CN1210227C - 陶瓷结构体 - Google Patents
陶瓷结构体 Download PDFInfo
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- CN1210227C CN1210227C CNB018006345A CN01800634A CN1210227C CN 1210227 C CN1210227 C CN 1210227C CN B018006345 A CNB018006345 A CN B018006345A CN 01800634 A CN01800634 A CN 01800634A CN 1210227 C CN1210227 C CN 1210227C
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- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 25
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052863 mullite Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
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Abstract
一种陶瓷结构体,系由多块烧结的陶瓷材料块(3a,3b)联结使之整体化而成,陶瓷材料的热膨胀系数为3.0×10-6/℃或其以上,在该陶瓷结构体中,在陶瓷块(3a、3b)之间设有能释放所加热冲击的热冲击消除区(5a、5b),该热冲击消除区(5a、5b)在陶瓷结构体断面方向上的宽度是多种多样的。该陶瓷结构体能充分地释放所加的热冲击而不会显著降低结构体的有效断面面积或结构体的总体强度,并具有能适应各种用途和各种材料的通用性。
Description
技术领域
本发明涉及用多块绕结陶瓷材料块结成整体的陶瓷结构体。
背景技术
当在要承受热冲击的场所、例如废气通道中配备使用热膨胀系数大的陶瓷结构体时,怕是是热冲击会造成破裂。为了解决这一问题,例如在日本专利JP-A-8-28246中,就公开了一种如图3所示的技术,它用多块陶瓷块3构成为一个陶瓷结构体,并在陶瓷块3之间插入弹性密封材料之类以释放所受到的热冲击。
由插入陶瓷块之间的密封剂之类所形成的热冲击消除区5,从消除热冲击的观点看来,它在断面方向上的宽度应尽可能地宽。但是,当热冲击消除区的宽度W变大后,用于指定目的的陶瓷结构体的有效断面面积就相应地变小,其结果是结构体的总的性能和效率就会降低,再加结构体的总强度也会降低。其间,若热冲击消除区5的宽度W设计较小,则所受到的热冲击就很难充分释放,而招致热冲击消除区5本身或陶瓷块3受损。
热冲击消除区的宽度W优选设定在适当的大小,以平衡上述两个互相矛盾的特性。但在实际上要平衡这两个特性是困难的,而所受到的热冲击的大小也会因陶瓷块3的材料、插入热冲击消除区的密封剂材料、以及陶瓷结构体的用途不同而不同,因此,过去存在着这样的问题,就是说,即使热冲击消除区的宽度W已经最佳化,但它的实际适用范围很窄。
鉴于上述情况,本发明已完成了预定的目标,即提供出一种陶瓷结构,它能充分地释放所受到的热冲击,而不会显著降低降低结构体的有效断面面积以及陶瓷结构体的整体强度,而且作为陶瓷结构体,在材料上和用途上都富有广泛性。
发明内容
本发明提供出了一种陶瓷结构体,它是将多块烧结的陶瓷材料块结合使之整体化而成的,陶瓷材料的热膨胀系数为3.0×10-6/℃或其以上,其特征在于,在陶瓷块之间设有能释放所受到的热冲击的陶瓷结构体热冲击消除区,并且这些热冲击消除区,在陶瓷结构体断面方向上的宽度是有差异的。
附图简述
图1示出本发明陶瓷结构体的一个实施方案的断面图。
图2示出本发明陶瓷结构体的另一个实施方案的断面图。
图3示出传统的由多块陶瓷块构成的陶瓷结构体的断面图。
图4(a)至4(c)示出实施例1所用陶瓷结构体的断面图。
图5(a)至5(d)示出实施例2所用陶瓷结构体的断面图。
实施本发明的最佳模式
在本发明的陶瓷结构体中,热冲击消除区的宽度是不象图3所示的那样均匀的,而是在断面方向上有差异(消除区5的宽度有大有小);借此可使所受到的热冲击充分地释放,而不会显著损害烧结陶瓷材料块的有效断面面积和陶瓷结构体的整体强度。
