CN1216393C - 场发射型电子源阵列及其制造方法与用途 - Google Patents
场发射型电子源阵列及其制造方法与用途 Download PDFInfo
- Publication number
- CN1216393C CN1216393C CN998019259A CN99801925A CN1216393C CN 1216393 C CN1216393 C CN 1216393C CN 998019259 A CN998019259 A CN 998019259A CN 99801925 A CN99801925 A CN 99801925A CN 1216393 C CN1216393 C CN 1216393C
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- 238000004519 manufacturing process Methods 0.000 title claims description 41
- 239000000758 substrate Substances 0.000 claims abstract description 185
- 238000000034 method Methods 0.000 claims abstract description 184
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 184
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 88
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 87
- 239000010703 silicon Substances 0.000 claims abstract description 87
- 238000009792 diffusion process Methods 0.000 claims abstract description 46
- 229920005591 polysilicon Polymers 0.000 claims description 177
- 239000004065 semiconductor Substances 0.000 claims description 140
- 238000007254 oxidation reaction Methods 0.000 claims description 104
- 230000003647 oxidation Effects 0.000 claims description 100
- 239000004020 conductor Substances 0.000 claims description 87
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 59
- 239000012535 impurity Substances 0.000 claims description 59
- 230000004888 barrier function Effects 0.000 claims description 55
- 230000015572 biosynthetic process Effects 0.000 claims description 37
- 238000009826 distribution Methods 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 32
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- 230000033228 biological regulation Effects 0.000 claims description 29
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- 238000005530 etching Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 14
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 8
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- 239000010408 film Substances 0.000 abstract description 183
- 239000010409 thin film Substances 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract description 2
- 230000005684 electric field Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 543
- 229910052814 silicon oxide Inorganic materials 0.000 description 41
- 239000010931 gold Substances 0.000 description 36
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 34
- 229910052737 gold Inorganic materials 0.000 description 34
- 238000010586 diagram Methods 0.000 description 25
- 239000011521 glass Substances 0.000 description 24
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 24
- 229910052782 aluminium Inorganic materials 0.000 description 18
- 239000004411 aluminium Substances 0.000 description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 18
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- 239000003792 electrolyte Substances 0.000 description 17
- 229910052581 Si3N4 Inorganic materials 0.000 description 16
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 16
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 16
- 230000000694 effects Effects 0.000 description 14
- 239000007789 gas Substances 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- 238000000151 deposition Methods 0.000 description 12
- 238000001259 photo etching Methods 0.000 description 12
- 229910052697 platinum Inorganic materials 0.000 description 12
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000010276 construction Methods 0.000 description 10
- 230000015556 catabolic process Effects 0.000 description 9
- 238000006731 degradation reaction Methods 0.000 description 9
- 239000012467 final product Substances 0.000 description 9
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- 239000011651 chromium Substances 0.000 description 8
