声焊极是一个扭转振荡器,其纵轴倾斜于或垂直于支架的支承扁导体的表面而延伸。其中,超声焊极和对应电极可设计成焊钳。在这种情况中,超声焊极和对应电极形成一个可对于扁导体进行调节的单元。
但象扭转振荡器的超声焊极也可从一个平行于表面的、在两个坐标方向内可移动的门架出发,超声焊极可相对于该门架调节高度和/或旋转。超声焊极最好从一根可沿门架调节的横梁开始,该超声焊极可沿并相对于该横梁进行调节。
如果扁导体的支架不是对应电极,则对应电极可设计成与超声焊极同步运动,这样就可很精确地并在短时间内移动到要相互焊接的扁导体的区域。
根据本发明的另一项建议,超声焊极可用一个多轴机器人系统或用一个Scara机器人进行调节。使超声焊极对准要连接或要焊接电导体的其它方案同样是可行的。
根据本发明的一个改进方案,为了使焊点平面延伸而瞄准要焊接的导体或达到高的使用年限,扭转振荡器形式的超声焊极设置了一个具有至少两个焊接面的超声焊极头面,这两个焊接面可具有不同的延伸。其中,所要求的焊接面可通过扭转振荡器绕其纵轴的旋转和/或倾斜来对准要焊接的导体。
特别是,超声焊极头面具有一个锥体、例如一个圆锥、截锥、三角锥或角锥台的表面形状。这样,不同的焊接面可与扭转振荡器的纵轴相隔一定距离分布在该表面上并通过超声焊极即扭转振荡器的旋转或倾斜来对准焊接区域。
根据本发明的另一项独特的建议,扭转振荡器形式的超声焊极具有一个沿其纵轴向内延伸的顶尖,以便刺穿要连接的扁导体,从而以机械的尤其是形状配合连接的方式实现导体的连接。在这种情况下,可用超声波补充地进行导体的焊接。为此,对应电极具有一个漏斗状的空隙,被刺穿的导体在该空隙内延伸,以便随后进行焊接。
此外,存在着这样的可能性,超声焊极即超声焊极头设计成可在一个区域内进行金属焊接即导体的相互连接,并在另一个区域内进行扁导体的外绝缘的连接即塑料焊接。
超声焊极对要焊接的导体的定位可用光学控制装置来实现。为此,可应用图像处理和/或光束例如激光束,该光束可对准焊接区或焊接点,以方便超声焊极或其焊接面的自动或手动移动。
在焊接的同时可进行质量监控,最好进行例如与伺服传动的行程相关的、能量相关的、时间或力相关的监控。也可进行多级焊接,这方面有足够的技术可资参考。此外,无疑存在这样的可能性,例如根据要焊接的材料用不同的频率进行焊接。
本发明的其它细节、优点和特征还可从附图所示各个优选实施例的下列说明中得知。
附图说明
图1扁导体一个搭接区的俯视图;
图2扁导体焊接装置的原理图;
图3扁导体焊接装置另一实施例的部分;
图4扭转振荡器形式的超声焊极的一段;
图5用对应电极连接电导体的扭转振荡器的原理图;
图6设计成纵向振荡器的超声焊极的原理图;
图7设计成弯曲振荡器的超声焊极的原理图。
具体实施方式
图1表示扁导体12和14之间的一个示意的搭接区10。图中示出扁导体12和14成直角相交,但根据本发明的原理不应受其限制。确切地说,这种情况普遍适用于至少部分的扁导体叠置且其导体要进行导电连接的搭接区域。在图1中也没有画出为实现本发明原理而提出的一个独特方案,即把许多扁导体铺开相互在一个平面内对准,以便然后按需要的范围连接电导体,如由图2原理地示出。
此外,从图1可以看出,扁导体12、14以公知的方式具有象扁铜线路那样的设计成印制导线的电导体16、18或20、24。然后用平面的外绝缘物包覆导体16、18、20、24,这可通过把线路埋入例如聚酯薄膜中来实现。
如果扁导体的导体要进行相互连接,则这些导体在搭接区域内最好裸露,然后相互接触。在所示实施例中,电导体18、24和16、20在接触部位30、32上通过焊接实现连接。为此,绝缘26、28首先按一般的方式例如用激光剥除,以便然后将裸露的导体相互连接。但对一定的使用场合来说,也可用超声波焊接来实现接触,而无须事先的两方面的去除绝缘。
为了使接触部位能经受大的机械负荷,搭接区10可用护层包覆,它们以导体12、14外面的区段38、40、42、44延伸并通过超声波焊接相互连接。从而使接触部位30、32机械稳定化。但同时不损失扁导体12、14本身的柔性,因为平面的护层是用塑料例如用热熔性胶粘剂或具有热熔性胶粘剂的塑料带制成的,且其厚度大致与扁导体的厚度相当。因此,由于护层的很小的高度,可以看出不会明显改变扁导体12、14的结构高度。
护层最好呈圆形,这样,在导体12、14之间延伸的区段38、40、42、44就可成图1所示那样的周边平齐。此外,在导体12、14安装在例如汽车内后,区段38、40、42、44可作为固定件使用。图1用附图标记46表示一个相应的固定点。