图1示出本发明陶瓷结构体的断面图,其中断面尺寸大的烧结陶瓷材料块3a和断面尺寸小的烧结陶瓷材料块是随机布置并结成整体的。由于这样的构造,就使宽度小的热冲击消除区5a在烧结陶瓷块3a之间形成,而宽度大的热冲击消除区5b就在烧结陶瓷块3a和3b之间形成。
图2示出本发明陶瓷结构体另一实施方案的断面图,其中断面尺寸小的烧结陶瓷材料块3b被集中放在陶瓷结构体的断面中央,而断面尺寸大的烧结陶瓷材料块3a则围绕陶瓷块3b安放。这样放置的结果是,断面最外部的烧结陶瓷材料块3a之间,形成了宽度最小的热冲击消除区;在最外部陶瓷块3a内侧的烧结陶瓷材料块3a和3b之间,形成了较大宽度的热冲击消除区;在断面中央的烧结陶瓷材料块3b之间,则形成了最大宽度的热冲击消除区。
当在陶瓷结构体的一个断面上局部地安置大宽度和小宽度的热冲击消除区,则该陶瓷结构体的特征(例如强度)就相应地是不均匀的;因此,优选的是,大宽度和小宽度的消除区应以某种交叉方式出现,如图1所示。可根据陶瓷结构体的用途采用这样的技术,即在热冲击集中的地点正好安排有较大宽度的热冲击消除区。例如,当陶瓷结构体被布置在管道中部而热冲击集中于结构体断面的中央时,就优选也在断面中央做成很多大宽度的热冲击消除区,并在断面的外部做成很多小宽度的热冲击消除区,如图2所示。
本发明的这种陶瓷结构体包括有多种宽度的热冲击消除区,因此,在用途上就有高度的广泛性,能适当地应付断面方向上的热冲击分布,相比之下,传统的陶瓷结构体却不能这样,它的热冲击消除区的最佳宽度是根据烧结陶瓷材料块使用的材料、插入热冲击消除区的密封剂等所用的材料、以及陶瓷结构体的用途来确定的,全部热冲击消除区都是按该确定的宽度统一联结(整合)的。在本发明的陶瓷结构体中,热冲击消除区的宽度是在断面方向上规定的。当把本发明的陶瓷结构体用于废气通道中,例如作为废气净化的一个部件时,稍后将会提到,此时也会存在气流方向上的热冲击分布,因此,我们也可采用在气流方向上的不同热冲击消除区宽度作为特性,这与在断面方向上的理论根据是相同的。
构成本发明的陶瓷结构体的烧结陶瓷材料块的热膨胀系数为3.0×10-6/℃或其以上。其原因是用热膨胀系数小于3.0×10-6/℃的烧结陶瓷材料块构成的陶瓷结构体,几乎不会发生大的热冲击,例如引起损坏(例如开裂)的冲击。本陶瓷结构体当它是用热膨胀系数为4.0×10-6/℃或以上的烧结陶瓷材料块构成的,会更加有效。
烧结陶瓷材料块所含有的作为晶相的,优选为选自下列材料中的一种:富铝红柱石、矾土、氮化硅和碳化硅。高导热系数的碳化硅是特别优选的,因为它能轻易地释放所受的热量。
热冲击消除区可在陶瓷块间的空隙中填入密封剂、垫块等来形成,也可留出不加填充的空隙。但是,当本陶瓷结构体被用作废气净化的一个部件(例如催化剂载体)时,后面将会讲到,陶瓷块之间的空隙最好是用密封剂、垫块等填充起来,以防废气直通过去,更优选是用能把烧结陶瓷材料块互相粘结起来的密封剂,因为这样做出的陶瓷结构体还可具有很高的的强度。
作为密封剂,特别优选的是具有热阻的陶瓷纤维或陶瓷粉、水泥等。它们可以单独使用或取两种或两种以上混合使用。需要时,也可优选使用有机粘结剂、无机粘结剂等,因为它们会作出预兆反应,有利于进一步改善粘接。
在本陶瓷结构体中,在一定的断面上,热冲击消除区的最大宽度,优选为热冲击消除区最小宽度的两倍或两倍以上。当最大宽度小于最小宽度的两倍时,就不可能取得充分的效果,亦即充分地释放所受到的热冲击而不显著地损害陶瓷结构体的有效断面面积或结构体的整体强度。三倍或三倍以上的最大宽度会发挥最高的效力,因而是更优选的。
热冲击消除区的最小宽度优选为0.1mm或其以上,或者是陶瓷块断面最长边(当陶瓷块断面为长方形时为较长边)长度的0.5%或其以上。当最小宽度小于此数时,陶瓷结构体就会有热冲击应付能力过弱的部分(即使这些部分周围有较大宽度的热冲击区也是这样)。
热冲击消除区的最大宽度优选为15.0mm或其以下,或者是陶瓷块断面最短边(当陶瓷块断面为长方形时为较短边)长度的50%或其以下。当最大宽度大于此数时(即使有较小宽度的热冲击消除区围绕着该最大宽度),陶瓷结构体的有效断面面积就会显著地减小,而结构体的整体强度就会显著降低。
