CN1250551A - 侧向约束激光器 - Google Patents
侧向约束激光器 Download PDFInfo
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- CN1250551A CN1250551A CN98803285A CN98803285A CN1250551A CN 1250551 A CN1250551 A CN 1250551A CN 98803285 A CN98803285 A CN 98803285A CN 98803285 A CN98803285 A CN 98803285A CN 1250551 A CN1250551 A CN 1250551A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2275—Buried mesa structure ; Striped active layer mesa created by etching
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Abstract
在包括台结构(11)的半导体激光器中;为了减小靠近激活发射层(15)的台壁处的电流,通过在台结构内设置一带有宽度小于台结构(11)的、处于台结构(11)中央的缝隙(14)的电流阻挡层(13),使台结构(11)中的侧向电流分布受到控制。
Description
本发明一般地涉及激光器,特别地涉及半导体激光器中的侧向约束的改进。
带有用于注入电流的侧向约束的半导体激光器是为人熟知的。
掩埋波导型半导体激光器,也称为掩埋异构型半导体激光器,可从例如US-A-5,227,015、US-A-5,260,230、US-A-5,398,255、US-A-5,452,315和US-A-5,470,785获知。
脊波导型激光器和掩埋波导型激光器两者都具有电约束和光约束的侧向控制。
所谓侧方向,是理解为垂直于外延生长的方向。对于竖直空穴表面发射型激光器(VCSELs-Vertical Cavity Surface Emitting Lasers)来说,侧方向可以指垂直于生长方向的平面内的所有方向。对于边缘发射型激光器(EELs-Edge Emitting Lasers)来说,侧方向通常指垂直于激光传播的方向。
另外,电侧约束是指在侧向对注入电流的散布的控制,而光侧约束是指激光的波导侧向控制。
对于脊波导型激光器,在激活区上方形成有一个脊(或台),毗邻激光发射的激活区不限于侧方向。电侧约束通过在激活层注入电流的有限的散布而达到,原因是上述脊的宽度有限。光侧约束由于脊的波导作用而达到。对于掩埋波导型激光器,激活层通过(即包括于)台而受到侧向约束。台向外延伸地掩埋,以避免因晶体在激活发射区的空穴的不完全性而导致不良的表现。电侧约束和光侧约束分别由分别位于频带偏移和折射率的激活材料和掩埋材料的差别而获得。
然而,对于普通的脊波导型激光器和掩埋波导型激光器,电侧约束和光侧约束两者都受到同样的设计参数即台、激活层和掩埋材料的实际尺寸和材质的控制。
本发明的目的是分别改善电侧约束特性和光侧约束特性而基本上不受控制参数的影响。
此目的是这样达到的,即在台内设置将电流基本上在侧向被阻挡而又基本上不改变激光的侧向波导作用的一层或多层。
这样,激光器的门限电流和/或总驱动电流会减小。而且,激光器的寿命会增加。例如,对于脊型激光器来说,在激活区不发射激光时,电流损失较小;而对于掩埋型激光器,通常作为重新复合和分解中心的靠近台侧壁的电流也会减小。
从而,根据本发明,可获得具有较好性能的激光器,即门限电流较低,注入效率较高,输出功率较高,光谱控制较好,并且有改善了的长期可靠性。
以下参照附图对本发明进行较详细的说明。附图中,
图1是本发明的一个掩埋波导型激光器实施例的透视图,及
图2是本发明的一个脊波导型激光器实施例的透视图。
图1是根据本发明的一个掩埋波导型半导体激光器实施例的透视图。
按照已知的方式,此激光器包括基片10和掩埋于一电流阻挡层12中的台结构11。
根据本发明,为了减小沿台结构11壁的电流,就要控制台结构11中的侧向电流分布,因而带有一个宽度小于台结构11的缝隙14的电流阻挡层13应定位成使其缝隙14基本上处于台结构11的中央。
在根据图1的台结构11中,带有缝隙14的电流阻挡层13以间隔层16与底部激活层15隔开,电流阻挡层13上面有覆盖层17。在本实施例中,覆盖层17也填满电流阻挡层13中的缝隙14。在台结构11和电流阻挡层12上面有接触层18。
在图1的实施例中,带有缝隙14的电流阻挡层13位于台结构11中的激活层15的上方。
可以理解,对于掩埋波导型激光器来说,带缝隙的电流阻挡层同样可以位于台结构的激活层的下面。事实上,激活层上方可以有一个带缝隙的电流阻挡层,而其下面可以有另一个带缝隙的电流阻挡层。
如上所述,带有缝隙14的电流阻挡层13的存在以受控制的方式减小了台壁处的电流。
利用电流阻挡层13中的缝隙14,迫使载流子的传输基本上侧向限制在缝隙14内,如图1中的箭头所示。在通过缝隙14之后,载流子散布到激活层13,在该处极性相反的载流子重新复合。由于层13的电流阻挡部分部分地跨过激活层15,沿台结构11的壁的电流会减小。这样,门限和/或驱动电流也会减小,并且/或者激光器的可靠性会增加。
图2是本发明的一个脊波导型半导体激光器实施例的透视图。
如同图1,图2中的激光器按照已知的方式包括基片20、激活层24和台结构21。
在图2的实施例中,激活层24中侧向电流分布的控制是通过本发明的带有宽度小于台结构21的缝隙23的电流阻挡层22来确定其在台结构21中的侧向散布得到改善的。电流阻挡层22定位成使其缝隙23基本上处于台结构21的中央。
在图2中,带有缝隙23的电流阻挡层22以间隔层25与底部激活层24隔开。电流阻挡层22上面有覆盖层26。在图2的实施例中,覆盖层26也填满电流阻挡层22中的缝隙23。在台结构21上面有接触层27。
同样,在图2的实施例中,由层22的电流阻挡部分迫使载流子的传输基本上侧向限制在缝隙23内,如图2中的箭头所示。
从而,在图1的实施例中,带有缝隙14的电流阻挡层13位于台结构11内;类似地,在图2的实施例中,带有缝隙23的电流阻挡层22位于台结构21内。
在所示的两个实施例中,与已知的掩埋型激光器和脊型激光器相比,沿台壁的电流会减小。
Claims (5)
1.一种带有台结构(11,21)的半导体激光器,其特征在于,在台结构(11,21)内设置至少一个带有宽度小于台结构(11,21)的、基本上处于台结构(11,21)中央的缝隙(14,23)的电流阻挡层(13,22)。
2.根据权利要求1的激光器,其特征在于,所述至少一个的电流阻挡层(13,22)位于激光激活层(15,24)上方。
3.根据权利要求1的激光器,其特征在于,该激光器为掩埋波导型激光器,所述至少一个的电流阻挡层位于激光激活层下面。