为了可相互导电连接扁导体47、49,本发明建议将扁导体47、49放在一个支架50的表面48上,以便然后用超声波焊接进行导电连接。为此,相应的超声焊极52必须对准要焊接的部位。超声焊极52可以是一个扭转振荡器,该振荡器与一个图中未详细示出的转换器连接,以便把电振荡转换成具有一定频率和振幅的超声波振动。转换器布置在一个壳体54中,该壳体可沿横梁56调节,而该横梁则可沿门架58移动。从而提供了这样的可能性,即超声焊极52可在整个平面48上移动,亦即可调节到要求的任一点上。所以覆盖了图2所示的XY坐标系。此外,壳体54和超声焊极52也可在Z方向调节并绕其纵轴旋转,以便利用超声焊极头的要求的焊接区,这点将结合图3和4进行说明。
配置于超声焊极52的对应电极可以是支架50本身。另一种办法是,如图3所示,支架60可具有通孔68,在支架的表面62放置扁导体64、66。其中,扁导体64、66的要相互焊接的区域与这些通孔对准。然后,对应电极72通过通孔68,以支撑扁导体64、66。在这个实施例中,对面的扭转振荡器74下降到连接区并产生旋转振动(箭头76),以便进行金属焊接。
如图2的超声焊极52或图4的相应超声焊极74所示,超声焊极74具有一个带一截锥形头78的圆柱体76,该截锥头的外表面80上具有多个焊接面82、84、86,这些焊接面必要时设计成不同的尺寸并可装配到扁导体64、66的要焊接的区域,以便在扁导体同时支撑在对应电极72上时进行扁导体64、66的电导体焊接。为了使超声焊极头的一个要求的焊接区82、84、86对准一个接触区,只须超声焊极74围绕其纵轴88旋转和/或摆动(双箭头90)。
为了使超声焊极74、也就是焊接面82、84、86精确地对准焊接区域,可使用一个光学系统例如图像处理系统。超声焊极也可用手移动,这时要焊接的区域例如可用光例如用激光束作标记。为此,从图2所示的壳体54伸出一个手柄55。
应当指出,在图3实施例中,超声焊极74和对应电极72可设计成焊钳,所以可进行同步运动。
如果在图2所示门架结构时,支架52不设计成对应电极,而是象图3那样具有通孔,接触部位对准这些通孔,那么在表面48下方,对应电极或砧座则可与超声焊极52同步运动。
上面结合图2至4对于用扭转振荡器52、74来焊接搭接扁导体12、14、47、49、64、66的导体的接触部位进行了说明,本发明的原理也可用超声波焊接技术公知的其它超声焊极例如用一个纵向振荡器102(图6)或弯曲振荡器104(图7)来实现。其中,纵向振荡器102和弯曲振荡器104最好设计成摇杆状而可倾斜,以便精确对准搭接的导体12、14、64、66的所希望的焊接点。纵向振荡器102安装在一个振荡波节108内,以便相应于双箭头110倾斜,从而下降到焊接部位。在这个实施例中,超声焊极106与一个转换器112无增强地连接。
当然,振荡器102、104也可平行移动到焊接点。
弯曲振荡器104以摇杆的形式安装在增强器116的区域114内,该增强器连接弯曲振荡器104的超声焊极118与转换器120。关于纵向振荡器102或弯曲振荡器104的结构或工作原理可参阅足够多的公知的技术,故在此不赘述。
在焊接时本身可进行质量监控。这可例如与伺服传动的行程关系和/或能量关系、时间关系或力关系来实现。也可进行多级焊接。
超声焊极的对准也可有别于上述的实施例,用一个多轴机器人系统或一个Scara机器人来实现。别的实现方法也是可行的。但起决定性作用的是,超声焊极或其焊接面应当极精确地对准要焊接的区域。同时应当保证到焊接部位的最佳可达性。这尤其可通过相应于图3和4的实施例的对于扭转振荡器的设计来实现。
图5表示本发明的另一设计方案。这里用一个扭转振荡器92不仅可以实现扁导体的要连接的电导体的焊接,而且同时可通过该振荡器刺穿导体本身来实现机械连接。为此,超声焊极92端面侧具有一个顶尖94,该顶尖设计成能把要连接的导体类似点状地刺穿,从而使要连接的导体通过顶尖94的形状产生一个预定的凹坑状结构。这时,导体的伸直被一个配置于超声焊极92的对应电极96限制,该对应电极具有一个喇叭状或漏斗状的空隙98,在刺穿导体时,超声焊极92的顶尖94部分地伸入该空隙中。所以顶尖94和空隙98的几何形状是相互吻合的。这样,导体就紧贴在空隙98的接触面100上,所以接下来可用由超声焊极92产生的超声波能量来焊接导体。这就是说,对应电极96的空隙98的接触面100起砧座的作用。所以图5实施例的导体被刺穿并用超声波焊接。