本发明的陶瓷结构体的有代表性的用途有:用作废气净化的部件如废气净化催化剂载体;用作捕获柴油机废气中的颗粒用的过滤器或称柴油颗粒过滤器(以下称为DPF)等。在生产本发明用于这些用途的陶瓷结构体时,所用的烧结陶瓷材料块,是具有蜂窝结构的烧结的多孔陶瓷材料,把多块这样的陶瓷块结成整体以取得要求的蜂窝结构体。在此,“蜂窝结构体”是指具有由间壁分开的大量通孔(微孔)的结构体。
当陶瓷结构体是用作废气净化用催化剂载体或DPF的蜂窝结构体时,其热冲击的分布是出现在断面方向上,其理由如次:
(1)废气的速度分布通常是在蜂窝结构体的断面方向上,因此废气的热量也会在蜂窝结构体的断面方向上产生出温度分布。
(2)当蜂窝结构体被用作催化剂载体时,进入蜂窝结构体的废气组分,会引起各种各样的反应、包括燃烧,借此,上述在断面方向上的温度分布就增强了。
(3)当蜂窝结构体被用作DPF而沉积在蜂窝结构体间壁上的颗粒物被定期燃烧以再生DPF时,则沉积的颗粒物的数量分布会与废气速度的分布相相应。颗粒物数量较大的部分在再生燃烧时所发生的热自然也较多。
当本发明的陶瓷结构体用作废气净化用的催化剂载体时,有可能催化剂组分是被装入蜂窝结构体的单个多孔烧结陶瓷材料块中,然后再把装填催化剂的单个陶瓷块联结起来(在此情况下,催化剂组分只装入多孔烧结陶瓷材料块中),也有可能先把单个多孔烧结陶瓷材料块联结起来,然后再往联结好的陶瓷块中装填催化剂组分(在此情况下,当在陶瓷块之间插入填充物以形成热冲击消除区时,则催化剂就不但装入多孔烧结陶瓷材料块,同时也装入填充物中)。
当本发明的陶瓷结构体被用作DPF时,应将烧结陶瓷材料块中邻接的通孔(微孔)交替地互相相反地闭塞其一端,以使闭塞后每块陶瓷块的两个端面呈现出棋盘格状。
当柴油机废气从一端被通入这种陶瓷块的陶瓷结构体时,废气会从该端未闭塞的通孔进入该结构体,然后穿越每块陶瓷块的多孔间壁而进入该端闭塞而另一端未闭塞的通孔中。在穿越间壁的这一过程中,废气中的颗粒物即被间壁捕获,而已除去颗粒物的废气被净化后即被从陶瓷结构体的另一端排出。
随着颗粒物在间壁上不断沉积,间壁就会产生堵塞并降低其过滤作用。因此要定期地借助于加热器等工具,对陶瓷结构体进行加热来烧掉积存的颗粒物,以恢复间壁的过滤作用。为在再生时助长积存颗粒物的燃烧,可在陶瓷结构体中装入催化组分。
当烧结陶瓷材料块是蜂窝结构体时,其微孔密度优选为6~1500孔/平方英寸(0.9~233孔/cm2),更优选为50~400孔/平方英寸(7.8~62孔/cm2)。当微孔密度小于6孔/平方英寸(0.9孔/cm2)时,该蜂窝结构体在强度和GSA(有效几何表面积)上是不足的;当微孔密度大于1500孔/平方英寸(233孔/cm2)时,该蜂窝结构体在气体穿越时就会显示出过大的压力损失。
当烧结陶瓷材料块是蜂窝结构体时,其间壁的厚度优选为50~2000μm,更优选为200~800μm。若间壁厚度小于50μm,该蜂窝结构体的强度就不足;若间壁厚度大于2000μm,则该蜂窝结构体的有效GSA就太低,而在气体穿越时就会显示出过大的压力损失。
下面本发明将参照实施例作更详细的描述。但本发明决不限于这些实施例。
实施例1
将两种尺寸不同的矾土制的蜂窝陶瓷块(A型:50mm□×50mmL,B型:48mm□×50mmL)以3×3=9块联结起来,如图4(a)至4(c)所示,然后用粘接剂整合成结构体a至c。图中,A和B示出所用蜂窝陶瓷块的类型。
如图中所示,结构体a系单由A型蜂窝块构成;结构体B系由6块A型蜂窝块和3块B型蜂窝块构成;结构体C系单由B型蜂窝块构成。在各结构体中,每个由A型蜂窝块之间形成的热冲击消除区的宽度W1为0.2mm;每个由A型蜂窝块与B型蜂窝块之间形成的热冲击消除区的宽度W2为1.2mm;每个由B型蜂窝块之间形成的热冲击消除区的宽度W3为2.2mm。粘接剂也涂在每个结构体的各面,厚度为0.2mm(在B型情况下为1.2mm),以此使每个结构体具有150.8mm□的外部尺寸。每一个样品都是从A型和B型蜂窝陶瓷块本身剪切下来,并经在气流方向上的热膨胀系数测定,其值为8.0×10-6/℃。
结构体a至c都经受了耐热冲击性试验。试验进行方式如下。每个结构体都被插入加热至700℃~900℃的电炉,在此停留30分钟,然后在室温下快速冷却;这一操作(一次循环)重复30次(30次循环);然后目视观察该结构体有无裂隙。目测结构示于表1中,同时还示出结构体蜂窝部分的有效断面面积。
表1
结构体 | 蜂窝部分的总有效断面面积(cm2) | 耐热冲击性 | |
室温700℃ | 室温700℃ | ||