- 238000002425 crystallisation Methods 0.000 description 8
- 230000008025 crystallization Effects 0.000 description 8
- 238000005192 partition Methods 0.000 description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 8
- 229910052721 tungsten Inorganic materials 0.000 description 8
- 239000010937 tungsten Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 229910021417 amorphous silicon Inorganic materials 0.000 description 7
- 238000005266 casting Methods 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- 230000001590 oxidative effect Effects 0.000 description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 238000000137 annealing Methods 0.000 description 6
- 238000007743 anodising Methods 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 6
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000005868 electrolysis reaction Methods 0.000 description 5
- 230000008676 import Effects 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 101100433727 Caenorhabditis elegans got-1.2 gene Proteins 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001260 Pt alloy Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
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- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 238000009279 wet oxidation reaction Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
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- 239000007772 electrode material Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/312—Cold cathodes, e.g. field-emissive cathode having an electric field perpendicular to the surface, e.g. tunnel-effect cathodes of metal-insulator-metal [MIM] type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
- H01J31/123—Flat display tubes
- H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
- H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/312—Cold cathodes having an electric field perpendicular to the surface thereof
- H01J2201/3125—Metal-insulator-Metal [MIM] emission type cathodes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Cold Cathode And The Manufacture (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23960698 | 1998-08-26 | ||
JP239606/1998 | 1998-08-26 | ||
JP27233498 | 1998-09-25 | ||
JP272334/1998 | 1998-09-25 | ||
JP363965/1998 | 1998-12-22 | ||
JP363970/1998 | 1998-12-22 | ||
JP36397098A JP3084272B2 (ja) | 1998-12-22 | 1998-12-22 | 電界放射型電子源 |
JP36396598A JP2000188057A (ja) | 1998-12-22 | 1998-12-22 | 電子源 |
JP146739/1999 | 1999-05-26 | ||
JP14673999A JP3076561B1 (ja) | 1999-05-26 | 1999-05-26 | 電界放射型電子源およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1287678A CN1287678A (zh) | 2001-03-14 |
CN1216393C true CN1216393C (zh) | 2005-08-24 |
Family
ID=27527774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN998019259A Expired - Fee Related CN1216393C (zh) | 1998-08-26 | 1999-08-26 | 场发射型电子源阵列及其制造方法与用途 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6794805B1 (de) |
EP (1) | EP1026721B1 (de) |
KR (1) | KR100366805B1 (de) |
CN (1) | CN1216393C (de) |
AT (1) | ATE517427T1 (de) |
DK (1) | DK1026721T3 (de) |
ES (1) | ES2372168T3 (de) |
TW (1) | TW442813B (de) |
WO (1) | WO2000013197A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE261611T1 (de) * | 1994-09-22 | 2004-03-15 | Canon Kk | Verfahren zur herstellung einer elektronen- emittierenden einrichtung sowie einer elektronenquelle und eines bilderzeugungsgerätes mit derartigen elektronen-emittierenden einrichtungen |
GB0025634D0 (en) * | 2000-10-18 | 2000-12-06 | Smiths Industries Plc | Light-emitting devices and displays |
TWI286773B (en) * | 2000-10-26 | 2007-09-11 | Matsushita Electric Works Ltd | Field emission type electron source |
JP3687522B2 (ja) * | 2000-10-26 | 2005-08-24 | 松下電工株式会社 | 電界放射型電子源 |
US6771010B2 (en) | 2001-04-30 | 2004-08-03 | Hewlett-Packard Development Company, L.P. | Silicon emitter with low porosity heavily doped contact layer |