Claims (24)

1.一种借助于超声焊接、将呈外绝缘包围的电导体形式的扁导体连接和焊接的方法,其中,在一个超声焊极和对应电极之间放置所述的扁导体,所述超声焊极产生超声波振动,通过调整该超声焊极相对所述对应电极的位置而将一个力引导到所述的扁导体上,其特征为所述方法包括:
将所述扁导体以下述方式布置在一个支架上,即使得扁导体在不同的区域叠置;
使所述超声焊极和该叠置的并要焊接的区域逐步相互对准,通过该超声焊极与一个区域对准而实施对所述扁导体的焊接,其中所述支架可在相应的区域作为所述的对应电极构成,或该支架在每一个所述的区域具有一个通孔,此时的焊接让该对应的电极对准所述的通孔,或让所述的通孔对准该对应电极。
2.按权利要求1的方法,其特征为:
所述超声焊极被设计成一个扭转振荡器,一个作为摇杆被支承的纵向振荡器,一个平行导向的纵向振荡器或弯曲振荡器。
3.按权利要求1的方法,其特征为:
该产生导体焊接所需的超声波能量的超声焊极产生扭转振动,其中超声焊极以其纵轴倾斜于或垂直于放置要焊接扁导体的表面延伸。
4.按权利要求3的方法,其特征为:
该产生扭转振动的超声焊极既可机械刺穿扁导体又可焊接扁导体。
5.按权利要求1的方法,其特征为:
所述超声焊极在目视控制下借助光学系统对准要焊接的扁导体。
6.按权利要求5的方法,其特征为:
目视控制通过图像处理来进行。
7.按权利要求1的方法,其特征为:
所述扁导体的要焊接的区域用光标出。
8.一种借助于超声焊接、将呈外绝缘包围的电导体形式的扁导体连接和焊接的装置,该装置具有一个产生超声波振动的超声焊极及一个焊接时支承所述扁导体并与所述超声焊极相配置的对应电极,其中该待焊接的扁导体位于一个支架的一个平面上,其特征为:
该用于焊接扁导体的超声焊极可沿所述支架平面相对移动,且该支架至少部分区域设计成所述对应电极或者具有通孔,在具有通孔的情况下该对应电极可伸入其中。
9.按权利要求8的装置,其特征为:
所述超声焊极(52)是一个扭转振荡器(74、92)、一个设计成摇杆的纵向振荡器(102)、一个平行导向的纵向振荡器或一个弯曲振荡器(104)。
10.按权利要求9的装置,其特征为:
所述扭转振荡器(74)以其纵轴(88)倾斜于或垂直于支架(50、60)的支撑所述扁导体的表面(68、42)而延伸。
11.按权利要求8的装置,其特征为:
所述超声焊极(74)和对应电极(72)设计成焊钳。
12.按权利要求8的装置,其特征为:
所述超声焊极(52)自门架(56、58)延伸,并可平行于表面(48)而在两个坐标方向移动,该超声焊极可相对于该门架调节高度和/或旋转。
13.按权利要求12的装置,其特征为:
所述超声焊极(52)从一根可沿门架(58)调节的横梁(56)出发,该超声焊极可沿并相对于该横梁调节或旋转。
14.按权利要求9的装置,其特征为:
所述以扭转振荡器(74)形式的超声焊极具有一个带至少两个焊接面(82、84、86)的超声焊极头面(80)。
15.按权利要求14的装置,其特征为:
所要求的焊接面(82、84、86)可通过扭转振荡器(74)的旋转和/或倾斜对准要焊接的导体。
16.接权利要求14的装置,其特征为:
所述超声焊极头面(80)具有一个锥体例如一个圆锥、截锥、三角锥或角锥台的表面。
17.按权利要求8的装置,其特征为:
所述对应电极(72)可相对于所述超声焊极(74)进行同步调节。
18.按权利要求8的装置,其特征为:
所述超声焊极通过一个多轴机器人系统进行调节。
19.按权利要求8的装置,其特征为:
所述超声焊极设计成既可进行金属焊接又可进行塑料焊接。
20.按权利要求9的装置,其特征为:
所述以扭转振荡器形式的超声焊极(92)具有一个在其纵轴向内延伸的顶尖(94),以便刺穿要连接的扁导体。
21.按权利要求8的装置,其特征为:
所述超声焊极可用光学控制装置定位到要焊接的扁导体上。
22.按权利要求21的装置,其特征为:
所述超声焊极定位到要焊接的扁导体上是通过图像处理来实现的。
23.按权利要求8的装置,其特征为:
所述扁导体的要焊接的区域用光束来指示。
24.按权利要求23的装置,其特征为:
所述要焊接的区域用激光束来指示。
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