a | 225 | ○ | ×* |
b | 219 | ○ | ○ |
c | 207 | ○ | ○ |
*:在蜂窝和粘接剂中出现裂隙。
如表1所示,本发明一个实施方案的结构体b,其蜂窝部分的有效断面面积损失较小而显示出很好的抗热冲击性。
实施例2
将两种碳化硅制的蜂窝陶瓷块(A’型:30mm□×200mL;B’型:26mm□×200mL;在每块蜂窝陶瓷块中,每个邻接的通孔都用主要由碳化硅粉组成的密封剂交替地互相相反地闭塞其一端,以使闭塞后陶瓷块的两个端面呈现出棋盘格状。)以5×5=25块联结起来,如图5(a)至5(d)所示,然后用粘接剂整合成结构体d至g。图中A’和B’示出所用蜂窝陶瓷块的类型。
如图所示,结构体d是单由A’型蜂窝陶瓷块构成的;结构体e是由20块A’型蜂窝陶瓷块与5块B’型蜂窝陶瓷块随机安排构成的;结构体f是安排5块B’型蜂窝陶瓷块在中央部位、并安排20块A’型蜂窝陶瓷块围绕着B’型蜂窝陶瓷块构成的;以及结构体g是单由B’型蜂窝陶瓷块构成的。在各结构体中,各个在A’型蜂窝陶瓷块之间形成的热冲击消除区的宽度W4为0.3mm;各个在A’型蜂窝陶瓷块与B’型蜂窝陶瓷块之间形成的热冲击消除区的宽度W5为2.3mm;而各个在B’型蜂窝陶瓷块之间形成的热冲击消除区的宽度W6为4.3mm。粘接剂也涂在每个结构体的各面,厚度为0.3mm(在B’型情况下为2.3mm),以此使每个结构体具有151.8mm□的外部尺寸。每一个样品都是从A’型和B’型蜂窝陶瓷块本身剪切下来并经在气流方向上的热膨胀系数测定,其值为4.5×10-6/℃。
每种上述的结构体都被装入马口铁罐中。罐体盖住每个结构体的四边;罐的断面形状在盖住结构体的部分是正方形,而两端是管形(直径60mm),亦即中部的正方形部分连续地渐变为管形的前端和后端,以此使罐体能与下述的在作耐热冲击性试验时所用的碳黑发生器相配合。结构体g因偶然的原因没有做耐热冲击性试验,这是由于它在被装入罐中时从粘接部件开裂了。
结构体d至f每块都做了耐热冲击性试验。在试验中,首先把结构体d至f每块都装配到碳黑发生器上,而使碳黑(细粒)在结构体内部积聚35g。然后,将预热到600℃的空气导入使积聚的碳黑燃烧。此时,为测量温度,往位于每块蜂窝陶瓷块的中央部位或其附近的微孔(积聚碳黑的微孔)中装入热电偶,其位置为从结构体前端起170mm处(从结构体后端起30mm处),该微孔在后端是被闭塞的;结果是,从d至f每块结构体中心部位的蜂窝陶瓷块都显示升温最高,达到1400℃。在试验后,目测了结构体d至f,其结果是,结构体d在粘接部位和蜂窝陶瓷块上出现了裂隙。结果示于表2。
表2
结构体 | 蜂窝部分总有效断面面积(cm2) | 抗热冲击性 | 强度 |
d | 225 | ×*1 | ○ |
e | 214 | ○ | ○ |
f | 214 | ○ | ○ |
g | 169 | - | ×*2 |
*1:在蜂窝部和粘接剂部出现裂隙。
*2:在装入罐中时破裂。
如表2所示,结构体e和f(这些是本发明的实施方案),其蜂窝部分的有效断面面积损失较小,保持有抗装罐的强度,并显示出良好的抗热冲击性。
工业适用性
如上所述,本发明的陶瓷结构体能充分地释放所受到的热冲击,而不会显著降低结构体的有效断面面积或结构体的总体强度,并具有能适应各种用途和各种材料的通用性。
Claims (9)
1.一种陶瓷结构体,系由多块烧结的陶瓷材料块联结使之整体化而成,陶瓷材料的热膨胀系数为3.0×10-6/℃-8.0×10-6/℃,在该陶瓷结构体中,在陶瓷块之间设有能释放所加热冲击的热冲击消除区,其中,在陶瓷结构体的一定断面上,热冲击消除区的最大宽度应至少为热冲击消除区最小宽度的两倍,并且热冲击消除区的宽度为在0.1~15.0mm的范围内。
2.权利要求1的陶瓷结构体,其中,烧结的陶瓷材料块的热膨胀系数为4.0×10-6/℃-8.0×10-6/℃。
3.权利要求1的陶瓷结构体,其中,烧结的陶瓷材料块中含有选自富铝红柱石、矾土、氮化硅和碳化硅之一作为主晶相。
4.权利要求1的陶瓷结构体,其中,热冲击消除区是借助于在烧结陶瓷材料块之间,填入能将它们相互之间粘结起来的密封剂而制成的。
5.权利要求1的陶瓷结构体,其中,烧结的陶瓷材料块是用具有蜂窝结构的多孔烧结陶瓷材料制造的。
6.权利要求5的陶瓷结构体作为废气净化部件的应用。