US20060012304A1 (en) * | 2004-07-13 | 2006-01-19 | Seung-Hyun Son | Plasma display panel and flat lamp using oxidized porous silicon |
KR100670351B1 (ko) * | 2005-08-24 | 2007-01-16 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널 |
KR100659099B1 (ko) * | 2005-10-11 | 2006-12-19 | 삼성에스디아이 주식회사 | 표시 장치 |
KR100659100B1 (ko) * | 2005-10-12 | 2006-12-21 | 삼성에스디아이 주식회사 | 디스플레이 장치와 이의 제조 방법 |
JP2007294126A (ja) * | 2006-04-21 | 2007-11-08 | Canon Inc | 電子放出素子、電子源、画像表示装置、及び、電子放出素子の製造方法 |
JP2007311329A (ja) | 2006-05-19 | 2007-11-29 | Samsung Sdi Co Ltd | 発光装置、発光装置の電子放出ユニット製造方法、及び表示装置 |
CN101609778B (zh) * | 2009-07-20 | 2011-11-09 | 浙江师范大学 | 多孔硅场发射发光二极管阵列及其制作技术 |
US8642371B2 (en) * | 2011-04-06 | 2014-02-04 | Shamsoddin Mohajerzadeh | Method and system for fabricating ion-selective field-effect transistor (ISFET) |
CN102360999A (zh) * | 2011-11-08 | 2012-02-22 | 福州大学 | 柔性可控有机pn结场发射电子源 |
US10032870B2 (en) * | 2015-03-12 | 2018-07-24 | Globalfoundries Inc. | Low defect III-V semiconductor template on porous silicon |
CN109285740B (zh) * | 2018-11-12 | 2024-02-09 | 北京大学 | 一种片上微型电子源及其制造方法 |
DE102020113351A1 (de) * | 2020-05-18 | 2021-11-18 | Dbt Gmbh | Elektronenemitterstruktur, Äußerer-Photoeffekt-Emitter, Partikelsammelvorrichtung Tunnel- Flächenemitter halbleiterbasierter Direktemitter, und Flüssigkeitsionisator mit derselben, Verfahren zum Erzeugen von freien Elektronen und Verfahren zum Sammeln von Partikeln |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05342995A (ja) * | 1992-06-08 | 1993-12-24 | Olympus Optical Co Ltd | Mis型冷陰極電子放出装置 |
JPH06140502A (ja) | 1992-10-26 | 1994-05-20 | Nec Corp | 半導体装置の製造方法 |
JP3214256B2 (ja) | 1994-10-12 | 2001-10-02 | 松下電器産業株式会社 | 電子パルス放出装置および表示装置 |
JPH0992130A (ja) | 1995-09-25 | 1997-04-04 | Olympus Optical Co Ltd | 電荷発生器及びその製造方法 |
JP3281533B2 (ja) | 1996-03-26 | 2002-05-13 | パイオニア株式会社 | 冷電子放出表示装置及び半導体冷電子放出素子 |
TW391022B (en) * | 1997-10-29 | 2000-05-21 | Mitsubishi Rayon Co | Field emission electron source, method of producing the same, and use of the same |
KR100338140B1 (ko) | 1998-09-25 | 2002-05-24 | 이마이 기요스케 | 전계 방사형 전자원 |
TW436837B (en) | 1998-11-16 | 2001-05-28 | Matsushita Electric Works Ltd | Field emission-type electron source and manufacturing method thereof and display using the electron source |
TW472273B (en) | 1999-04-23 | 2002-01-11 | Matsushita Electric Works Ltd | Field emission-type electron source and manufacturing method thereof |
SG90182A1 (en) | 1999-10-18 | 2002-07-23 | Matsushita Electric Works Ltd | Field emission-type electron source and manufacturing method thereof |
-
1999
- 1999-08-25 US US09/382,956 patent/US6794805B1/en not_active Expired - Fee Related
- 1999-08-26 ES ES99940499T patent/ES2372168T3/es not_active Expired - Lifetime
- 1999-08-26 WO PCT/JP1999/004613 patent/WO2000013197A1/ja active IP Right Grant
- 1999-08-26 AT AT99940499T patent/ATE517427T1/de active
- 1999-08-26 DK DK99940499.9T patent/DK1026721T3/da active
- 1999-08-26 KR KR10-2000-7004437A patent/KR100366805B1/ko not_active IP Right Cessation
- 1999-08-26 EP EP99940499A patent/EP1026721B1/de not_active Expired - Lifetime
- 1999-08-26 CN CN998019259A patent/CN1216393C/zh not_active Expired - Fee Related
- 1999-08-26 TW TW088114664A patent/TW442813B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW442813B (en) | 2001-06-23 |
ES2372168T3 (es) | 2012-01-16 |
EP1026721A4 (de) | 2006-12-06 |
EP1026721B1 (de) | 2011-07-20 |
ATE517427T1 (de) | 2011-08-15 |
WO2000013197A1 (fr) | 2000-03-09 |
CN1287678A (zh) | 2001-03-14 |
EP1026721A1 (de) | 2000-08-09 |
DK1026721T3 (da) | 2011-10-10 |
KR100366805B1 (ko) | 2003-01-09 |
KR20010031414A (ko) | 2001-04-16 |
US6794805B1 (en) | 2004-09-21 |
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