4.根据权利要求1的激光器,其特征在于,该激光器为掩埋波导型激光器,所述电流阻挡层位于激光激活层上方,另一个电流阻挡层位于激活层下面。
5.根据权利要求1至4的其中之一的激光器,其特征在于,设有一激活层(15,24),该激活层和所述至少一个的电流阻挡层(13,22)之间有至少一个间隔层(16,25)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9700931-0 | 1997-03-14 | ||
SE97009310 | 1997-03-14 | ||
SE9700931A SE9700931D0 (sv) | 1997-03-14 | 1997-03-14 | Buried heterostructure laser |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1250551A true CN1250551A (zh) | 2000-04-12 |
CN1090831C CN1090831C (zh) | 2002-09-11 |
Family
ID=20406159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN98803285A Expired - Fee Related CN1090831C (zh) | 1997-03-14 | 1998-03-06 | 带有台结构的半导体激光器 |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP0966778B1 (zh) |
JP (1) | JP2001515659A (zh) |
KR (1) | KR20000076262A (zh) |
CN (1) | CN1090831C (zh) |
AU (1) | AU6428398A (zh) |
CA (1) | CA2283233C (zh) |
DE (1) | DE69825870T2 (zh) |
HK (1) | HK1027440A1 (zh) |
SE (1) | SE9700931D0 (zh) |
WO (1) | WO1998042051A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005159299A (ja) * | 2003-10-30 | 2005-06-16 | Sharp Corp | 半導体発光素子 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US4425650A (en) * | 1980-04-15 | 1984-01-10 | Nippon Electric Co., Ltd. | Buried heterostructure laser diode |
CA1218136A (en) * | 1983-01-17 | 1987-02-17 | Toshihiro Kawano | Semiconductor laser device |
GB8516853D0 (en) * | 1985-07-03 | 1985-08-07 | British Telecomm | Manufacture of semiconductor structures |
JP2561163B2 (ja) * | 1990-02-28 | 1996-12-04 | 富士通株式会社 | メサ埋め込み型光半導体装置の製造方法 |
JP2823476B2 (ja) * | 1992-05-14 | 1998-11-11 | 三菱電機株式会社 | 半導体レーザおよびその製造方法 |
-
1997
- 1997-03-14 SE SE9700931A patent/SE9700931D0/xx unknown
-
1998
- 1998-03-06 JP JP54041398A patent/JP2001515659A/ja not_active Ceased
- 1998-03-06 AU AU64283/98A patent/AU6428398A/en not_active Abandoned
- 1998-03-06 EP EP98909917A patent/EP0966778B1/en not_active Expired - Lifetime
- 1998-03-06 DE DE69825870T patent/DE69825870T2/de not_active Expired - Lifetime
- 1998-03-06 CA CA002283233A patent/CA2283233C/en not_active Expired - Fee Related
- 1998-03-06 CN CN98803285A patent/CN1090831C/zh not_active Expired - Fee Related
- 1998-03-06 KR KR1019997008358A patent/KR20000076262A/ko not_active Application Discontinuation
- 1998-03-06 WO PCT/SE1998/000416 patent/WO1998042051A1/en active IP Right Grant
-
2000
- 2000-10-10 HK HK00106430A patent/HK1027440A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1090831C (zh) | 2002-09-11 |
CA2283233C (en) | 2005-08-16 |
DE69825870T2 (de) | 2005-09-01 |
JP2001515659A (ja) | 2001-09-18 |
SE9700931D0 (sv) | 1997-03-14 |
EP0966778B1 (en) | 2004-08-25 |
HK1027440A1 (en) | 2001-01-12 |
EP0966778A1 (en) | 1999-12-29 |
WO1998042051A1 (en) | 1998-09-24 |
KR20000076262A (ko) | 2000-12-26 |
AU6428398A (en) | 1998-10-12 |
CA2283233A1 (en) | 1998-09-24 |
DE69825870D1 (de) | 2004-09-30 |
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