7.权利要求5的陶瓷结构体作为废气净化催化剂载体的应用。
8.权利要求5的陶瓷结构体作为捕获柴油机废气中含有的颗粒物的过滤器的应用。
9.权利要求8的陶瓷结构体的应用,它具有装入其中的催化剂组分。
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CN (1) | CN1210227C (zh) |
AU (1) | AU2705201A (zh) |
BR (1) | BR0104177A (zh) |
CA (1) | CA2372301C (zh) |
DE (1) | DE60118469T2 (zh) |
WO (1) | WO2001053232A1 (zh) |
ZA (1) | ZA200107111B (zh) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1724448B2 (en) | 2002-02-05 | 2013-11-20 | Ibiden Co., Ltd. | Honeycomb filter for purifyng exhaust gases, adhesive, coating material, and manufacturing method of honeycomb filter for purifying exhaust gases |
ATE407285T1 (de) * | 2002-02-05 | 2008-09-15 | Ibiden Co Ltd | Wabenfilter für abgasentgiftung |
JP4279497B2 (ja) * | 2002-02-26 | 2009-06-17 | 日本碍子株式会社 | ハニカムフィルタ |
US20050169819A1 (en) | 2002-03-22 | 2005-08-04 | Ibiden Co., Ltd | Honeycomb filter for purifying exhaust gas |
JP2004000896A (ja) * | 2002-03-25 | 2004-01-08 | Ngk Insulators Ltd | ハニカムフィルター |
JP4409959B2 (ja) * | 2002-03-29 | 2010-02-03 | イビデン株式会社 | セラミックフィルタおよび排ガス浄化装置 |
CN1305548C (zh) * | 2002-04-09 | 2007-03-21 | 揖斐电株式会社 | 废气净化用蜂窝式过滤器 |
US7314496B2 (en) | 2002-09-13 | 2008-01-01 | Ibiden Co., Ltd. | Honeycomb structure |
JPWO2004024295A1 (ja) | 2002-09-13 | 2006-01-05 | イビデン株式会社 | ハニカム構造体 |
US7556665B2 (en) * | 2003-03-19 | 2009-07-07 | Ngk Insulators, Ltd. | Honeycomb structure |
DE602004003885T2 (de) * | 2003-06-05 | 2007-08-30 | Ibiden Co., Ltd | Wabenstrukturkörper |
PL1514588T3 (pl) * | 2003-06-23 | 2007-09-28 | Ibiden Co Ltd | Korpus o strukturze plastra miodu |
ATE386581T1 (de) | 2003-10-20 | 2008-03-15 | Ibiden Co Ltd | Wabenstruktur |
JP4439236B2 (ja) * | 2003-10-23 | 2010-03-24 | イビデン株式会社 | ハニカム構造体 |
JP2006110413A (ja) * | 2004-10-12 | 2006-04-27 | Ngk Insulators Ltd | ハニカムフィルター |
EP1884275B1 (en) | 2005-05-23 | 2014-07-23 | NGK Insulators, Ltd. | Honeycomb structure body |
