CN120883361A - 半导体元件搭载用基板 - Google Patents

半导体元件搭载用基板

Info

Publication number
CN120883361A
CN120883361A CN202480021466.1A CN202480021466A CN120883361A CN 120883361 A CN120883361 A CN 120883361A CN 202480021466 A CN202480021466 A CN 202480021466A CN 120883361 A CN120883361 A CN 120883361A
Authority
CN
China
Prior art keywords
substrate
protective layer
semiconductor element
mounting
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480021466.1A
Other languages
English (en)
Chinese (zh)
Inventor
宇佐美宪三
近藤洋右
村濑达宣
西村充
渡边幸裕
佐野五十铃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Publication of CN120883361A publication Critical patent/CN120883361A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0365—Manufacture or treatment of packages of means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN202480021466.1A 2023-03-30 2024-03-21 半导体元件搭载用基板 Pending CN120883361A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023055861 2023-03-30
JP2023-055861 2023-03-30
PCT/JP2024/011069 WO2024203736A1 (ja) 2023-03-30 2024-03-21 半導体素子搭載用基板

Publications (1)

Publication Number Publication Date
CN120883361A true CN120883361A (zh) 2025-10-31

Family

ID=92906084

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480021466.1A Pending CN120883361A (zh) 2023-03-30 2024-03-21 半导体元件搭载用基板

Country Status (4)

Country Link
EP (1) EP4693391A1 (https=)
JP (1) JPWO2024203736A1 (https=)
CN (1) CN120883361A (https=)
WO (1) WO2024203736A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629533A (ja) 1992-07-10 1994-02-04 Seiko Epson Corp 半導体装置および、その製造方法
JP3509809B2 (ja) * 2002-04-30 2004-03-22 住友電気工業株式会社 サブマウントおよび半導体装置
JP2004356429A (ja) * 2003-05-29 2004-12-16 Sumitomo Electric Ind Ltd サブマウントおよびそれを用いた半導体装置
JP5857355B2 (ja) * 2010-09-16 2016-02-10 Ｓｈマテリアル株式会社 半導体発光素子搭載用基板、及びそれを用いた半導体発光装置
WO2019082480A1 (ja) * 2017-10-25 2019-05-02 パナソニックＩｐマネジメント株式会社 光半導体装置用パッケージ、光半導体装置および光半導体装置用パッケージの製造方法

Also Published As

Publication number Publication date
EP4693391A1 (en) 2026-02-11
WO2024203736A1 (ja) 2024-10-03
JPWO2024203736A1 (https=) 2024-10-03

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