JP2007252993A (ja) * | 2006-03-20 | 2007-10-04 | Ngk Insulators Ltd | ハニカム構造体 |
JP5498705B2 (ja) * | 2007-02-02 | 2014-05-21 | 日本碍子株式会社 | ハニカム構造体 |
WO2008126433A1 (ja) * | 2007-03-30 | 2008-10-23 | Ngk Insulators, Ltd. | ハニカムセグメント及びハニカム構造体 |
WO2009066388A1 (ja) * | 2007-11-21 | 2009-05-28 | Ibiden Co., Ltd. | ハニカム構造体及びハニカム構造体の製造方法 |
EP2113643B1 (en) * | 2008-03-24 | 2012-01-25 | Ibiden Co., Ltd. | Honeycomb structured body |
WO2009118812A1 (ja) * | 2008-03-24 | 2009-10-01 | イビデン株式会社 | ハニカム構造体 |
WO2011114506A1 (ja) * | 2010-03-19 | 2011-09-22 | イビデン株式会社 | ハニカム構造体 |
JP5261425B2 (ja) * | 2010-03-23 | 2013-08-14 | 日本碍子株式会社 | コージェライトのハニカム構造体 |
WO2013186923A1 (ja) | 2012-06-15 | 2013-12-19 | イビデン株式会社 | ハニカムフィルタ |
WO2013186922A1 (ja) | 2012-06-15 | 2013-12-19 | イビデン株式会社 | ハニカムフィルタ |
CN102798781B (zh) * | 2012-08-08 | 2014-08-27 | 上海市质量监督检验技术研究院 | 一种热冲击试验系统 |
WO2014054159A1 (ja) | 2012-10-04 | 2014-04-10 | イビデン株式会社 | ハニカムフィルタ |
JP6239305B2 (ja) | 2013-07-31 | 2017-11-29 | イビデン株式会社 | ハニカムフィルタ |
JP6239306B2 (ja) * | 2013-07-31 | 2017-11-29 | イビデン株式会社 | ハニカムフィルタ |
JP6239304B2 (ja) | 2013-07-31 | 2017-11-29 | イビデン株式会社 | ハニカムフィルタ |
JP6239307B2 (ja) | 2013-07-31 | 2017-11-29 | イビデン株式会社 | ハニカムフィルタ |
JP6239303B2 (ja) * | 2013-07-31 | 2017-11-29 | イビデン株式会社 | ハニカムフィルタ |
CN105705237B (zh) * | 2014-02-12 | 2018-01-30 | 新日铁住金高新材料股份有限公司 | 催化剂承载用基材 |
JP1538058S (zh) * | 2015-06-17 | 2015-11-16 | ||
JP6581828B2 (ja) * | 2015-07-17 | 2019-09-25 | 日本碍子株式会社 | ハニカムフィルタ |
JP6948273B2 (ja) * | 2018-02-06 | 2021-10-13 | 日本碍子株式会社 | ハニカムフィルタ |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6294307A (ja) * | 1985-10-21 | 1987-04-30 | バブコツク日立株式会社 | ハニカム強化方法 |
JP2505261B2 (ja) * | 1988-09-29 | 1996-06-05 | 日本碍子株式会社 | セラミック熱交換体およびその製造法 |
JPH04130069A (ja) * | 1990-09-19 | 1992-05-01 | Matsushita Electric Ind Co Ltd | ハニカム状セラミックス構造体の製造方法 |
EP1382443B1 (en) * | 1996-01-12 | 2013-04-24 | Ibiden Co., Ltd. | A filter for purifying exhaust gas |
JP3067740B2 (ja) * | 1997-08-20 | 2000-07-24 | 住友電気工業株式会社 | セラミックス製フィルターモジュール |
JP3752370B2 (ja) * | 1997-10-16 | 2006-03-08 | 日本碍子株式会社 | 高温排ガス処理用のセラミック製フィルタ装置 |
JP3277918B2 (ja) * | 1999-06-15 | 2002-04-22 | 住友電気工業株式会社 | セラミック多孔体を用いた濾過器 |
-
2000
- 2000-01-24 JP JP2000014834A patent/JP4049501B2/ja not_active Expired - Lifetime
-
2001
- 2001-01-18 BR BR0104177-0A patent/BR0104177A/pt not_active Application Discontinuation
- 2001-01-18 WO PCT/JP2001/000277 patent/WO2001053232A1/ja active IP Right Grant
- 2001-01-18 DE DE60118469T patent/DE60118469T2/de not_active Expired - Lifetime
- 2001-01-18 CN CNB018006345A patent/CN1210227C/zh not_active Expired - Lifetime
- 2001-01-18 AU AU27052/01A patent/AU2705201A/en not_active Abandoned
- 2001-01-18 CA CA002372301A patent/CA2372301C/en not_active Expired - Fee Related
- 2001-01-18 KR KR10-2001-7012012A patent/KR100473914B1/ko active IP Right Grant
- 2001-01-18 EP EP01901403A patent/EP1174399B1/en not_active Expired - Lifetime
- 2001-01-18 US US09/936,521 patent/US6395370B1/en not_active Expired - Lifetime
- 2001-08-28 ZA ZA200107111A patent/ZA200107111B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE60118469T2 (de) | 2006-12-14 |
JP4049501B2 (ja) | 2008-02-20 |
AU2705201A (en) | 2001-07-31 |
CA2372301C (en) | 2008-06-03 |
KR100473914B1 (ko) | 2005-03-08 |
CA2372301A1 (en) | 2001-07-26 |
ZA200107111B (en) | 2002-08-28 |
JP2001206780A (ja) | 2001-07-31 |
EP1174399B1 (en) | 2006-04-05 |
US6395370B1 (en) | 2002-05-28 |
BR0104177A (pt) | 2001-12-18 |
EP1174399A4 (en) | 2003-04-02 |
DE60118469D1 (de) | 2006-05-18 |
EP1174399A1 (en) | 2002-01-23 |
KR20020003555A (ko) | 2002-01-12 |
CN1365346A (zh) | 2002-08-21 |
WO2001053232A1 (fr) | 2001-07-26 |
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